JP2005332895A - Package for high frequency - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive package for high frequency which prevents the deterioration of transmission characteristics of the package. <P>SOLUTION: The package 10 for high frequency is constituted of a base body 13 having a placing unit for mounting a semiconductor device and a frame body 11 connected to the base body so as to surround the placing unit. An attaching unit 15 bored on one side wall of the frame body 11 is provided with an adaptor 16, and a coaxial connector 19 is connected to the adaptor 16 by abutting one end face of a connector core lines supporting unit 22 against the stepped part 20 of a through hole 21. The diameter of opening becomes larger at the outside of the frame body 11 to position and fix the same. In such a package 10 for high frequency, a transmission substrate 25 is equipped with a signal line 27 for connecting one end unit of the connector core lines 24 projected out of one end face of the connector core line supporting unit 22, and is provided by abutting one side surface against the front surface of the adaptor 16 exposed on the inside of the frame body 11 while the tip end of the signal line 27 is provided with a gap 28, not arriving at the ridgeline of the side surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a high-frequency package for accommodating a semiconductor element for optical communication and flowing a high-frequency signal, and more particularly to a high-frequency package having a coaxial connector for flowing a high-frequency signal joined thereto.

In an optical communication module capable of large-capacity communication, a module capable of flowing a high-frequency signal through the package is required. Such a high-frequency package requires a main body made of ceramic or metal. With reference to FIGS. 7A to 7C, for example, a conventional high frequency package 50 having a metal main body will be described. 7A is a plan view of the high frequency package 50, FIG. 7B is an enlarged longitudinal sectional view taken along the line CC ′, and FIG. 7C is an enlarged transverse sectional view taken along the line DD ′. . As shown in FIGS. 7A to 7C, the high frequency package 50 includes a base 51 made of a metal member having excellent heat dissipation and a frame body 52 made of a metal member having a thermal expansion coefficient similar to that of ceramic. Yes. The cavity 53 formed by the base body 51 and the frame body 52 is provided for mounting a semiconductor element using, for example, a light wave from a light emitting element such as a laser diode as a carrier wave. The high frequency package 50 is brazed and joined by inserting a metal fixing member 54 made of a metal member and serving as an optical fiber light entrance / exit into a through hole formed in one side wall of the frame body 52. . Further, the high-frequency package 50 includes a ceramic material such as alumina (Al ₂ O ₃ ) formed in a window frame-shaped notch formed in a side wall adjacent to the side wall of the frame body 52 to which the metal fixing member 54 is bonded. A feedthrough substrate 56 made of is joined. The feedthrough substrate 56 includes conductor patterns 55 and 55 a formed to be conductive from the cavity 53 side to the outside of the frame body 52. An external connection terminal 57 made of a metal member for electrical connection from the outside is brazed and joined to the conductor pattern 55a of the outer portion of the frame 52.

This high frequency package 50 is an adapter provided with an insertion hole 59 for joining a coaxial connector 58 to an attachment portion drilled in a side wall of a frame body 52 facing a side wall provided with a feedthrough substrate 56. 60 is joined. The coaxial connector 58 has a connector core wire 62 fixed by an insulator at the center of the axis of the connector core wire support portion 61 whose outer periphery is made of a metal cylinder. The insertion hole 59 has a stepped portion 63 inside, and the end surface of the connector core wire support portion 61 is brought into contact with the stepped portion 63 to cover the outer periphery of the connector core wire support portion 61. The brazing material is heated and melted between the surface and the outer surface of the insertion hole 59 of the adapter 60, and the coaxial connector 58 is brazed and joined to the adapter 60. The tip portion of the connector core wire 62 of the coaxial connector 58 extending inside the cavity portion 53 is made of ceramic such as alumina (Al ₂ O ₃ ), aluminum nitride (AlN), etc. joined on the pedestal portion 64 of the adapter 60, A conductor wiring pattern signal line 66 formed on a transmission board 65 made of a dielectric member such as resin is joined with solder or the like. The signal line 66 is provided on the upper surface between two opposing sides of the transmission board 65 in parallel along the extending direction of the connector core wire 62.

  Further, the high frequency package 50 has a metal seal ring 67 for airtightly sealing the inside of the cavity portion 53 by bonding the lid body and airtightly sealing the cavity 53 after the semiconductor element is mounted on the frame body 52. doing. In the high frequency package 50, a semiconductor element is mounted in the cavity 53, and the semiconductor element is connected to the conductor pattern 55 on the cavity 53 side of the feedthrough substrate 56 with a bonding wire or the like, and the external connection terminal 57 and the semiconductor are connected. The element is brought into conduction. Further, the semiconductor element and the signal line 66 of the transmission board 65, a ground pattern (not shown), and the like are connected by a bonding wire or the like, and the coaxial connector 58 and the semiconductor element are brought into conduction. Further, after the optical fiber member is connected to the metal fixing member 54, an optical semiconductor module is formed by brazing and joining a lid made of a metal plate or the like to the upper surface of the seal ring 67. This optical semiconductor module is used for fixing. The screw is fixed to the board or the like with a screw through the hole 68.

