JP2005332951A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2005332951A
JP2005332951A JP2004149488A JP2004149488A JP2005332951A JP 2005332951 A JP2005332951 A JP 2005332951A JP 2004149488 A JP2004149488 A JP 2004149488A JP 2004149488 A JP2004149488 A JP 2004149488A JP 2005332951 A JP2005332951 A JP 2005332951A
Authority
JP
Japan
Prior art keywords
light
scattering particles
emitting device
led lamp
light scattering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004149488A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005332951A5 (enrdf_load_stackoverflow
Inventor
Yoshiki Saito
義樹 齋藤
Naoki Shibata
直樹 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2004149488A priority Critical patent/JP2005332951A/ja
Publication of JP2005332951A publication Critical patent/JP2005332951A/ja
Publication of JP2005332951A5 publication Critical patent/JP2005332951A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Led Device Packages (AREA)
JP2004149488A 2004-05-19 2004-05-19 発光装置 Withdrawn JP2005332951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004149488A JP2005332951A (ja) 2004-05-19 2004-05-19 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004149488A JP2005332951A (ja) 2004-05-19 2004-05-19 発光装置

Publications (2)

Publication Number Publication Date
JP2005332951A true JP2005332951A (ja) 2005-12-02
JP2005332951A5 JP2005332951A5 (enrdf_load_stackoverflow) 2006-11-02

Family

ID=35487394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004149488A Withdrawn JP2005332951A (ja) 2004-05-19 2004-05-19 発光装置

Country Status (1)

Country Link
JP (1) JP2005332951A (enrdf_load_stackoverflow)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227932A (ja) * 2006-02-22 2007-09-06 Samsung Electro Mech Co Ltd 発光ダイオードパッケージ
JP2007227679A (ja) * 2006-02-23 2007-09-06 Matsushita Electric Works Ltd 発光装置
JP2007287962A (ja) * 2006-04-18 2007-11-01 Nichia Chem Ind Ltd 半導体発光装置
WO2008087918A1 (ja) * 2007-01-15 2008-07-24 Sanyo Electric Co., Ltd. 半導体発光装置
JP2008198997A (ja) * 2007-01-15 2008-08-28 Sanyo Electric Co Ltd 半導体発光装置
JP2008277828A (ja) * 2007-05-07 2008-11-13 Neovison Pnv Co Ltd 電光板に設置される発光ダイオード
JP2012089652A (ja) * 2010-10-19 2012-05-10 Panasonic Corp 半導体発光デバイス
CN102544319A (zh) * 2012-01-05 2012-07-04 深圳雷曼光电科技股份有限公司 Led支架、led及led封装工艺
JP2013254972A (ja) * 2006-08-03 2013-12-19 Intematix Corp 光放出蛍光体を包含するｌｅｄ照明装置
CN103515512A (zh) * 2012-06-29 2014-01-15 四川柏狮光电技术有限公司 Led二次封装工艺以及通过该工艺制造的led像素管
JP2014239073A (ja) * 2006-03-21 2014-12-18 株式会社半導体エネルギー研究所 液晶表示装置
JP2015019099A (ja) * 2007-09-27 2015-01-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 可変の放射特性を有する光源
WO2016035311A1 (ja) * 2014-09-01 2016-03-10 パナソニックＩｐマネジメント株式会社 波長変換フィルタおよびそれを利用した太陽電池モジュール
US9512970B2 (en) 2013-03-15 2016-12-06 Intematix Corporation Photoluminescence wavelength conversion components
US9546765B2 (en) 2010-10-05 2017-01-17 Intematix Corporation Diffuser component having scattering particles
US10557594B2 (en) 2012-12-28 2020-02-11 Intematix Corporation Solid-state lamps utilizing photoluminescence wavelength conversion components

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227932A (ja) * 2006-02-22 2007-09-06 Samsung Electro Mech Co Ltd 発光ダイオードパッケージ
JP2007227679A (ja) * 2006-02-23 2007-09-06 Matsushita Electric Works Ltd 発光装置
JP2014239073A (ja) * 2006-03-21 2014-12-18 株式会社半導体エネルギー研究所 液晶表示装置
JP2007287962A (ja) * 2006-04-18 2007-11-01 Nichia Chem Ind Ltd 半導体発光装置
US9595644B2 (en) 2006-08-03 2017-03-14 Intematix Corporation LED lighting arrangement including light emitting phosphor
JP2013254972A (ja) * 2006-08-03 2013-12-19 Intematix Corp 光放出蛍光体を包含するｌｅｄ照明装置
US8384101B2 (en) 2007-01-15 2013-02-26 Sanyo Electric Co., Ltd. Semiconductor light-emitting device
JP2008198997A (ja) * 2007-01-15 2008-08-28 Sanyo Electric Co Ltd 半導体発光装置
WO2008087918A1 (ja) * 2007-01-15 2008-07-24 Sanyo Electric Co., Ltd. 半導体発光装置
JP2008277828A (ja) * 2007-05-07 2008-11-13 Neovison Pnv Co Ltd 電光板に設置される発光ダイオード
JP2015019099A (ja) * 2007-09-27 2015-01-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 可変の放射特性を有する光源
US9546765B2 (en) 2010-10-05 2017-01-17 Intematix Corporation Diffuser component having scattering particles
JP2012089652A (ja) * 2010-10-19 2012-05-10 Panasonic Corp 半導体発光デバイス
CN102544319A (zh) * 2012-01-05 2012-07-04 深圳雷曼光电科技股份有限公司 Led支架、led及led封装工艺
CN103515512A (zh) * 2012-06-29 2014-01-15 四川柏狮光电技术有限公司 Led二次封装工艺以及通过该工艺制造的led像素管
US10557594B2 (en) 2012-12-28 2020-02-11 Intematix Corporation Solid-state lamps utilizing photoluminescence wavelength conversion components
US9512970B2 (en) 2013-03-15 2016-12-06 Intematix Corporation Photoluminescence wavelength conversion components
WO2016035311A1 (ja) * 2014-09-01 2016-03-10 パナソニックＩｐマネジメント株式会社 波長変換フィルタおよびそれを利用した太陽電池モジュール
JPWO2016035311A1 (ja) * 2014-09-01 2017-05-25 パナソニックＩｐマネジメント株式会社 波長変換フィルタおよびそれを利用した太陽電池モジュール

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