JP2005505895A5 - - Google Patents
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- Publication number
- JP2005505895A5 JP2005505895A5 JP2003534363A JP2003534363A JP2005505895A5 JP 2005505895 A5 JP2005505895 A5 JP 2005505895A5 JP 2003534363 A JP2003534363 A JP 2003534363A JP 2003534363 A JP2003534363 A JP 2003534363A JP 2005505895 A5 JP2005505895 A5 JP 2005505895A5
- Authority
- JP
- Japan
- Prior art keywords
- boron
- mixtures
- group
- containing reactant
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 8
- 229910052796 boron Inorganic materials 0.000 claims 8
- 239000000376 reactant Substances 0.000 claims 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims 2
- 229910020599 Co 3 O 4 Inorganic materials 0.000 claims 2
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 claims 2
- 229910005793 GeO 2 Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910006404 SnO 2 Inorganic materials 0.000 claims 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 229910052810 boron oxide Inorganic materials 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229910052703 rhodium Inorganic materials 0.000 claims 2
- 239000010948 rhodium Substances 0.000 claims 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32815301P | 2001-10-09 | 2001-10-09 | |
| PCT/US2002/033469 WO2003031373A2 (en) | 2001-10-09 | 2002-10-08 | Thick film conductor compositions for use on aluminum nitride substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005505895A JP2005505895A (ja) | 2005-02-24 |
| JP2005505895A5 true JP2005505895A5 (https=) | 2006-01-05 |
| JP4351050B2 JP4351050B2 (ja) | 2009-10-28 |
Family
ID=23279742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003534363A Expired - Fee Related JP4351050B2 (ja) | 2001-10-09 | 2002-10-08 | 窒化アルミニウム基板上で使用するための厚膜導体組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20040245508A1 (https=) |
| EP (1) | EP1434750B1 (https=) |
| JP (1) | JP4351050B2 (https=) |
| KR (1) | KR100585909B1 (https=) |
| CN (1) | CN1307124C (https=) |
| AT (1) | ATE334949T1 (https=) |
| AU (1) | AU2002356830A1 (https=) |
| DE (1) | DE60213628T2 (https=) |
| WO (1) | WO2003031373A2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7494607B2 (en) * | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
| US7611645B2 (en) * | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
| US20070023388A1 (en) * | 2005-07-28 | 2007-02-01 | Nair Kumaran M | Conductor composition for use in LTCC photosensitive tape on substrate applications |
| JP2010500779A (ja) * | 2006-08-11 | 2010-01-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | デバイスチップキャリア、モジュールおよびその製造方法 |
| US7704416B2 (en) * | 2007-06-29 | 2010-04-27 | E.I. Du Pont De Nemours And Company | Conductor paste for ceramic substrate and electric circuit |
| KR100954722B1 (ko) | 2008-07-04 | 2010-04-23 | (주) 아모엘이디 | ＡｌＮ기판의 전극 재료와 ＡｌＮ기판에 전극을 형성하는방법 및 ＡｌＮ기판 |
| US9351398B2 (en) | 2013-04-04 | 2016-05-24 | GM Global Technology Operations LLC | Thick film conductive inks for electronic devices |
| CN107211535B (zh) * | 2015-01-13 | 2019-08-16 | 日本特殊陶业株式会社 | 电路基板和其制造方法 |
| CN113470865B (zh) * | 2021-09-06 | 2021-12-21 | 西安宏星电子浆料科技股份有限公司 | 一种氮化铝用环保型银导体浆料 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3929674A (en) * | 1974-06-03 | 1975-12-30 | Du Pont | Boride-containing metallizations |
| US4322316A (en) * | 1980-08-22 | 1982-03-30 | Ferro Corporation | Thick film conductor employing copper oxide |
| FR2490210A1 (fr) * | 1980-09-15 | 1982-03-19 | Labo Electronique Physique | Melange de depart pour une composition fortement resistante, encre serigraphiable constituee avec et circuits electriques ainsi realises |
| GB2152060B (en) * | 1983-12-02 | 1987-05-13 | Osaka Soda Co Ltd | Electrically conductive adhesive composition |
| US4877760A (en) * | 1985-05-22 | 1989-10-31 | Ngk Spark Plug Co., Ltd. | Aluminum nitride sintered body with high thermal conductivity and process for producing same |
| JPS6265991A (ja) * | 1985-09-13 | 1987-03-25 | 株式会社東芝 | 高熱伝導性セラミツクス基板 |
| US5089172A (en) * | 1987-08-31 | 1992-02-18 | Ferro Corporation | Thick film conductor compositions for use with an aluminum nitride substrate |
| US5298330A (en) * | 1987-08-31 | 1994-03-29 | Ferro Corporation | Thick film paste compositions for use with an aluminum nitride substrate |
| US4906404A (en) * | 1988-11-07 | 1990-03-06 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Copper conductor composition |
| JPH03246901A (ja) * | 1990-02-23 | 1991-11-05 | Hitachi Ltd | 厚膜抵抗組成物、該組成物を用いたハイブリッドｉｃおよびその製法 |
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| US5637261A (en) * | 1994-11-07 | 1997-06-10 | The Curators Of The University Of Missouri | Aluminum nitride-compatible thick-film binder glass and thick-film paste composition |
| JP3927250B2 (ja) * | 1995-08-16 | 2007-06-06 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 窒化アルミニウム基板用厚膜導体ペースト組成物 |
| JP4161423B2 (ja) * | 1997-10-30 | 2008-10-08 | 住友電気工業株式会社 | 窒化アルミニウム焼結体及びそのメタライズ基板 |
| JP3228923B2 (ja) * | 2000-01-18 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
-
2002
- 2002-10-08 CN CNB028197828A patent/CN1307124C/zh not_active Expired - Fee Related
- 2002-10-08 WO PCT/US2002/033469 patent/WO2003031373A2/en not_active Ceased
- 2002-10-08 AT AT02801065T patent/ATE334949T1/de not_active IP Right Cessation
- 2002-10-08 JP JP2003534363A patent/JP4351050B2/ja not_active Expired - Fee Related
- 2002-10-08 US US10/488,844 patent/US20040245508A1/en not_active Abandoned
- 2002-10-08 KR KR1020047005129A patent/KR100585909B1/ko not_active Expired - Fee Related
- 2002-10-08 AU AU2002356830A patent/AU2002356830A1/en not_active Abandoned
- 2002-10-08 EP EP02801065A patent/EP1434750B1/en not_active Expired - Lifetime
- 2002-10-08 DE DE60213628T patent/DE60213628T2/de not_active Expired - Lifetime
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