  In an optical semiconductor module that flows a large amount of information, for example, 40 Gbps, it is necessary to flow a high-frequency signal equivalent to 40 GHz through the package. The high-frequency package 50 that handles such a high-frequency signal has a coaxial connector 58 and a transmission. The necessity of mounting the substrate 65 is higher. The high-frequency package 50 has an opening diameter c of the stepped portion 63 of the adapter 60 at the same time that one side of the transmission board 65 is brought into contact with and joined to the wall surface of the adapter 60 in order to reduce loss during signal passing. When the opening portion is filled with air having a relative dielectric constant of 1 or the like, it is calculated by substituting the required characteristic impedance value into a normal characteristic impedance calculation formula and performing reverse calculation. The opening diameter c is, for example, a distance d between the end of the signal line 66 and the end of the opening diameter c when the desired characteristic impedance is 50Ω and the opening is filled with air having a relative dielectric constant of 1 or the like. Regardless of the diameter, the diameter is usually 7/3 times the diameter of the connector core wire 62 of the coaxial connector 58.

In order to improve the transmission efficiency at the time of input / output of a high-frequency signal, it has been proposed that a high-frequency package is provided with a space between the adapter and the coaxial connector in order to reduce reflection loss (for example, , See Patent Document 1). For high-frequency packages, it has been proposed to reduce the thickness of the connector core wire tip of the coaxial connector in order to reduce reflection loss in order to improve transmission efficiency during input / output of high-frequency signals. (For example, refer to Patent Document 2).
Japanese Patent Laid-Open No. 2003-1000092 JP 2003-133455 A

However, the conventional high frequency package as described above has the following problems.
(1) A material having a dielectric constant of 1 with one side of the transmission board abutting against the adapter wall surface, the stepped portion opening diameter c (see FIG. 7C) of the adapter being a diameter obtained from the characteristic impedance calculation formula In the high-frequency package filled in, the distance d (see FIG. 7C) between the end of the signal line on the transmission board and the opening diameter end of the stepped portion of the adapter insertion hole is too close, resulting in excessive coupling capacity. It has a problem that transmission characteristics deteriorate.
(2) The high frequency package in the case where a space is provided between the adapter and the coaxial connector has no change in the distance between the signal line end on the transmission board and the adapter opening end, and is too close as in the past. There is a problem that the transmission characteristics deteriorate due to the extra coupling capacity.
(3) When the thickness of the connector core wire tip of the coaxial connector is reduced, the distance between the signal line end on the transmission board and the end of the adapter opening does not change, and it is too close as before Therefore, there is a problem that the transmission characteristics deteriorate due to the extra coupling capacity. In addition, it is difficult to process the tip of the connector core wire thinly or to align the thin connector core wire tip with respect to the signal line so as to be joined, thereby increasing the cost of the high frequency package.
The present invention has been made in view of such circumstances, and an object thereof is to provide an inexpensive high-frequency package that prevents deterioration of transmission characteristics of the package.

A high-frequency package according to the present invention that meets the above-described object includes a metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion. A coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter on the outside of the frame body, and having a metal adapter joined to a mounting portion made of a notch formed in one side wall of the frame body. In a high frequency package that is joined by positioning and fixing one end surface of the connector core wire support portion to the stepped portion, one end portion of the connector core wire protruding from one end surface of the connector core wire support portion is contacted A transmission board made of a dielectric member having a signal line made of a conductor wiring pattern for connection is provided with one side abutting against the adapter surface exposed to the inside of the frame body, and a connector Tip side of the signal line connecting line has a withdraw part does not reach the ridge line of the one side.
Here, the high-frequency package may have a pattern lacking portion at the corner of the tip of the signal line on the side to which the connector core wire is connected.

  A high-frequency package according to the present invention that meets the above-described object includes a metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion. A coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter outside the frame body, and having a metal adapter joined to a mounting portion made of a notch formed in one side wall of the frame body. In a high frequency package where one end surface of the connector core wire support portion is brought into contact with the stepped portion and positioned, fixed, and joined, one end portion of the connector core wire protruding from one end surface of the connector core wire support portion is contacted A transmission board made of a dielectric member having a signal line made of a conductor wiring pattern for connection is provided with one side abutting against the adapter surface exposed to the inside of the frame body, and a connector The tip side of the signal lines connecting the line reaches the edge line of one side has a pattern lacking portion at the corner portion of the front end of the signal line.

