JP2005350698A - Electroplating method for box-shaped work, electroplating device, and holder for electroplating - Google Patents

Electroplating method for box-shaped work, electroplating device, and holder for electroplating Download PDF

Info

Publication number
JP2005350698A
JP2005350698A JP2004170522A JP2004170522A JP2005350698A JP 2005350698 A JP2005350698 A JP 2005350698A JP 2004170522 A JP2004170522 A JP 2004170522A JP 2004170522 A JP2004170522 A JP 2004170522A JP 2005350698 A JP2005350698 A JP 2005350698A
Authority
JP
Japan
Prior art keywords
bag
support member
workpiece
plating
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004170522A
Other languages
Japanese (ja)
Inventor
Kiyoshi Kida
潔 木田
Yoji Nakagawa
洋二 中川
Hidemi Ishikawa
秀美 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kidaseiko KK
Sugiura Seisakusho Co Ltd
Original Assignee
Kidaseiko KK
Sugiura Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kidaseiko KK, Sugiura Seisakusho Co Ltd filed Critical Kidaseiko KK
Priority to JP2004170522A priority Critical patent/JP2005350698A/en
Publication of JP2005350698A publication Critical patent/JP2005350698A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroplating method for a box-shaped work with which, in the case the inside face of a box-shaped work such as a box nut is subjected to surface treatment, a satisfactory plating film is formed, to provide an electroplating device, and to provide a holder for electroplating. <P>SOLUTION: The holder for electroplating is provided with: a base part having a through hole piercing from the upper face to the lower face; a first supporting member extended from the upper face on the through hole in the base part; a second member guiding part extended from the base part; a second supporting member which has insertion holes into which the first supporting member and the second member guiding part are inserted and can slide along the second member guiding part; and a supporting part supporting the second member guiding part. The first supporting member can support a box-shaped work in a state of thrusting up the inside face thereof, and external plating is performed in this state. Further, the second supporting member can support the box-shaped work in a seated state, and internal plating is performed in this state. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、袋状空間を有する袋状ワークにめっき処理を施すための袋状ワークの電解めっき方法、電解めっき装置、および電解めっき用保持具に関する。   The present invention relates to a bag-shaped workpiece electroplating method, an electrolytic plating apparatus, and a holder for electrolytic plating for plating a bag-shaped workpiece having a bag-shaped space.

袋状ワーク、例えば、袋ナットの表面に電解めっき等の処理を施すことが行われている。袋状のワークの外面、内面に、酸電解(焼入後のスケール取り)や電解めっき等の処理を施す場合は、いわば魚の骨を逆さ吊りしたような浸漬保持具を用いる場合が多い。その浸漬保持具のそれぞれの枝部に、1個ずつ袋ナットをその開口から取り付けることにより、多数の袋ナットをそれぞれが斜め上を向く状態(開口部が斜め下を向く状態)でツリー状に保持し、その保持具を多数の袋ナットとともに酸電解槽(硫酸液等を主体とする)やめっき槽等に浸漬して脱スケール処理やめっき処理等を行っている(特許文献1)。   The surface of a bag-like workpiece, for example, a cap nut, is subjected to a treatment such as electrolytic plating. When the outer surface and the inner surface of the bag-shaped workpiece are subjected to treatment such as acid electrolysis (scaling after quenching) or electrolytic plating, a so-called immersion holder in which a fish bone is suspended upside down is often used. By attaching one cap nut to each branch part of the immersion holder from its opening, a large number of cap nuts are in a tree shape with each facing upward (the opening is inclined downward). The holding tool is dipped in an acid electrolysis tank (mainly sulfuric acid solution or the like), a plating tank or the like together with a number of cap nuts to perform descaling or plating (Patent Document 1).

図21は、袋ナットを保持してめっき槽等に浸漬するための従来の浸漬保持具を概念的に示す。(a)は、浸漬保持具201の正面図である。浸漬保持具201は、本体フレーム部から斜め上を向く形状に支持竿部202が形成されている。この支持竿部202に袋ナット1の開口部を差し込む形態で、浸漬保持具201に袋ナット1を保持させる。図21(b)は、浸漬保持具201をめっき槽215に浸漬させたところを示す。図は、浸漬保持具201の側面を示している。このように浸漬保持具201に袋状ナット1を保持させた状態で、めっき槽215等に浸漬して、外面および内面の表面処理を行っている。このとき、めっき槽215に電極211を設置し、正の電圧を印加し、浸漬保持具201には、負の電荷を印加することによって、袋ナット1の表面処理を行う。   FIG. 21 conceptually shows a conventional immersion holder for holding a cap nut and immersing it in a plating tank or the like. (A) is a front view of the immersion holder 201. FIG. The dipping holder 201 has a support collar 202 formed in a shape that faces obliquely upward from the main body frame. The dipping holder 201 holds the cap nut 1 in such a manner that the opening of the cap nut 1 is inserted into the support collar 202. FIG. 21 (b) shows the immersion holder 201 immersed in the plating tank 215. The figure shows the side of the immersion holder 201. In this manner, the bag-shaped nut 1 is held by the immersion holder 201 and immersed in the plating tank 215 or the like to perform the surface treatment of the outer surface and the inner surface. At this time, the electrode 211 is installed in the plating tank 215, a positive voltage is applied, and a negative charge is applied to the immersion holder 201 to perform the surface treatment of the cap nut 1.

特開2001−335994号公報JP 2001-335994 A

しかしながら、浸漬保持具201を多数の袋ナット1とともに例えばめっき槽215等の液槽に浸漬していく過程で、袋ナット1の閉ざされた空間(閉鎖空間)にはめっき液等の液が入り込むが、閉鎖空間内に閉じ込められる空気により液はその閉鎖空間に充満することはできず、袋ナットの内面には液と接触できない部分が残る。また電流のほとんどが袋ナット1の外面に流れて内面に流れにくい実状もある。つまりこのような方法によると、袋ナットの内面全体をめっき液等により処理することが難しい。   However, in the process of immersing the immersion holder 201 together with a number of cap nuts 1, for example, in a bath such as a plating bath 215, a solution such as a plating solution enters the closed space (closed space) of the cap nut 1. However, the liquid cannot be filled in the closed space by the air confined in the closed space, and a portion that cannot contact the liquid remains on the inner surface of the cap nut. In addition, there is a situation where most of the current flows to the outer surface of the cap nut 1 and hardly flows to the inner surface. That is, according to such a method, it is difficult to treat the entire inner surface of the cap nut with a plating solution or the like.

さらに図21の浸漬保持具201のように多段に支持竿部202を形成した場合、上段に保持された袋ナットと、下段に保持された袋ナットに形成されるめっき層の厚さが異なってしまう。これは、多段のため電流の流れ方が一様とはならないためで、下段の袋ナットに厚いめっき層が形成される。すなわち製品間にめっき厚のばらつきを生じることとなる。   Further, when the support collar 202 is formed in multiple stages as in the immersion holder 201 of FIG. 21, the thickness of the plating layer formed on the cap nut held on the upper stage and the cap nut held on the lower stage is different. End up. This is because the current flow is not uniform because of multiple stages, and a thick plating layer is formed on the lower cap nut. That is, the plating thickness varies between products.

そこで本発明の課題は、液槽に浸漬することにより、袋ナット等の袋状ワークの内面の表面処理を施す場合に、良好なめっき被膜を形成する袋状ワークの電解めっき方法、電解めっき装置、および電解めっき用保持具を提供することである。   Then, the subject of this invention is the electroplating method of a bag-shaped workpiece | work which forms a favorable plating film, and an electroplating apparatus, when surface-treating the inner surface of bag-shaped workpieces, such as a cap nut, by immersing in a liquid tank And providing a holder for electrolytic plating.

課題を解決するための手段および発明の効果Means for Solving the Problems and Effects of the Invention

上記課題を解決するための本発明の袋状ワークの電解めっき方法は、
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように保持するために、その袋状ワークの内面に当接して袋状ワークを突き上げ状態で支持する第1支持部材と、その第1支持部材に替わって袋状ワークを着座させて支持する第2支持部材とを用い、
袋状ワークを第2支持部材に着座させるとともに、第1支持部材の先端が袋状ワークの内面から離間させた状態で、かつ袋状ワークと当接した第2支持部材に陰極となる電圧を印加するとともに、袋状ワークの袋状空間に位置する又は前記袋状空間の開口部近傍に位置する第1支持部材に陽極となる電圧を印加した状態で、袋状ワークの少なくとも袋状空間内面に電解めっきを施す第1工程と、
その第1工程の前又は後に、袋状ワークをその内面に第1支持部材を当接させて突き上げ、袋状ワークを第2支持部材から離間させた状態で、かつ袋状ワークに当接した第1支持部材に陰極となる電圧を印加した状態で、袋状ワークの少なくとも外面に電解めっきを施す第2工程と、
を含む。
The electrolytic plating method of the bag-shaped workpiece of the present invention for solving the above problems is as follows.
First support for supporting the bag-shaped workpiece in a state of being pushed up by contacting the inner surface of the bag-shaped workpiece in order to hold the bag-shaped workpiece having the bag-shaped space in the plating solution so that the opening faces downward. Using a member and a second support member that supports the bag-shaped workpiece by sitting instead of the first support member,
While the bag-like workpiece is seated on the second support member, a voltage acting as a cathode is applied to the second support member in contact with the bag-like workpiece in a state where the tip of the first support member is separated from the inner surface of the bag-like workpiece. And applying at least the inner surface of the bag-shaped space to the first support member that is positioned in the bag-shaped space of the bag-shaped workpiece or in the vicinity of the opening of the bag-shaped space. A first step of performing electroplating on
Before or after the first step, the bag-like work is pushed up with the first support member abutting on the inner surface thereof, and the bag-like work is brought into contact with the bag-like work in a state of being separated from the second support member. A second step of applying electrolytic plating to at least the outer surface of the bag-like workpiece in a state where a voltage serving as a cathode is applied to the first support member;
including.

第1工程においては、袋状ワークを第2支持部材に着座させ、第1支持部材の先端を袋状ワークの内面から離間させた状態でめっき液に浸漬する。この状態において、第2支持部材に負の電圧、第1支持部材に正の電圧を印加することにより、袋状ワークが陰極となり、袋状空間内に離間して位置する又は袋状空間の開口部近傍に位置する第1支持部材が正極となるため、袋状ワーク内面に電流が効率よく流れ、袋状空間内のめっき液により、袋状空間をなす内面にめっき処理を良好に施すことができる。   In the first step, the bag-like work is seated on the second support member, and the tip of the first support member is immersed in the plating solution in a state of being separated from the inner surface of the bag-like work. In this state, when a negative voltage is applied to the second support member and a positive voltage is applied to the first support member, the bag-like workpiece becomes a cathode and is located apart in the bag-like space or opened in the bag-like space. Since the first support member located in the vicinity of the portion serves as a positive electrode, current can efficiently flow on the inner surface of the bag-shaped workpiece, and the inner surface forming the bag-shaped space can be satisfactorily plated with the plating solution in the bag-shaped space. it can.

第2工程においては、袋状ワークの内面を第1支持部材により突き上げた状態で支持し、第2支持部材を袋状ワークから離間させた状態でめっき液に浸漬する。この状態において第1支持部材に負の電圧を印加することにより、袋状ワークの外面をめっき処理することができる。なお袋状ワークの外部に離間した状態で電極を配置して、この電極に正の電圧を印加して外面めっき処理を行うとよい。また第2工程を第1工程の前に行ってもよい。   In the second step, the inner surface of the bag-shaped workpiece is supported while being pushed up by the first support member, and the second support member is immersed in the plating solution in a state of being separated from the bag-shaped workpiece. In this state, the outer surface of the bag-like workpiece can be plated by applying a negative voltage to the first support member. In addition, it is good to arrange | position an electrode in the state spaced apart from the bag-shaped workpiece | work, and to apply a positive voltage to this electrode, and to perform an outer surface plating process. Further, the second step may be performed before the first step.

