JP2005338125A - Optical waveguide and its manufacturing method, and optical information processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide which can perform a stable light incidence/light emission and its manufacturing method, and an optical information processor having the optical waveguide. <P>SOLUTION: In an optical waveguide 1 which consists of a laminated body of a 1st cladding layer 2, a core layer 4 and a 2nd cladding layer 3 and which is constituted so that light is guided through the core layer 4, the optical waveguide 1 is constituted so that reinforcing parts 6 different from the 1st cladding layer 2 are formed at light incident and emitting end sides other than the middle part 5 of the laminated body by being projected from the surface of the 1st cladding layer 2. The manufacturing method of the optical waveguide 1 has a process for forming the laminated body and a process for forming the reinforcing part 6 different from the 1st cladding layer 2 at at least one side of the light incident and emitting end sides other than the middle part 5 of the laminated body by projecting it from the surface of the 1st cladding layer. The optical information processor has the optical waveguide 1, and a light incidence means for making the light incident on the core layer 4 of the waveguide 1, and light receiving means for receiving the light emitted from the layer 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical waveguide suitable for a light source module, optical interconnection, optical communication, and the like, a manufacturing method thereof, and an optical information processing apparatus.

  Currently, signal propagation between semiconductor chips such as LSIs (Large Scale Integrated Circuits) is all made by electrical signals via substrate wiring. However, with the recent increase in MPU functionality, the amount of data exchanged between chips has increased remarkably, and as a result, various high frequency problems have emerged. Typical examples thereof include RC signal delay, impedance mismatch, EMC / EMI, crosstalk, and the like.

  In order to solve the above problems, the mounting industry and others have so far taken the lead in solving various problems such as optimization of wiring layout and development of new materials.

  However, in recent years, the effects of optimization of the wiring layout and development of new materials have been hampered by physical limitations, and it is assumed that simple semiconductor chips will be mounted in order to realize further advanced system functionality in the future. It has become necessary to review the structure of the printed wiring board itself. In recent years, various drastic measures have been proposed to solve these problems, but the following are representative examples.

・ Fine wiring bonding by multi-chip module (MCM) mounting High-performance chips on precision mounting boards such as ceramic and silicon, realizing fine wiring bonding that cannot be formed on a motherboard (multilayer printed circuit board). As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Sealing and integration of various semiconductor chips and electrical wiring bonding by integration Various semiconductor chips are two-dimensionally sealed and integrated using polyimide resin or the like, and fine wiring bonding is performed on the integrated substrate. As a result, the pitch of the wiring can be narrowed, and the amount of data exchange increases dramatically by widening the bus width.

-Three-dimensional bonding of semiconductor chips A through electrode is provided in various semiconductor chips, and each is bonded to form a laminated structure. Thereby, the connection between the different types of semiconductor chips is physically short-circuited, and as a result, problems such as signal delay are avoided. On the other hand, however, problems such as an increase in the amount of heat generated due to lamination and thermal stress between semiconductor chips occur.

  Furthermore, in order to realize high speed and large capacity of signal transmission / reception as described above, an optical transmission coupling technique using optical wiring has been developed (for example, see Non-Patent Document 1 and Non-Patent Document 2 described later). . The optical wiring can be applied to various places such as between electronic devices, between boards in an electronic device, or between chips in a board. For example, as shown in FIG. 22, for transmission of signals over a short distance such as between chips, an optical waveguide 51 is formed on a printed wiring board 57 on which the chips are mounted, and the optical waveguide 51 is subjected to signal modulation. In addition, it is possible to construct an optical transmission / communication system using a transmission path of laser light or the like. Further, as shown in FIG. 23, the optical waveguide 51 includes clad layers 54 and 55 and a core layer 56 sandwiched between the clad layers 54 and 55, and an end face on the light incident side of the core layer 56 is It is formed on a 45 ° mirror surface.

Nikkei Electronics, “Encounter with Optical Wiring”, December 3, 2001, pages 122, 123, 124, 125, FIG. 4, FIG. 5, FIG. 6, FIG. NTT R & D, vol.48, no.3, pp.271-280 (1999)

  Optical components such as lenses are arranged at both ends of the optical waveguide, and an optical signal is incident or emitted. However, since the optical waveguide according to the conventional example as described above is generally made of resin, it has hygroscopicity, and the optical waveguide gradually expands. When such an optical waveguide is used, the optical axis gradually shifts as a result due to expansion of the optical waveguide.

  Further, even when the optical waveguide 51 according to the conventional example as shown in FIG. 23 is manufactured by the injection molding process with the highest precision, the limit thickness of the cladding layers 54 and 55 is about 0.3 mm, Considering the yield, etc., it is necessary to secure about 0.5 mm. The thickness of the core layer 56 is generally 40 μm or less. Therefore, the optical waveguide 51 according to the conventional example as shown in FIG. 23 has a limit thickness of about 1 mm. With this thickness, the optical waveguide is not deformed by heat or external stress without applying stress to the core layer 56. It is extremely difficult to absorb.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an optical waveguide capable of performing stable light incidence and / or light emission, a method for manufacturing the same, and the optical waveguide. An object of the present invention is to provide an optical information processing apparatus having a waveguide.

  That is, the present invention provides an optical waveguide comprising a laminate of a first clad layer, a core layer, and a second clad layer, wherein light is guided through the core layer. A reinforcing portion different from the first clad layer is formed on at least one of the light incident / exit end sides excluding the surface of the first clad layer on the side opposite to the core layer. This relates to the optical waveguide.

  And a step of producing the laminated body in a method of manufacturing an optical waveguide comprising a laminated body of a first cladding layer, a core layer, and a second cladding layer, wherein light is guided through the core layer. A reinforcing portion different from the first cladding layer is protruded from the surface of the first cladding layer opposite to the core layer on at least one of the light incident / exit end sides excluding the intermediate portion of the laminate. And a process for forming the optical waveguide.

  Furthermore, the present invention relates to an optical information processing apparatus having the optical waveguide of the present invention, a light incident means for making light incident on the core layer of the optical waveguide, and a light receiving means for receiving the light emitted from the core layer.

  Here, in the present invention, the “core layer” means not only a single core layer but also a plurality of arrays.

  According to the present invention, at least one of the light incident / exit end sides excluding the intermediate portion of the laminate is provided with a reinforcing portion different from the first cladding layer, and the first cladding layer on the side opposite to the core layer. Since at least one of the light incident / exit end side excluding the intermediate portion of the laminate has excellent rigidity, for example, the bonding strength between the optical waveguide and the mounting substrate can be improved. it can. Therefore, unlike the optical waveguide according to the conventional example described above, the optical axis is not shifted due to swelling or the like, and efficient and stable light incidence and / or light emission can be performed.

  Since the optical waveguide of the present invention has the excellent effects as described above, it can be suitably used as an optical information processing apparatus such as an optical wiring.

