JP2005508436A5 - - Google Patents
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- Publication number
- JP2005508436A5 JP2005508436A5 JP2003542292A JP2003542292A JP2005508436A5 JP 2005508436 A5 JP2005508436 A5 JP 2005508436A5 JP 2003542292 A JP2003542292 A JP 2003542292A JP 2003542292 A JP2003542292 A JP 2003542292A JP 2005508436 A5 JP2005508436 A5 JP 2005508436A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- polyepoxide resin
- weight
- alicyclic
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive Effects 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 125000002723 alicyclic group Chemical group 0.000 claims 3
- YRKVLGUIGNRYJX-UHFFFAOYSA-N 4-[9-(4-amino-3-methylphenyl)fluoren-9-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(N)=CC=2)=C1 YRKVLGUIGNRYJX-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
Claims (3)
- 硬化性接着剤組成物であって、
ａ）少なくとも２０〜８０重量％の脂環含有ポリエポキシド樹脂および８０〜２０重量％の芳香族ポリエポキシド樹脂を含み、１０重量％を超える脂環性部分を有するポリエポキシド樹脂混合物と、
ｂ）有効量の９，９−ビス（３−メチル−４−アミノフェニル）フルオレンと、
の混合物を含む接着剤組成物。 - 強靭化剤をさらに含む、請求項１に記載の接着剤組成物。
- 前記脂環含有ポリエポキシド樹脂が、式
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/005,556 US6624213B2 (en) | 2001-11-08 | 2001-11-08 | High temperature epoxy adhesive films |
| PCT/US2002/030155 WO2003040251A1 (en) | 2001-11-08 | 2002-09-23 | High temperature epoxy adhesive films |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005508436A JP2005508436A (ja) | 2005-03-31 |
| JP2005508436A5 true JP2005508436A5 (ja) | 2006-01-05 |
| JP4242771B2 JP4242771B2 (ja) | 2009-03-25 |
Family
ID=21716455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003542292A Expired - Fee Related JP4242771B2 (ja) | 2001-11-08 | 2002-09-23 | 耐熱性エポキシ接着剤フィルム |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6624213B2 (ja) |
| EP (1) | EP1442090B1 (ja) |
| JP (1) | JP4242771B2 (ja) |
| CN (1) | CN1256396C (ja) |
| AT (1) | ATE437932T1 (ja) |
| BR (1) | BR0213751B1 (ja) |
| CA (1) | CA2462454C (ja) |
| DE (1) | DE60233153D1 (ja) |
| ES (1) | ES2330926T3 (ja) |
| WO (1) | WO2003040251A1 (ja) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060261312A1 (en) * | 2003-05-28 | 2006-11-23 | Lonza Inc. | Quaternary ammonium salts containing non-halogen anions as anticorrosive agents |
| WO2004108790A1 (ja) * | 2003-06-04 | 2004-12-16 | Sekisui Chemical Co., Ltd. | 硬化性樹脂組成物、液晶表示素子用シール剤及び液晶表示素子 |
| US20060240198A1 (en) * | 2003-06-04 | 2006-10-26 | Sekisui Chemical Co., Ltd. | Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| US20060182949A1 (en) | 2005-02-17 | 2006-08-17 | 3M Innovative Properties Company | Surfacing and/or joining method |
| US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
| US7405246B2 (en) * | 2005-04-05 | 2008-07-29 | Momentive Performance Materials Inc. | Cure system, adhesive system, electronic device |
| ATE534703T1 (de) * | 2005-08-24 | 2011-12-15 | Henkel Kgaa | Epoxidzusammensetzungen mit verbesserter schlagzähigkeit |
| ES2691528T3 (es) | 2006-07-31 | 2018-11-27 | Henkel Ag & Co. Kgaa | Composiciones adhesivas basadas en resina epoxi curable |
| CA2665551A1 (en) * | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
| EP2083865A2 (en) | 2006-10-12 | 2009-08-05 | C-3 International, Llc | Methods for providing prophylactic surface treatment for fluid processing systems and components thereof |
| US20080199642A1 (en) * | 2007-02-16 | 2008-08-21 | James Barlow | Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular |
| US20090011247A1 (en) | 2007-07-02 | 2009-01-08 | Oil States Industries, Inc. | Molded Composite Mandrel for a Downhole Zonal Isolation Tool |