上記課題を解決するための本発明の袋状ワークの電解めっき装置は、
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように、その袋状ワークの内面に当接して袋状ワークを突き上げ状態で支持する第1支持部材と、
その第1支持部材に替わって袋状ワークを着座させて支持する第2支持部材と、
袋状ワークが第2支持部材に着座するとともに、第1支持部材の先端が袋状ワークの内面から離間した第1位置と、袋状ワークをその内面に第1支持部材を当接させて突き上げ、袋状ワークを第2支持部材から離間させて支持する第2位置との間で、第1支持部材と第2支持部材との相対的な位置を変換する支持部材相対位置変換装置と、
第1位置において袋状ワークと当接した第2支持部材に陰極となる電圧を印加するとともに、袋状ワークの袋状空間に位置する又は前記袋状空間の開口部近傍に位置する第1支持部材に陽極となる電圧を印加する一方、第2位置において袋状ワークに当接した第1支持部材に陰極となる電圧を印加するように、少なくとも第1支持部材への電圧印加の極性を変換する電圧極性変換装置と、を含み、
袋状ワークが第2支持部材に着座し、袋状ワークの内面から第1支持部材が離間した第1位置において、電圧極性変換装置により第2支持部材に陰極となる電圧を印加するとともに、袋状ワークの袋状空間に位置する又は前記袋状空間の開口部近傍に位置する第1支持部材に陽極となる電圧を印加した状態で、袋状ワークの少なくとも袋状空間内面に電解めっきを施し、第1支持部材が袋状ワークをその内面に当接して突き上げ、袋状ワークを第2支持部材から離間させた第2位置において、電圧極性変換装置により袋状ワークに当接した第1支持部材に陰極となる電圧を印加した状態で、袋状ワークの少なくとも外面に電解めっきを施すことを特徴とする。
The electrolytic plating apparatus for bag-like workpieces of the present invention for solving the above problems is as follows.
A first support member that supports the bag-shaped workpiece in a state of pushing up by contacting the inner surface of the bag-shaped workpiece so that the opening of the bag-shaped workpiece having the bag-shaped space faces downward in the plating solution;
A second support member that seats and supports the bag-like workpiece instead of the first support member;
The bag-like workpiece is seated on the second support member, the first position where the tip of the first support member is separated from the inner surface of the bag-like workpiece, and the bag-like workpiece is pushed up by bringing the first support member into contact with the inner surface. A support member relative position conversion device that converts a relative position between the first support member and the second support member between a second position that supports the bag-like workpiece apart from the second support member, and
A voltage serving as a cathode is applied to the second support member in contact with the bag-like workpiece at the first position, and the first support is located in the bag-like space of the bag-like workpiece or in the vicinity of the opening of the bag-like space. The polarity of the voltage application to at least the first support member is changed so that the voltage to be the anode is applied to the member while the voltage to be the cathode is applied to the first support member that is in contact with the bag-like workpiece at the second position. A voltage polarity conversion device that includes:
In the first position where the bag-like workpiece is seated on the second support member and the first support member is separated from the inner surface of the bag-like workpiece, a voltage serving as a cathode is applied to the second support member by the voltage polarity conversion device. Electrolytic plating is performed on at least the inner surface of the bag-shaped space with a voltage serving as an anode applied to the first support member located in the bag-shaped space of the bag-shaped workpiece or in the vicinity of the opening of the bag-shaped space. The first support member abuts the bag-like workpiece against the inner surface and pushes it up, and the first support member abuts against the bag-like workpiece by the voltage polarity converter at the second position where the bag-like workpiece is separated from the second support member. Electrolytic plating is performed on at least the outer surface of the bag-shaped workpiece in a state where a voltage serving as a cathode is applied to the member.

第1支持部材は、袋状ワークの内面を突き上げた状態で支持することができる。また第2支持部材は、袋状ワークを着座させて支持することができる。第1位置においては、袋状ワークが第2支持部材に着座するとともに、第1支持部材の先端が袋状ワークの内面から離間した状態となる。また第2位置においては、袋状ワークをその内面に第1支持部材を当接させて突き上げ、袋状ワークを第2支持部材から離間させて支持する状態となる。   The first support member can be supported in a state where the inner surface of the bag-like workpiece is pushed up. In addition, the second support member can support the bag-like workpiece by being seated thereon. In the first position, the bag-shaped workpiece is seated on the second support member, and the tip of the first support member is separated from the inner surface of the bag-shaped workpiece. In the second position, the bag-like workpiece is pushed up with the first support member in contact with the inner surface thereof, and the bag-like workpiece is supported while being separated from the second support member.

そして袋状ワークをめっき液に浸漬して、第1位置において、第2支持部材に負の電圧を印加し、第1支持部材に正の電圧を印加することによって、袋状空間をなす内面をめっき処理することができる。さらに第2位置において、第1支持部材に負の電圧を印加することによって、袋状ワークの外面をめっき処理することができる。上記電解めっき装置によれば、袋状ワークの内面と外面とを異なるめっき層に仕上げることができる。   Then, by dipping the bag-like workpiece in the plating solution, applying a negative voltage to the second support member and applying a positive voltage to the first support member at the first position, the inner surface forming the bag-like space is formed. It can be plated. Furthermore, the outer surface of the bag-like workpiece can be plated by applying a negative voltage to the first support member at the second position. According to the electrolytic plating apparatus, the inner surface and the outer surface of the bag-like workpiece can be finished into different plating layers.

上記課題を解決するための本発明の袋状ワークの電解めっき用保持具は、
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように、その袋状ワークの内面に当接して袋状ワークを突き上げ状態で支持する第1支持部材と、
その第1支持部材に替わって袋状ワークを着座させて支持する第2支持部材と、
袋状ワークが第2支持部材に着座するとともに、第1支持部材の先端が袋状ワークの内面から離間した第1位置と、袋状ワークをその内面に第1支持部材が当接して突き上げ、袋状ワークを第2支持部材から離間させて支持する第2位置との間で、第1支持部材と第2支持部材とを相対的に移動可能に支持する支持部材移動機構と、
を含む。
The holder for electrolytic plating of the bag-like workpiece of the present invention for solving the above problems is
A first support member that supports the bag-shaped workpiece in a state of pushing up by contacting the inner surface of the bag-shaped workpiece so that the opening of the bag-shaped workpiece having the bag-shaped space faces downward in the plating solution;
A second support member that seats and supports the bag-like workpiece instead of the first support member;
The bag-like workpiece is seated on the second support member, the first position where the tip of the first support member is separated from the inner surface of the bag-like workpiece, and the bag-like workpiece is brought into contact with the inner surface and pushed up. A support member moving mechanism that supports the first support member and the second support member so as to be relatively movable between a second position for supporting the bag-like workpiece apart from the second support member;
including.

第1支持部材は、袋状ワークの内面を突き上げた状態で支持することができる。また第2支持部材は、袋状ワークを着座させて支持することができる。支持部材移動機構によって、第1支持部材と第2支持部材とを相対的に移動させることができる。そして第1位置として、袋状ワークが第2支持部材に着座するとともに、第1支持部材の先端が袋状ワークの内面から離間した状態することができる。また第2位置として、袋状ワークをその内面に第1支持部材を当接させて突き上げ、袋状ワークを第2支持部材から離間させて支持する状態とすることができる。   The first support member can be supported in a state where the inner surface of the bag-like workpiece is pushed up. In addition, the second support member can support the bag-like workpiece by being seated thereon. The first support member and the second support member can be relatively moved by the support member moving mechanism. As the first position, the bag-like workpiece can be seated on the second support member, and the tip of the first support member can be separated from the inner surface of the bag-like workpiece. Further, as the second position, the bag-like workpiece can be pushed up by bringing the first support member into contact with the inner surface of the bag-like workpiece and the bag-like workpiece is supported while being separated from the second support member.

また本発明の袋状ワークの電解めっき用保持具は、
めっきラインの昇降機構に接続される本体フレームと、
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように、その袋状ワークの内面に当接して袋状ワークを突き上げ状態で支持するとともに本体フレームに対し固定的に設けられた、互いに同様の高さで隣接してそれぞれ1個の袋状ワークを支持する複数の第1支持部材と、
それら第1支持部材の先端をつなぐ直線とほぼ平行に配置され、複数の第1支持部材をそれぞれ挿通させるとともに、複数の袋状ワークをその開口部を下側に向けて着座させて第1支持部材に替わって袋状ワークを支持する複数の挿通兼支持穴を備え、第1支持部材に対して高さ変更可能に設けられた第2支持部材と、
袋状ワークがその第2支持部材に着座するとともに、第1支持部材の先端が袋状ワークの内面から離間した第1位置と、第1支持部材が袋状ワークの内面に当接して袋状ワークを突き上げ、袋状ワークを第2支持部材から離間させて支持する第2位置との間で、第2支持部材を第1支持部材に対して昇降可能に案内する第2部材第2部材ガイド部と、
を含む。
The holder for electrolytic plating of the bag-like workpiece of the present invention is
A body frame connected to the lifting mechanism of the plating line;
A bag-shaped workpiece having a bag-shaped space is supported in a state in which the bag-shaped workpiece is pushed up in contact with the inner surface of the bag-shaped workpiece so that the opening faces downward in the plating solution and fixed to the main body frame. A plurality of first support members that are adjacent to each other at the same height and support one bag-like workpiece,
The first support members are arranged substantially parallel to the straight line connecting the tips of the first support members, and the plurality of first support members are inserted through the first support members, and the plurality of bag-like workpieces are seated with the openings facing downward to provide the first support. A second support member provided with a plurality of insertion and support holes for supporting the bag-shaped workpiece instead of the member, the height of which can be changed with respect to the first support member;
The bag-shaped workpiece is seated on the second support member, the first position where the tip of the first support member is separated from the inner surface of the bag-shaped workpiece, and the first support member abuts the inner surface of the bag-shaped workpiece to form a bag 2nd member 2nd member guide which pushes up a workpiece | work and guides a 2nd support member with respect to a 1st support member so that raising / lowering is possible between the 2nd positions which isolate | separate and support a bag-shaped workpiece | work from a 2nd support member. And
including.

電解めっき用保持具は、本体フレームによって、めっきラインの昇降機構に接続することができる。第1支持部材は、袋状ワークの内面を突き上げた状態で支持することができる。また第2支持部材は、袋状ワークを着座させて支持することができる。第2支持部材は、第2部材ガイドによって、第1支持部材に対して昇降可能である。   The electrolytic plating holder can be connected to the lifting mechanism of the plating line by the main body frame. The first support member can be supported in a state where the inner surface of the bag-like workpiece is pushed up. In addition, the second support member can support the bag-like workpiece by being seated thereon. The second support member can be moved up and down with respect to the first support member by the second member guide.

さらに本発明の袋状ワークの電解めっき用保持具は、
上面と下面とを貫通する貫通孔を有する基底部と、
基底部の貫通孔上の上面から延びた第1支持部材と、
基底部から延びた第2部材ガイド部と、
第1支持部材と第2部材ガイド部とが挿入される挿入孔を有し、第2部材ガイド部に沿って摺動可能な第2支持部材と、
第2部材ガイド部を支持する支持部と、
を備え、
袋状ワークを第1支持部材または第2支持部材によって支持し、めっき液を有する液槽へ浸漬して、袋状ワークをめっき液で処理する。
Furthermore, the holder for electrolytic plating of the bag-like workpiece of the present invention is:
A base portion having a through hole penetrating the upper surface and the lower surface;
A first support member extending from an upper surface on the through hole of the base portion;
A second member guide portion extending from the base portion;
A second support member having an insertion hole into which the first support member and the second member guide portion are inserted, and capable of sliding along the second member guide portion;
A support part for supporting the second member guide part;
With
The bag-like workpiece is supported by the first support member or the second support member, immersed in a liquid tank having a plating solution, and the bag-like workpiece is treated with the plating solution.

第1支持部材または第2支持部材によって、袋状ワークを保持することができる。第2支持部材は、第2部材ガイド部によって摺動可能であり、第2支持部材を摺動させることにより、第1支持部材で袋状ワークを保持したり、第2支持部材に袋状ワークを着座させたりすることができる。   The bag-like workpiece can be held by the first support member or the second support member. The second support member is slidable by the second member guide portion. By sliding the second support member, the bag-like workpiece is held by the first support member, or the bag-like workpiece is held on the second support member. Can be seated.