  In the present invention, the core layer serves to guide incident signal light, and the first cladding layer and the second cladding layer serve to confine the signal light in the core layer. The core layer is made of a material having a high refractive index, and the first cladding layer and the second cladding layer are made of a material having a refractive index lower than that of the core layer.

  It is preferable that the reinforcing portion is integrally formed with the second cladding layer. Moreover, it is preferable that the said reinforcement part is formed by extending the said 2nd clad layer in the outer periphery of the said core layer. In this case, it is preferable that the second clad layer extends from a side of the stacked body to a position protruding from the surface of the first clad layer on the side opposite to the core layer. Thereby, compared with the case where the said reinforcement part is installed separately or retrofitted, the positioning accuracy of the said reinforcement part is easy, manufacture is also easy, and it can reduce cost. In addition, the number of parts does not increase and productivity is high.

  The reinforcing portion may be fixed to the second cladding layer separately or retrofitted. Also in this case, it is important that the reinforcing portion has a size that reaches a position protruding from the surface of the first cladding layer on the side opposite to the core layer.

  The first cladding layer preferably has a flat sheet shape, and it is more preferable to use a low-rigidity resin sheet (for example, a thickness of 100 μm). Examples of the low-rigidity resin sheet include an optical acrylic sheet. Even if a low-rigidity resin sheet is used as the first cladding layer, the optical waveguide according to the present invention is separate from the first cladding layer on at least one side of the light incident / exit end except the intermediate portion of the laminate. The reinforcing portion is formed so as to protrude from the surface of the first cladding layer on the side opposite to the core layer, so that at least one of the light incident / exit end side excluding the intermediate portion of the laminated body has excellent rigidity. It is possible to maintain excellent bonding strength between the optical waveguide and the mounting substrate, and to improve parallel accuracy of the optical waveguide installed on the mounting substrate. For this reason, there is no deviation of the optical axis, and efficient and stable light incidence and / or light emission can be performed. Further, since the intermediate portion of the laminate can be made to have low rigidity, deformation of the optical waveguide due to mounting error, heat, external stress, etc. between the optical waveguide and the mounting substrate without applying stress to the core layer. Can be absorbed, and more stable light propagation can be performed.

  Further, it is preferable that light collimation or focusing means is formed on the second cladding layer at a position corresponding to the light incident / exiting portion with respect to the core layer. Thus, the optical signal from the light source can be focused and effectively incident on the optical waveguide according to the present invention, or the output light emitted from the optical waveguide based on the present invention can be collimated effectively to output the light. The light receiving means can efficiently receive the incident light. The collimation or focusing means may be integrally formed with the second cladding layer, or may be provided later. In particular, it is preferable that the collimation or focusing means is integrally formed with the second cladding layer at a position corresponding to the light incident / exiting portion with respect to the core layer, whereby an optical component such as a lens is separately or retrofitted. Compared with the case, the positioning accuracy of the collimation or focusing means is easy, and the manufacturing is easy and the cost can be reduced. Further, since the collimation or focusing means is integrally formed with the second cladding layer, the number of parts does not increase and the productivity is high.

  Here, it is preferable that the reinforcing portion is formed at least in a portion corresponding to a region where the collimation or focusing means exists. Thereby, since the rigidity of the laminated body in the existence region of the collimation or focusing means can be further improved, more stable light incidence and / or light emission can be performed.

  The reinforcing part and the collimation or focusing means are preferably made of the same material as that of the second cladding layer. Specifically, an injection molding resin for optical elements (for example, a product name ZEONEEX manufactured by ZEON Corporation) Etc.

  In the optical waveguide according to the present invention, a blocking wall for blocking the core layer from the outside is formed between the first cladding layer and the second cladding layer in the outer periphery of the core layer. Is preferred. Thereby, a dustproof effect, a waterproof effect, and a reinforcing effect are obtained for the core layer, and more efficient and more stable light incidence and / or light emission can be performed.

  The blocking wall is preferably made of the same material as that of the core layer, and a conventionally known material can be used as the material, and examples thereof include UV (ultraviolet) curable resins such as fluorine-based polyimide.

  Then, the present invention efficiently collects and emits a predetermined light flux by the optical waveguide, or emits the signal light after efficiently entering the optical waveguide to the light receiving element (optical wiring, photodetector, etc.) of the next stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured to be incident.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

First Embodiment FIG. 1A is a schematic sectional view of an optical waveguide according to the present invention. FIG. 1B is a schematic plan view seen from the A side of the optical waveguide according to the present invention shown in FIG. 1A, and the first cladding layer is not shown. FIG.1 (c) is the schematic plan view seen from the B side of the optical waveguide based on this invention shown to Fig.1 (a).

  As shown in FIG. 1, the optical waveguide 1 is composed of a laminated body of a first cladding layer 2, a core layer 4, and a second cladding layer 3. The core layer 4 serves to guide the incident signal light, and the first cladding layer 2 and the second cladding layer 3 serve to confine the signal light in the core layer 4. The core layer 4 is made of a material having a high refractive index, and the first cladding layer 2 and the second cladding layer 3 are made of a material having a refractive index lower than that of the core layer 4.

  A reinforcing portion 6 different from the first cladding layer 2 protrudes from the surface of the first cladding layer 2 opposite to the core layer 4 on the light incident / exit end side excluding the intermediate portion 5 of the optical waveguide 1. Is formed. According to this, the light incident / exit end side excluding the intermediate portion 5 of the optical waveguide 1 has excellent rigidity, and for example, improves the bonding strength between the optical waveguide 1 and a mounting substrate (not shown; the same applies hereinafter). Can do. For this reason, there is no deviation of the optical axis, and efficient and stable light incidence and / or light emission can be performed.

  The reinforcing portion 6 is integrally formed with the second cladding layer 3. Specifically, the reinforcing portion 6 is formed by extending the second cladding layer 3 around the outer periphery of the core layer 4. Preferably it is. In this case, the second clad layer 3 is preferably extended from the side of the laminate to a position protruding from the surface of the first clad layer 2 opposite to the core layer 4. Thereby, compared with the case where the reinforcement part 6 is installed separately or retrofitted, the positioning accuracy of the reinforcement part 6 is easy, manufacture is also easy, and cost can be reduced. In addition, the number of parts does not increase and productivity is high.

  A plurality of core layers 4 are arranged in parallel, and the light incident / exit portions 7 and 8 of each core layer 4 are preferably formed on an inclined mirror surface, for example, a 45 ° mirror surface. The core layer 4 with the inclined mirror surface can be formed by injection molding. By the injection molding, the inclined mirror surface can be formed without directly processing the core layer 4, so that there is no damage during production, the surface state can be smoothed, and good quality easily and accurately. A simple optical waveguide 1 can be produced. Further, by forming the light incident / exit portions 7 and 8 of the core layer 4 on the inclined mirror surface, the signal light emitted from the light emitting element 9 such as a laser can be efficiently incident on the core layer 4. The incident signal light can be guided and effectively emitted to the light receiving element 10. As the material for the core layer 4, conventionally known materials can be used, and examples thereof include UV (ultraviolet) curable resins such as fluorine-based polyimide.