  A high-frequency package according to the present invention that meets the above-described object includes a metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion. A coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter on the outside of the frame body, and having a metal adapter joined to a mounting portion made of a notch formed in one side wall of the frame body. In a high frequency package where one end face of the connector core wire support part is brought into contact with the step part and positioned and fixed, the opening diameter in the step part of the adapter exceeds the value calculated from the desired characteristic impedance value. Have

A high-frequency package according to the present invention that meets the above-described object includes a metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion. A coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter on the outside of the frame body, and having a metal adapter joined to a mounting portion made of a notch formed in one side wall of the frame body. In a high frequency package that is joined by positioning and fixing one end surface of the connector core wire support portion to the stepped portion, one end portion of the connector core wire protruding from one end surface of the connector core wire support portion is contacted A transmission board made of a dielectric member having a signal line made of a conductor wiring pattern for connection is provided with one side abutting against the adapter surface exposed to the inside of the frame body, and a connector The tip side of the signal line connecting line has a withdraw part does not reach the ridge line of the one side, has a magnitude greater than the value opening diameter at the step portion of the adapter is calculated from the desired characteristic impedance.
Here, the high-frequency package preferably has a pattern lacking portion at the corner of the tip of the signal line on the side to which the connector core wire is connected.

  A high-frequency package according to the present invention that meets the above-described object includes a metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion. A coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter on the outside of the frame body, and having a metal adapter joined to a mounting portion made of a notch formed in one side wall of the frame body. In a high frequency package that is joined by positioning and fixing one end surface of the connector core wire support portion to the stepped portion, one end portion of the connector core wire protruding from one end surface of the connector core wire support portion is contacted A transmission board made of a dielectric member having a signal line made of a conductor wiring pattern for connection is provided with one side abutting against the adapter surface exposed to the inside of the frame body, and a connector The tip of the signal line on the side to which the wire is connected reaches the ridge line on one side, the pattern line lacks at the corner of the tip of the signal line, and the opening diameter at the step of the adapter is calculated from the desired characteristic impedance value It has a size that exceeds the specified value.

The high-frequency package according to claim 1 and claim 2 dependent thereon is a signal comprising a conductor wiring pattern for contacting and connecting one end portion of a connector core wire protruding from one end surface of the connector core wire support portion. A transmission board made of dielectric material with wires is provided with one side abutting against the adapter surface exposed inside the frame, and the tip of the signal line on the side connecting the connector core wire does not reach the ridge line on one side Since it has a pull-down section, an adjustment section that adjusts the distance between the signal line end on the transmission board and the adapter opening end can be provided on the signal line, reducing excess coupling capacity and improving transmission characteristics Can do.
In particular, the high frequency package according to claim 2 has a pattern lacking portion at the corner of the tip of the signal line on the side to which the connector core wire is connected, so that the distance between the signal line end on the transmission board and the adapter opening end is set. The adjustment range to be adjusted can be increased, and the excess coupling capacity with the adapter opening can be surely reduced to improve the transmission characteristics.

  The high frequency package according to claim 3 is made of a dielectric member provided with a signal line comprising a conductor wiring pattern for contacting and connecting one end of a connector core wire protruding from one end surface of the connector core wire support portion. The transmission board is provided with one side abutting against the adapter surface exposed inside the frame, and the tip of the signal line on the side to which the connector core wire is connected reaches the ridge line on one side, and the corner of the tip of the signal line Since it has a pattern missing part, an adjustment part that adjusts the distance between the signal line end on the transmission board and the adapter opening end can be provided on the signal line, reducing the excess coupling capacity and improving the transmission characteristics can do.

  The high frequency package according to claim 4 has a size in which the opening diameter of the stepped portion of the adapter exceeds a value calculated from a desired characteristic impedance value, and therefore, the signal line end on the transmission board and the adapter opening end An adjustment unit for adjusting the distance can be provided in the adapter, and an excessive coupling capacity with the adapter opening can be reduced, thereby improving the transmission characteristics.

The high-frequency package according to claim 5 and claim 6 dependent thereon is a signal comprising a conductor wiring pattern for contacting and connecting one end portion of a connector core wire protruding from one end surface of the connector core wire support portion. A transmission board made of dielectric material with wires is provided with one side abutting against the adapter surface exposed inside the frame, and the tip of the signal line on the side connecting the connector core wire does not reach the ridge line on one side Adjust the distance between the signal line end on the transmission board and the end of the adapter opening because it has a pull-down portion and the opening diameter at the stepped portion of the adapter exceeds the value calculated from the desired characteristic impedance value. The adjustment part can be provided on the signal line and on the adapter, the adjustment width can be increased, and the extra coupling capacity with the adapter opening part is reliably reduced. , It is possible to improve the transmission characteristic.
In particular, since the high frequency package according to claim 6 has a pattern lacking portion at the corner of the tip of the signal line on the side to which the connector core wire is connected, the distance between the signal line end on the transmission board and the adapter opening end is set. The adjustment range to be adjusted can be increased, and the excess coupling capacity with the adapter opening can be surely reduced to improve the transmission characteristics.