より具体的には、
第2支持部材を基底部から離間し、かつ第1支持部材の先端面より基底部に近い上昇位置に保持することにより、袋状ワークの袋状空間の頭部面と第1支持部材の先端面とを非接触状態とし、第2支持部材に負の電圧を印加することにより、袋状ワークに負の電圧を印加し、また第1支持部材に正の電圧を印加することにより、めっき液で袋状ワークの内面を処理することができる。
More specifically,
The head surface of the bag-like space of the bag-like workpiece and the tip of the first support member are separated from the base and held at a raised position closer to the base than the tip of the first support member. By applying a negative voltage to the bag-like workpiece by applying a negative voltage to the second support member, and applying a positive voltage to the first support member, the plating solution The inner surface of the bag-like workpiece can be processed with.

袋状ワークを下向きの状態で、めっき液に浸漬すると、袋状ワークの袋状空間には、空気などの気体が包含された状態となり、めっき液が袋状ワークの袋空間内部まで進入しない。そこで基底部の貫通孔と第1支持部材とを介して、袋状ワークの袋状空間を満たす気体またはめっき液を吸引することにより、または第1支持部材からめっき液を噴出することにより、袋状ワークの内面をめっき液で処理する。このように、気体などを吸引する、またはめっき液を噴出することで、袋状空間の内部全体にめっき処理を施すことができる。なお第1支持部材の先端部が袋状ワークと絶縁された状態で、かつ流体が流動可能なら、先端部が袋状ワークの内面と接触していてもよい。   When the bag-like workpiece is immersed in the plating solution in the downward state, the bag-like space of the bag-like workpiece contains a gas such as air, and the plating solution does not enter the bag-like space of the bag-like workpiece. Therefore, by sucking a gas or a plating solution that fills the bag-like space of the bag-like workpiece through the through hole of the base portion and the first support member, or by ejecting the plating solution from the first support member, the bag The inner surface of the workpiece is treated with the plating solution. In this way, the entire interior of the bag-like space can be plated by sucking gas or the like or ejecting the plating solution. In addition, if the front-end | tip part of a 1st support member is the state insulated with the bag-shaped workpiece | work, and a fluid can flow, the front-end | tip part may contact the inner surface of a bag-shaped workpiece.

また第2支持部材を下降位置に下げることにより、袋状ワークの袋状空間の頭部面に第1支持部材の先端面が接触する状態とし、第1支持部材に負の電圧を印加することにより、袋状ワークに負の電圧を印加して、めっき液により袋状ワークの外面処理を行うことができる。   Also, by lowering the second support member to the lowered position, the tip surface of the first support member is brought into contact with the head surface of the bag-like space of the bag-like workpiece, and a negative voltage is applied to the first support member. Thus, a negative voltage can be applied to the bag-shaped workpiece and the outer surface treatment of the bag-shaped workpiece can be performed with the plating solution.

さらに袋状ワークの外面処理は、袋状ワークに負の電圧を印加することに加え、液槽内に正の電極を設置し、その液槽に浸漬して袋状ワークに負の電圧を印加することによって行う。このような袋状ワークの電解めっき用保持具を使用することによって、内面めっきと外面めっきとを異なった工程で行うことができるため、内面めっき層と外面めっき層とを異なった仕上がりとすることができる。   Furthermore, in addition to applying a negative voltage to the bag-shaped workpiece, the bag surface workpiece is treated with a positive electrode in the liquid tank and immersed in the liquid tank to apply a negative voltage to the bag-shaped workpiece. By doing. By using such a bag-shaped workpiece electrolytic plating holder, inner plating and outer plating can be performed in different processes, so that the inner plating layer and outer plating layer have different finishes. Can do.

さらに少なくとも第1支持部材と第2支持部材とを、導体により形成することによって、第1支持部材や第2支持部材に電圧を印加することによって、袋状ワークに電圧を印加することができ、これによって電解めっき処理を施すことができる。   Furthermore, the voltage can be applied to the bag-shaped workpiece by applying a voltage to the first support member and the second support member by forming at least the first support member and the second support member with a conductor. Thus, an electrolytic plating process can be performed.

以下、図面を参照しつつ、本発明の実施例を説明する。図1は袋状ワークの一例として袋ナットを示すものである。袋ナット1は、めねじ部4を有する本体2と、本体2におねじ部材の螺入側とは反対側の開口を塞ぐキャップ部3とを備え、めねじ部4とその奥部の空所(ボルト等のおねじ部材の先端部が進入する部分)とにより袋状の空間(閉鎖空間)5が形成される。本体2の外面には、側方にせり出したフランジ7を有する。このような袋ナットの一例として、ハブナットが挙げられる。このような袋ナット1が、鍛造加工さらに転造もしくは切削等によるねじ加工、キャップ部3の溶接及び必要に応じて熱処理の後、洗浄や防錆、めっき等のために所定の液槽に浸漬される。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a cap nut as an example of a bag-like workpiece. The cap nut 1 includes a main body 2 having a female screw portion 4 and a cap portion 3 that closes the opening of the main body 2 on the side opposite to the screwing side of the screw member. A bag-like space (closed space) 5 is formed by a place (a portion into which a tip portion of a male screw member such as a bolt enters). The outer surface of the main body 2 has a flange 7 protruding to the side. An example of such a cap nut is a hub nut. Such a cap nut 1 is immersed in a predetermined bath for cleaning, rust prevention, plating, etc. after forging, further threading by rolling or cutting, welding of the cap 3 and heat treatment as necessary. Is done.

その際、図2に示すような電解めっき用保持具である浸漬保持具21を用いる。この浸漬保持具21は、上面と下面とを貫通する貫通孔を有する基底部27、基底部27の上面側の貫通孔上から延びた吸引管(または吐出管)となる第1支持部材としての軸状に形成された突起管25、基底部27から延びた第2部材ガイド部としてのガイド軸24、複数の突起管25とガイド軸24とが挿入される挿入孔(貫通孔)を有する第2支持部材としての摺動板26、ガイド軸24を支持する支持軸23a,23b、さらにその支持軸23a,23bと接続される本体フレームの一部を構成する支持板22を備える。この浸漬保持具21は、電流を流すことができるように、金属などの導体によって形成される。例えば、チタンを使用することができる。ただし、支持板22は、支持軸23aと支持軸24bとの絶縁をとるために不導体で形成される(支持軸23aと支持軸24bとの絶縁がとれれば、支持板22の全体が不導体である必要はない)。支持板22は、搬送ラインに連結され得る形状であれば、図のような形状に限られない。基底部27が、2列並列に形成されているが、必ずしも2列、または並列に形成される必要はない。また突起管が各基底部27上に3本形成されているが、突起管の数は、3本に限られない。基底部の数や突起管の数を増やすと、多くの袋状ワークを同時に処理することが可能となる。   At that time, an immersion holder 21 which is a holder for electrolytic plating as shown in FIG. 2 is used. The immersion holder 21 serves as a first support member serving as a base portion 27 having a through hole penetrating the upper surface and the lower surface, and a suction pipe (or discharge pipe) extending from the through hole on the upper surface side of the base portion 27. A projecting tube 25 formed in a shaft shape, a guide shaft 24 as a second member guide portion extending from the base portion 27, and a first insertion hole (through hole) into which the plurality of projecting tubes 25 and the guide shaft 24 are inserted. (2) A sliding plate 26 as a support member, support shafts 23a and 23b for supporting the guide shaft 24, and a support plate 22 constituting a part of a main body frame connected to the support shafts 23a and 23b. The immersion holder 21 is formed of a conductor such as metal so that a current can flow. For example, titanium can be used. However, the support plate 22 is formed of a non-conductor to insulate the support shaft 23a and the support shaft 24b (if the support shaft 23a and the support shaft 24b are insulated, the entire support plate 22 is a non-conductor. Need not be). The support plate 22 is not limited to the shape shown in the figure as long as it can be connected to the transport line. Although the base portions 27 are formed in two rows in parallel, they are not necessarily formed in two rows or in parallel. Further, although three protruding tubes are formed on each base portion 27, the number of protruding tubes is not limited to three. Increasing the number of bases and the number of protruding tubes makes it possible to process many bag-like workpieces simultaneously.

従来の多段の袋状ワーク保持部を有する浸漬保持具の場合、前処理やめっき処理を施す液槽が深く形成される必要があるのに対し、この浸漬保持具21は、突起管25が一面上に並ぶため、前処理やめっき処理を施す液槽の深さを浅くすることができる。水洗槽も浅くすることができるため、給水量や放水量が少なくなる。まためっき処理ラインを設置する建屋を従来よりも低くできる。さらに従来の多段の浸漬保持具の場合は、上段に保持された袋状ワークと、下段に保持された袋状ワークとのめっき厚に差が生じるが、この浸漬保持具21は、一段に形成されているため、袋状ワークのめっき厚に差が生じにくい。従来の多段の浸漬保持具では、めっき厚を25μmとするためにめっき処理を施すと、製品間に10μm程度のめっき厚のばらつきが生じていた。この浸漬保持具は、被めっき物が、一面上にならぶ一段構造であるため、製品間のめっき厚のばらつきを2〜3μm程度に抑えることができる。   In the case of a conventional immersion holder having a multi-stage bag-like workpiece holder, a liquid tank for pretreatment and plating needs to be formed deeply, whereas the immersion holder 21 has a protruding tube 25 on one side. Since they are arranged on the top, the depth of the liquid tank for pretreatment and plating can be reduced. Since the washing tank can also be made shallower, the amount of water supplied and discharged is reduced. Moreover, the building which installs a plating processing line can be made lower than before. Furthermore, in the case of the conventional multistage immersion holder, there is a difference in the plating thickness between the bag-like workpiece held in the upper stage and the bag-like workpiece held in the lower stage, but this immersion holder 21 is formed in one stage. Therefore, a difference in the plating thickness of the bag-like workpiece is unlikely to occur. In the conventional multistage immersion holder, when the plating treatment is performed in order to make the plating thickness 25 μm, the plating thickness variation of about 10 μm occurs between products. Since the object to be plated has a one-stage structure in which the object to be plated is arranged on one surface, the immersion thickness of the immersion holder can be suppressed to about 2 to 3 μm.

図3に浸漬保持具21の拡大断面図を示す。基底部27には、複数の貫通孔28が形成され(図2の実施例の場合、一つの基底部27には、3箇所の貫通孔)、その貫通孔28上に突起管25が形成されている。突起管25の先端部35を除く部分の表面には、絶縁部12(例えば、樹脂モールド)が形成されている。突起管25の貫通孔34と、基底部27の貫通孔28は連なって形成されており、基底部貫通孔28の下部から突起管貫通孔34の上部へ、あるいは突起管貫通孔34の上部から基底部貫通孔28の下部へと、気体または液体が流動可能である。これら突起管34の先端部35に1つずつ袋ナット1が装着される。摺動板26には、ガイド軸24a、突起管25を挿入するための貫通孔33が形成されており、摺動板26は、ガイド軸24aにガイドされ、ガイド軸24aに沿って摺動可能である。摺動板26、ガイド軸24によって支持部材移動機構が構成されている。さらに浸漬保持具21にモータなどの駆動装置を備えて上下移動させてもよい。この場合、駆動装置も支持部材移動機構に含まれる。また摺動板26の貫通孔33内に突起管25が位置する。ガイド軸24aと基底部27とは、絶縁部11(例えば、塩化ビニル)によって電気的に絶縁されている。   FIG. 3 shows an enlarged cross-sectional view of the immersion holder 21. A plurality of through holes 28 are formed in the base portion 27 (in the case of the embodiment of FIG. 2, one base portion 27 has three through holes), and the protruding tube 25 is formed on the through hole 28. ing. An insulating portion 12 (for example, a resin mold) is formed on the surface of the protruding tube 25 except for the distal end portion 35. The through hole 34 of the projection tube 25 and the through hole 28 of the base portion 27 are formed in a row, and from the lower portion of the base portion through hole 28 to the upper portion of the projection tube through hole 34 or from the upper portion of the projection tube through hole 34. A gas or a liquid can flow to the lower part of the base through hole 28. The cap nuts 1 are attached to the tip portions 35 of the protruding tubes 34 one by one. The sliding plate 26 is formed with a guide shaft 24a and a through-hole 33 for inserting the protruding tube 25. The sliding plate 26 is guided by the guide shaft 24a and can slide along the guide shaft 24a. It is. The sliding member 26 and the guide shaft 24 constitute a support member moving mechanism. Further, the immersion holder 21 may be provided with a driving device such as a motor and moved up and down. In this case, the driving device is also included in the support member moving mechanism. The protruding tube 25 is located in the through hole 33 of the sliding plate 26. The guide shaft 24a and the base portion 27 are electrically insulated by the insulating portion 11 (for example, vinyl chloride).