  It is preferable that the first cladding layer 2 has a flat sheet shape, and it is more preferable to use a low-rigidity resin sheet (for example, a thickness of 100 μm). Examples of the low-rigidity resin sheet include an optical acrylic sheet. Even if a low-rigidity resin sheet is used as the first cladding layer 2, the optical waveguide 1 according to the present invention has a reinforcing portion 6 different from the first cladding layer 2 on the light incident / exit end side excluding the intermediate portion 5. However, since it is formed so as to protrude from the surface of the first cladding layer 2 opposite to the core layer 4, the light incident / exit end side excluding the intermediate portion 5 has excellent rigidity, and the optical waveguide 1 and the mounting substrate Excellent bonding strength. Further, the parallel accuracy of the optical waveguide 1 installed on the mounting substrate can be improved. For this reason, there is no deviation of the optical axis, and efficient and stable light incidence and / or light emission can be performed. Further, since the intermediate portion 5 of the optical waveguide 1 can be made to be low in rigidity, the optical waveguide 1 is not subjected to stress on the core layer 4 and is caused by mounting errors, heat, external stress, etc. between the optical waveguide 1 and the mounting substrate. Can be absorbed, and more stable light propagation can be performed.

  Further, it is preferable that light collimation or focusing means (lens) 11 is formed on the second cladding layer 3 at positions corresponding to the light incident / exit portions 7 and 8 with respect to the core layer 4. Thereby, the optical signal from the light emitting element 9 can be focused and effectively incident on the optical waveguide 1 based on the present invention, or the outgoing light emitted from the optical waveguide 1 based on the present invention can be collimated effectively. The light receiving element 10 can efficiently receive the emitted light. The collimation or focusing means 11 may be integrally formed with the second cladding layer 3 or may be provided later. In particular, the collimation or focusing means 11 is preferably integrally formed with the second cladding layer 3 at positions corresponding to the light incident / exiting portions 7 and 8 with respect to the core layer 4, whereby an optical component such as a lens is separately or retrofitted. Compared with the case where it installs by, collimation or the positioning accuracy of the focusing means 11 is easy, manufacture is also easy, and it can reduce cost. Further, since the collimation or focusing means 11 is integrally formed with the second cladding layer 3, the number of parts does not increase and the productivity is high.

  Here, it is preferable that the reinforcing portion 6 is formed at least in a portion corresponding to the region where the collimation or focusing means 11 exists. Thereby, since the rigidity of the optical waveguide 1 in the said presence area | region of the collimation or the focusing means 11 can be improved more, more stable light incidence and / or light emission can be performed.

  The reinforcing portion 6 and the collimation or focusing means 11 are preferably made of the same material as that of the second cladding layer 3, and specifically, an injection molding resin for an optical element (for example, a product name ZEONEX manufactured by Nippon Zeon Co., Ltd.) Etc.

  In addition, the optical waveguide 1 according to the present invention has a blocking wall 12 for blocking the core layer 4 from the outside between the first cladding layer 2 and the second cladding layer 3 in the outer periphery of the core layer 4. Preferably it is. As a result, a dustproof effect, a waterproof effect, and a reinforcing effect on the core layer 4 are obtained, and more efficient and more stable light incidence and / or light emission can be performed. Further, the blocking wall 12 is preferably made of the same material as the core layer 4.

  As shown in FIG. 1A, an optical component 13 may be installed in a light emitting element 9 such as a laser, and signal light (for example, laser light) emitted from the light emitting element 9 by this optical component 13 is parallel light. It is collimated. Then, the parallel light is focused by the collimation or focusing means 11 and is effectively incident on the core layer 4. In this case, even when the position of the light-emitting element 9 is slightly deviated by the collimation or focusing means 11 and the optical component 13, the signal light from the light-emitting element 9 is effectively focused and incident on the core layer 4 for efficient operation. Optical coupling can be performed.

  Here, for example, as shown in FIG. 2, the thickness t (excluding the thickness of the lens 11) of the central portion 5 of the second cladding layer 3 can be about 0.3 mm. The thickness T including the portion 6 can be about 3 mm. The core layer 4 can have a thickness m of about 15 μm and a width (not shown) of about 5 μm. The thickness n of the first cladding layer 2 can be about 100 μm. The distance k from the surface of the first cladding layer 2 opposite to the core layer 4 to the bottom surface of the reinforcing portion 6 can be about 1 mm to 2 mm. The width A of the reinforcing portion 6 can be about 1 mm, and the length a can be about 10 mm. The total length L of the optical waveguide 1 can be about 5 cm to 30 cm. The thickness of the collimation or focusing means (lens) 11 can be about 50 μm, and the lens diameter can be about Φ100 μm.

  Such an optical waveguide 1 according to the present invention is efficiently condensed into a predetermined light flux by the optical waveguide 1 and emitted, or signal light emitted after being efficiently incident on the optical waveguide 1 is received by the next-stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured to enter the element (optical wiring, photodetector, etc.) 10.

  Next, an example of the manufacturing method of the optical waveguide 1 based on this invention is demonstrated with reference to FIG.

  First, as shown in FIG. 3A, an upper die 14, a lower die 15 and an inner die having shapes corresponding to the second cladding layer 3 (including the reinforcing portion 6 and the collimation or focusing means 11) as described above. (Not shown) is filled with the second cladding material. Examples of the second clad material include injection molding resins for optical elements (for example, product name ZEONEX manufactured by Nippon Zeon Co., Ltd.). After the filling, the upper die 14, the lower die 15 and the inner die are peeled off, so that the reinforcing portion 6 and the collimation or focusing means 11 as described above are provided in the second cladding layer 3 as shown in FIG. And can be integrally molded. Thereby, compared with the case where the reinforcement part 6 and the collimation or the focusing means 11 are installed separately or retrofitted, those positioning accuracy is easy, manufacture is also easy, and cost can be reduced. In addition, the number of parts does not increase and productivity is high.

  Next, as shown in FIG. 3 (c), the core material 4 a is filled into a quartz mold 16 having a shape corresponding to the light incident portion 7 and the light emitting portion 8 of the core layer 4 and a shape corresponding to the blocking wall 12. . A conventionally well-known thing can be used as the core material 4a, and UV (ultraviolet ray) curable resin, for example, a fluorine-type polyimide etc. are mentioned. The quartz mold 16 can be easily manufactured by, for example, binary mask exposure and dry etching.

  Then, the second clad layer 3 produced as described above is placed on the quartz mold 16 filled with the core material 4a with the surface having the collimation or focusing means 11 facing upward, and irradiated with ultraviolet rays, for example. The material 4a is solidified. Next, the core layer 4 and the blocking wall 12 bonded to the second cladding layer 3 are peeled from the quartz mold 16. Thereby, as shown in FIG. 3D, the core layer 4 and the blocking wall 12 can be simultaneously formed in the second cladding layer 3. Thus, by forming the light incident / exit portions 7 and 8 of the core layer 4 on the inclined mirror surface, for example, a 45 ° mirror surface by injection molding, the inclined mirror surface can be formed without directly processing the core layer 4. Since it can be formed, there is no damage during production, the surface state can be smoothed, and the optical waveguide 1 of good quality can be produced easily and accurately.