  The high-frequency package according to claim 7 is made of a dielectric member provided with a signal line made of a conductor wiring pattern for contacting and connecting one end of a connector core wire protruding from one end surface of the connector core wire support portion. The transmission board is provided with one side abutting against the adapter surface exposed inside the frame, and the tip of the signal line on the side to which the connector core wire is connected reaches the ridge line on one side, and the corner of the tip of the signal line In addition, the distance between the signal line end on the transmission board and the end of the adapter opening is larger than the value calculated from the desired characteristic impedance value. An adjustment part that adjusts the adjustment can be provided on the signal line and on the adapter, and the adjustment width can be increased, thus reducing the extra coupling capacity with the adapter opening. , It is possible to improve the transmission characteristic.

Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A and 1B are a plan view of a high-frequency package according to one embodiment of the first to fifth inventions, an enlarged longitudinal sectional view taken along line AA ′, and FIG. FIG. 3B is an enlarged cross-sectional view taken along line BB ′ of the high-frequency package according to the embodiment of the first invention, an enlarged cross-sectional view taken along line BB ′ of a modification of the high-frequency package, and FIG. FIG. 4 is an enlarged cross-sectional view taken along line BB ′ of the high frequency package according to the embodiment of the second invention, and FIG. 4 is an enlarged view of line BB ′ of the high frequency package according to the embodiment of the third invention. 5A and 5B are respectively an enlarged cross-sectional view taken along line BB ′ of the high-frequency package according to the embodiment of the fourth invention, and a B- of a modification of the high-frequency package. B 'line enlarged transverse sectional view, FIG. 6 is a BB' line enlarged transverse sectional view of the high frequency package according to one embodiment of the fifth invention. .

  As shown in FIGS. 1A and 1B, a high frequency package 10, 10a, 10b, 10c, 10d, 10e, 10f according to one embodiment of the first to fifth inventions is made of a metal frame. 11 and a metal base 13 provided with fixing holes 12 (four in the present embodiment) for mounting on a board or the like are brazed and joined with a high-temperature brazing material, and the high frequency braid is formed on the internal base 13. The cavity portion 14 is a mounting portion for the semiconductor element. One side wall of the frame body 11 is provided with a mounting portion 15 that is communicated with the cavity portion 14 and formed by cutting. A side wall portion 17 of an adapter 16 made of a metal member is brazed to the mounting portion 15 using a high-temperature brazing material. The adapter 16 is provided with a pedestal 18 that is integrated with the side wall 17 and disposed in the cavity 14. Further, the side wall portion 17 is provided with a cylindrical insertion hole 21 having a stepped portion 20 provided therein for joining the coaxial connector 19. A coaxial connector 19 is inserted into the insertion hole 21, and one end face of the connector core wire support portion 22 of the coaxial connector 19 is abutted against the step portion 20 and is fixedly positioned. The outer peripheral side surface of the metal cylinder 23 of the connector core support 22 and the wall surface of the insertion hole 21 are joined by a brazing material or the like.

  One side portion protruding into the cavity portion 14 of the connector core wire 24 protruding from one end face of the connector core wire support portion 22 is a dielectric member such as ceramic or resin joined on the base portion 18 of the adapter 16. It is joined to the conductor wiring pattern on the transmission board 25 made of metal. The other of the connector core wires 24 protruding from the other end face of the connector core wire support portion 22 to the outside of the package is exposed inside the cylindrical body portion 26 formed integrally with the adapter 16. This cylindrical body portion 26 is provided for mounting and fixing at the time of connection with a lead wire connected to the other of the connector core wires 24. As shown in FIG. 2 (A), the high-frequency package 10 according to one embodiment of the first invention is such that the signal line 27 on the transmission board 25 connects the one side portion of the connector core wire 24. Has a pull-down portion 28 that does not reach the ridge line on one side surface of the transmission board 25. Further, as shown in FIG. 2B, in the high frequency package 10a of the modified example of the high frequency package 10 according to the embodiment of the first invention, the signal line 27a on the transmission board 25 is connected to the connector core wire 24. A pull-down portion 28 is provided at the tip on the side where one side is connected, and a pattern lacking portion 29 having a C-plane shape, an R-plane shape, a staircase shape, or the like is provided at a corner portion of the tip. The high frequency packages 10, 10 a have a distance between the ends of the signal lines 27, 27 a and the end portion of the opening diameter a of the step portion 20 provided in the insertion hole 21 of the adapter 16 by the lowered portion 28 and the pattern lacking portion 29. Since b can be adjusted to reduce excess coupling capacity, transmission characteristics can be improved.

  Next, a high frequency package 10b according to an embodiment of the second invention will be described with reference to FIG. As shown in FIG. 3, the high-frequency package 10b is basically formed in the same configuration as the high-frequency packages 10 and 10a, but the signal line 27b made of a conductor wiring pattern on the transmission board 25 is formed. The tip of the connector core wire 24 connected to one side reaches a ridge line on one side of the transmission board 25, and the corner of the tip has a C surface shape, an R surface shape, a staircase shape, etc. The pattern lacking portion 29 is formed. In the high-frequency package 10b, the pattern lacking portion 29 adjusts the distance b between the end of the signal line 27b and the end of the opening diameter a of the stepped portion 20 provided in the insertion hole 21 of the adapter 16, so that an excess coupling capacity is obtained. Therefore, transmission characteristics can be improved.

