JP2005302605A5 - - Google Patents

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Publication number
JP2005302605A5
JP2005302605A5 JP2004119250A JP2004119250A JP2005302605A5 JP 2005302605 A5 JP2005302605 A5 JP 2005302605A5 JP 2004119250 A JP2004119250 A JP 2004119250A JP 2004119250 A JP2004119250 A JP 2004119250A JP 2005302605 A5 JP2005302605 A5 JP 2005302605A5
Authority
JP
Japan
Prior art keywords
cover
substrate
semiconductor device
disposed
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004119250A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005302605A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004119250A priority Critical patent/JP2005302605A/ja
Priority claimed from JP2004119250A external-priority patent/JP2005302605A/ja
Priority to US11/100,578 priority patent/US20050230679A1/en
Publication of JP2005302605A publication Critical patent/JP2005302605A/ja
Publication of JP2005302605A5 publication Critical patent/JP2005302605A5/ja
Pending legal-status Critical Current

Links

JP2004119250A 2004-04-14 2004-04-14 半導体装置 Pending JP2005302605A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004119250A JP2005302605A (ja) 2004-04-14 2004-04-14 半導体装置
US11/100,578 US20050230679A1 (en) 2004-04-14 2005-04-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004119250A JP2005302605A (ja) 2004-04-14 2004-04-14 半導体装置

Publications (2)

Publication Number Publication Date
JP2005302605A JP2005302605A (ja) 2005-10-27
JP2005302605A5 true JP2005302605A5 (enExample) 2007-02-15

Family

ID=35095377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004119250A Pending JP2005302605A (ja) 2004-04-14 2004-04-14 半導体装置

Country Status (2)

Country Link
US (1) US20050230679A1 (enExample)
JP (1) JP2005302605A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287669A (ja) * 2006-03-23 2007-11-01 Canon Inc 有機発光装置及び有機発光装置の製造方法
JP5593630B2 (ja) * 2009-04-01 2014-09-24 セイコーエプソン株式会社 有機ｅｌ装置および電子機器
KR101399779B1 (ko) 2011-06-09 2014-05-27 주식회사 엘지화학 유기발광소자 및 이를 포함하는 발광장치
JP2020098757A (ja) * 2018-12-19 2020-06-25 旭化成エレクトロニクス株式会社 赤外線発光装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW354380B (en) * 1995-03-17 1999-03-11 Hitachi Ltd A liquid crystal device with a wide visual angle
US6174974B1 (en) * 1996-07-05 2001-01-16 Bayer Aktiengesellschaft Method for producing thermoplastic elastomers
JP2000133439A (ja) * 1998-10-22 2000-05-12 Minolta Co Ltd 有機電界発光素子の製造方法及び有機電界発光素子
JP3652898B2 (ja) * 1998-11-19 2005-05-25 株式会社日立製作所 液晶表示装置
US6383664B2 (en) * 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
WO2001018886A2 (de) * 1999-09-09 2001-03-15 Siemens Aktiengesellschaft Organische lichtemittierende diode und herstellungsverfahren
JP2001265251A (ja) * 2000-03-17 2001-09-28 Minolta Co Ltd 表示素子及び積層型表示素子
US6515310B2 (en) * 2000-05-06 2003-02-04 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and electric apparatus
US6717361B2 (en) * 2000-10-11 2004-04-06 Mrm Acquisitions, Llc Membranous EL system in UV-cured urethane envelope
US7178927B2 (en) * 2000-11-14 2007-02-20 Semiconductor Energy Laboratory Co., Ltd. Electroluminescent device having drying agent
US6686642B2 (en) * 2001-06-11 2004-02-03 Hewlett-Packard Development Company, L.P. Multi-level integrated circuit for wide-gap substrate bonding
JP2003086356A (ja) * 2001-09-06 2003-03-20 Semiconductor Energy Lab Co Ltd 発光装置及び電子機器
JP2003051383A (ja) * 2001-08-07 2003-02-21 Matsushita Electric Ind Co Ltd Ｏｌｅｄディスプレイ
JP4010845B2 (ja) * 2002-03-28 2007-11-21 富士フイルム株式会社 発光素子
JP2003308977A (ja) * 2002-04-12 2003-10-31 Morio Taniguchi 有機エレクトロルミネッセンス発光装置とその製造方法
US6949389B2 (en) * 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
JP2004103337A (ja) * 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
US6822326B2 (en) * 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
TW569477B (en) * 2002-11-19 2004-01-01 Au Optronics Corp Active matrix organic light emitting diode display and fabricating method thereof
US20040114085A1 (en) * 2002-12-16 2004-06-17 Toppoly Optoelectronics Corp., Liquid crystal display device
JP4449341B2 (ja) * 2003-05-16 2010-04-14 カシオ計算機株式会社 封止構造
US6953891B2 (en) * 2003-09-16 2005-10-11 Micron Technology, Inc. Moisture-resistant electronic device package and methods of assembly

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