CN1307124C - 用于氮化铝基片上的厚膜导体组合物 - Google Patents

用于氮化铝基片上的厚膜导体组合物 Download PDF

Info

Publication number
CN1307124C
CN1307124C CNB028197828A CN02819782A CN1307124C CN 1307124 C CN1307124 C CN 1307124C CN B028197828 A CNB028197828 A CN B028197828A CN 02819782 A CN02819782 A CN 02819782A CN 1307124 C CN1307124 C CN 1307124C
Authority
CN
China
Prior art keywords
composition
mixture
weight parts
organic medium
metal oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028197828A
Other languages
English (en)
Chinese (zh)
Other versions
CN1564794A (zh
Inventor
Y·王
A·F·卡罗尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN1564794A publication Critical patent/CN1564794A/zh
Application granted granted Critical
Publication of CN1307124C publication Critical patent/CN1307124C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5105—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the noble metals or copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5111—Ag, Au, Pd, Pt or Cu
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5116—Ag or Au
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Paints Or Removers (AREA)
  • Inorganic Insulating Materials (AREA)
  • Glass Compositions (AREA)
CNB028197828A 2001-10-09 2002-10-08 用于氮化铝基片上的厚膜导体组合物 Expired - Fee Related CN1307124C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32815301P 2001-10-09 2001-10-09
US60/328,153 2001-10-09

Publications (2)

Publication Number Publication Date
CN1564794A CN1564794A (zh) 2005-01-12
CN1307124C true CN1307124C (zh) 2007-03-28

Family

ID=23279742

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028197828A Expired - Fee Related CN1307124C (zh) 2001-10-09 2002-10-08 用于氮化铝基片上的厚膜导体组合物

Country Status (9)

Country Link
US (1) US20040245508A1 (https=)
EP (1) EP1434750B1 (https=)
JP (1) JP4351050B2 (https=)
KR (1) KR100585909B1 (https=)
CN (1) CN1307124C (https=)
AT (1) ATE334949T1 (https=)
AU (1) AU2002356830A1 (https=)
DE (1) DE60213628T2 (https=)
WO (1) WO2003031373A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US7611645B2 (en) * 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
US20070023388A1 (en) * 2005-07-28 2007-02-01 Nair Kumaran M Conductor composition for use in LTCC photosensitive tape on substrate applications
JP2010500779A (ja) * 2006-08-11 2010-01-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー デバイスチップキャリア、モジュールおよびその製造方法
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
KR100954722B1 (ko) 2008-07-04 2010-04-23 (주) 아모엘이디 ＡｌＮ기판의 전극 재료와 ＡｌＮ기판에 전극을 형성하는방법 및 ＡｌＮ기판
US9351398B2 (en) 2013-04-04 2016-05-24 GM Global Technology Operations LLC Thick film conductive inks for electronic devices
CN107211535B (zh) * 2015-01-13 2019-08-16 日本特殊陶业株式会社 电路基板和其制造方法
CN113470865B (zh) * 2021-09-06 2021-12-21 西安宏星电子浆料科技股份有限公司 一种氮化铝用环保型银导体浆料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322316A (en) * 1980-08-22 1982-03-30 Ferro Corporation Thick film conductor employing copper oxide
EP0913371A2 (en) * 1997-10-30 1999-05-06 Sumitomo Electric Industries, Ltd. Sintered aluminum nitride body and metallized substrate prepared therefrom

