JP2005508767A5 - - Google Patents
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- Publication number
- JP2005508767A5 JP2005508767A5 JP2002593135A JP2002593135A JP2005508767A5 JP 2005508767 A5 JP2005508767 A5 JP 2005508767A5 JP 2002593135 A JP2002593135 A JP 2002593135A JP 2002593135 A JP2002593135 A JP 2002593135A JP 2005508767 A5 JP2005508767 A5 JP 2005508767A5
- Authority
- JP
- Japan
- Prior art keywords
- layered
- thermally conductive
- fibers
- interface
- interface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 52
- 239000000835 fiber Substances 0.000 claims 26
- 150000001875 compounds Chemical class 0.000 claims 9
- 239000000853 adhesive Substances 0.000 claims 8
- 230000001070 adhesive effect Effects 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 8
- 239000000203 mixture Substances 0.000 claims 7
- 229920000877 Melamine resin Polymers 0.000 claims 5
- 239000004640 Melamine resin Substances 0.000 claims 5
- 229920001971 elastomer Polymers 0.000 claims 5
- 239000005060 rubber Substances 0.000 claims 5
- 150000001412 amines Chemical class 0.000 claims 4
- 239000008393 encapsulating agent Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 229920006395 saturated elastomer Polymers 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 239000011231 conductive filler Substances 0.000 claims 3
- 150000002009 diols Chemical class 0.000 claims 3
- 150000007974 melamines Chemical class 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000012782 phase change material Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000005062 Polybutadiene Substances 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920002857 polybutadiene Polymers 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 239000001993 wax Substances 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- -1 boron nitride compound Chemical class 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 238000004132 cross linking Methods 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000012188 paraffin wax Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29443301P | 2001-05-30 | 2001-05-30 | |
| US10/047,617 US6673434B2 (en) | 1999-12-01 | 2002-01-14 | Thermal interface materials |
| PCT/US2002/017331 WO2002096636A1 (en) | 2001-05-30 | 2002-05-30 | Interface materials and methods of production and use thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005508767A JP2005508767A (ja) | 2005-04-07 |
| JP2005508767A5 true JP2005508767A5 (OSRAM) | 2006-01-05 |
| JP4237505B2 JP4237505B2 (ja) | 2009-03-11 |
Family
ID=26725250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002593135A Expired - Fee Related JP4237505B2 (ja) | 2001-05-30 | 2002-05-30 | インターフェース材料、ならびにその製造方法および使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1401641A4 (OSRAM) |
| JP (1) | JP4237505B2 (OSRAM) |
| KR (1) | KR20040002866A (OSRAM) |
| CN (1) | CN1267268C (OSRAM) |
| CA (1) | CA2433637A1 (OSRAM) |
| TW (1) | TWI286514B (OSRAM) |
| WO (1) | WO2002096636A1 (OSRAM) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| US7608324B2 (en) | 2001-05-30 | 2009-10-27 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| CN1841713A (zh) | 2005-03-31 | 2006-10-04 | 清华大学 | 热界面材料及其制作方法 |
| CN100358132C (zh) * | 2005-04-14 | 2007-12-26 | 清华大学 | 热界面材料制备方法 |
| JP2007251002A (ja) * | 2006-03-17 | 2007-09-27 | Toshiba Corp | ヒートシンク、電子デバイス、ヒートシンクの製造方法及び電子デバイスの製造方法 |
| TWI432592B (zh) | 2007-04-27 | 2014-04-01 | Honeywell Int Inc | 具有降低預燒時間之濺鍍靶，其製造方法及其用途 |
| US7808099B2 (en) | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
| US9269603B2 (en) | 2013-05-09 | 2016-02-23 | Globalfoundries Inc. | Temporary liquid thermal interface material for surface tension adhesion and thermal control |
| WO2015120773A1 (en) | 2014-02-13 | 2015-08-20 | Honeywell International Inc. | Compressible thermal interface materials |
| DE102015223443A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
| MX393621B (es) | 2016-03-08 | 2025-03-24 | Honeywell Int Inc | Material de camibo de fase. |
| US11041103B2 (en) * | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2019202964A1 (ja) * | 2018-04-17 | 2019-10-24 | 三井化学株式会社 | 熱硬化性樹脂組成物、プレコートメタル用コート材、硬化物および積層体 |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5250600A (en) * | 1992-05-28 | 1993-10-05 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
| US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
| US5725707A (en) * | 1995-04-10 | 1998-03-10 | Northrop Grumman Corporation | Enhanced conductive joints from fiber flocking |
| JP2002519846A (ja) * | 1998-06-24 | 2002-07-02 | ジョンソン マシュー エレクトロニクス インコーポレイテッド | 繊維状インタフェースを有する電気素子 |
| AU1616300A (en) * | 1998-12-02 | 2000-06-19 | Intel Corporation | A fibrous thermal interface adaptor |
| JP2000273196A (ja) * | 1999-03-24 | 2000-10-03 | Polymatech Co Ltd | 熱伝導性樹脂基板および半導体パッケージ |
-
2002
- 2002-05-30 EP EP02729331A patent/EP1401641A4/en not_active Withdrawn
- 2002-05-30 KR KR10-2003-7010597A patent/KR20040002866A/ko not_active Ceased
- 2002-05-30 WO PCT/US2002/017331 patent/WO2002096636A1/en not_active Ceased
- 2002-05-30 CN CNB028111036A patent/CN1267268C/zh not_active Expired - Fee Related
- 2002-05-30 JP JP2002593135A patent/JP4237505B2/ja not_active Expired - Fee Related
- 2002-05-30 CA CA002433637A patent/CA2433637A1/en not_active Abandoned
- 2002-05-31 TW TW091111709A patent/TWI286514B/zh not_active IP Right Cessation
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