  Next, as shown in FIG. 3E, by disposing the first cladding layer 2 on the opposite side of the core layer 4 from the second cladding layer 3, as shown in FIG. The optical waveguide 1 based on this invention can be produced. The first cladding layer 2 is not limited to the one produced by injection molding or the like, and may be a sheet-like body (for example, 100 μm thick) of a low-rigidity resin made of an optical acrylic sheet or the like.

Second Embodiment In the optical waveguide according to the present invention, the reinforcing portion may be fixed to the second cladding layer separately or retrofitted. Also in this case, it is important that the reinforcing portion has a size that reaches a position protruding from the surface of the first cladding layer on the side opposite to the core layer. When the reinforcing part is fixed to the second cladding layer separately or retrofitted, the reinforcing part 6 partially covers the core layer 4 and the blocking wall 12 as shown in FIG. 4 (a) or (b). It can be set as a structure and rigidity can be improved more. In FIG. 4 (a) or (b), the first cladding layer is not shown.

Third Embodiment FIG. 6A is a diagram showing the arrangement of the light emitting element 9, the light receiving element 10 and the optical waveguide 1 as viewed from the A side of the optical waveguide 1 according to the present invention as shown in FIG. 6 (b) is a schematic cross-sectional view taken along line YY ′ in FIG. 6 (a), and FIG. 6 (c) is a schematic cross-sectional view taken along line XX ′ in FIG. 6 (a). 6B and 6C are shown upside down. In FIG. 6, the first cladding layer 2 is not shown.

  In the optical waveguide 1 shown in FIG. 6, a plurality of core layers 4 each having a light incident portion 7 and a light emitting portion 8 which are 45 ° mirror surfaces are arranged in parallel. 8 positions are aligned in the length direction.

  The light emitting element array 9 a includes a plurality of light emitting elements 9 arranged at positions corresponding to the light incident portions 7 of the respective core layers 4. In the gaps between the light emitting elements 9, through electrodes (not shown) for electrical connection between the light emitting elements 9 and the semiconductor integrated circuit chip (not shown) are arranged. The light receiving element array 10a is the same as the light emitting element array 9a.

  In the optical waveguide 1 shown in FIG. 6, the light emitting elements 9 of the light emitting element array 9a and the light receiving elements 10 of the light receiving element array 10a are arranged at the same pitch as the arrangement pitch of the core layers 4.

  In this case, the collimation or focusing means 11 in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 7 and 8 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 7 and the second cladding layer 3 may be integrally formed.

  In this operation mechanism, an electrical signal transmitted from one semiconductor integrated circuit chip (not shown) is converted into an optical signal and emitted as an optical signal from each light emitting element 9 of the light emitting element array 9a. The emitted optical signal is focused by one corresponding collimation or focusing means 11 of the optical waveguide 1, is incident on the light incident portion 7 of the core layer 4, and is reflected by the light incident portion 7 constituted by a 45 ° mirror surface. Then, the light is guided in the waveguide direction in which the core layer 4 extends, is reflected again by the light emitting portion 8 formed of the other 45 ° mirror surface, and is emitted from the light emitting portion 8 of the core layer 4. The optical signal emitted from the optical waveguide 1 is received by the corresponding light receiving element 10 of the light receiving element array 10a through the collimation or focusing means 11 and converted into an electric signal, and the other semiconductor integrated circuit chip (not shown). It is transmitted as an electrical signal (hereinafter, the same applies to other embodiments).

  According to the present embodiment, the same effect as the optical waveguide 1 according to the present invention according to the first embodiment can be obtained.

Fourth Embodiment FIG. 8A is a diagram showing the arrangement of the light emitting element 9, the light receiving element 10 and the optical waveguide 1 as viewed from the A side of the optical waveguide 1 according to the present invention as shown in FIG. 8B is a side view seen from the A direction in FIG. 8A, and FIG. 8C is a side view seen from the B direction in FIG. 8A. In FIGS. 8B and 8C, the upper and lower sides are shown inverted, and the reinforcing portion 6 and the blocking wall 12 existing in front are not shown. In FIG. 8, the first cladding layer 2 is not shown.

  As shown in FIG. 8A, the optical waveguide 1 has a plurality of core layers 4 arranged in parallel. The end of each core layer 4 becomes a light incident part 7 and a light emission part 8 which are 45 ° mirror surfaces. In the optical waveguide 1 according to the present embodiment, the light incident / exit parts 7 and 8 of each core layer 4 are shifted in the length direction with respect to the light incident / exit parts 7 and 8 of other adjacent core layers 4. Has been.

  The light emitting element array 9 a includes a plurality of light emitting elements 9 arranged at positions corresponding to the light incident / exit portions 7 and 8 of each core layer 4. In the gaps between the light emitting elements 9, penetrating electrodes (not shown) for electrical connection between the light emitting elements 9 and the semiconductor integrated circuit chip (not shown) are arranged (this corresponds to the light receiving element array 10 a). The same applies to the light receiving element 10).

  In this case, the collimation or focusing means 11 in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 7 and 8 of the core layer 4. Specifically, it may be configured so as to have an arrangement as shown in FIG. 9 and integrally formed with the second cladding layer 3.

  According to the present embodiment, the same effect as the optical waveguide 1 according to the present invention according to the first embodiment can be obtained.

  Further, the light incident / exit portions 7 and 8 of each core layer 4 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 7 and 8 of the other adjacent core layers 4. The pitch between the light emitting elements 9 arranged in the length direction is as large as the amount of deviation in the length direction. For example, when the light incident / exit portions 7 and 8 of the adjacent core layer 4 are shifted by 100 μm in the extending direction, the pitch between the light emitting elements 9 arranged in the length direction of the core layer 4 is 100 μm. The same applies to the light receiving element 10.

  Further, the pitch of the light emitting elements 9 arranged in the arrangement direction of the core layers 4 is a size corresponding to the total arrangement pitch of the plurality of core layers 4. For example, when the core layers 4 are arranged at an arrangement pitch of 20 μm, the pitch of the light emitting elements 9 arranged in the arrangement direction of the core layers 4 is 100 μm.

  As described above, the light incident / exit portions 7 and 8 of each core layer 4 are formed so as to be shifted in the length direction with respect to the light incident / exit portions 7 and 8 of the other adjacent core layers 4. Optical elements (a light emitting element and a light receiving element are collectively referred to) 9 and 10 arranged corresponding to the layer 4 can be secondarily arranged, and the optical elements 9 and 10 are arranged at a pitch of about 100 μm. The core layer 4 can be integrated up to a pitch of 20 μm.

  That is, it is possible to improve the degree of integration of the core layer 4 while arranging the distance between the optical elements 9 and 10 at a pitch to avoid the influence of crosstalk due to optical interference and element heat generation.