  Next, a high frequency package 10c according to an embodiment of the third invention will be described with reference to FIG. As shown in FIG. 4, the high-frequency package 10 c is basically formed in the same configuration as the high-frequency packages 10, 10 a, and 10 b, but is a signal line formed of a conductor wiring pattern on the transmission substrate 25. Reference numeral 27 c denotes a shape in which the tip on the side connecting one side of the connector core wire 24, which is the shape of the signal line of the conventional high frequency package, reaches the ridge line on one side surface of the transmission board 25. The high frequency package 10c has a size in which the opening diameter a 'of the step portion 20 provided in the insertion hole 21 of the adapter 16 exceeds the value calculated from the desired characteristic impedance value. The calculation method of the opening diameter a ′ can be calculated by substituting a desired characteristic impedance value into the characteristic impedance calculation formula expressed by the following formula 1 and performing reverse calculation. The high-frequency package 10c is configured such that the end of the signal line 27c and the adapter 16 have a size such that the opening diameter a ′ of the stepped portion 20 provided in the insertion hole 21 of the adapter 16 exceeds a value calculated from a desired characteristic impedance value. Since the distance b from the opening diameter a ′ end of the step portion 20 provided in the insertion hole 21 can be adjusted and the excess coupling capacity can be reduced, the transmission characteristics can be improved.

  Next, a high frequency package 10d and a modified high frequency package 10e according to an embodiment of the fourth invention will be described with reference to FIGS. As shown in FIG. 5A, the high-frequency package 10d is basically formed in the same configuration as the high-frequency packages 10, 10a, 10b, and 10c, but the conductor wiring on the transmission board 25 is formed. The signal line 27 made of a pattern has a pull-down portion 28 that does not reach the ridge line on one side surface of the transmission board 25 on the side to which one side portion of the connector core wire 24 is connected, and is provided in the insertion hole 21 of the adapter 16. The opening diameter a ′ of the stepped portion 20 is larger than the value calculated from the desired characteristic impedance value according to the above equation (1). As shown in FIG. 5B, the high frequency package 10e, which is a modification of the high frequency package 10d, has a signal line 27a on the transmission board 25 at the tip of the side where one side of the connector core wire 24 is connected. In addition to having a pull-down portion 28, the opening diameter a ′ of the step portion 20 provided in the insertion hole 21 of the adapter 16 has a size exceeding the value calculated from the desired characteristic impedance value according to the above equation 1, and A pattern lacking portion 29 having a C-plane shape, an R-plane shape, a staircase shape, or the like is provided at the corner of the tip on the side where one side portion of the connector core wire 24 is connected. In the high frequency packages 10d and 10e, the signal line 27 or the end of the signal line 27a by the pulling part 28 or the pattern lacking part 29 and the opening diameter a ′ of the step part 20 provided in the insertion hole 21 of the adapter 16 are desired. The width of adjustment of the distance b to the end of the aperture diameter a 'that exceeds the value calculated from the characteristic impedance value to be adjusted can be expanded, and the extra coupling capacity can be reduced more finely, improving transmission characteristics Can be made.

  Next, a high frequency package 10f according to an embodiment of the fifth invention will be described with reference to FIG. As shown in FIG. 6, the high frequency package 10f is basically formed in the same configuration as the high frequency packages 10, 10a, 10b, 10c, 10d, and 10e. The signal line 27b composed of the wiring pattern has a tip on the side connecting one side of the connector core wire 24 reaching the ridge line on one side of the transmission board 25, and has a pattern lacking portion 29 at the corner of the tip. In addition, the design is calculated by substituting the desired characteristic impedance value into the characteristic impedance calculation formula expressed by the above formula 1 so that the opening diameter a ′ of the stepped portion 20 provided in the insertion hole 21 of the adapter 16 is reversed. It has a size that exceeds the size of the value. This high-frequency package 10f has a design value calculated from the desired characteristic impedance value of the signal line 27b end by the pattern lacking portion 29 and the opening diameter a ′ of the step portion 20 provided in the insertion hole 21 of the adapter 16. The adjustment width of the distance b with the end portion of the opening diameter a ′ exceeding the size can be increased, and the extra coupling capacity can be reduced more finely, so that the transmission characteristics can be improved.