| GB0717867D0 (en) * | 2007-09-14 | 2007-10-24 | 3M Innovative Properties Co | Flexible epoxy-based compositions |
| JP2009096851A (ja) * | 2007-10-15 | 2009-05-07 | Three M Innovative Properties Co | 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法 |
| US20110027592A1 (en) * | 2007-10-26 | 2011-02-03 | Attila Molnar | Aqueous binder or sizing composition |
| KR101482294B1 (ko) * | 2007-10-30 | 2015-01-13 | 헨켈 아게 운트 코 카게아아 | 워시-오프 저항성 에폭시 페이스트 접착제 |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| US8623301B1 (en) | 2008-04-09 | 2014-01-07 | C3 International, Llc | Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same |
| US20100192321A1 (en) * | 2009-01-30 | 2010-08-05 | 3M Innovative Properties Company | Hair and lint cleaning tool |
| EP2475730B1 (en) * | 2009-09-11 | 2014-10-08 | 3M Innovative Properties Company | Curable and cured adhesive compositions |
| GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
| EP2534723A4 (en) | 2010-02-10 | 2015-08-05 | Fcet Inc | LOW TEMPERATURE ELECTROLYTE FOR SOLID FUEL CELLS WITH HIGH ION CONDUCTIVITY |
| CN103153604B (zh) | 2010-03-04 | 2016-04-13 | 泽菲罗斯公司 | 结构复合层压板 |
| WO2012088693A1 (en) * | 2010-12-30 | 2012-07-05 | Dow Global Technologies Llc | Exterior thermal insulation system |
| US8840750B2 (en) | 2012-02-29 | 2014-09-23 | United Technologies Corporation | Method of bonding a leading edge sheath to a blade body of a fan blade |
| US20140299268A1 (en) * | 2013-04-09 | 2014-10-09 | The Boeing Company | Thermally Curable Bonding Film Adhesive with Uniform Thickness |
| EP3022792A4 (en) | 2013-07-15 | 2016-12-21 | Fcet Inc | LOW TEMPERATURE solid oxide fuel cells |
| EP3024871B1 (en) | 2013-07-26 | 2022-12-07 | Zephyros Inc. | Thermosetting adhesive films including a fibrous carrier |
| US10087707B2 (en) | 2013-09-12 | 2018-10-02 | Weatherford Technology Holdings, Llc | Molded composite slip of sheet molded compound for downhole tool |
| GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
| CN104388028A (zh) * | 2014-12-01 | 2015-03-04 | 南京大学 | 一种韧性耐高温环氧树脂粘合剂 |
| TWI600674B (zh) * | 2016-04-15 | 2017-10-01 | 南亞塑膠工業股份有限公司 | 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用 |
| US11485881B2 (en) | 2017-12-15 | 2022-11-01 | 3M Innovative Properties Company | High temperature structural adhesive films |
| WO2020003122A1 (en) * | 2018-06-27 | 2020-01-02 | 3M Innovative Properties Company | Curable compositions and related methods |
| EP3873963B1 (en) * | 2018-10-31 | 2024-03-13 | 3M Innovative Properties Company | Curable adhesive, bonding film, and method of bonding the same |
| CN115916862A (zh) * | 2020-07-13 | 2023-04-04 | 汉高股份有限及两合公司 | 用于铜粘合的导电环氧树脂组合物 |
| CN112063344A (zh) * | 2020-08-07 | 2020-12-11 | 江苏东邦科技有限公司 | 用于汽车内装的高韧性低挥发接着剂及接着剂膜 |
| WO2022133880A1 (en) * | 2020-12-24 | 2022-06-30 | Sika Technology Ag | One-component thermosetting epoxy adhesive with improved adhesion at high temperatures |
| WO2023168177A1 (en) * | 2022-03-03 | 2023-09-07 | Henkel Ag & Co. Kgaa | Epoxy structural adhesives resistant to uncured and cured humidity exposure |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB814695A (ja) | 1956-05-17 | |||
| US3449280A (en) | 1960-04-27 | 1969-06-10 | Minnesota Mining & Mfg | Adhesive composition containing high molecular weight polyamides,epoxy resins and curing agents |
| US3298998A (en) | 1961-03-07 | 1967-01-17 | Eastman Kodak Co | Bisglycidyl ethers of bisphenols |
| US3316195A (en) | 1961-11-13 | 1967-04-25 | Raybestos Manhattan Inc | Curable binder composition comprising epoxy resin, curing agent, and polymeric latex |