  Further, by arranging the optical elements 9 and 2 two-dimensionally while highly integrating the core layer 4, useless space is eliminated and the area occupied by the substrate per element can be reduced. For this reason, further cost reduction can be achieved.

Fifth Embodiment FIG. 10A shows a schematic configuration of a light emitting element array, a light receiving element array, and an optical waveguide as viewed from the surface side on which the first cladding layer is arranged in the optical waveguide 1 according to the present invention. 10 (b) is a side view seen from the A direction in FIG. 10 (a), and FIG. 10 (c) is a side view seen from the B direction in FIG. 10 (a). 10B and 10C are shown upside down, and the reinforcing portion 6 and the blocking wall 12 existing in front are not shown. In FIG. 10, the first cladding layer 2 is not shown.

  As shown in FIG. 10, the optical waveguide 1 includes light input / output portions of the core layers 4-1 and 4-2, and light input / output portions of the other adjacent core layers 4-2 and 4-1. 7 and 8 are shifted in the length direction. In the present embodiment, the two first core layers 4-1 and the second core layer 4-2 whose positions of the light incident / exiting portions 7 and 8 are shifted are repeatedly arranged as a unit.

  A light emitting element array 9a-1 having a plurality of light emitting elements 9 arranged corresponding to the light incident portions 7 of the first core layer 4-1, on one side in the length direction of each core layer 4, and a second A light receiving element array 10a-2 having a plurality of light receiving elements 10 arranged corresponding to the light emitting portions 8 of the core layer 4-2 is arranged.

  On the other side in the length direction of each core layer 4, a light receiving element array 10 a-1 having a plurality of light receiving elements 10 arranged corresponding to the light emitting portions 8 of the first core layer 4-1, A light emitting element array 9a-2 having a plurality of light emitting elements 9 arranged corresponding to the light incident portions 7 of the core layer 4-2 is arranged.

  That is, in the optical waveguide 1, the light emitting elements 9 and the light receiving elements 10 are alternately arranged with respect to the core layers 4-1 and 4-2 arranged in parallel. Therefore, each of the core layers 4-1 and 4-2 guides light in the opposite direction to the other adjacent core layers 4-2 and 4-1.

  In this case, the collimation or focusing means 11 in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 7 and 8 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 11 and the second cladding layer 3 may be integrally formed. As a result, the optical signal from the light emitting element 9 can be effectively focused and incident on the core layer 4 to efficiently perform optical coupling. Further, the light receiving element 10 can effectively receive the light emitted from the optical waveguide 1.

  Further, since the light emitting elements 9 and the light receiving elements 10 are alternately arranged for each of the core layers 4-1 and 4-2 arranged in parallel, for example, they are connected to a specific circuit of a semiconductor integrated circuit chip. Since the positions of the light emitting element 9 and the light receiving element 10 corresponding to the input / output pads are close to each other as shown in part C of FIG. 10, the length of the electric wiring can be shortened, and high frequency countermeasures are easy. There is an effect of becoming. In addition, it has the same effect as the first embodiment and the third embodiment.

Sixth Embodiment FIG. 12A shows a schematic configuration of a light-emitting element array, a light-receiving element array, and an optical waveguide as viewed from the surface side on which the first cladding layer is arranged in the optical waveguide 1 according to the present invention. 12 (b) is a side view seen from the A direction in FIG. 12 (a), and FIG. 12 (c) is a side view seen from the B direction in FIG. 12 (a). 12 (d) is a diagram showing the arrangement of the light receiving elements in the light receiving element array and the arrangement of the light emitting elements in the light emitting element array. In FIGS. 12B and 12C, the upper and lower sides are shown inverted, and the reinforcing portion 6 and the blocking wall 12 existing in the front are not shown. In FIG. 12, the first cladding layer 2 is not shown.

  In the present embodiment, the configuration of the fourth embodiment and the fifth embodiment is combined. That is, similarly to the fifth embodiment, in the optical waveguide 1, the light emitting elements 9 and the light receiving elements 10 are alternately arranged for the core layers 4 arranged in parallel. Therefore, each core layer 4 guides light in the opposite direction with respect to the other adjacent core layers.

  Similarly to the fourth embodiment, the optical elements 9 and 10 in each of the optical element arrays 9a-1, 9a-2, 10a-1, and 10a-2 are adjacent to each other as shown in FIG. The other optical elements 9 and 10 are arranged so as to be shifted in the length direction of the core layer 4.

  In this case, the collimation or focusing means 11 in the second cladding layer 3 is formed corresponding to the positions of the light incident / exit portions 7 and 8 of the core layer 4. Specifically, the arrangement may be as shown in FIG. 13 and integrally formed with the second cladding layer 3. As a result, the optical signal from the light emitting element 9 can be effectively focused and incident on the core layer 4 to efficiently perform optical coupling. Further, the light receiving element 10 can effectively receive the light emitted from the optical waveguide 1.

  In addition, since the pitch between the optical elements can be increased as compared with the case where the optical elements are linearly arranged in each optical element array as shown in FIG. 6, the fifth embodiment described above. Since the distance between the optical elements can be arranged at a pitch to avoid the influence of crosstalk due to optical interference or element heat generation while maintaining the effect, the integration degree of the core layer 4 can be improved. In addition, the effects of the first embodiment and the third embodiment can be obtained.

Seventh Embodiment An optical waveguide according to the present invention can be directly mounted on a printed wiring board.
A socket and an optical waveguide installed in the socket, and at least one of a light emitting element for making light incident on the optical waveguide and a light receiving element for receiving light emitted from the optical waveguide, The present invention can be suitably used for a photoelectric composite device disposed so as to face the optical waveguide.

  FIG. 14 is a schematic perspective view of the socket. FIG. 14A is a schematic perspective view seen from the surface side where the optical waveguide of the socket is installed, and FIG. 14B is a schematic perspective view seen from the opposite surface side of FIG. It is.

  As shown in FIG. 14, the socket 17 is provided with positioning means having a concavo-convex structure for positioning and fixing the optical waveguide according to the present invention. Specifically, the concavo-convex structure has a recess 18 for fitting the optical waveguide and positioning the width direction thereof, and a protrusion 19 for positioning the length direction of the optical waveguide. . The depth of the recess 18 is larger than the thickness of the optical waveguide.

  The convex surface 20 of the concavo-convex structure of the socket 17 is provided with conducting means, for example, a terminal pin 21 for conducting the front and back surfaces of the socket 17. Then, an interposer on which the light emitting element and / or the light receiving element are mounted is fixed on the convex surface 20 of the concavo-convex structure, as will be described later.

  As the material of the socket 17, a conventionally known material can be used as long as it is an insulating resin. Examples thereof include glass-filled PES (polyethylene sulfide) resin and glass-filled PET (polyethylene terephthalate) resin. Such socket 17 materials already have a lot of data on their types, insulation, reliability, etc., and a wide range of manufacturers handle them. Therefore, it is a structure that is easy to accept in all of its functions, costs, reliability, etc., and can be easily integrated with the existing printed wiring board mounting process.