図4に浸漬保持具21の拡大斜視図を示す。真中の突起管25に袋ナット1が装着された例を示す。袋ナット1は、突起管25の先端部35に被せる状態で装着される。図は、他の突起管25に袋ナット1が装着されていないが、表面処理工程においては、通常、すべての突起管25の先端部に袋ナットを装着する。また図は、摺動板26が、上に移動した上昇位置にセットされているところを示す。摺動板26が、上昇位置にある状態では、後述するように内面めっきを施すことができる。この実施例の場合は、突起管が3本であるが、突起管の数は、3本に限られない。さらにガイド軸と複数の突起管が一直線上に並ぶ必要は、必ずしもない。   FIG. 4 shows an enlarged perspective view of the immersion holder 21. An example in which the cap nut 1 is attached to the middle protruding tube 25 is shown. The cap nut 1 is mounted so as to cover the tip portion 35 of the protruding tube 25. In the figure, the cap nuts 1 are not attached to the other protruding tubes 25, but in the surface treatment step, the cap nuts are usually attached to the tip portions of all the protruding tubes 25. The figure also shows that the sliding plate 26 is set at the raised position moved upward. When the sliding plate 26 is in the raised position, inner plating can be performed as described later. In this embodiment, there are three protruding tubes, but the number of protruding tubes is not limited to three. Furthermore, it is not always necessary that the guide shaft and the plurality of projecting tubes are aligned.

図5に電解めっきラインの例を示す。各処理工程を施すための液槽51ないし67が並んで設置され、その上方に浸漬保持具21を搬送するための搬送ライン72が設置されている。さらに搬送ライン72や各液槽の諸条件を制御するための制御盤71が設置されている。搬送ライン72は、浸漬保持具21を上下させるための昇降装置73と、浸漬保持具21を連結するための連結部74を備える(半光沢槽59上以外の浸漬保持具21、連結部74、昇降装置73は、省略されて描かれていない)。各液槽において順次処理が行われることにより、袋状ワークとしての袋ナット1に電解めっき(例えばニッケルクロムメッキ等)が施される。   FIG. 5 shows an example of an electrolytic plating line. Liquid tanks 51 to 67 for performing each processing step are installed side by side, and a transport line 72 for transporting the immersion holder 21 is installed thereabove. Further, a control panel 71 for controlling various conditions of the transfer line 72 and each liquid tank is installed. The conveyance line 72 includes an elevating device 73 for moving the immersion holder 21 up and down, and a connecting part 74 for connecting the immersion holder 21 (the immersion holder 21 and the connecting part 74 other than on the semi-gloss tank 59, The lifting device 73 is omitted and not shown). By sequentially performing the treatment in each liquid tank, electrolytic plating (for example, nickel chrome plating or the like) is performed on the cap nut 1 as a bag-like workpiece.

まず、ロード/アンロード工程(ステーション)(図示されていない)で、浸漬保持具21の突起管25に、袋ナット1が、開口が下を向くようにして取り付けられる。そして、袋ナット1が突起管25に装着された浸漬保持具21は、搬送ライン72に連結され、その巡回搬送路に沿って搬送されつつ、それぞれの液槽に浸漬される。   First, in a load / unload process (station) (not shown), the cap nut 1 is attached to the protruding tube 25 of the immersion holder 21 so that the opening faces downward. Then, the immersion holder 21 having the cap nut 1 mounted on the protruding tube 25 is connected to the conveyance line 72 and is immersed in the respective liquid tanks while being conveyed along the cyclic conveyance path.

巡回搬送路72は、例えばチェーン等の無限軌道が、モーター等の駆動装置により巡回させられるものである。巡回搬送路72の連結部74および昇降装置73は、巡回搬送路72に沿って巡回する。   The circular transport path 72 is such that an endless track such as a chain is circulated by a driving device such as a motor. The connecting portion 74 and the lifting device 73 of the circular conveyance path 72 circulate along the cyclic conveyance path 72.

ある浸漬保持具21は、巡回搬送路72に沿って間欠的に送られつつ、各液槽上において停止し、下降してその液槽に浸漬される。そして液槽から引き上げられ、次の液槽へ送られる。前進、停止、下降、上昇、前進により、各液槽を一巡して、その浸漬保持具21に装着されている袋ナットに電解めっきが施される。そしてこれらの工程終了後、ロード/アンロードステーションに戻り、袋ナット1ごと浸漬保持具21が連結部74から取り外され、代わりに、未処理の袋ナット1を多数保持する別の浸漬保持具21が連結部74に装着される。   A certain immersion holder 21 is intermittently sent along the circulating conveyance path 72, stops on each liquid tank, descends, and is immersed in the liquid tank. And it is pulled up from a liquid tank and sent to the next liquid tank. Electrolytic plating is performed on the cap nut attached to the immersion holder 21 by making a round of each liquid tank by advance, stop, descend, rise and advance. After these steps are completed, the load / unload station is returned to, and the dipping holder 21 together with the cap nut 1 is removed from the connecting portion 74. Instead, another dipping holder 21 that holds a large number of untreated cap nuts 1 is used. Is attached to the connecting portion 74.

次に各工程について説明する。電解めっきの工程に先立ち、脱脂等の前工程が施される。主要なものは、脱脂槽51における脱脂工程、陰極酸電解槽52における電解(スケール除去)工程、酸洗槽54における酸洗工程、陽極電解脱脂槽56における電解脱脂(活性化)工程、中和槽57における中和工程である。これらの間に、水洗槽53、55、58が配置されて、洗浄される。前工程が終了すると、続いてめっき工程が実施される。めっき工程は、半光沢槽59、トリNi槽60、光沢Ni61、ジュールNi槽62、クロム槽64によって行われる。また水洗槽63,65,66によって洗浄され、乾燥槽67にて乾燥されて、ロード/アンロードステーション(図示されていない)によって、処理の行われた袋ナットが取り外され、未処理の袋ナットが装着される。つまり浸漬保持具21は、間欠的に巡回移動して、各液槽51〜66等への浸漬を繰り返し、各種処理が施される。間欠移動の停止時に、各浸漬保持具21が一斉に下降することにより、脱脂、洗浄、めっき等の工程が並列的に実施される。   Next, each step will be described. Prior to the electrolytic plating process, a pre-process such as degreasing is performed. The main ones are a degreasing process in the degreasing tank 51, an electrolysis (scale removal) process in the cathodic acid electrolytic tank 52, a pickling process in the pickling tank 54, an electrolytic degreasing (activation) process in the anodic electrolytic degreasing tank 56, and neutralization. This is a neutralization step in the tank 57. Between these, washing tanks 53, 55, and 58 are disposed and cleaned. When the pre-process is completed, a plating process is subsequently performed. The plating process is performed by a semi-gloss tank 59, a Tri Ni tank 60, a gloss Ni 61, a Joule Ni tank 62, and a chromium tank 64. Moreover, it wash | cleans with the water-washing tanks 63,65,66, and is dried with the drying tank 67, and the processed nut is removed by the load / unload station (not shown), An unprocessed container nut Is installed. That is, the immersion holder 21 is intermittently moved and repeatedly immersed in each of the liquid tanks 51 to 66 and various processes are performed. When the intermittent movement is stopped, the respective immersion holders 21 are lowered at the same time, so that steps such as degreasing, washing, and plating are performed in parallel.

ここで、一つの浸漬保持具21に着目し、それに保持された複数の袋ナットに対する各工程を順に説明する。ロード/アンロードステーションで、浸漬保持具21を介して工程ライン(巡回搬送路)に供給された多数の袋ナットは、そのステーションから一定量前進して停止し、アルカリ脱脂工程で所定のアルカリ溶液(脱脂層51)に浸漬(下降)されてアルカリ脱脂が行われる。次に、ここから引き上げられ(上昇)、一定量前進してから、熱処理により袋ナットに生じているスケールを除去する(スケールとばし)陰極酸電解工程が電解槽52において実施される。続いて、ここから引き上げられ(上昇)、一定量前進してから水洗槽53に浸漬(下降)されて、水洗工程53が実施される。その水洗の後、袋ナットは(浸漬保持具21と共に)引き上げられ、また一定量前進して、今度は袋ナットが硫酸溶液等(酸洗槽54)に浸漬(下降)される。   Here, paying attention to one immersion holder 21, the respective steps for the plurality of cap nuts held thereon will be described in order. At the load / unload station, a large number of cap nuts supplied to the process line (circular conveyance path) via the immersion holder 21 are moved forward from the station by a certain amount and stopped. Alkaline degreasing is performed by dipping (lowering) in (degreasing layer 51). Next, after being pulled up (raised) and moved forward by a certain amount, the cathodic acid electrolysis step is performed in the electrolytic cell 52 to remove the scale generated in the cap nut by heat treatment (expand the scale). Subsequently, the water is pulled up (raised), moved forward by a certain amount, and then immersed (lowered) in the water rinsing tank 53, and the water washing step 53 is performed. After the rinsing, the cap nut is lifted (together with the immersion holder 21) and moved forward by a certain amount, and this time the cap nut is immersed (lowered) in a sulfuric acid solution or the like (pickling bath 54).

それから、袋ナットは、水洗槽55で、上記と同様の水洗工程により上記硫酸溶液等が洗われた後、めっきの付きを良くするために、所定のアルカリ溶液(陽極電解脱脂槽56)に浸漬され、表面を活性化する陽極電解脱脂工程が施される。さらに、中和工程(中和槽57)、上記と同様の水洗工程(水洗槽58)を経て、めっき工程に至る。   Then, the cap nut is immersed in a predetermined alkaline solution (anodic electrolytic degreasing bath 56) in order to improve the plating after the sulfuric acid solution and the like are washed in the washing bath 55 in the same washing step as described above. Then, an anodic electrolytic degreasing step for activating the surface is performed. Furthermore, it passes through the neutralization process (neutralization tank 57) and the water washing process (water washing tank 58) similar to the above to reach the plating process.

めっき工程においては、半光沢槽59、トリNi槽60、光沢Ni槽61、ジュールNi槽62の各槽においてニッケルめっきが施される。めっき槽57に多数の袋ナットが浸漬保持具21に保持された状態で浸漬(下降)され、袋ナットにめっき層が形成される。半光沢槽59においては、後述するように、内面めっき、外面めっきが施される。続くトリNi槽60、光沢Ni槽61、ジュールNi槽62の各槽においては、外面めっきが施される。   In the plating step, nickel plating is performed in each of the semi-gloss tank 59, the tri-Ni tank 60, the gloss Ni tank 61, and the joule Ni tank 62. A large number of cap nuts are immersed (lowered) in the plating tank 57 while being held by the immersion holder 21, and a plating layer is formed on the cap nut. In the semi-gloss tank 59, as will be described later, inner plating and outer plating are performed. In each of the subsequent Ni tank 60, gloss Ni tank 61, and Joule Ni tank 62, outer plating is performed.

このようなめっき工程により、内面に半光沢めっき、外面に光沢めっきを施すことができる。外面は、光沢仕上げにできるため装飾効果を確保できる。つまり内面と外面とを異なるめっき層として仕上げることができる。また内面全体にめっき処理を施すことができるため、内面においても防錆効果が得られるばかりではなく、内面は半光沢めっきで薄く仕上げることができるために、ねじの精度を確保しやすい。   By such a plating process, semi-gloss plating can be applied to the inner surface and bright plating can be applied to the outer surface. Since the outer surface can be glossy finished, a decorative effect can be secured. That is, the inner surface and the outer surface can be finished as different plating layers. In addition, since the entire inner surface can be plated, not only a rust prevention effect can be obtained on the inner surface, but the inner surface can be thinly finished with semi-gloss plating, so that it is easy to ensure the accuracy of the screw.

