JP2005310152A - 効率的に空間を利用するための、複数の熱交換器を有する液体ループ - Google Patents

効率的に空間を利用するための、複数の熱交換器を有する液体ループ Download PDF

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Publication number
JP2005310152A
JP2005310152A JP2005120787A JP2005120787A JP2005310152A JP 2005310152 A JP2005310152 A JP 2005310152A JP 2005120787 A JP2005120787 A JP 2005120787A JP 2005120787 A JP2005120787 A JP 2005120787A JP 2005310152 A JP2005310152 A JP 2005310152A
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JP
Japan
Prior art keywords
tube
heat exchangers
chassis
cooling
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005120787A
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English (en)
Japanese (ja)
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JP2005310152A5 (cg-RX-API-DMAC7.html
Inventor
Christopher G Malone
ジー． マローン クリストファー
Glenn C Simon
シー． サイモン グレン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2005310152A publication Critical patent/JP2005310152A/ja
Publication of JP2005310152A5 publication Critical patent/JP2005310152A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2005120787A 2004-04-19 2005-04-19 効率的に空間を利用するための、複数の熱交換器を有する液体ループ Pending JP2005310152A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/827,801 US7280358B2 (en) 2004-04-19 2004-04-19 Liquid loop with multiple heat exchangers for efficient space utilization

Publications (2)

Publication Number Publication Date
JP2005310152A true JP2005310152A (ja) 2005-11-04
JP2005310152A5 JP2005310152A5 (cg-RX-API-DMAC7.html) 2008-05-29

Family

ID=34574896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005120787A Pending JP2005310152A (ja) 2004-04-19 2005-04-19 効率的に空間を利用するための、複数の熱交換器を有する液体ループ

Country Status (3)

Country Link
US (1) US7280358B2 (cg-RX-API-DMAC7.html)
JP (1) JP2005310152A (cg-RX-API-DMAC7.html)
GB (1) GB2413439B (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007272294A (ja) * 2006-03-30 2007-10-18 Nec Personal Products Co Ltd 冷却装置及び情報処理装置
KR20160082238A (ko) * 2013-10-31 2016-07-08 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 통합형 열 전달 유닛을 구비한 원심 팬

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6997247B2 (en) * 2004-04-29 2006-02-14 Hewlett-Packard Development Company, L.P. Multiple-pass heat exchanger with gaps between fins of adjacent tube segments
JP2007094648A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 電子機器
US7626815B2 (en) * 2005-11-14 2009-12-01 Nvidia Corporation Drive bay heat exchanger
US20070125523A1 (en) * 2005-12-01 2007-06-07 Bhatti Mohinder S Low profile liquid cooled server heat sink
US20080043425A1 (en) * 2006-08-17 2008-02-21 Justin Richard Hebert Methods and systems for cooling a computing device
US7372698B1 (en) * 2006-12-21 2008-05-13 Isothermal Systems Research, Inc. Electronics equipment heat exchanger system
US7551440B2 (en) * 2007-01-24 2009-06-23 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic component
US7667967B1 (en) * 2008-08-06 2010-02-23 Sun Microsystems, Inc. Liquid-cooled rack with optimized rack heat exchanger design for non-uniform power dissipation
US7804687B2 (en) * 2008-08-08 2010-09-28 Oracle America, Inc. Liquid-cooled rack with pre-cooler and post-cooler heat exchangers used for EMI shielding
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
WO2011045866A1 (ja) * 2009-10-16 2011-04-21 富士通株式会社 電子装置および複合電子装置
JP6127416B2 (ja) * 2012-09-07 2017-05-17 富士通株式会社 電子機器
JP6003423B2 (ja) * 2012-09-07 2016-10-05 富士通株式会社 冷却ユニット及び電子装置
JP2018186249A (ja) * 2017-04-27 2018-11-22 富士通株式会社 電子機器
CN107885295A (zh) * 2017-11-08 2018-04-06 北京图森未来科技有限公司 一种散热系统
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
US10925183B2 (en) * 2019-02-21 2021-02-16 Adlink Technology Inc. 3D extended cooling mechanism for integrated server
US11194371B2 (en) * 2019-05-17 2021-12-07 EKWB d.o.o. Liquid cooling system
US10925187B1 (en) * 2019-08-30 2021-02-16 Dell Products, L.P. Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment
US11178789B2 (en) * 2020-03-31 2021-11-16 Advanced Energy Industries, Inc. Combination air-water cooling device
US11785741B2 (en) * 2021-07-20 2023-10-10 Dell Products L.P. System and method for cooling a computing device
US20240032257A1 (en) * 2022-07-22 2024-01-25 Dell Products L.P. Inter-stage air-to-liquid radiator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108079U (ja) * 1983-01-11 1984-07-20 松下冷機株式会社 熱交換器
JPS60240987A (ja) * 1984-05-14 1985-11-29 Showa Alum Corp 板状フイン付熱交換器
JPH08213526A (ja) * 1994-10-31 1996-08-20 At & T Corp 回路パック
JP2001147085A (ja) * 1999-11-19 2001-05-29 Sanyo Electric Co Ltd 熱搬送装置
JP2001237582A (ja) * 1999-12-13 2001-08-31 Matsushita Electric Ind Co Ltd 放熱体およびこれを用いた冷却装置およびこの冷却装置を備えた電子機器
JP2002372360A (ja) * 2001-06-15 2002-12-26 Hitachi Ltd 冷却方式