  Although the manufacturing method of the socket 17 is not specifically limited, For example, it can manufacture easily by shaping | molding using the metal mold | die which has the said uneven structure.

  FIG. 15 is a schematic perspective view of a photoelectric composite device using the socket 17. 15A is a schematic perspective view of the photoelectric composite device, and FIG. 15B is an exploded view of FIG. 15A.

  As shown in FIG. 15, the photoelectric composite device 22 includes a pair of sockets 17 and the optical waveguide 1 according to the present invention installed in the socket 17, and the optical waveguide 1 is bridged between the pair of sockets 17. Has been passed. The optical waveguide 1 may have any structure of the above-described embodiments. At this time, since the optical waveguide 1 is not in contact with a printed wiring board to be described later, it is possible to effectively prevent the optical waveguide 1 from being broken by heat dissipation of the semiconductor integrated circuit chip.

  Further, on the convex surface 20 of the concave-convex structure of the socket 17, semiconductor integrated circuit chips 23 a and 23 b, the light emitting element (not shown) (for example, a laser) and / or the light receiving element (not shown) are mounted. The poser 24 is fixed.

  For example, as shown in FIG. 16, the interposer 24 has a semiconductor integrated circuit chip 23 mounted on one surface side (FIG. 16A), and the other surface side transmits light to the optical waveguide 1. A light emitting element array 9a for performing and a light receiving element array 10a for receiving light emitted from the optical waveguide 1 are mounted, and other signal wiring electrodes (for example, power wiring, DC signal, etc.) 25 are provided in the periphery. Is provided (FIG. 16B). The light emitting element array 9a and the light receiving element array 10a include a plurality of light emitting elements and light receiving elements arranged at positions corresponding to the light incident / exit portions of the optical waveguides (not shown). A through electrode for electrical connection between the light emitting element and the light receiving element and the semiconductor integrated circuit chip is disposed in the gap between each light emitting element and the light receiving element (not shown).

  Then, when fixing the pair of sockets 17 in which the optical waveguide 1 is installed in the recess 18 and the interposer 24, the surface side of the interposer 24 on which the light emitting element array 9a and / or the light receiving element array 10a are mounted is arranged. The socket 17 is configured to be in contact with the convex surface 20, and the terminal pin 21 of the socket 17 and the other signal wiring electrode 25 of the interposer 24 are fixed so as to be electrically connected.

  Further, as described above, the depth of the recess 18 of the socket 17 is formed to be larger than the thickness (for example, 1 mm) of the optical waveguide 1 (for example, the depth is set to 2 mm). ), A space (for example, 500 μm) 27 is provided between one surface 26 side of the optical waveguide 1 and the surface side of the interposer 24 on which the light emitting element array 9a and / or the light receiving element array 10a are mounted. It can be formed (when the thickness of the light emitting element array 9a and / or the light receiving element array 10a is 500 μm).

  As described above, the semiconductor integrated circuit chip 23 is mounted on the socket 17 via the interposer 24, the one surface 26 side of the optical waveguide 1, the light emitting element array 9 a and / or the light receiving element of the interposer 24. By forming the space 27 between the surface on which the array 10a is mounted, even if the semiconductor integrated circuit chip 23 generates heat when the photoelectric composite device 22 is used, the optical waveguide 1 is broken by this heat. Can be effectively prevented.

  In this operation mechanism, an electrical signal transmitted from one semiconductor chip 23a is converted into an optical signal and emitted from each light emitting element (not shown) of the light emitting element array 9a as an optical signal by laser light. The emitted optical signal is focused by one of the corresponding collimation or focusing means of the optical waveguide 1, is incident on the light incident portion of the core layer, is guided in the waveguide direction in which the core layer extends, The light is emitted from the light emitting portion of the core layer. The optical signal emitted from the optical waveguide 1 is received by a corresponding light receiving element (not shown) of the light receiving element array 10a, converted into an electric signal, and transmitted to the other semiconductor chip 23b as an electric signal.

  This photoelectric composite device 22 can constitute an optical wiring system in which the optical waveguide 1 according to the present invention is used as an optical wiring. That is, the photoelectric composite device 22 is fixed in a state of being electrically connected to the printed wiring board.

  According to the photoelectric composite device 22, the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board in a state where the optical waveguide 1 is installed in the recess 18 of the socket 17. The structure can be used as it is. Therefore, if a region where the socket 17 can be installed is provided on the printed wiring board, other general electric wiring can be formed by a conventional process.

  Even if the optical waveguide is vulnerable to a high temperature process, for example, after fixing the socket 17 to the printed wiring board, and after completing all mounting processes including a high temperature process such as solder reflow and underfill resin sealing. Since the optical waveguide 1 according to the present invention can be installed in the concave portion 18 of the socket 17, the optical waveguide can be mounted without suffering damage due to high temperature.

  Further, since the socket 17 can be made of a resin having higher rigidity than the printed wiring board, and the light coupling between the light emitting element and / or the light receiving element and the optical waveguide can be performed on the socket 17. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Furthermore, since the semiconductor integrated circuit chip 23 and the light emitting element array 9a and / or the light receiving element array 10a can be installed close to the upper and lower surfaces thereof via the interposer 24, the semiconductor integrated circuit chip 23, The wiring length between the light emitting element and / or the light receiving element can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  Further, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board in a state where it is installed in the concave portion 18 of the socket 17, the high-density wiring of the printed wiring board and the degree of freedom of design thereof. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high speed, high-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and development Short TAT (turn around time) can be expected.

  Next, an example of a method for manufacturing the photoelectric composite device 22 will be described with reference to FIGS. 17 and 18 are schematic cross-sectional views taken along the line A-A ′ of the photoelectric composite device 18 in FIG.

  First, as shown in FIGS. 17A and 17B, a pair of sockets 17 is mounted on the printed wiring board 28. At this time, an electrode (not shown) on the printed wiring board 28 and the terminal pin 21 of the socket 17 are aligned and mounted so that the electrode and the socket 17 are electrically connected.

  Although not shown in the drawings, other electronic components and the like are mounted on the printed wiring board 28 in advance.

  Next, as shown in FIG. 17C, the optical waveguide 1 according to the present invention is installed in the recess 18 of the socket 17, and the optical waveguide 1 is bridged between the pair of sockets 17. At this time, the projection 19 as the concavo-convex structure provided on the socket 17 can easily position the optical waveguide 1 in the length direction, and the concave portion 18 can easily position the optical waveguide 1 in the width direction. It can be carried out. In addition, since the optical waveguide 1 is installed in the concave portion 18 of the socket 17, the optical waveguide 1 and the printed wiring board 28 are in a non-contact state.