| US3332908A (en) | 1965-02-08 | 1967-07-25 | Union Carbide Corp | Glycidyl ethers |
| US3894112A (en) | 1969-10-31 | 1975-07-08 | Minnesota Mining & Mfg | Bonding film containing polytetramethyleneoxide elastomeric segments and polyepoxide |
| US3833683A (en) | 1970-12-21 | 1974-09-03 | Ford Motor Co | Rubber-modified thermosets and process i |
| US3707583A (en) | 1971-06-04 | 1972-12-26 | Minnesota Mining & Mfg | Adhesive |
| BE793030A (fr) | 1971-12-20 | 1973-04-16 | Goodrich Co B F | Procede pour la realisation de matieres plastiques de resine epoxy |
| US3864426A (en) | 1973-05-23 | 1975-02-04 | Union Carbide Corp | Thermal shock resistant epoxy compositions |
| US3856883A (en) | 1973-05-29 | 1974-12-24 | Ford Motor Co | Graded rubber particles having hydroxy functionality and a polymeric crosslinking agent |
| US4331582A (en) | 1980-01-14 | 1982-05-25 | Hitco | Epoxy latent catalyst |
| US4521490A (en) | 1983-08-11 | 1985-06-04 | Minnesota Mining And Manufacturing Co. | Two-part epoxy composition |
| US4704331A (en) | 1984-07-18 | 1987-11-03 | Minnesota Mining And Manufacturing Company | Method for adhering surfaces using fast curing epoxy resin compositions |
| CA1264476A (en) * | 1985-05-30 | 1990-01-16 | William J. Schultz | Epoxy resin curing agent, process, and composition |
| US4684678A (en) | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
| US4904360A (en) | 1986-09-12 | 1990-02-27 | Minnesota Mining And Manufacturing Company | Water-compatible coating composition |
| US4980234A (en) | 1987-12-23 | 1990-12-25 | Minnesota Mining And Manufacturing Co. | Epoxide resin compositions and method |
| JP2643706B2 (ja) * | 1991-11-26 | 1997-08-20 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及び半導体装置 |
| JPH07165880A (ja) | 1993-12-14 | 1995-06-27 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物 |
| JP3821870B2 (ja) | 1994-10-07 | 2006-09-13 | スリーエム カンパニー | 難燃性熱硬化性樹脂組成物 |
| JPH08291278A (ja) | 1995-04-21 | 1996-11-05 | Minnesota Mining & Mfg Co <3M> | ホットメルト接着剤組成物及び接着性フィルム |
| JPH098178A (ja) | 1995-06-14 | 1997-01-10 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
| US6180696B1 (en) | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| US6294270B1 (en) | 1998-12-23 | 2001-09-25 | 3M Innovative Properties Company | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| JP2001064483A (ja) * | 1999-08-27 | 2001-03-13 | Sumitomo Bakelite Co Ltd | 液晶表示素子用シール材組成物 |
| US6379799B1 (en) | 2000-06-29 | 2002-04-30 | Cytec Technology Corp. | Low moisture absorption epoxy resin systems with alkylated diamine hardeners |
-
2001
- 2001-11-08 US US10/005,556 patent/US6624213B2/en not_active Expired - Lifetime
-
2002
- 2002-09-23 DE DE60233153T patent/DE60233153D1/de not_active Expired - Lifetime
- 2002-09-23 WO PCT/US2002/030155 patent/WO2003040251A1/en active Application Filing
- 2002-09-23 EP EP02778311A patent/EP1442090B1/en not_active Expired - Lifetime
- 2002-09-23 BR BRPI0213751-8A patent/BR0213751B1/pt not_active IP Right Cessation
- 2002-09-23 ES ES02778311T patent/ES2330926T3/es not_active Expired - Lifetime
- 2002-09-23 CN CN02822191.5A patent/CN1256396C/zh not_active Expired - Fee Related
- 2002-09-23 JP JP2003542292A patent/JP4242771B2/ja not_active Expired - Fee Related
- 2002-09-23 CA CA002462454A patent/CA2462454C/en not_active Expired - Fee Related
- 2002-09-23 AT AT02778311T patent/ATE437932T1/de not_active IP Right Cessation
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