JP2005506447A5 - - Google Patents
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- Publication number
- JP2005506447A5 JP2005506447A5 JP2003536487A JP2003536487A JP2005506447A5 JP 2005506447 A5 JP2005506447 A5 JP 2005506447A5 JP 2003536487 A JP2003536487 A JP 2003536487A JP 2003536487 A JP2003536487 A JP 2003536487A JP 2005506447 A5 JP2005506447 A5 JP 2005506447A5
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- bath
- electroplating
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 claims 10
- 238000007747 plating Methods 0.000 claims 6
- 239000003792 electrolyte Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000005192 partition Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34441701P | 2001-10-19 | 2001-10-19 | |
| PCT/US2002/033530 WO2003033770A2 (en) | 2001-10-19 | 2002-10-21 | System and method for electrolytic plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005506447A JP2005506447A (ja) | 2005-03-03 |
| JP2005506447A5 true JP2005506447A5 (OSRAM) | 2005-12-22 |
Family
ID=23350458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003536487A Pending JP2005506447A (ja) | 2001-10-19 | 2002-10-21 | 電解メッキ用システムおよび方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6818115B2 (OSRAM) |
| EP (1) | EP1438446B1 (OSRAM) |
| JP (1) | JP2005506447A (OSRAM) |
| KR (1) | KR100660086B1 (OSRAM) |
| CN (3) | CN101570873B (OSRAM) |
| AU (1) | AU2002349972B2 (OSRAM) |
| ES (1) | ES2449076T3 (OSRAM) |
| WO (1) | WO2003033770A2 (OSRAM) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4759834B2 (ja) * | 2001-04-25 | 2011-08-31 | 凸版印刷株式会社 | フィルムキャリア用電気めっき装置 |
| US20050061660A1 (en) * | 2002-10-18 | 2005-03-24 | Kempen Hein Van | System and method for electrolytic plating |
| EP1903129A1 (en) * | 2003-11-20 | 2008-03-26 | Process Automation International Limited | A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus |
| US7947161B2 (en) * | 2004-03-19 | 2011-05-24 | Faraday Technology, Inc. | Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes |
| US7553401B2 (en) * | 2004-03-19 | 2009-06-30 | Faraday Technology, Inc. | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
| JP2011256444A (ja) * | 2010-06-10 | 2011-12-22 | Sumitomo Bakelite Co Ltd | 基板の処理方法および処理装置 |
| NL2005480C2 (nl) * | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
| CN103590079A (zh) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | 一种电镀方法 |
| CN103320844A (zh) * | 2013-05-16 | 2013-09-25 | 陈焕宗 | 一种电镀工艺的面铜控制装置 |
| KR101457060B1 (ko) * | 2014-04-30 | 2014-10-31 | (주)네오피엠씨 | 진동전달기능을 갖는 도금장치 |
| CN105862098B (zh) * | 2016-06-22 | 2018-01-12 | 苏州翔邦达机电有限公司 | 适用于pcb板电镀的浮架系统 |
| JP2020147831A (ja) * | 2019-03-15 | 2020-09-17 | 三菱マテリアル株式会社 | 電解めっき装置、及び、電解めっき方法 |
| WO2021071885A1 (en) * | 2019-10-08 | 2021-04-15 | Applied Materials, Inc. | Mechanically-driven oscillating flow agitation |
| CN112822873A (zh) * | 2019-11-15 | 2021-05-18 | 宇泰和股份有限公司 | 高纵深比电路板通孔化学处理/电化学处理装置 |
| CN112111779A (zh) * | 2020-09-04 | 2020-12-22 | 深圳市欣佳宏科技有限公司 | 线路板电镀电源无线感应飞巴机构及电源无线感应方法 |
| KR102751572B1 (ko) * | 2024-05-23 | 2025-01-09 | (주)티피에스일렉콤 | 피도금물의 도금 품질 개선 및 광택 저하 방지를 위한 도금장치 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3015282C2 (de) * | 1980-04-21 | 1986-07-17 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum partiellen Galvanisieren von leitenden oder leitend gemachten Oberflächen |
| US4634503A (en) * | 1984-06-27 | 1987-01-06 | Daniel Nogavich | Immersion electroplating system |
| US4696729A (en) * | 1986-02-28 | 1987-09-29 | International Business Machines | Electroplating cell |
| JPH04500838A (ja) * | 1988-10-25 | 1992-02-13 | ベロルススキ ポリテフニチェスキ インスティテュト | 電気化学加工のための装置 |
| US4879007B1 (en) * | 1988-12-12 | 1999-05-25 | Process Automation Int L Ltd | Shield for plating bath |
| DE4106733A1 (de) * | 1991-03-02 | 1992-09-03 | Schering Ag | Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii) |
| DE4337724A1 (de) * | 1993-11-05 | 1995-05-11 | Hoellmueller Maschbau H | Vorrichtung zur Beschichtung der Wandung von Bohrungen in elektrischen Leiterplatten oder Multilayern |
| JP2002121699A (ja) * | 2000-05-25 | 2002-04-26 | Nippon Techno Kk | めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法 |
| US20030010625A1 (en) * | 2001-07-16 | 2003-01-16 | Gramarossa Daniel J. | Processing cells for wafers and other planar articles |
-
2002
- 2002-10-18 US US10/273,820 patent/US6818115B2/en not_active Expired - Lifetime
- 2002-10-21 WO PCT/US2002/033530 patent/WO2003033770A2/en not_active Ceased
- 2002-10-21 CN CN2009101458143A patent/CN101570873B/zh not_active Expired - Fee Related
- 2002-10-21 KR KR1020047005787A patent/KR100660086B1/ko not_active Expired - Fee Related
- 2002-10-21 CN CNA2006101467242A patent/CN1962956A/zh active Pending
- 2002-10-21 AU AU2002349972A patent/AU2002349972B2/en not_active Ceased
- 2002-10-21 EP EP02786452A patent/EP1438446B1/en not_active Expired - Lifetime
- 2002-10-21 ES ES02786452.9T patent/ES2449076T3/es not_active Expired - Lifetime
- 2002-10-21 CN CNB028203887A patent/CN100523305C/zh not_active Expired - Fee Related
- 2002-10-21 JP JP2003536487A patent/JP2005506447A/ja active Pending
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