  The means for fixing the optical waveguide 1 to the socket 17 is not particularly limited, and for example, an adhesive resin can be used. Specifically, first, as shown in FIG. 19A, the groove 30 is formed in an arbitrary shape on the bottom surface of the recess 18 of the socket 17. At this time, the end of the groove 30 is formed so as to be located up to the periphery of the protrusion 19 of the socket 17. Next, as shown in FIG. 19 (b), the optical waveguide 1 according to the present invention is installed in the recess 18 of the socket 17. As described above, the positioning in the length direction and the width direction of the optical waveguide 1 can be easily performed by the protrusions 19 and the recesses 18 provided in the socket 17. Here, since the groove 30 is formed so as to be located up to the periphery of the protrusion 19, a part of the groove 30 is not covered by the optical waveguide 1. Next, as shown in FIG. 19 (c), an adhesive resin is injected from a part of the groove 30 not covered with the optical waveguide 1 using a dispenser 31 or the like and hardened, whereby the concave portion 18 of the socket 17 is obtained. The optical waveguide 1 can be bonded and fixed to.

  After the optical waveguide 1 according to the present invention is installed in the socket 17 as described above, for example, an MPU (micro processor) as the semiconductor integrated circuit chip is formed on the convex surface 20 of the socket 17 as shown in FIG. unit) 23a or DRAM (dynamic random access memory) 23b, and light-emitting element array 9a and / or light-receiving element array 10a are mounted. At this time, the surface side of the interposer 24 on which the light emitting element array 9a and / or the light receiving element array 10a is mounted is configured to be in contact with the convex surface 20 of the socket 17, and terminal pins (not shown) exposed on the convex surface 20 of the socket 17 are illustrated. And the other signal wiring electrodes 25 of the interposer 24 are fixed so as to be electrically connected.

  Next, as shown in FIG. 18E, aluminum fins 29 are installed on the MPU 23a and the DRAM 23b, respectively.

  As described above, an optical wiring system in which the optical waveguide 1 according to the present invention is used as an optical wiring can be configured using the photoelectric composite device 22.

  Here, FIG. 20 is a schematic diagram illustrating an example in which the photoelectric composite device 22 is developed on the printed wiring board 28. For example, by standardizing the optical waveguide module, it can be freely deployed in four directions. Further, in the optical waveguide 1 according to the present invention, a reinforcing portion 6 different from the first cladding layer 2 is provided on the light incident / exit end side excluding the intermediate portion of the laminated body, and the first side opposite to the core layer 4 is provided. Since the light incident / exit end side excluding the intermediate part of the laminated body has excellent rigidity, it is formed so as to protrude from the surface of the clad layer 2, so that not only the development on the printed wiring board 28 but also, for example, between a plurality of printed wiring boards It is also possible to expand to. As a result, high-speed distributed processing on the printed wiring board 28 becomes possible, and high functionality of the SET, short TAT of development, and the like can be expected. In particular, if a low-rigidity resin sheet is used as the first cladding layer 2, the flexibility of the intermediate portion of the laminate can be further improved, so that it can absorb mounting errors, deformation due to heat, external stress, and the like. Thus, the above-described effects can be realized more reliably.

  According to the present embodiment, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board 28 in a state where it is installed in the recess 18 of the socket 17, the existing printed wiring board 28 can be mounted. The structure can be used as it is. Therefore, if an area where the socket 17 can be installed is provided on the printed wiring board 28, other general electric wiring can be formed by a conventional process.

  Further, even if the optical waveguide 1 according to the present invention is vulnerable to a high temperature process, as described above, the socket 17 is fixed to the printed wiring board 28 and further includes a high temperature process such as solder reflow and underfill resin sealing. After completing the mounting process, the optical waveguide 1 according to the present invention is installed in the recess 18 of the socket 17, so that the optical waveguide 1 can be mounted without suffering damage due to high temperature.

  Further, since the socket 17 can be made of a resin having higher rigidity than the printed wiring board 28, the light coupling between the light emitting element and / or the light receiving element and the optical waveguide 1 can be performed on the socket 17. The mounting accuracy required for optical coupling can be easily secured. For example, the assembly accuracy of the order of several μm can be secured by the current mold technology. Therefore, it is possible to increase the density of the optical bus.

  Further, since the semiconductor integrated circuit chips 23a and 23b and the light emitting element array 9a and / or the light receiving element array 10a can be disposed close to the upper and lower surfaces via the interposer 24, the semiconductor integrated circuit chip 23a. , 23b and the wiring length between the light emitting element and / or the light receiving element can be shortened. Therefore, countermeasures against noise and crosstalk in the electric signal are facilitated, and the light modulation speed can be improved.

  In addition, since the optical waveguide 1 according to the present invention can be electrically connected to the printed wiring board 28 in a state where the optical waveguide 1 is installed in the recess 18 of the socket 17, the high-density wiring of the printed wiring board 28 and the degree of freedom of design thereof. It is possible to develop an optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while ensuring high speed, high-speed distributed processing on the printed wiring board, high functionality in total electronic equipment, and development Short TAT (turn around time) can be expected.

  Further, the semiconductor integrated circuit chips 23a and 23b are mounted on the socket 17 via the interposer 24, and the one surface 26 side of the optical waveguide 1 according to the present invention, and the light emitting element array 9a and / or the interposer 24 are provided. Alternatively, by forming a space 27 between the surface on which the light receiving element array 10a is mounted, even if the semiconductor integrated circuit chip 23 generates heat when the photoelectric composite device 22 is used, this heat causes light based on the present invention. It is possible to effectively prevent the waveguide 1 from being broken.

  As mentioned above, although embodiment of this invention was described, the above-mentioned example can be variously modified based on the technical idea of this invention.

  For example, in the optical waveguide according to the present invention, the reinforcing portion protrudes from the surface of the first cladding layer on the side opposite to the core layer on at least one of the light incident / exit end sides excluding the intermediate portion of the laminate. It is important that the shape, size, material, and the like can be selected as appropriate. When the reinforcing portion is not integrally formed with the second clad layer but is provided separately or retrofitted, it can be bonded onto the first clad layer, for example.

  Further, as described in the seventh embodiment, when the optical waveguide according to the present invention is applied to the photoelectric composite device using the socket, as shown in FIG. The socket positioning mechanism 33 (for example, a fitting boss) may be provided on the (bottom surface), and the shape, size, and the like are not particularly limited.

  As the collimation or focusing means, for example, a convex lens can be used, and the shape thereof is not particularly limited, and a spherical lens, a cylindrical lens, or the like can be applied. The collimation or focusing means is preferably formed integrally with the second clad layer, but is not limited to this and can be provided separately or retrofitted.

  As described above, the barrier wall is preferably formed of the same material as that of the core layer at the same time, which is particularly preferable in terms of cost and manufacturing, but is not limited thereto. Different materials may be used, and the core layer may be formed separately or retrofitted.

  Furthermore, as shown in FIG. 21, the socket 17 may have the interposer positioning mechanism 32 (for example, a fitting boss) on the convex surface 20, and the shape, size, and the like are not particularly limited. Furthermore, the shape, size, etc. of the protrusion 19 formed in the recess 18 of the socket 17 are not particularly limited.

