JP2005353878A5 - - Google Patents

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Publication number
JP2005353878A5
JP2005353878A5 JP2004173745A JP2004173745A JP2005353878A5 JP 2005353878 A5 JP2005353878 A5 JP 2005353878A5 JP 2004173745 A JP2004173745 A JP 2004173745A JP 2004173745 A JP2004173745 A JP 2004173745A JP 2005353878 A5 JP2005353878 A5 JP 2005353878A5
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JP
Japan
Prior art keywords
mold
runner
resin
lead frame
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004173745A
Other languages
English (en)
Japanese (ja)
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JP2005353878A (ja
JP4454399B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2004173745A priority Critical patent/JP4454399B2/ja
Priority claimed from JP2004173745A external-priority patent/JP4454399B2/ja
Publication of JP2005353878A publication Critical patent/JP2005353878A/ja
Publication of JP2005353878A5 publication Critical patent/JP2005353878A5/ja
Application granted granted Critical
Publication of JP4454399B2 publication Critical patent/JP4454399B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2004173745A 2004-06-11 2004-06-11 半導体装置の製造方法 Expired - Fee Related JP4454399B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004173745A JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004173745A JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005353878A JP2005353878A (ja) 2005-12-22
JP2005353878A5 true JP2005353878A5 (da) 2007-07-26
JP4454399B2 JP4454399B2 (ja) 2010-04-21

Family

ID=35588077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004173745A Expired - Fee Related JP4454399B2 (ja) 2004-06-11 2004-06-11 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4454399B2 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5054923B2 (ja) * 2006-01-23 2012-10-24 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
JP7121835B1 (ja) 2021-06-25 2022-08-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

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