JP2005298859A - Electroforming mold for spiral contactor and method for manufacturing spiral contactor using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroforming mold for spiral contactors in which holding sheets are surely stuck to the supporting sections of individual spiral contactors and a method for manufacturing the spiral contactors using the same. <P>SOLUTION: A side wall member 14 and a partition member 16 are disposed to project in a Z1 direction from an underlying section 10a of the electroforming mold 10 and therefore, plate thickness dimensions h of a plating layer 41 forming the supporting section 21 are formed between the surface of the partition plate member 16 and the top end of the sidewall member 14, and thereby an adhesive layer 52 of the holding sheet 50 can be put into a state apart from the partition plate member 16 when the holding sheet 50 is stuck to the supporting section 21. Consequently, the holding sheet 50 can surely fix only the supporting section 21 and therefore the peeling of the spiral contactor can be surely performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a spiral contactor manufacturing method for making electrical connection by contacting an external contactor such as LGA or BGA provided on an electronic component such as an IC (integrated circuit), and the manufacturing process is particularly easy. In addition, the present invention relates to an electroforming mold for a spiral contact and a method for manufacturing a spiral contact using the same.

  For example, the following patent document 1 exists as prior art relating to the spiral contact, and FIGS. 37 to 40 of the patent document 1 disclose a method for manufacturing the spiral contact.

  FIG. 11 is a process diagram showing a manufacturing method described in FIG. 37 in Patent Document 1 as an example of a manufacturing method of a conventional spiral contactor.

  As shown in FIG. 11, in step a, copper plating 3 is applied to the SUS thin plate 2, and a resist film 5 is pasted thereon. In step b, baking and development are performed to form a concave groove portion imitating the shape of the spiral contact 1 on the resist film 5. In step c, nickel plating 6 is applied thereon. In step d, the resist film 5 is removed with a chemical (solvent). In step e, the resist film 5 is applied with a thickness of 50 μm. In step f, the resist film 5 is baked and developed to form the guide frame 7. In step g, after the SUS thin plate 2 is peeled off and removed, the copper plating 3 is removed by etching.

  In the conventional manufacturing method, the spiral contact is manufactured through the steps a to g.

  As another manufacturing method, a method of manufacturing a spiral contact using a general mold is also conceivable.

  FIG. 12 is a process diagram for manufacturing a spiral contact using a general mold. A shows a state in which plating is grown in the mold, and B shows a state in which a holding sheet is attached. In FIG. 12, a part of the mold is shown enlarged.

  As shown in FIG. 12A, in this manufacturing method, a mold having a groove 8a for forming a spiral contact piece of a spiral contact and a groove 8b for forming a support part for supporting the contact piece. 8 is used. The groove 8a has a spiral shape, and the groove 8b has a frame shape. In the mold 8, a plurality of grooves 8a and grooves 8b are regularly arranged in a matrix.

As shown in FIG. 12A, when the mold 8 is dipped in an electrolytic solution and electroplated to grow nickel plating, a spiral contact piece 1a is formed in the groove 8a, and the groove The spiral contact 1 is formed by forming the frame-shaped support portion 1b within 8b. Then, as shown in FIG. 12B, a contact sheet in which the plurality of spiral contacts 1 are fixed to the holding sheet 9 is formed by attaching an adhesive layer of the holding sheet 9 to the surface of the support portion 1b.
JP 2002-175859 A

  However, in the conventional method of manufacturing a spiral contact, the step a in which the SUS thin plate 2 is subjected to the copper plating 3 and the resist film 5 is pasted thereon before the step c in which the spiral contact 1 is formed by the nickel plating 6. And the step b of forming a groove for forming the spiral contact 1 in the resist film 5 by baking and development. Moreover, after the step c, a step d for removing the resist film 5 with a chemical (solvent), a step g for removing the copper plating 3 by etching after peeling off the SUS thin plate 2, and the like are necessary. For this reason, the process for manufacturing the spiral contact 1 is complicated, and it is difficult to shorten the manufacturing time.

  Furthermore, since other materials such as a copper plating 3, a resist film 5, a solvent, and an etching agent are required to form the spiral contact 1, there is a problem that it is difficult to reduce the manufacturing cost.

  Further, in the manufacturing method using the above general mold, when the adhesive sheet of the holding sheet 9 adheres to the surface of the mold 8 when the holding sheet 9 is bonded to the support portion 1b, the spiral contact 1 is attached to the mold. Therefore, it is necessary that the adhesive layer does not adhere to the surface of the mold 8. For this purpose, the surface of the plating is formed so as to slightly protrude from the surface of the mold 8, and the adhesive layer of the holding sheet 9 and the surface of the mold 8 are bonded during the operation of attaching the holding sheet 9. It is easy means to form a gap between them.

  Here, FIG. 13 is a process diagram showing a state in which plating is further grown from the state of FIG. 12B.

  However, as shown in FIG. 13, with such a means, the plated portion protruding from the surface of the mold 8 spreads in an umbrella shape on the surface of the mold. For this reason, since the thickness of the plating of the contact piece 1a and the shape of the contact piece 1a itself are likely to vary, the physical properties of the spiral contact 1 as the contact piece 1a, particularly the spring constant, differ from part to part. There is a problem that a spiral contact with high accuracy cannot be manufactured. Furthermore, since the adhesive force of the adhesive layer becomes weak in the umbrella-shaped support portion, there is a problem that the spiral contact 1 is easily peeled off from the holding sheet 9.