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5131233A (en) * 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
JP2560559B2 (ja) 1991-04-05 1996-12-04 株式会社日立製作所 電子計算機
US5293930A (en) * 1992-09-24 1994-03-15 Hewlett-Packard Company Surface-to-air heat exchanger for electronic devices
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
JPH07321267A (ja) 1994-05-30 1995-12-08 Nec Corp 集積回路の冷却構造
US5647216A (en) * 1995-07-31 1997-07-15 The United States Of America As Represented By The Secretary Of The Navy High-power thermoacoustic refrigerator
EP0898220B1 (en) * 1997-08-19 2003-01-15 Hewlett-Packard Company, A Delaware Corporation Electronic apparatus with improved heatsink arrangement
US6038128A (en) * 1998-07-14 2000-03-14 Dell U.S.A., L.P. Computer and computer/docking assembly with improved internal cooling
US6377453B1 (en) * 1999-01-29 2002-04-23 Hewlett-Packard Company Field replaceable module with enhanced thermal interface
JP2001057492A (ja) * 1999-08-18 2001-02-27 Furukawa Electric Co Ltd:The 発熱素子を収納する筐体の冷却装置および冷却方法
US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
JP2002099356A (ja) * 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
US6418018B1 (en) * 2000-12-21 2002-07-09 Foxconn Precision Components Co., Ltd. Heat removal system
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US6496386B2 (en) * 2000-12-22 2002-12-17 Hewlett-Packard Company Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external environment
US6504719B2 (en) * 2001-03-30 2003-01-07 Intel Corporation Computer system that can be operated without a cooling fan
US6351381B1 (en) * 2001-06-20 2002-02-26 Thermal Corp. Heat management system
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
US6926070B2 (en) * 2002-03-22 2005-08-09 Intel Corporation System and method for providing cooling systems with heat exchangers
US6705089B2 (en) * 2002-04-04 2004-03-16 International Business Machines Corporation Two stage cooling system employing thermoelectric modules
US6771497B2 (en) * 2002-09-19 2004-08-03 Quanta Computer, Inc. Heat dissipation apparatus
JP2005228237A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108079U (ja) * 1983-01-11 1984-07-20 松下冷機株式会社 熱交換器
JPS60240987A (ja) * 1984-05-14 1985-11-29 Showa Alum Corp 板状フイン付熱交換器
JPH08213526A (ja) * 1994-10-31 1996-08-20 At & T Corp 回路パック
JP2001147085A (ja) * 1999-11-19 2001-05-29 Sanyo Electric Co Ltd 熱搬送装置
JP2001237582A (ja) * 1999-12-13 2001-08-31 Matsushita Electric Ind Co Ltd 放熱体およびこれを用いた冷却装置およびこの冷却装置を備えた電子機器
JP2002372360A (ja) * 2001-06-15 2002-12-26 Hitachi Ltd 冷却方式

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007272294A (ja) * 2006-03-30 2007-10-18 Nec Personal Products Co Ltd 冷却装置及び情報処理装置
KR20160082238A (ko) * 2013-10-31 2016-07-08 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 통합형 열 전달 유닛을 구비한 원심 팬
KR102277432B1 (ko) 2013-10-31 2021-07-13 마이크로소프트 테크놀로지 라이센싱, 엘엘씨 통합형 열 전달 유닛을 구비한 원심 팬

Also Published As

Publication number Publication date
US7280358B2 (en) 2007-10-09
GB2413439B (en) 2007-10-31
GB0506331D0 (en) 2005-05-04
US20050231910A1 (en) 2005-10-20
GB2413439A (en) 2005-10-26

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