  The high frequency packages 10, 10 a, 10 b, 10 c, 10 d, 10 e, and 10 f have a feedthrough substrate 30 made of ceramic on the side wall facing the side wall of the frame 11 to which the adapter 16 is joined. The feedthrough substrate 30 includes conductor wiring patterns 31 and 31a that are electrically connected to the outside of the package. The feedthrough substrate 30 is fitted into a window frame-shaped cutout portion 32 that communicates with the cavity portion 14 provided in the frame body 11, and the high-temperature brazing material. It is brazed and joined. An external connection terminal 33 for electrical connection with the outside is brazed and joined to the conductor wiring pattern 31a outside the frame 11 in a butterfly shape with a high-temperature brazing material. The conductor wiring pattern 31 on the cavity portion 14 side is used to connect the semiconductor element with a bonding wire.

  In addition, a through hole 34 communicating with the cavity portion 14 is provided on one side wall of the frame 11 to which the adapter 16 and the feedthrough substrate 30 are not joined. A metal fixing member 35 serving as an outlet is inserted and brazed with a high-temperature brazing material. A seal ring 36 made of a metal member brazed with a high-temperature brazing material is provided above the frame 11. The seal ring 36 is used to hermetically seal the inside of the cavity portion 14 by bonding a lid (not shown) after mounting a semiconductor element.

  In the high frequency packages 10, 10 a, 10 b, 10 c, 10 d, 10 e and 10 f, high frequency semiconductor elements are mounted in the cavity portion 14, and an optical fiber member is attached to the metal fixing member 35. Then, a lid formed of a metal member is brazed to the seal ring 36 with a low-temperature brazing material and sealed, and used as a high-frequency semiconductor module for optical communication.

  Next, a method for manufacturing the high-frequency packages 10, 10a, 10b, 10c, 10d, 10e, and 10f according to one embodiment of the first to fifth inventions will be described. The frame 11 cuts a metal lump such as KV (Fe—Ni—Co alloy, trade name “Kovar”) or 42 alloy (Fe—Ni alloy) whose thermal expansion coefficient approximates that of ceramic. Alternatively, the pipe shape is cut and then bent. A substantially rectangular attachment portion 15 communicating with the cavity portion 14 cut out from the upper end portion is formed on the sidewall of the frame body 11. Further, a substantially rectangular window frame-shaped cutout portion 32 communicating with the cavity portion 14 cut out from the upper end portion is formed on the side wall of the frame body 11 facing the attachment portion 15. Furthermore, a substantially circular through-hole 34 communicating with the cavity portion 14 is formed in one side wall of the frame body 11 where the attachment portion 15 and the window frame-shaped notch portion 32 are not formed.

  The base 13 that forms the bottom of the cavity 14 and includes a fixing hole 12 for mounting to a mounting member such as a board with a screw is Cu-W (porous tungsten that is excellent in radiating heat generated from the semiconductor element. And a metal plate such as Cu—Mo—Cu (formed by joining three layers of copper, molybdenum, and copper).

  The frame body 11 and the base body 13 are subjected to Ni plating, and then are heated by sandwiching Ag—Cu brazing, which is an example of a high-temperature brazing material, at the joint portion. As a result, a cavity portion 14 for mounting therein a high-frequency semiconductor element such as a laser diode or a photodiode is formed.

  A metal adapter 16 made of KV, 42 alloy, or the like is attached to the mounting portion 15, and after Ni plating is applied to the surface thereof, a high-temperature brazing material such as Ag—Cu brazing is sandwiched between the joints and heated. Join. The adapter 16 to be joined here is integrally formed so as to have a corner portion where the side wall portion 17 and the pedestal portion 18 intersect at a right angle by cutting a metal material or the like. Further, the side wall portion 17 is provided with a step portion 20 composed of a small diameter hole and a large diameter hole for joining the coaxial connector 19, and an insertion hole 21 communicating with the cavity portion 14 is formed.

  On the other hand, the window frame-shaped notch 32 is subjected to Ni plating on a conductor pattern formed on the joint surface with the feedthrough substrate 30 made of ceramic, and then a high-temperature brazing material such as Ag—Cu solder is used as the joint. The feed-through substrate 30 is brazed and joined by heating. As the ceramic forming the feedthrough substrate 30 to be joined here, alumina or the like which is an example of ceramic can be used. In order to produce this alumina ceramic, first, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, and calcia to alumina powder, a plasticizer such as dioctyl phthalate, a binder such as an acrylic resin, and toluene, A solvent such as xylene and alcohol is added, kneaded sufficiently, and defoamed to prepare a slurry having a viscosity of 2000 to 40000 cps. Next, for example, a roll-shaped sheet having a thickness of 0.25 mm is formed by a doctor blade method or the like, and a plurality of rectangular ceramic green sheets cut to an appropriate size are produced. The plurality of ceramic green sheets are screen printed using a conductive paste made of a refractory metal such as tungsten or molybdenum to form conductor wiring patterns 31, 31a, and the like. In a reducing atmosphere, the feedthrough substrate 30 is manufactured by simultaneously firing the ceramic and the refractory metal.

