JP2005303213A - 固体撮像装置 - Google Patents

固体撮像装置 Download PDF

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Publication number
JP2005303213A
JP2005303213A JP2004120953A JP2004120953A JP2005303213A JP 2005303213 A JP2005303213 A JP 2005303213A JP 2004120953 A JP2004120953 A JP 2004120953A JP 2004120953 A JP2004120953 A JP 2004120953A JP 2005303213 A JP2005303213 A JP 2005303213A
Authority
JP
Japan
Prior art keywords
solid
imaging device
state imaging
sealing resin
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004120953A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005303213A5 (enExample
Inventor
Kojiro Nakamura
浩二郎 中村
Takahiko Yagi
能彦 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2004120953A priority Critical patent/JP2005303213A/ja
Publication of JP2005303213A publication Critical patent/JP2005303213A/ja
Publication of JP2005303213A5 publication Critical patent/JP2005303213A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2004120953A 2004-04-16 2004-04-16 固体撮像装置 Pending JP2005303213A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004120953A JP2005303213A (ja) 2004-04-16 2004-04-16 固体撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004120953A JP2005303213A (ja) 2004-04-16 2004-04-16 固体撮像装置

Publications (2)

Publication Number Publication Date
JP2005303213A true JP2005303213A (ja) 2005-10-27
JP2005303213A5 JP2005303213A5 (enExample) 2007-04-26

Family

ID=35334319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004120953A Pending JP2005303213A (ja) 2004-04-16 2004-04-16 固体撮像装置

Country Status (1)

Country Link
JP (1) JP2005303213A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007099677A1 (ja) * 2006-03-03 2007-09-07 Sony Chemical & Information Device Corporation 機能素子実装モジュール及びその製造方法、これに用いる樹脂封止プレート、樹脂封止用基板構造体
JP2008226895A (ja) * 2007-03-08 2008-09-25 New Japan Radio Co Ltd 光半導体装置およびその製造方法
JP2011086789A (ja) * 2009-10-16 2011-04-28 Japan Radio Co Ltd 電子部品の実装構造及び実装方法
WO2015060345A1 (ja) * 2013-10-23 2015-04-30 京セラ株式会社 撮像素子搭載用基板および撮像装置
JP2017092320A (ja) * 2015-11-12 2017-05-25 旭化成エレクトロニクス株式会社 光センサ装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220115A (ja) * 1998-01-30 1999-08-10 Matsushita Electric Ind Co Ltd 固体撮像装置の製造方法
JP2002009265A (ja) * 2000-06-21 2002-01-11 Sony Corp 固体撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220115A (ja) * 1998-01-30 1999-08-10 Matsushita Electric Ind Co Ltd 固体撮像装置の製造方法
JP2002009265A (ja) * 2000-06-21 2002-01-11 Sony Corp 固体撮像装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007099677A1 (ja) * 2006-03-03 2007-09-07 Sony Chemical & Information Device Corporation 機能素子実装モジュール及びその製造方法、これに用いる樹脂封止プレート、樹脂封止用基板構造体
JP2008226895A (ja) * 2007-03-08 2008-09-25 New Japan Radio Co Ltd 光半導体装置およびその製造方法
JP2011086789A (ja) * 2009-10-16 2011-04-28 Japan Radio Co Ltd 電子部品の実装構造及び実装方法
WO2015060345A1 (ja) * 2013-10-23 2015-04-30 京セラ株式会社 撮像素子搭載用基板および撮像装置
JP5988412B2 (ja) * 2013-10-23 2016-09-07 京セラ株式会社 撮像素子搭載用基板および撮像装置
JP2017092320A (ja) * 2015-11-12 2017-05-25 旭化成エレクトロニクス株式会社 光センサ装置

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