このめっき工程が終われば、一定量前進してから、水洗槽63に浸漬されて水洗される。そしてさらにクロム槽64に浸漬され、クロムめっきが施される。続いて水洗工程の水洗槽65,66に至り、そこでめっき液が洗われる。   When this plating step is completed, the plate is moved forward by a certain amount, and then immersed in the water rinsing tank 63 and washed with water. And it is further immersed in the chromium tank 64, and chromium plating is given. Subsequently, the baths 65 and 66 in the washing step are reached, where the plating solution is washed.

浸漬保持具21の使用は、必ずしも上記のようなめっき工程に限られない。必要に応じて一部めっき工程を行わないこともできるし、あるいはさらに別の工程を行うこともできる。   The use of the immersion holder 21 is not necessarily limited to the plating process as described above. If necessary, a partial plating process can be omitted, or a further process can be performed.

図6を用いて、浸漬保持具21を使用した電解めっきラインにおける処理工程について説明する。浸漬保持具21に保持された袋ナット1は、前処理工程の液槽に順次浸漬されて表面を清浄化され、水洗槽58で洗浄された後、めっき工程の半光沢槽59へ移動する。半光沢槽59において、内面めっき、外面めっきを施される。(a)に示すように、半光沢めっき槽59上に移動した浸漬保持具21は、下降して、(b)に示すように、半光沢めっき槽59に浸漬される。半光沢めっき槽59には、ノズル86を有する流動補助具85が設置されている。流動補助具を図7に示す。流動補助具85は、上面にノズル86を複数有する。このノズル86には、貫通孔(図示されていない)が形成され、貫通孔は、流動補助具85の下面に連結されているパイプ87と接続されている。そして図6に示すように、流動補助具85の下面から、パイプ87によってポンプ75へと接続されている。   The process in the electrolytic plating line using the immersion holder 21 will be described with reference to FIG. The cap nut 1 held by the immersion holder 21 is sequentially immersed in the liquid tank in the pretreatment process, the surface is cleaned, and after being washed in the water washing tank 58, it is moved to the semi-gloss tank 59 in the plating process. In the semi-gloss tank 59, inner plating and outer plating are performed. As shown in (a), the immersion holder 21 moved onto the semi-gloss plating tank 59 is lowered and immersed in the semi-gloss plating tank 59 as shown in (b). The semi-gloss plating tank 59 is provided with a flow assisting tool 85 having a nozzle 86. A flow aid is shown in FIG. The flow assisting tool 85 has a plurality of nozzles 86 on the upper surface. The nozzle 86 is formed with a through hole (not shown), and the through hole is connected to a pipe 87 connected to the lower surface of the flow assisting tool 85. Then, as shown in FIG. 6, the pipe 87 is connected to the pump 75 from the lower surface of the flow assisting tool 85.

図6(b)に示すように、流動補助具85の上面に形成されたノズル86に浸漬保持具21の基底部27の貫通孔28(図3参照)が当接する。内面めっきを施す場合には、摺動板26は、上昇位置にセットされる。   As shown in FIG. 6B, the through hole 28 (see FIG. 3) of the base portion 27 of the immersion holder 21 contacts the nozzle 86 formed on the upper surface of the flow assisting tool 85. When inner plating is performed, the sliding plate 26 is set at the raised position.

図8を用いて、半光沢槽59内における内面めっきと外面めっきの浸漬保持具21の摺動板26の位置を説明する。図の左側において内面めっき、右側において外面めっきを施す。(a)に示すように袋ナット1を水洗槽58で洗浄した後、まず半光沢槽59の前部(図の左側)において、摺動板26を上げた位置にして、基底部27の貫通孔28が、流動補助具85のノズル86に当接された状態で、袋ナット1に内面めっきを施す。図に示すようにストッパー37を液槽に備え、これに摺動板26が載ることにより、摺動板26を上昇位置としてもよい。あるいは、浸漬保持具21にモータなどの駆動装置を備えて上下に移動させてもよい。これらは、支持部材相対位置変換装置である。(b)に突起管25の先端部分の拡大図を示す。摺動板26が上昇位置にある場合、図の左側に示すように、突起管25の先端部分は、袋ナット1の内面と非接触状態である。この状態で内面めっきを施すことができる。続いて、(a)の右側に示すように、半光沢槽59の後部(図の右側)において、摺動板26を下げた位置にして、袋ナット1に外面めっきを施す。(b)の右側に、突起管の先端部分の拡大図を示す。摺動板26が下降位置にある場合、図に示すように突起管25の先端部分は、袋ナット1の内面に接触した状態である。この状態で電圧を印加して、外面めっきを施すことができる。なお前部(図の左側)において摺動板26が下がる状態になり、後部(図の右側)において摺動板26が上がる状態となるようにし、外面めっき、内面めっきの順にめっき処理を行ってもよい。   The position of the sliding plate 26 of the inner plating and outer plating immersion holder 21 in the semi-gloss tank 59 will be described with reference to FIG. Internal plating is applied on the left side of the figure, and external plating is applied on the right side. After the cap nut 1 is washed in the water washing tank 58 as shown in FIG. 5A, first, the sliding plate 26 is moved up to the front part (left side of the figure) of the semi-gloss tank 59 and the base part 27 is penetrated. In a state where the hole 28 is in contact with the nozzle 86 of the flow assisting tool 85, inner plating is applied to the cap nut 1. As shown in the figure, the stopper 37 may be provided in the liquid tank, and the sliding plate 26 may be placed on the stopper 37 so that the sliding plate 26 is in the raised position. Alternatively, the immersion holder 21 may be provided with a driving device such as a motor and moved up and down. These are support member relative position conversion devices. FIG. 4B is an enlarged view of the tip portion of the protruding tube 25. When the sliding plate 26 is in the raised position, the tip portion of the protruding tube 25 is not in contact with the inner surface of the cap nut 1 as shown on the left side of the drawing. In this state, inner plating can be performed. Subsequently, as shown on the right side of (a), the outer surface plating is applied to the cap nut 1 with the sliding plate 26 in a lowered position at the rear part (right side of the drawing) of the semi-gloss tank 59. The enlarged view of the front-end | tip part of a protruding tube is shown on the right side of (b). When the sliding plate 26 is in the lowered position, the tip portion of the protruding tube 25 is in contact with the inner surface of the cap nut 1 as shown in the figure. In this state, a voltage can be applied to perform external plating. The sliding plate 26 is lowered at the front part (left side in the figure) and the sliding plate 26 is raised at the rear part (right side in the figure), and plating is performed in the order of outer plating and inner plating. Also good.

めっき処理を施す場合の電圧印加は、半光沢槽59に図9に示すような通電装置となる電圧印加部を形成することによって行うことができる。(a)は、半光沢槽59の電極印加部を説明するための図である。半光沢槽59の前部(図の左側)において、内面めっき、後部(図の右側)において、外面めっきを施す。電圧印加部76,78は、負の電圧、電圧印加部77は、正の電圧を印加することができる。そして、この電圧印加部76,77,78に浸漬保持具21が設置される。これら電圧印加部76,77,78が電圧極性変換装置をなす。   The voltage application in the case of performing a plating process can be performed by forming a voltage application section that becomes an energization device as shown in FIG. (A) is a figure for demonstrating the electrode application part of the semi-gloss tank 59. FIG. In the front part (left side in the figure) of the semi-gloss tank 59, inner plating is performed, and in the rear part (right side in the figure), outer surface plating is performed. The voltage application units 76 and 78 can apply a negative voltage, and the voltage application unit 77 can apply a positive voltage. Then, the immersion holder 21 is installed in the voltage application units 76, 77, 78. These voltage application units 76, 77, 78 constitute a voltage polarity converter.

図9(b)に示すように、内面めっきを施す場合には、電圧印加部76,77に、浸漬保持具21が設置される。そして電源線79aにより電圧印加部76から支持軸23aへ負の電圧が印加される。さらに電源線79bにより、電圧印加部77から支持軸23bへ、正の電圧が印加される。   As shown in FIG. 9 (b), when inner plating is performed, the immersion holder 21 is installed in the voltage application units 76 and 77. A negative voltage is applied from the voltage application unit 76 to the support shaft 23a by the power line 79a. Further, a positive voltage is applied from the voltage application unit 77 to the support shaft 23b by the power supply line 79b.

図10を用いて、内面めっきの処理を説明する。内面めっきを施す場合は、摺動板26を上昇位置(第1位置)にする。これにより、袋ナット1の袋状空間の頭部面6と突起管25の先端面29とは、接触せずに間隙を有する状態となる。この状態で、半光沢槽59に浸漬し、図9に示したように浸漬保持具21を電圧印加部76,77に設置して、一方の支持軸23aからガイド軸24aに負、他方の支持軸23bからガイド軸24bに、正の電圧を印加する。ガイド軸24aと基底部27とは、絶縁部11により電気的に絶縁されている。また摺動板26とガイド軸24bとは、絶縁部13により電気的に絶縁されている。これによりガイド軸24a、摺動板26から袋ナット1の外面に負の電圧が印加される。さらにガイド軸24b、基底部27から突起管25に正の電圧が印加される。袋ナット1が負、その袋状空間内に挿入された突起管25が正に印加されることから、袋状ナット1の内面にめっきが施される。なお外部アノードを設置して、このアノードに通電すれば、内面めっきと同時に外面めっきも施すことができる。   The inner plating process will be described with reference to FIG. When the inner plating is performed, the sliding plate 26 is set to the raised position (first position). As a result, the head surface 6 of the bag-shaped space of the cap nut 1 and the tip surface 29 of the protruding tube 25 are not in contact with each other and have a gap. In this state, it is immersed in the semi-gloss tank 59, and the immersion holder 21 is installed in the voltage application sections 76 and 77 as shown in FIG. 9, and the negative is supported from the one support shaft 23a to the guide shaft 24a, and the other support is supported. A positive voltage is applied from the shaft 23b to the guide shaft 24b. The guide shaft 24 a and the base portion 27 are electrically insulated by the insulating portion 11. Further, the sliding plate 26 and the guide shaft 24 b are electrically insulated by the insulating portion 13. As a result, a negative voltage is applied from the guide shaft 24 a and the sliding plate 26 to the outer surface of the cap nut 1. Further, a positive voltage is applied to the protruding tube 25 from the guide shaft 24 b and the base portion 27. Since the cap nut 1 is negative and the protruding tube 25 inserted into the bag-like space is applied positively, the inner surface of the cap-like nut 1 is plated. If an external anode is installed and the anode is energized, the outer plating can be performed simultaneously with the inner plating.

