JP2005353839A5 - - Google Patents

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Publication number
JP2005353839A5
JP2005353839A5 JP2004172895A JP2004172895A JP2005353839A5 JP 2005353839 A5 JP2005353839 A5 JP 2005353839A5 JP 2004172895 A JP2004172895 A JP 2004172895A JP 2004172895 A JP2004172895 A JP 2004172895A JP 2005353839 A5 JP2005353839 A5 JP 2005353839A5
Authority
JP
Japan
Prior art keywords
bonding apparatus
axis
moving table
motor
mover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004172895A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353839A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004172895A priority Critical patent/JP2005353839A/ja
Priority claimed from JP2004172895A external-priority patent/JP2005353839A/ja
Priority to TW094112334A priority patent/TW200603298A/zh
Priority to KR1020050039663A priority patent/KR100648492B1/ko
Priority to US11/150,415 priority patent/US20050274771A1/en
Publication of JP2005353839A publication Critical patent/JP2005353839A/ja
Publication of JP2005353839A5 publication Critical patent/JP2005353839A5/ja
Pending legal-status Critical Current

Links

JP2004172895A 2004-06-10 2004-06-10 ボンディング装置 Pending JP2005353839A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置
TW094112334A TW200603298A (en) 2004-06-10 2005-04-19 Bonding equipment
KR1020050039663A KR100648492B1 (ko) 2004-06-10 2005-05-12 본딩 장치
US11/150,415 US20050274771A1 (en) 2004-06-10 2005-06-10 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置

Publications (2)

Publication Number Publication Date
JP2005353839A JP2005353839A (ja) 2005-12-22
JP2005353839A5 true JP2005353839A5 (cg-RX-API-DMAC7.html) 2006-09-21

Family

ID=35459461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004172895A Pending JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置

Country Status (4)

Country Link
US (1) US20050274771A1 (cg-RX-API-DMAC7.html)
JP (1) JP2005353839A (cg-RX-API-DMAC7.html)
KR (1) KR100648492B1 (cg-RX-API-DMAC7.html)
TW (1) TW200603298A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
CN103624192B (zh) * 2013-11-07 2015-09-02 深圳市综科邦达机电设备有限公司 焊线机
CN103612036B (zh) * 2013-11-13 2015-06-17 深圳市综科邦达机电设备有限公司 焊线机
KR102622020B1 (ko) * 2021-02-22 2024-01-08 가부시키가이샤 신가와 와이어 본딩 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH636740A5 (fr) * 1980-05-19 1983-06-15 Far Fab Assortiments Reunies Dispositif pour l'alignement d'une piece et d'un substrat.
JPH1110467A (ja) * 1997-06-18 1999-01-19 Yaskawa Electric Corp Ｘｙテーブル
JP3454234B2 (ja) * 1999-09-27 2003-10-06 日産自動車株式会社 分割コアモータ
JP4018057B2 (ja) * 2003-03-31 2007-12-05 株式会社新川 ボンディング装置

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