JP2005327509A - 導電性微粒子及び異方性導電材料 - Google Patents
導電性微粒子及び異方性導電材料 Download PDFInfo
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- JP2005327509A JP2005327509A JP2004142851A JP2004142851A JP2005327509A JP 2005327509 A JP2005327509 A JP 2005327509A JP 2004142851 A JP2004142851 A JP 2004142851A JP 2004142851 A JP2004142851 A JP 2004142851A JP 2005327509 A JP2005327509 A JP 2005327509A
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- fine particles
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- 239000011347 resin Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229920003023 plastic Polymers 0.000 claims abstract description 19
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- 230000001788 irregular Effects 0.000 abstract 1
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- 239000011246 composite particle Substances 0.000 description 7
- 238000002788 crimping Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
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- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
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- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
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- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
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- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- KFGFVPMRLOQXNB-UHFFFAOYSA-N 3,5,5-trimethylhexanoyl 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOC(=O)CC(C)CC(C)(C)C KFGFVPMRLOQXNB-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
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- 239000004902 Softening Agent Substances 0.000 description 1
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- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004067 bulking agent Substances 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000012674 dispersion polymerization Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- JZKFHQMONDVVNF-UHFFFAOYSA-N dodecyl sulfate;tris(2-hydroxyethyl)azanium Chemical compound OCCN(CCO)CCO.CCCCCCCCCCCCOS(O)(=O)=O JZKFHQMONDVVNF-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
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- 239000009719 polyimide resin Substances 0.000 description 1
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- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
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- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004142851A JP2005327509A (ja) | 2004-05-12 | 2004-05-12 | 導電性微粒子及び異方性導電材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004142851A JP2005327509A (ja) | 2004-05-12 | 2004-05-12 | 導電性微粒子及び異方性導電材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005327509A true JP2005327509A (ja) | 2005-11-24 |
| JP2005327509A5 JP2005327509A5 (enExample) | 2007-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004142851A Pending JP2005327509A (ja) | 2004-05-12 | 2004-05-12 | 導電性微粒子及び異方性導電材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005327509A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009017200A1 (ja) * | 2007-08-02 | 2009-02-05 | Hitachi Chemical Company, Ltd. | 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 |
| JP2014080484A (ja) * | 2012-10-15 | 2014-05-08 | Hitachi Chemical Co Ltd | 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体 |
| JP2014080485A (ja) * | 2012-10-15 | 2014-05-08 | Hitachi Chemical Co Ltd | 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体 |
| JPWO2013085039A1 (ja) * | 2011-12-08 | 2015-04-27 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
| KR20180127439A (ko) | 2016-03-23 | 2018-11-28 | 히타치가세이가부시끼가이샤 | 반응 장치, 그리고 수지 입자, 도전성 입자, 이방 도전 재료 및 접속 구조체의 제조 방법 |
| US10546831B2 (en) | 2015-05-27 | 2020-01-28 | Dexerials Corporation | Anisotropic electrically conductive film and connection structure |
| WO2020071271A1 (ja) * | 2018-10-03 | 2020-04-09 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
| JP2020095941A (ja) * | 2018-10-03 | 2020-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
-
2004
- 2004-05-12 JP JP2004142851A patent/JP2005327509A/ja active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009017200A1 (ja) * | 2007-08-02 | 2009-02-05 | Hitachi Chemical Company, Ltd. | 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 |
| JPWO2009017200A1 (ja) * | 2007-08-02 | 2010-10-21 | 日立化成工業株式会社 | 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 |
| TWI396205B (zh) * | 2007-08-02 | 2013-05-11 | 日立化成工業股份有限公司 | A circuit connecting material, a connecting structure using the circuit member, and a connection method of the circuit member |
| KR101302778B1 (ko) * | 2007-08-02 | 2013-09-02 | 히타치가세이가부시끼가이샤 | 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법 |
| CN101689410B (zh) * | 2007-08-02 | 2013-10-16 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
| JPWO2013085039A1 (ja) * | 2011-12-08 | 2015-04-27 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
| JP2014080485A (ja) * | 2012-10-15 | 2014-05-08 | Hitachi Chemical Co Ltd | 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体 |
| JP2014080484A (ja) * | 2012-10-15 | 2014-05-08 | Hitachi Chemical Co Ltd | 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体 |
| US10546831B2 (en) | 2015-05-27 | 2020-01-28 | Dexerials Corporation | Anisotropic electrically conductive film and connection structure |
| US10892243B2 (en) | 2015-05-27 | 2021-01-12 | Dexerials Corporation | Anisotropic electrically conductive film and connection structure |
| KR20180127439A (ko) | 2016-03-23 | 2018-11-28 | 히타치가세이가부시끼가이샤 | 반응 장치, 그리고 수지 입자, 도전성 입자, 이방 도전 재료 및 접속 구조체의 제조 방법 |
| WO2020071271A1 (ja) * | 2018-10-03 | 2020-04-09 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
| JP2020095941A (ja) * | 2018-10-03 | 2020-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
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