袋ナットを浸漬保持具21で保持した状態で、めっき液48中に単に浸漬した場合は、袋ナット1の袋状空間5に、空気等の気体が存在するために、内面が十分にめっきされない。そこで内面めっきを施す場合には、図11(a)に示すように、突起管25、流動補助具85につながる負圧吸引装置としてのポンプ75によって、袋状空間5内の気体や液体を吸引する。袋状空間5内の気体を吸引することにより、液槽内のめっき液48が袋状空間内に流入して、袋状空間内を充満することができる。すなわち吸引することによりめっき液を流動させつつ、電解めっきのための電圧を印加する。あるいは、流動させた後に電圧を印加させるようにしてもよい。従来は、袋状空間5に満たされた気体により、めっき液48が袋状空間の奧部まで侵入しないため、袋状空間の開口周辺しか、めっき処理を施すことができなかったが、このように吸引することにより袋状空間5をめっき液48で満たすことができ、また袋ナット1の内面に対向して正電極(突起管25)を配置し、袋ナットの内面に電流を十分流すことができることから、袋ナット1の内面全域をめっきすることができる。さらに吸引を続けると、めっき液48が流動して、良好なめっき処理が可能となる。あるいは(b)に示すように、加圧吐出装置として、例えばポンプを使用して、突起管25からめっき液48を袋ナットの袋状空間5に噴出させて、めっき処理を行ってもよい。噴出させることにより、内面全体にめっき処理を施すことができる。この場合、内面に圧力がかかることになるため、図12(a)に示すように、袋ナット1の頭部3を固定部材41で抑えて袋ナット1を強制的に固定するとよい。または、図12(b)に示すようにフランジ部7を固定部材42で抑えるようにしてもよい。なお図11においては、突起管が袋状空間内に挿入されているが、図13に示すように開口部近傍に端部が位置するようにして、同様に処理してもよい。この場合も袋状空間5内をめっき液48で充満させることができ、また袋ナット1の内面に電流を十分流すことができる。   If the cap nut is simply immersed in the plating solution 48 while being held by the immersion holder 21, the inner surface is not sufficiently plated because a gas such as air is present in the bag-like space 5 of the cap nut 1. . Therefore, when inner plating is performed, as shown in FIG. 11A, the gas or liquid in the bag-like space 5 is sucked by a pump 75 as a negative pressure suction device connected to the protruding tube 25 and the flow assisting tool 85. To do. By sucking the gas in the bag-like space 5, the plating solution 48 in the liquid tank flows into the bag-like space and can fill the bag-like space. That is, a voltage for electrolytic plating is applied while flowing the plating solution by suction. Or you may make it apply a voltage after making it flow. Conventionally, since the plating solution 48 does not penetrate into the flange portion of the bag-like space due to the gas filled in the bag-like space 5, the plating process can be performed only around the opening of the bag-like space. The bag-like space 5 can be filled with the plating solution 48 by sucking into the bag nut, and a positive electrode (protruding tube 25) is disposed opposite to the inner surface of the bag nut 1 so that a sufficient current flows through the inner surface of the bag nut. Therefore, the entire inner surface of the cap nut 1 can be plated. When the suction is further continued, the plating solution 48 flows, and a favorable plating process can be performed. Alternatively, as shown in (b), as a pressure discharge device, for example, a pump may be used to eject the plating solution 48 from the protruding tube 25 into the bag-like space 5 of the cap nut and perform the plating process. By spraying, the entire inner surface can be plated. In this case, since pressure is applied to the inner surface, the cap nut 1 may be forcibly fixed by holding the head 3 of the cap nut 1 with a fixing member 41 as shown in FIG. Or you may make it hold | suppress the flange part 7 with the fixing member 42, as shown in FIG.12 (b). In FIG. 11, the protruding tube is inserted into the bag-like space, but the same processing may be performed with the end positioned near the opening as shown in FIG. Also in this case, the inside of the bag-like space 5 can be filled with the plating solution 48, and a sufficient current can flow through the inner surface of the cap nut 1.

次に外面めっきについて、図14を用いて説明する。外面めっきを施す場合には、摺動板26を下降位置(第2位置)にセットする。そして電圧印加部78(図9参照)によって、支持軸23b、ガイド軸24b、基底部27、突起管25に負の電圧が印加される。また電圧印加部78から、支持軸23a、ガイド軸24a、摺動板26、基底部27と負の電圧が印加される。摺動板26が下降位置にある場合には、袋ナット1の袋状空間の頭部面6は、突起管25の先端面29と接触している。このため突起管25から袋ナット1に負の電圧が印加される。また図15に示すように、半光沢槽59内にアノード91を設置する。このようにして袋ナット1側が負、アノード側が正の電圧となることによって、袋ナット1の外面にめっき処理を施すことができる。   Next, outer plating will be described with reference to FIG. When the outer plating is performed, the sliding plate 26 is set at the lowered position (second position). Then, a negative voltage is applied to the support shaft 23b, the guide shaft 24b, the base portion 27, and the protruding tube 25 by the voltage application unit 78 (see FIG. 9). Further, a negative voltage is applied to the support shaft 23 a, the guide shaft 24 a, the sliding plate 26, and the base portion 27 from the voltage application unit 78. When the sliding plate 26 is in the lowered position, the head surface 6 of the bag-like space of the cap nut 1 is in contact with the tip surface 29 of the protruding tube 25. For this reason, a negative voltage is applied from the protruding tube 25 to the cap nut 1. Further, as shown in FIG. 15, an anode 91 is installed in the semi-gloss tank 59. In this way, the outer surface of the cap nut 1 can be plated by setting the cap nut 1 side to a negative voltage and the anode side to a positive voltage.

さらに液槽内のアノード91以外に、補助陽極92を設置した例を図16に示す。図16は、液槽を上から眺めたところを示す。液槽内の両側にアノード91が対向して設置されている。そしてアノード間に複数の補助陽極92が設置されている。この補助陽極に囲まれた領域に、浸漬保持具21に保持された袋ナット1が、それぞれ設置されることになる。そしてアノード91、補助陽極92に正の電圧を印加し、前述のように電圧印加部78によって、支持軸23b、ガイド軸24b、基底部27、突起管25、袋ナット1に負の電圧が印加される。このようにして袋ナット1の外面にめっき処理を施すことができる。袋ナット1を取り囲むように補助陽極92が設置されていることから、電流が安定して、かつ均一に流れることができ、外面に、より一様な厚さのめっきを施すことができる。   Further, FIG. 16 shows an example in which an auxiliary anode 92 is installed in addition to the anode 91 in the liquid tank. FIG. 16 shows the liquid tank as viewed from above. Anodes 91 are placed opposite to each other in the liquid tank. A plurality of auxiliary anodes 92 are installed between the anodes. The cap nuts 1 held by the immersion holder 21 are respectively installed in the area surrounded by the auxiliary anode. Then, a positive voltage is applied to the anode 91 and the auxiliary anode 92, and a negative voltage is applied to the support shaft 23b, the guide shaft 24b, the base portion 27, the protruding tube 25, and the cap nut 1 by the voltage application unit 78 as described above. Is done. In this manner, the outer surface of the cap nut 1 can be plated. Since the auxiliary anode 92 is installed so as to surround the cap nut 1, the current can flow stably and uniformly, and the outer surface can be plated with a more uniform thickness.

図17に袋状ワーク保持用治具の変形例を示す。この浸漬保持具110は、上面と下面とを貫通する貫通孔を有する基底部27、基底部27の上面側の貫通孔上のから延びた突起管25、基底部27から延びたガイド軸24、複数の突起管25とガイド軸24とが挿入される挿入孔(貫通孔)を有する摺動板26、ガイド軸24を支持する支持軸23、さらにその支持軸23と接続される支持板22を備える。そして基底部27が、3列並列に形成されている。このよう基底部27の数を増やすことで、一度に多くの袋ナットを処理することができる。4列以上としてもよい。また突起管が各基底部27上に3本形成されているが、突起管の数は、3本に限られない。基底部の数や突起管の数を増やすと、多くの袋状ワークを同時に処理することが可能となる。   FIG. 17 shows a modification of the bag-like workpiece holding jig. The immersion holder 110 includes a base portion 27 having a through hole penetrating the upper surface and the lower surface, a protruding tube 25 extending from a through hole on the upper surface side of the base portion 27, a guide shaft 24 extending from the base portion 27, A sliding plate 26 having an insertion hole (through hole) into which the plurality of protruding tubes 25 and the guide shaft 24 are inserted, a support shaft 23 for supporting the guide shaft 24, and a support plate 22 connected to the support shaft 23 are provided. Prepare. And the base part 27 is formed in 3 rows in parallel. By increasing the number of the base portions 27 in this way, many cap nuts can be processed at a time. It is good also as four or more rows. Further, although three protruding tubes are formed on each base portion 27, the number of protruding tubes is not limited to three. Increasing the number of bases and the number of protruding tubes makes it possible to process many bag-like workpieces simultaneously.

さらに図18に袋状ワーク保持用治具の変形例を示す。浸漬保持具111の基底部27は、互いを結合する結合部30を両端に有する。このような結合部30によって基底部27を結合することにより、基底部27やガイド軸24が浸漬保持具111の移動などにともなって、揺れたりすることを防いで、安定化することができる。また結合部30は、基底部27の両端を結合する形状に限られない。基底部27の中間領域を結合したり、3本以上の結合部30を形成したりしてもよい。さらに摺動板26にも同様の結合部30を形成してもよい。   FIG. 18 shows a modification of the bag-like workpiece holding jig. The base portion 27 of the immersion holder 111 has coupling portions 30 that couple each other at both ends. By connecting the base portion 27 with the connecting portion 30 as described above, the base portion 27 and the guide shaft 24 can be stabilized by preventing the base holder 27 and the guide shaft 24 from shaking as the immersion holder 111 moves. Further, the connecting portion 30 is not limited to a shape that connects both ends of the base portion 27. The intermediate region of the base portion 27 may be coupled, or three or more coupling portions 30 may be formed. Further, a similar coupling portion 30 may be formed on the sliding plate 26.

内面めっきの他の方法について図19を用いて説明する。(a)に示すように、浸漬保持具の摺動板126によって保持された袋ナット1は、めっき液48上に移動される。そして液面上で、突起管125から、めっき液を噴出する。めっき液を噴出することにより、袋ナット1の内面全域をめっき処理することができる。このとき、噴出圧によって袋ナットが動かないように、袋ナット1の頭部等を抑えて固定しておくとよい。内面めっき処理工程が終了すると、続いて(b)に示すように、めっき液内に、袋ナットを浸漬し、外面めっきを施す。   Another method of inner plating will be described with reference to FIG. As shown in (a), the cap nut 1 held by the sliding plate 126 of the immersion holder is moved onto the plating solution 48. Then, the plating solution is ejected from the protruding tube 125 on the liquid surface. By spraying the plating solution, the entire inner surface of the cap nut 1 can be plated. At this time, the head of the cap nut 1 and the like may be suppressed and fixed so that the cap nut does not move due to the ejection pressure. When the inner plating process is completed, as shown in (b), the cap nut is dipped in the plating solution to perform outer plating.

図20を用いて、処理液循環方法を説明する。図20は、めっき槽151、例えば、半光沢槽を示す。このめっき槽151には、流出管135、ポンプ75、流入管136が備えられている。袋ナット1を、浸漬保持具によって保持して、めっき槽151へ浸漬し、流出管135の先端部が、袋ナット1の袋状空間に挿入されるようにする。あるいは、前述の浸漬保持具21のように突起管が袋状空間に挿入され、流動補助具85を経て、流出管135へ連結される構造としてもよい。この状態で、袋ナット1に電圧を印加して、めっき処理を施す。この時、ポンプ75で袋ナット1の袋状空間内の気体または液体を吸引する。そして流出管135、ポンプ75と吸入された気体または液体は、流入管136によってめっき槽151内へ、流入される。これにより、めっき槽151内の処理液に流動が起こり、めっき効率を上げることができる。   The processing liquid circulation method will be described with reference to FIG. FIG. 20 shows a plating bath 151, for example a semi-gloss bath. The plating tank 151 is provided with an outflow pipe 135, a pump 75, and an inflow pipe 136. The cap nut 1 is held by the immersion holder and immersed in the plating tank 151 so that the tip of the outflow pipe 135 is inserted into the bag-like space of the cap nut 1. Alternatively, the protruding tube may be inserted into the bag-like space like the above-described immersion holder 21 and connected to the outflow tube 135 via the flow assisting device 85. In this state, a voltage is applied to the cap nut 1 to perform plating. At this time, gas or liquid in the bag-like space of the cap nut 1 is sucked by the pump 75. The outflow pipe 135 and the pump 75 and the sucked gas or liquid are introduced into the plating tank 151 through the inflow pipe 136. Thereby, a flow occurs in the treatment liquid in the plating tank 151, and the plating efficiency can be increased.

なお袋状ワークとして図22に示すような袋ナット301に対し本発明を適用することができる。   Note that the present invention can be applied to a cap nut 301 as shown in FIG.