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929674A (en) * 1974-06-03 1975-12-30 Du Pont Boride-containing metallizations
FR2490210A1 (fr) * 1980-09-15 1982-03-19 Labo Electronique Physique Melange de depart pour une composition fortement resistante, encre serigraphiable constituee avec et circuits electriques ainsi realises
GB2152060B (en) * 1983-12-02 1987-05-13 Osaka Soda Co Ltd Electrically conductive adhesive composition
US4877760A (en) * 1985-05-22 1989-10-31 Ngk Spark Plug Co., Ltd. Aluminum nitride sintered body with high thermal conductivity and process for producing same
JPS6265991A (ja) * 1985-09-13 1987-03-25 株式会社東芝 高熱伝導性セラミツクス基板
US5089172A (en) * 1987-08-31 1992-02-18 Ferro Corporation Thick film conductor compositions for use with an aluminum nitride substrate
US5298330A (en) * 1987-08-31 1994-03-29 Ferro Corporation Thick film paste compositions for use with an aluminum nitride substrate
US4906404A (en) * 1988-11-07 1990-03-06 Dai-Ichi Kogyo Seiyaku Co., Ltd. Copper conductor composition
JPH03246901A (ja) * 1990-02-23 1991-11-05 Hitachi Ltd 厚膜抵抗組成物、該組成物を用いたハイブリッドｉｃおよびその製法
US6074893A (en) * 1993-09-27 2000-06-13 Sumitomo Metal Industries, Ltd. Process for forming fine thick-film conductor patterns
US5637261A (en) * 1994-11-07 1997-06-10 The Curators Of The University Of Missouri Aluminum nitride-compatible thick-film binder glass and thick-film paste composition
JP3927250B2 (ja) * 1995-08-16 2007-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 窒化アルミニウム基板用厚膜導体ペースト組成物
JP3228923B2 (ja) * 2000-01-18 2001-11-12 イビデン株式会社 半導体製造・検査装置用セラミックヒータ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322316A (en) * 1980-08-22 1982-03-30 Ferro Corporation Thick film conductor employing copper oxide
EP0913371A2 (en) * 1997-10-30 1999-05-06 Sumitomo Electric Industries, Ltd. Sintered aluminum nitride body and metallized substrate prepared therefrom

Also Published As

Publication number Publication date
WO2003031373A3 (en) 2003-08-21
DE60213628D1 (de) 2006-09-14
AU2002356830A1 (en) 2003-04-22
JP4351050B2 (ja) 2009-10-28
WO2003031373B1 (en) 2004-07-08
EP1434750A2 (en) 2004-07-07
JP2005505895A (ja) 2005-02-24
DE60213628T2 (de) 2007-10-11
US20040245508A1 (en) 2004-12-09
CN1564794A (zh) 2005-01-12
WO2003031373A2 (en) 2003-04-17
KR20040068118A (ko) 2004-07-30
KR100585909B1 (ko) 2006-06-07
ATE334949T1 (de) 2006-08-15
EP1434750B1 (en) 2006-08-02

Similar Documents

Publication Publication Date Title
US5250229A (en) Silver-rich conductor compositions for high thermal cycled and aged adhesion
TW200418221A (en) Terminal electrode compositions for multilayer ceramic capacitors
CN1096685C (zh) 用于氮化铝衬底的厚膜导体浆料组合物
JPH01128488A (ja) 厚膜銅導体インキ
JP4161423B2 (ja) 窒化アルミニウム焼結体及びそのメタライズ基板
CN1307124C (zh) 用于氮化铝基片上的厚膜导体组合物
GB2182048A (en) Copper conductive paint for porcelainized metal substrates
CN1873837A (zh) 用于微波应用中ltcc带的厚膜导电浆组合物
JPS6255805A (ja) 導体組成物
US7303698B2 (en) Thick film conductor case compositions for LTCC tape
CN1434462A (zh) 用于氮化铝衬底的无铅厚膜导体浆料组合物
US7731812B2 (en) Thick film conductor case compositions for LTCC tape
CN1500277A (zh) 导电性合成物在电路中的应用
JPS6253031B2 (https=)
KR100744855B1 (ko) 높은 열적 사이클 전도체 시스템
JP2004055558A (ja) 銅ペースト及びそれを用いた配線基板
IE52134B1 (en) Thick film conductor compositions
CN1511325A (zh) 导体合成物及其应用
JP2941002B2 (ja) 導体組成物
JPS62186407A (ja) 導電性組成物
JP2002128581A (ja) 銅メタライズ組成物ならびにそれを用いたセラミック配線基板およびその製造方法
JPH0353405A (ja) 窒化アルミニウム焼結体用導電ペースト
JPH022244B2 (https=)
JPH0571198B2 (https=)
JPS6253032B2 (https=)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070328

Termination date: 20131008