  The through hole 34 is plated with Ni on the joint surface with the metal fixing member 35 made of KV, 42 alloy or the like, and then heated with a high-temperature brazing material such as Ag-Cu brazing in the joint. The metal fixing member 35 is brazed and joined. The metal fixing member 35 to be joined here is manufactured by forming an outer portion and a cavity hole from a metal lump by cutting or the like. An optical fiber member (not shown) that transmits and receives an optical signal to and from the semiconductor element is joined to the metal fixing member 35 with a low-temperature brazing material such as Au—Sn after the semiconductor element is mounted in the cavity portion 14. , YAG or other laser welding.

Above the frame 11 is made of a metal such as KV or 42 alloy, and after Ni plating is applied to the seal ring 36 formed by pressing or cutting, a high-temperature brazing material such as Ag-Cu brazing Is heated between the joints and brazed.
In addition, the brazing joining using each said high temperature brazing material can be brazed once or divided into several times.

  The coaxial connector 19 is inserted into an insertion hole 21 formed in the adapter 16 via a low-temperature brazing material made of Au—Sn brazing, Au—Ge brazing, or the like, and is made of a dielectric such as glass or resin of the coaxial connector 19. The end face of one end portion of the connector core wire support portion 22 is in contact with and fixed to the step portion 20 composed of a small diameter hole and a large diameter hole. The coaxial connector 19 is placed with the other end of the connector core support 22 exposed from the surface of the side wall 17 of the adapter 16. By heating, the adapter 16 and the coaxial connector 19 are brazed and joined to the wall surface of the insertion hole 22 of the adapter 16 and the outer peripheral surface of the metal cylinder 23 of the coaxial connector 19.

  One end of the connector core wire 24 supported by the connector core wire support portion 22 protruding into the cavity portion 14 is a signal line formed on the transmission board 25 joined to the base portion 18 of the adapter 16. 27, 27a and 27b are brazed and joined with a low-temperature brazing material made of Au—Sn brazing, Au—Ge brazing or the like. Here, the transmission board 25 is made of a dielectric member such as ceramic or resin. For example, when the transmission board 25 is made of a ceramic such as alumina, a ceramic green sheet similar to the ceramic green sheet used to make the feedthrough board 30 is used. The signal lines 27, 27a and 27b formed on the transmission board 25 are made of a high melting point metal similar to the high melting point metal used for manufacturing the feedthrough board 30 on the ceramic green sheet, and are drawn by screen printing. 28 and a conductor wiring pattern in which a pattern lacking portion 29 is formed. The ceramic green sheet and the conductor wiring pattern are simultaneously fired to form the transmission board 25 and the signal lines 27, 27a, 27b thereon. The transmission substrate 25 and the signal lines 27, 27a, 27b formed on the transmission substrate 25 are conductor wiring having a pull-down portion 28 and a pattern lacking portion 29 by thin film metallization by sputtering or the like on a fired ceramic substrate. It may be produced by a manufacturing method for forming a pattern.

  The inventor of the present invention provides a high-frequency package according to the first embodiment in which the signal line has a pull-down portion that does not reach the ridge line on one side surface of the transmission board at the tip of the side where the one side of the connector core wire is connected. For the high frequency of the second embodiment, the shape reaches the ridge line on one side surface of the same transmission board, and the opening diameter of the stepped portion provided in the insertion hole of the adapter exceeds the value calculated from the desired characteristic impedance value. Prepared the package. In addition, the present inventor prepared a conventional high-frequency package in which the signal line reaches the ridge line on one side surface of the transmission board and the opening diameter of the stepped portion is as calculated. Then, the inventor conducted S-parameter simulation analysis using the finite element method for the transmission characteristics of each high-frequency package. The resulting graph is shown in Table 1. The S parameter graph shown in Table 1 displays the frequency on the horizontal axis and S11 (reflection characteristics) at each frequency in decibels (dB) on the vertical axis, and the negative (−) of S11 in the high frequency band of 30 GHz or higher. The larger the value, the smaller the reflection and the better the transmission characteristics.

  As shown in Table 1, S11 of Example 1 is −21.5 dB to −25.4 dB, S11 of Example 2 is −18.5 dB to −25.6 dB, and S11 of the conventional example is − Since it is 14.3 dB--16.5 dB, it turns out that the transmission characteristic of Example 1 and Example 2 is superior to the transmission characteristic of a prior art example.

  The high frequency package of the present invention can be used with a high frequency semiconductor module for passing a high frequency signal.

(A), (B) is the top view of the package for high frequency which concerns on one Embodiment of the 1st-5th invention, respectively, and an A-A 'line enlarged vertical sectional view. (A), (B) is each the BB 'line expanded cross-sectional view of the high frequency package which concerns on one embodiment of 1st invention, The BB' line expanded cross section of the modification of the same high frequency package FIG. It is a B-B 'line expanded transverse sectional view of the high frequency package concerning one embodiment of the 2nd invention. It is a B-B 'line expanded transverse sectional view of the high frequency package concerning one embodiment of the 3rd invention. (A), (B) is the BB 'line enlarged cross-sectional view of the high frequency package which concerns on one embodiment of 5th invention, respectively, and the BB' line enlarged cross section of the modification of the same high frequency package FIG. It is a B-B 'line expanded transverse sectional view of the high frequency package concerning one embodiment of the 5th invention. (A)-(C) are the top view of the conventional high frequency package, a C-C 'line enlarged longitudinal sectional view, and a D-D' line enlarged transverse sectional view, respectively.