先に説明したように、この発明によれば袋ナットの内面に半光沢めっきを、また外面に光沢めっきを施すことができる。すなわち、より上位概念的に言えば、次のようなめっき付の袋状部材(代表的には袋ナット)(1)ないし(5)を容易に得ることができる。
(1)開口部で開放された袋状空間を有する、めっき処理された袋状部材であって、外面のめっき層と、内面(袋ナットの場合はめねじ穴を含む)のめっき層とが異なるめっき形態とされたことを特徴とする袋状部材。
(2)開口部で開放された袋状空間を有する、めっき処理された袋状部材であって、外面のめっき層と、内面(袋ナットの場合はめねじ穴を含む)のめっき層とが形成され、内面のめっき層の厚さが外面のめっき層の厚さより薄くされたことを特徴とする袋状部材。
(3)開口部で開放された袋状空間を有する、めっき処理された袋状部材であって、外面のめっき層と、内面(袋ナットの場合はめねじ穴を含む)のめっき層とが形成され、内面のめっき層が半光沢めっき、外面のめっき層が光沢めっきとされたことを特徴とする袋状部材。
(4)開口部で開放された袋状空間を有する、めっき処理された袋状部材であって、外面のめっき層と内面(袋ナットの場合はめねじ穴を含む)のめっき層とが形成され、内面のめっき層の厚さが外面のめっき層の厚さより薄くされ、かつ内面は半光沢めっき、外面は光沢めっきとされたことを特徴とする袋状部材。
(5)開口部で開放された袋状空間を有する、めっき処理された袋状部材であって、外面のめっき層と、内面(袋ナットの場合はめねじ穴を含む)のめっき層とが形成され、内面のめっき層の材質と外面のめっき層の材質とが互いに異なる材質とされたことを特徴とする袋状部材。
As described above, according to the present invention, semi-gloss plating can be applied to the inner surface of the cap nut and gloss plating can be applied to the outer surface. That is, in terms of a higher level concept, the following plated bag-like members (typically, cap nuts) (1) to (5) can be easily obtained.
(1) A plated bag-like member having a bag-like space opened at an opening, and the outer plating layer is different from the inner plating layer (including a female screw hole in the case of a cap nut). A bag-like member characterized by being in a plating form.
(2) A plated bag-like member having a bag-like space opened at an opening, and an outer plating layer and an inner plating layer (including a female screw hole in the case of a cap nut) are formed. A bag-shaped member, wherein the inner plating layer is thinner than the outer plating layer.
(3) A plated bag-like member having a bag-like space opened at an opening, and an outer plating layer and an inner plating layer (including a female screw hole in the case of a cap nut) are formed. A bag-like member, wherein the inner plating layer is semi-gloss plating and the outer plating layer is bright plating.
(4) A plated bag-like member having a bag-like space opened at an opening, wherein an outer plating layer and an inner plating layer (including a female screw hole in the case of a cap nut) are formed. A bag-shaped member, wherein the inner plating layer is thinner than the outer plating layer, the inner surface is semi-gloss plating, and the outer surface is gloss plating.
(5) A plated bag-shaped member having a bag-shaped space opened at the opening, and formed with an outer plating layer and an inner plating layer (including a female screw hole in the case of a cap nut). A bag-like member, wherein the material of the inner plating layer and the outer plating layer are different from each other.

以上の効果を確かめるために、めっき処理を行い、袋ナットのめっき層の厚さについて測定した。内面は、めっきによって十分に、全領域に渡り被覆されていることが確認された。   In order to confirm the above effects, plating treatment was performed, and the thickness of the plating layer of the cap nut was measured. It was confirmed that the inner surface was sufficiently covered by plating over the entire area.

さらにアノードと補助陽極を使用して、ナットに外面めっきを施して、そのめっき厚を過電流式非破壊膜厚計を用いて測定を行った。測定箇所にばらつきが少なく、ほぼ同じ程度の膜厚を得ることができた。以上の試験から、両側のアノードと補助陽極を使用した場合には、外側のめっき膜厚のばらつきが小さく、一様にめっき処理が施されていることが確認された。   Furthermore, using an anode and an auxiliary anode, the outer plating was applied to the nut, and the plating thickness was measured using an overcurrent nondestructive film thickness meter. There was little variation in the measurement location, and almost the same film thickness could be obtained. From the above tests, it was confirmed that when the anodes on both sides and the auxiliary anode were used, the variation in the outer plating film thickness was small and the plating treatment was performed uniformly.

以上の内面めっきにおける袋状空間の気体または液体の吸引や噴出、このための浸漬保持具、補助陽極は、ニッケルめっきに限られない。さらに被めっき物は、袋状空間を有するワークであれば、袋ナットに限られない。内面めっきと外面めっきとを異なる工程において行うことで、内面と外面とを異なるめっき層に仕上げることができる。   The suction or ejection of gas or liquid in the bag-shaped space in the above inner plating, the immersion holder, and the auxiliary anode for this purpose are not limited to nickel plating. Furthermore, if a to-be-plated object is a workpiece | work which has a bag-shaped space, it will not be restricted to a cap nut. By performing the inner surface plating and the outer surface plating in different processes, the inner surface and the outer surface can be finished in different plating layers.

浸漬保持具が利用される袋状ワークの一例としての袋ナット。A cap nut as an example of a bag-like workpiece in which an immersion holder is used. 浸漬保持具の実施例。Example of immersion holder. 浸漬保持具の拡大断面図。The expanded sectional view of an immersion holder. 浸漬保持具の拡大斜視図。The expansion perspective view of an immersion holder. めっき処理ラインの実施例。An example of a plating line. めっき処理ラインにおける浸漬保持具の動作を説明する図。The figure explaining operation | movement of the immersion holder in a plating processing line. 流動補助具を説明する図。The figure explaining a flow aid. 内面めっき、外面めっきにおける浸漬保持具の使用状態を説明する図。The figure explaining the use condition of the immersion holder in inner surface plating and outer surface plating. 液槽の電圧印加部について説明する図。The figure explaining the voltage application part of a liquid tank. 内面めっきにおける摺動板の位置と電圧印加について説明する図。The figure explaining the position of a sliding plate and voltage application in inner surface plating. 内面めっきを施すための気体・液体の吸引または吐出について説明する図。The figure explaining the attraction | suction or discharge of the gas and liquid for performing inner surface plating. 袋ナットの固定について説明する図。The figure explaining fixation of a cap nut. 突起管が開口部近傍に位置する場合を示す図。The figure which shows the case where a protruding tube is located in the opening part vicinity. 外面めっきにおける摺動板の位置と電圧印加について説明する図。The figure explaining the position of a sliding plate and voltage application in outer surface plating. 液槽内のアノードについて説明する図。The figure explaining the anode in a liquid tank. アノードと補助陽極について説明する図。The figure explaining an anode and an auxiliary anode. 浸漬保持具の第二の実施例。2nd Example of an immersion holder. 浸漬保持具の第三の実施例。3rd Example of an immersion holder. 処理液の吐出によるめっき処理について説明する図。The figure explaining the plating process by discharge of a process liquid. 処理液の循環について説明する図。The figure explaining the circulation of a process liquid. 従来の浸漬保持具とめっき処理を説明する図。The figure explaining the conventional immersion holder and plating process. 袋状ワークの他の実施例としての袋ナットの図。The figure of the cap nut as other examples of a bag-like work.

符号の説明Explanation of symbols

1 袋ナット
21 浸漬保持具
24 ガイド軸
25 突起管
26 摺動板
27 基底部
59 半光沢槽
72 搬送ライン
75 ポンプ
76,77,78 電圧印加部
91 アノード
92 補助陽極
1 Cap nut 21 Immersion holder 24 Guide shaft 25 Projection tube 26 Sliding plate 27 Base part 59 Semi-gloss tank 72 Transfer line 75 Pump 76, 77, 78 Voltage application part 91 Anode 92 Auxiliary anode

Claims (10)

袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように保持するために、その袋状ワークの内面に当接して前記袋状ワークを突き上げ状態で支持する第1支持部材と、その第1支持部材に替わって前記袋状ワークを着座させて支持する第2支持部材とを用い、
前記袋状ワークを第2支持部材に着座させるとともに、前記第1支持部材の先端が前記袋状ワークの内面から離間させた状態で、かつ前記袋状ワークと当接した第2支持部材に陰極となる電圧を印加するとともに、前記袋状ワークの袋状空間に位置する又は前記袋状空間の開口部近傍に位置する前記第1支持部材に陽極となる電圧を印加した状態で、前記袋状ワークの少なくとも袋状空間内面に電解めっきを施す第1工程と、
その第1工程の前又は後に、前記袋状ワークをその内面に前記第1支持部材を当接させて突き上げ、前記袋状ワークを前記第2支持部材から離間させた状態で、かつ袋状ワークに当接した前記第1支持部材に陰極となる電圧を印加した状態で、袋状ワークの少なくとも外面に電解めっきを施す第2工程と、
を含むことを特徴とする袋状ワークの電解めっき方法。
In order to hold the bag-shaped workpiece having a bag-shaped space in the plating solution so that the opening portion faces downward, the first is supported against the inner surface of the bag-shaped workpiece and supported in the pushed-up state. Using a support member and a second support member that supports the bag-shaped workpiece by sitting instead of the first support member,
The bag-like workpiece is seated on the second support member, and the cathode is applied to the second support member in contact with the bag-like workpiece in a state where the tip of the first support member is separated from the inner surface of the bag-like workpiece. In the state where the voltage which becomes the anode is applied to the first support member which is located in the bag-like space of the bag-like work or in the vicinity of the opening of the bag-like space A first step of performing electrolytic plating on at least the inner surface of the bag-like space of the workpiece;
Before or after the first step, the bag-shaped workpiece is pushed up with the first support member in contact with the inner surface thereof, and the bag-shaped workpiece is separated from the second support member, and the bag-shaped workpiece is A second step of applying electrolytic plating to at least the outer surface of the bag-like workpiece in a state where a voltage serving as a cathode is applied to the first support member in contact with the first support member;
A method for electroplating a bag-like workpiece, comprising:
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように、その袋状ワークの内面に当接して前記袋状ワークを突き上げ状態で支持する第1支持部材と、
その第1支持部材に替わって前記袋状ワークを着座させて支持する第2支持部材と、
前記袋状ワークが第2支持部材に着座するとともに、前記第1支持部材の先端が前記袋状ワークの内面から離間した第1位置と、前記袋状ワークをその内面に前記第1支持部材を当接させて突き上げ、前記袋状ワークを前記第2支持部材から離間させて支持する第2位置との間で、前記第1支持部材と第2支持部材との相対的な位置を変換する支持部材相対位置変換装置と、
前記第1位置において前記袋状ワークと当接した第2支持部材に陰極となる電圧を印加するとともに、前記袋状ワークの前記袋状空間に位置する又は前記袋状空間の開口部近傍に位置する前記第1支持部材に陽極となる電圧を印加する一方、前記第2位置において前記袋状ワークに当接した前記第1支持部材に陰極となる電圧を印加するように、少なくとも前記第1支持部材への電圧印加の極性を変換する電圧極性変換装置と、を含み、
前記袋状ワークが前記第2支持部材に着座し、前記袋状ワークの内面から前記第1支持部材が離間した前記第1位置において、前記電圧極性変換装置により第2支持部材に陰極となる電圧を印加するとともに、前記袋状ワークの袋状空間に位置する又は前記袋状空間の開口部近傍に位置する前記第1支持部材に陽極となる電圧を印加した状態で、前記袋状ワークの少なくとも前記袋状空間内面に電解めっきを施し、前記第1支持部材が前記袋状ワークをその内面に当接して突き上げ、前記袋状ワークを前記第2支持部材から離間させた前記第2位置において、前記電圧極性変換装置により前記袋状ワークに当接した前記第1支持部材に陰極となる電圧を印加した状態で、前記袋状ワークの少なくとも外面に電解めっきを施すことを特徴とする袋状ワークの電解めっき装置。
A first support member that contacts the inner surface of the bag-shaped workpiece and supports the bag-shaped workpiece in a pushed-up state so that the opening of the bag-shaped workpiece having a bag-shaped space faces downward in the plating solution;
A second support member that seats and supports the bag-like workpiece instead of the first support member;
The bag-like workpiece is seated on the second support member, and a first position where the tip of the first support member is separated from the inner surface of the bag-like workpiece; and the bag-like workpiece on the inner surface of the first support member. Support that changes the relative position between the first support member and the second support member between the second support member and the second position where the bag-like workpiece is supported by being separated from the second support member. A member relative position conversion device;
A voltage serving as a cathode is applied to the second support member that is in contact with the bag-shaped workpiece at the first position, and is positioned in the bag-shaped space of the bag-shaped workpiece or in the vicinity of the opening of the bag-shaped space. At least the first support so as to apply a voltage serving as an anode to the first support member while applying a voltage serving as a cathode to the first support member that is in contact with the bag-like workpiece at the second position. A voltage polarity conversion device that converts the polarity of voltage application to the member,
In the first position where the bag-like workpiece is seated on the second support member and the first support member is separated from the inner surface of the bag-like workpiece, the voltage that becomes the cathode of the second support member by the voltage polarity conversion device And applying a voltage serving as an anode to the first support member located in the bag-shaped space of the bag-shaped workpiece or in the vicinity of the opening of the bag-shaped space, at least the bag-shaped workpiece In the second position where the bag-shaped space inner surface is subjected to electrolytic plating, the first support member pushes the bag-shaped workpiece into contact with the inner surface, and the bag-shaped workpiece is separated from the second support member. Electrolytic plating is performed on at least the outer surface of the bag-shaped workpiece in a state in which a voltage serving as a cathode is applied to the first support member in contact with the bag-shaped workpiece by the voltage polarity converter. Electrolytic plating apparatus of Jo work.
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように、その袋状ワークの内面に当接して前記袋状ワークを突き上げ状態で支持する第1支持部材と、
その第1支持部材に替わって前記袋状ワークを着座させて支持する第2支持部材と、
前記袋状ワークが第2支持部材に着座するとともに、前記第1支持部材の先端が前記袋状ワークの内面から離間した第1位置と、前記袋状ワークをその内面に前記第1支持部材が当接して突き上げ、前記袋状ワークを前記第2支持部材から離間させて支持する第2位置との間で、前記第1支持部材と第2支持部材とを相対的に移動可能に支持する支持部材移動機構と、
を含むことを特徴とする袋状ワークの電解めっき用保持具。
A first support member that contacts the inner surface of the bag-shaped workpiece and supports the bag-shaped workpiece in a pushed-up state so that the opening of the bag-shaped workpiece having a bag-shaped space faces downward in the plating solution;
A second support member that seats and supports the bag-like workpiece instead of the first support member;
The bag-like workpiece is seated on the second support member, and a first position where the tip of the first support member is separated from the inner surface of the bag-like workpiece, and the bag-like workpiece is placed on the inner surface of the first support member. Support that supports the first support member and the second support member so as to be relatively movable between a second position where the bag-like workpiece is supported by being pushed up and separated from the second support member. A member moving mechanism;
A holder for electrolytic plating of a bag-like workpiece, comprising:
めっきラインの昇降機構に接続される本体フレームと、
袋状空間を有する袋状ワークをめっき液中でその開口部が下側を向くように、その袋状ワークの内面に当接して袋状ワークを突き上げ状態で支持するとともに前記本体フレームに対し固定的に設けられた、互いに同様の高さで隣接してそれぞれ1個の袋状ワークを支持する複数の第1支持部材と、
それら第1支持部材の先端をつなぐ直線とほぼ平行に配置され、前記複数の第1支持部材をそれぞれ挿通させるとともに、複数の袋状ワークをその開口部を下側に向けて着座させて前記第1支持部材に替わって前記袋状ワークを支持する複数の挿通兼支持穴を備え、前記第1支持部材に対して高さ変更可能に設けられた第2支持部材と、
前記袋状ワークがその第2支持部材に着座するとともに、前記第1支持部材の先端が前記袋状ワークの内面から離間した第1位置と、前記第1支持部材が前記袋状ワークの内面に当接して前記袋状ワークを突き上げ、前記袋状ワークを前記第2支持部材から離間させて支持する第2位置との間で、前記第2支持部材を第1支持部材に対して昇降可能に案内する第2部材ガイド部と、
を含むことを特徴とする袋状ワークの電解めっき用保持具。
A body frame connected to the lifting mechanism of the plating line;
A bag-shaped workpiece having a bag-shaped space is supported in a state in which the bag-shaped workpiece is pushed up in contact with the inner surface of the bag-shaped workpiece so that its opening faces downward in the plating solution and fixed to the main body frame. A plurality of first support members that are adjacent to each other at the same height and support one bag-like workpiece,
The first support members are arranged substantially in parallel with the straight line connecting the tips of the first support members, and the plurality of first support members are respectively inserted, and the plurality of bag-like workpieces are seated with their openings facing downward. A second support member provided with a plurality of insertion and support holes for supporting the bag-shaped workpiece instead of the one support member, the height of the second support member being changeable with respect to the first support member;
The bag-shaped workpiece is seated on the second support member, the first position where the tip of the first support member is separated from the inner surface of the bag-shaped workpiece, and the first support member is on the inner surface of the bag-shaped workpiece. The second support member can be moved up and down with respect to the first support member between the second support member and the second position where the bag-like workpiece is supported by being separated from the second support member. A second member guide for guiding;
A holder for electrolytic plating of a bag-like workpiece, comprising:
上面と下面とを貫通する貫通孔を有する基底部と、
前記基底部の前記貫通孔上の上面から延びた第1支持部材と、
前記基底部から延びた第2部材ガイド部と、
前記第1支持部材と第2部材ガイド部とが挿入される挿入孔を有し、前記第2部材ガイド部に沿って摺動可能な第2支持部材と、
前記第2部材ガイド部を支持する支持部と、
を備え、
袋状ワークを前記第1支持部材または第2支持部材によって支持し、めっき液を有する液槽へ浸漬して、前記袋状ワークを前記めっき液で処理することを特徴とする袋状ワークの電解めっき用保持具。
A base portion having a through hole penetrating the upper surface and the lower surface;
A first support member extending from an upper surface of the base portion on the through hole;
A second member guide portion extending from the base portion;
A second support member having an insertion hole into which the first support member and the second member guide portion are inserted, and capable of sliding along the second member guide portion;
A support portion for supporting the second member guide portion;
With
The bag-like workpiece is supported by the first support member or the second support member, immersed in a liquid bath having a plating solution, and the bag-like workpiece is treated with the plating solution. Plating holder.
前記第2支持部材を前記基底部から離間し、かつ前記第1支持部材の先端面より前記基底部に近い上昇位置に保持することにより、前記袋状ワークの前記袋状空間の頭部面と前記第1支持部材の前記先端面とを非接触状態とし、前記第2支持部材に負の電圧を印加することにより、前記袋状ワークに負の電圧を印加し、前記第1支持部材に正の電圧を印加することにより、前記めっき液で前記袋状ワークの内面を処理する請求項5に記載の袋状ワークの電解めっき用保持具。   The head surface of the bag-shaped space of the bag-shaped workpiece is formed by holding the second support member away from the base portion and holding the second support member at a raised position closer to the base portion than the tip surface of the first support member. A negative voltage is applied to the bag-like workpiece by applying a negative voltage to the second support member by bringing the tip end surface of the first support member into a non-contact state and applying a negative voltage to the second support member. The holder for electrolytic plating of a bag-shaped workpiece according to claim 5, wherein the inner surface of the bag-shaped workpiece is treated with the plating solution by applying a voltage of 5. 前記基底部の前記貫通孔と前記第1支持部材とを介して、前記袋状ワークの前記袋状空間を満たす気体またはめっき液を吸引することにより、または前記第1支持部材から前記めっき液を噴出することにより、前記袋状ワークの内面を前記めっき液で処理する請求項5または6に記載の袋状ワークの電解めっき用保持具。   By sucking a gas or a plating solution that fills the bag-like space of the bag-like workpiece through the through hole of the base portion and the first support member, or the plating solution from the first support member The holder for electrolytic plating of a bag-shaped workpiece according to claim 5 or 6, wherein the inner surface of the bag-shaped workpiece is treated with the plating solution by being ejected. 前記第2支持部材を下降位置に下げることにより、前記袋状ワークの前記袋状空間の頭部面に前記第1支持部材の先端面が接触する状態とし、前記第1支持部材に負の電圧を印加することにより、前記袋状ワークに負の電圧を印加して、前記めっき液により前記袋状ワークの外面処理を行う請求項5ないし7のいずれか1項に記載の袋状ワークの電解めっき用保持具。   By lowering the second support member to the lowered position, the tip surface of the first support member comes into contact with the head surface of the bag-like space of the bag-like workpiece, and a negative voltage is applied to the first support member. The electrolysis of the bag-shaped workpiece according to any one of claims 5 to 7, wherein a negative voltage is applied to the bag-shaped workpiece by applying a voltage to perform an outer surface treatment of the bag-shaped workpiece with the plating solution. Plating holder. 前記液槽内に正の電極を設置し、その液槽に浸漬して前記袋状ワークに負の電圧を印加し、前記袋状ワークの外面処理を行う請求項8に記載の袋状ワークの電解めっき用保持具。   The bag-shaped workpiece according to claim 8, wherein a positive electrode is installed in the liquid tank, a negative voltage is applied to the bag-shaped work by immersing in the liquid tank, and the outer surface treatment of the bag-shaped work is performed. Electroplating holder. 少なくとも前記第1支持部材と前記第2支持部材とが、導体により形成されている請求項3ないし9のいずれか1項に記載の袋状ワークの電解めっき用保持具。
The holder for electrolytic plating of a bag-shaped workpiece according to any one of claims 3 to 9, wherein at least the first support member and the second support member are formed of a conductor.
JP2004170522A 2004-06-08 2004-06-08 Electroplating method for box-shaped work, electroplating device, and holder for electroplating Pending JP2005350698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004170522A JP2005350698A (en) 2004-06-08 2004-06-08 Electroplating method for box-shaped work, electroplating device, and holder for electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004170522A JP2005350698A (en) 2004-06-08 2004-06-08 Electroplating method for box-shaped work, electroplating device, and holder for electroplating

Publications (1)

Publication Number Publication Date
JP2005350698A true JP2005350698A (en) 2005-12-22

Family

ID=35585422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004170522A Pending JP2005350698A (en) 2004-06-08 2004-06-08 Electroplating method for box-shaped work, electroplating device, and holder for electroplating

Country Status (1)

Country Link
JP (1) JP2005350698A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102953111A (en) * 2011-08-19 2013-03-06 悦虎电路(苏州)有限公司 Copper ball addition device used in electroplating
KR101342359B1 (en) 2011-10-31 2013-12-16 이병록 Surface treatment method for nut bore

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102953111A (en) * 2011-08-19 2013-03-06 悦虎电路(苏州)有限公司 Copper ball addition device used in electroplating
KR101342359B1 (en) 2011-10-31 2013-12-16 이병록 Surface treatment method for nut bore

Similar Documents

Publication Publication Date Title
EP2000564B1 (en) Workpiece surface treatment systems and methods
ES2886073T3 (en) Electropolishing method and system for the same
CN111519233A (en) Nickel plating production line and electroplating process thereof
JP2017031438A (en) Suction plating device
US9382637B2 (en) Method of anodizing hollow metallic bodies
AU2019204152B2 (en) Portable and modular production electroplating system
US9238874B2 (en) Method and apparatus for electroplating metal parts
JP3600787B2 (en) Surface treatment method and surface treatment line for bag-like work
JP4603822B2 (en) Workpiece holder for plating process
JP4613035B2 (en) Electrolytic plating method and electrolytic plating apparatus for bag-like workpiece
JP2005350703A (en) Electroplating method for box-shaped work, box-shaped work holder for electroplating, and electroplating device for box-shaped work
JP3586420B2 (en) Plating method and plating line for bag-like work
JP2005350698A (en) Electroplating method for box-shaped work, electroplating device, and holder for electroplating
JP4574237B2 (en) Electrolytic plating equipment
JP2005350701A (en) Electroplating method and electroplating device for box-shaped work
JP5164693B2 (en) Plating equipment
JP2010189736A (en) Automatic plating apparatus
US20150136182A1 (en) Continuous-type apparatus for surface treatment of workpieces
JP5164694B2 (en) Plating method
KR102035233B1 (en) Plating system
JP5294730B2 (en) Surface treatment line and surface treatment method for bag-like workpiece
CN106488658B (en) Seed layer rapid etching method for high-density substrate semi-addition process
JP2009094523A (en) Apparatus and method for treating substrate
KR102057507B1 (en) Plating system
TWI471926B (en) Deflash apparatus for strip-shaped elements