  The present invention is suitable for the above-described optical wiring system in which a signal is placed on a laser beam. However, the present invention can also be applied to a display or the like by selecting a light source or the like.

  The present invention efficiently collects and emits a predetermined light flux by an optical waveguide, or causes the signal light emitted after being efficiently incident on the optical waveguide to enter a light receiving element (such as an optical wiring or a photodetector) in the next stage circuit. It can be suitably used as an optical information processing apparatus such as an optical wiring configured as described above.

It is the schematic of the optical waveguide based on this invention by 1st Embodiment. 1 is a schematic sectional view of an optical waveguide according to the present invention. It is a schematic sectional drawing which shows an example of the manufacturing process of the optical waveguide based on this invention in order of a process. It is a schematic plan view of the optical waveguide based on this invention by 2nd Embodiment. It is a schematic sectional drawing of the optical waveguide based on this invention by another form. It is a schematic block diagram of the light emitting element array by the 3rd Embodiment, a light receiving element array, and an optical waveguide. FIG. 3 is a schematic plan view of the second cladding layer. It is a schematic block diagram of the light emitting element array by the 4th Embodiment, a light receiving element array, and an optical waveguide. FIG. 3 is a schematic plan view of the second cladding layer. It is a schematic block diagram of the light emitting element array by 5th Embodiment, a light receiving element array, and an optical waveguide. FIG. 3 is a schematic plan view of the second cladding layer. It is a schematic block diagram of the light emitting element array by the 6th Embodiment, a light receiving element array, and an optical waveguide. FIG. 3 is a schematic plan view of the second cladding layer. It is a schematic perspective view of the socket by 6th Embodiment. 2 is a schematic perspective view of the photoelectric composite device. FIG. It is a schematic perspective view of an interposer. It is a schematic sectional drawing which shows an example of the manufacturing method of a photoelectric composite apparatus in order of a process. It is a schematic sectional drawing which shows an example of the manufacturing method of a photoelectric composite apparatus in order of a process. It is a schematic plan view of a partial process of the manufacturing method of the photoelectric composite device. It is a schematic plan view of an example of the mounting structure of the photoelectric composite device. It is a schematic perspective view of the other example of the said socket. It is the schematic which shows the mounting structure of the optical waveguide by a prior art example. It is a schematic sectional drawing of an optical waveguide same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical waveguide, 2 ... 1st cladding layer, 3 ... 2nd cladding layer, 4 ... Core layer,
4a ... core material, 5 ... intermediate portion of optical waveguide (the laminate), 6 ... reinforcing portion, 7 ... light incident portion,
8 ... light emitting part, 9 ... light emitting element, 9a ... light emitting element array, 10 ... light receiving element,
10a ... light receiving element array, 11 ... collimation or focusing means, 12 ... blocking wall,
13 ... Optical component, 17 ... Socket, 18 ... Recess, 19 ... Projection, 20 ... Convex surface,
21 ... Terminal pins, 22 ... Photoelectric composite devices, 23 ... Semiconductor integrated circuit chips,
24 ... interposer, 25 ... other electrodes for signal wiring, 28 ... printed wiring board

Claims (23)

  A light incident / exit end side excluding an intermediate portion of the laminated body in an optical waveguide composed of a laminated body of a first cladding layer, a core layer, and a second cladding layer and configured to guide light through the core layer An optical waveguide characterized in that a reinforcing portion different from the first cladding layer is formed on at least one of the first cladding layer so as to protrude from the surface of the first cladding layer opposite to the core layer.   The optical waveguide according to claim 1, wherein the reinforcing portion is integrally formed with the second cladding layer.   The optical waveguide according to claim 2, wherein the reinforcing portion is formed by extending the second cladding layer around the outer periphery of the core layer.   4. The optical waveguide according to claim 3, wherein the second cladding layer is extended from a side of the stacked body to a position protruding from a surface of the first cladding layer opposite to the core layer.   The optical waveguide according to claim 1, wherein the reinforcing portion is fixed to the second cladding layer.   The optical waveguide according to claim 1, wherein the first cladding layer has a flat sheet shape.   2. The optical waveguide according to claim 1, wherein light collimation or focusing means is formed in the second cladding layer at a position corresponding to a light incident / exiting portion with respect to the core layer.   The optical waveguide according to claim 7, wherein the reinforcing portion is formed at least in a portion corresponding to a region where the collimation or focusing means exists.   The optical waveguide according to claim 7, wherein the reinforcing portion and the collimation or focusing means are made of the same material as the second cladding layer.   2. The optical waveguide according to claim 1, wherein a blocking wall for blocking the core layer from the outside is formed between the first cladding layer and the second cladding layer on an outer periphery of the core layer.   The optical waveguide according to claim 10, wherein the blocking wall is made of the same material as the core layer.   An optical information comprising: the optical waveguide according to any one of claims 1 to 11; a light incident unit that causes light to enter the core layer of the optical waveguide; and a light receiving unit that receives light emitted from the core layer. Processing equipment.   In the method of manufacturing an optical waveguide, which includes a laminate of a first clad layer, a core layer, and a second clad layer, and is configured to guide light through the core layer, the step of producing the laminate, A reinforcing portion different from the first clad layer is formed on at least one of the light incident / exit end sides excluding the intermediate portion of the laminate so as to protrude from the surface of the first clad layer opposite to the core layer. A method of manufacturing an optical waveguide.   The method for manufacturing an optical waveguide according to claim 13, wherein the reinforcing portion is integrally formed with the second cladding layer.   The method for manufacturing an optical waveguide according to claim 14, wherein the reinforcing portion formed by extending the second cladding layer around the outer periphery of the core layer is integrally formed with the second cladding layer.   The optical waveguide manufacturing method according to claim 15, wherein the second cladding layer is extended from a side of the stacked body to a position protruding from a surface of the first cladding layer opposite to the core layer. Method.   The method for manufacturing an optical waveguide according to claim 13, wherein the reinforcing portion is fixed to the second cladding layer.   The method for manufacturing an optical waveguide according to claim 13, wherein a flat sheet-like body is used as the first cladding layer.   14. The method of manufacturing an optical waveguide according to claim 13, wherein light collimation or focusing means is integrally formed with the second cladding layer at a position corresponding to the light incident / exiting portion with respect to the core layer.   20. The method of manufacturing an optical waveguide according to claim 19, wherein the reinforcing portion is formed at least in a portion corresponding to a region where the collimation or focusing means exists.   The method for manufacturing an optical waveguide according to claim 19, wherein the reinforcing portion and the collimation or focusing means are integrally formed with the second cladding layer.   On the outer periphery of the core layer, a blocking wall for blocking the core layer from the outside is formed between the first cladding layer and the second cladding layer, and the blocking wall is used together with the core layer for the second cladding. The method for manufacturing an optical waveguide according to claim 13, wherein the optical waveguide is bonded to the layers simultaneously.   23. The method of manufacturing an optical waveguide according to claim 22, wherein the blocking wall is formed of the same material as the core layer.

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