Explanation of symbols

  10, 10a, 10b, 10c, 10d, 10e, 10f: High-frequency package, 11: Frame, 12: Fixing hole, 13: Base, 14: Cavity, 15: Mounting, 16: Adapter, 17: Side wall Part: 18: pedestal part, 19: coaxial connector, 20: stepped part, 21: insertion hole, 22: connector core wire support part, 23: metal cylinder, 24: connector core, 25: transmission board, 26: cylinder Part, 27, 27a, 27b: signal line, 28: pull-down part, 29: pattern lacking part, 30: feedthrough substrate, 31, 31a: conductor wiring pattern, 32: window frame-like notch part, 33: external connection terminal 34: Through hole, 35: Metal fixing member, 36: Seal ring

Claims (7)

A metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion, and formed on one side wall of the frame A metal adapter is joined to the mounting portion made of the cutout, and a coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter outside the frame body on one side of the connector core support portion. In the package for high frequency that is bonded by positioning and fixing the end face in contact with the stepped portion,
A transmission board made of a dielectric member provided with a signal line made of a conductor wiring pattern for contacting and connecting one end of the connector core wire protruding from one end face of the connector core wire support portion is provided inside the frame body. A high-frequency package characterized by having a pull-down portion that is provided with one side abutting against the exposed adapter surface, and the tip of the signal line on the side to which the connector core wire is connected does not reach the ridge line on the one side .   2. The high frequency package according to claim 1, wherein a pattern lacking portion is provided at a corner portion of the tip of the signal line on the side to which the connector core wire is connected. A metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion, and formed on one side wall of the frame A metal adapter is joined to the mounting portion made of the cutout, and a coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter outside the frame body on one side of the connector core support portion. In the package for high frequency that is bonded by positioning and fixing the end face in contact with the stepped portion,
A transmission board made of a dielectric member provided with a signal line made of a conductor wiring pattern for contacting and connecting one end of the connector core wire protruding from one end face of the connector core wire support portion is provided inside the frame body. Provided with one side abutting against the exposed adapter surface, the tip of the signal line on the side connecting the connector core wire reaches the ridge line of the one side, and lacks a pattern at the corner of the tip of the signal line A package for high frequency characterized by having a portion. A metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion, and formed on one side wall of the frame A metal adapter is joined to the mounting portion made of the cutout, and a coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter outside the frame body on one side of the connector core support portion. In the package for high frequency that is bonded by positioning and fixing the end face in contact with the stepped portion,
A high frequency package, wherein an opening diameter of the step portion of the adapter exceeds a value calculated from a desired characteristic impedance value. A metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion, and formed on one side wall of the frame A metal adapter is joined to the mounting portion made of the cutout, and a coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter outside the frame body on one side of the connector core support portion. In the package for high frequency that is bonded by positioning and fixing the end face in contact with the stepped portion,
A transmission board made of a dielectric member provided with a signal line made of a conductor wiring pattern for contacting and connecting one end of the connector core wire protruding from one end face of the connector core wire support portion is provided inside the frame body. One end of the adapter wire is provided in contact with the exposed adapter surface, and a tip portion of the signal line on the side to which the connector core wire is connected does not reach the ridge line on the one side surface, and the step portion of the adapter A high-frequency package characterized in that the opening diameter of the package has a size exceeding a value calculated from a desired characteristic impedance value.   6. The high frequency package according to claim 5, wherein a pattern lacking portion is provided at a corner of the tip of the signal line on the side to which the connector core wire is connected. A metal base having a mounting portion for mounting a semiconductor element, and a metal frame joined to the base so as to surround the mounting portion, and formed on one side wall of the frame A metal adapter is joined to the mounting portion made of the cutout, and a coaxial connector is inserted into the insertion hole having a stepped portion having a large opening diameter outside the frame body on one side of the connector core support portion. In the package for high frequency that is bonded by positioning and fixing the end face in contact with the stepped portion,
A transmission board made of a dielectric member having a signal line made of a conductor wiring pattern for contacting and connecting one end of the connector core wire protruding from one end surface of the connector core wire support portion is provided inside the frame body. Provided with one side abutting against the exposed adapter surface, the tip of the signal line on the side connecting the connector core wire reaches the ridge line of the one side, and lacks a pattern at the corner of the tip of the signal line A high-frequency package comprising: a portion having an opening diameter at the step portion of the adapter that exceeds a value calculated from a desired characteristic impedance value.

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