JP2005317836A5 - - Google Patents
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- Publication number
- JP2005317836A5 JP2005317836A5 JP2004135465A JP2004135465A JP2005317836A5 JP 2005317836 A5 JP2005317836 A5 JP 2005317836A5 JP 2004135465 A JP2004135465 A JP 2004135465A JP 2004135465 A JP2004135465 A JP 2004135465A JP 2005317836 A5 JP2005317836 A5 JP 2005317836A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004135465A JP2005317836A (ja) | 2004-04-30 | 2004-04-30 | 配線回路基板およびその製造方法 |
EP05007458A EP1592290A1 (en) | 2004-04-30 | 2005-04-05 | Wired circuit board and production method thereof |
TW094111613A TW200601920A (en) | 2004-04-30 | 2005-04-13 | Wiring circuit board and production method thereof |
US11/108,720 US20050244620A1 (en) | 2004-04-30 | 2005-04-19 | Wired circuit board and production method thereof |
KR1020050035627A KR20060047598A (ko) | 2004-04-30 | 2005-04-28 | 배선 회로 기판 및 그 제조 방법 |
CNA2005100701089A CN1694604A (zh) | 2004-04-30 | 2005-04-28 | 布线电路板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004135465A JP2005317836A (ja) | 2004-04-30 | 2004-04-30 | 配線回路基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005317836A JP2005317836A (ja) | 2005-11-10 |
JP2005317836A5 true JP2005317836A5 (ja) | 2006-03-23 |
Family
ID=34934782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004135465A Withdrawn JP2005317836A (ja) | 2004-04-30 | 2004-04-30 | 配線回路基板およびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050244620A1 (ja) |
EP (1) | EP1592290A1 (ja) |
JP (1) | JP2005317836A (ja) |
KR (1) | KR20060047598A (ja) |
CN (1) | CN1694604A (ja) |
TW (1) | TW200601920A (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4640802B2 (ja) | 2005-07-07 | 2011-03-02 | 日東電工株式会社 | 回路付サスペンション基板 |
JP2007103586A (ja) * | 2005-10-03 | 2007-04-19 | Nitto Denko Corp | 配線回路基板の製造方法 |
JP4615427B2 (ja) | 2005-12-01 | 2011-01-19 | 日東電工株式会社 | 配線回路基板 |
KR20070087929A (ko) * | 2006-02-10 | 2007-08-29 | 삼성전자주식회사 | 인쇄회로와 이의 제조방법 및, 인쇄회로-전자소자 결합체와이의 제조방법 |
JP2007258281A (ja) * | 2006-03-20 | 2007-10-04 | Sharp Corp | フレキシブル配線基板およびその接続構造 |
JP2008034639A (ja) * | 2006-07-28 | 2008-02-14 | Nitto Denko Corp | 配線回路基板 |
JP4865453B2 (ja) | 2006-08-30 | 2012-02-01 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP2008282995A (ja) | 2007-05-10 | 2008-11-20 | Nitto Denko Corp | 配線回路基板 |
KR101159514B1 (ko) * | 2007-05-24 | 2012-06-26 | 프린코 코포레이션 | 다층기판 금속배선 제조방법 및 그 구조 |
US8815333B2 (en) | 2007-12-05 | 2014-08-26 | Princo Middle East Fze | Manufacturing method of metal structure in multi-layer substrate |
CN101784165B (zh) * | 2010-03-19 | 2014-11-05 | 中兴通讯股份有限公司 | 一种印制电路板耐腐蚀可焊涂层处理方法 |
CN101840988A (zh) * | 2010-04-22 | 2010-09-22 | 傲迪特半导体(南京)有限公司 | 汽车前大灯发热pcb基台及其制作方法 |
JP6807180B2 (ja) * | 2015-07-31 | 2021-01-06 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
US9883583B2 (en) * | 2015-09-02 | 2018-01-30 | Apple Inc. | Fabric signal path structures for flexible devices |
KR101816983B1 (ko) * | 2016-01-11 | 2018-01-09 | 주식회사 케이씨씨 | 세라믹 회로기판 및 이의 제조방법 |
KR101877931B1 (ko) * | 2016-12-06 | 2018-07-12 | 주식회사 테토스 | 솔더 입자의 제조 방법 |
US20190029122A1 (en) * | 2017-07-19 | 2019-01-24 | Anaren, Inc. | Encapsulation of circuit trace |
JP7161866B2 (ja) * | 2018-05-31 | 2022-10-27 | 日東電工株式会社 | 配線回路基板 |
CN111182737B (zh) * | 2018-11-13 | 2021-08-03 | 上海和辉光电股份有限公司 | 柔性线路板及其制造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
US3981691A (en) * | 1974-07-01 | 1976-09-21 | Minnesota Mining And Manufacturing Company | Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers |
US3984907A (en) * | 1975-07-25 | 1976-10-12 | Rca Corporation | Adherence of metal films to polymeric materials |
US4568413A (en) * | 1983-07-25 | 1986-02-04 | James J. Toth | Metallized and plated laminates |
US4863808A (en) * | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
DE3639604A1 (de) * | 1986-11-20 | 1988-05-26 | Bbc Brown Boveri & Cie | Verfahren zur herstellung lotverstaerkter leiterbahnen |
JPH0418789A (ja) * | 1990-05-14 | 1992-01-22 | Furukawa Electric Co Ltd:The | プリント配線板の製造方法 |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
JP2717911B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
JPH08330728A (ja) * | 1995-05-26 | 1996-12-13 | Toyo Metaraijingu Kk | フレキシブルプリント配線用基板 |
JP2000340911A (ja) * | 1999-05-25 | 2000-12-08 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔 |
US6296949B1 (en) * | 1999-09-16 | 2001-10-02 | Ga-Tek Inc. | Copper coated polyimide with metallic protective layer |
EP1332238B1 (de) * | 2000-10-09 | 2009-04-22 | Hueck Folien Gesellschaft m.b.H. | Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung |
KR20030016409A (ko) * | 2001-05-24 | 2003-02-26 | 도레이 가부시끼가이샤 | 금속층이 형성된 내열성 수지 필름 및 배선판, 그리고이들을 제조하는 방법 |
KR100604819B1 (ko) * | 2003-06-12 | 2006-07-28 | 삼성전자주식회사 | 반도체 패키지용 배선 기판, 그 제조방법 및 이를 이용한반도체 패키지 |
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2004
- 2004-04-30 JP JP2004135465A patent/JP2005317836A/ja not_active Withdrawn
-
2005
- 2005-04-05 EP EP05007458A patent/EP1592290A1/en not_active Withdrawn
- 2005-04-13 TW TW094111613A patent/TW200601920A/zh unknown
- 2005-04-19 US US11/108,720 patent/US20050244620A1/en not_active Abandoned
- 2005-04-28 CN CNA2005100701089A patent/CN1694604A/zh active Pending
- 2005-04-28 KR KR1020050035627A patent/KR20060047598A/ko not_active Application Discontinuation