  The present invention is for solving the above-described conventional problems, so that spiral contacts can be formed with high accuracy, and a holding sheet for fixing a plurality of spiral contacts can be securely attached. An object of the present invention is to provide an electroformed mold for a spiral contact.

  Another object of the present invention is to provide a method of manufacturing a spiral contact using the electroformed mold, which can be manufactured in a short time by a simple manufacturing process and can reduce the manufacturing cost.

The present invention has a base part on which plating is electrodeposited, a side wall member that partitions the base part in a spiral shape, and a partition member that is arranged so as to surround the outer periphery of the side wall member,
The side wall member and the partition member are provided so as to protrude from the base portion.

  In the above, when the base portion is used as a reference plane, the height dimension of the side wall member from the reference plane is set higher than the height dimension from the reference plane to the surface of the partition member. preferable.

  In the electroforming mold of the present invention, it is possible to expose a plating layer formed using the electroforming mold, particularly a plating layer formed as a support portion of the spiral contactor, on the surface (underlying part) of the mold. Become. Therefore, the operation of attaching the holding sheet to the support portion can be reliably performed, and the operation of peeling the spiral contact from the electroforming mold can be facilitated.

  In addition, a concave groove portion is formed in the base portion, the partition member is provided in the groove portion, and a fitting groove into which the side wall member is fitted is formed in the base portion. It can be configured.

  In the above, it is preferable that the side wall member is formed of an insulating material, or a surface of a conductive material is coated with a water repellent material, and the partition member is formed of an insulating material or formed on the surface of the conductive material. Those coated with a water repellent material are preferred.

  In this case, the side wall member and the partition member can be formed integrally.

  Fluorine can be used as the insulating material, and further fluorine can be used as the water repellent material.

  Furthermore, in the above, what has the peeling layer formed in the surface of the said base part is preferable, and chromic acid or potassium permanganate can be used as said peeling layer.

Further, the present invention is a method of manufacturing a spiral contact using the electroforming mold described in any of the above, at least,
(A) a step of forming a release layer on the base portion which is the surface of the electroforming mold;
(B) Electroplating a spiral contactor provided with a contact piece and a support on the electroforming mold; and
(C) a step of attaching a holding sheet to the surface of the support part;
(D) peeling the spiral contact from the electroformed mold;
It is characterized by having.

  In the manufacturing method of the present invention, a spiral contact with high dimensional accuracy can be manufactured by using an electroforming mold. Moreover, since an electroforming mold can be used repeatedly, manufacturing cost can be reduced.

  Furthermore, the number of manufacturing steps can be reduced and facilitated, and the time required for manufacturing can be shortened.

  Between the step (a) and the step (b), a step of fitting the side wall member into the fitting groove may be included.

  The means is a step necessary when the side wall member and the partition member are formed separately, and by performing this step after forming a release layer in the fitting groove, the fitting groove and It is possible to effectively prevent the electrolyte from penetrating into the gap between the side wall member.

  When the plate thickness dimension h of the support part formed in the step (b), the height dimension H1 from the base part to the surface of the partition member, and the height dimension of the side wall member from the base part are H2. Further, it is preferable that the plate thickness dimension h is formed in the range of H1 <h <H2.

  In the above, since the plating layer formed as the support portion of the spiral contact can be formed higher than the surface of the partition member, when the holding sheet is attached to the support portion, the adhesive layer of the holding sheet is It can be set as the state separated from the partition member, and only the said support part can be fixed reliably. Therefore, the spiral contact can be reliably peeled off.

  In the present invention, an electroforming mold capable of manufacturing a highly accurate spiral contact can be provided.

Further, the spiral contact after the plating is generated can be easily peeled from the electroforming mold.
Further, since the electroforming mold can be used repeatedly, the manufacturing cost can be reduced.

  In addition, the manufacturing process can be simplified and the time required for manufacturing can be shortened.

  FIG. 1 is a plan view partially showing an electroforming mold of the present invention, FIG. 2 is an enlarged plan view showing a part of the electroforming mold of FIG. 1, and FIG. 3 is a first embodiment of the electroforming mold. Fig. 2 is a cross-sectional view taken along line 3-3, and Fig. 4 is a cross-sectional view similar to Fig. 3 as the second embodiment of the electroforming mold.

  The electroformed mold 10 shown in FIG. 1 is formed of a conductive material, and a plurality of pattern portions 13, 13,... Are regularly formed in a matrix in the vertical and horizontal directions (XY directions) on the surface. .

  As shown in FIGS. 2 to 4, a spiral side wall member 14 is formed in the pattern portion 13 so as to protrude from the base portion 10 a which is the surface of the electroforming mold 10 in the Z1 direction.

  FIG. 3 shows a first embodiment in which the electroforming mold 10 and the side wall member 14 are integrally formed. In the first embodiment, the surface of the side wall member 14 formed of a conductive material such as metal is coated with an insulating material that is difficult to be plated. In this case, as the insulating material, for example, a fluororesin can be used.

  FIG. 4 shows a second embodiment in which the electroforming mold 10 and the side wall member 14 are formed separately. In the second embodiment, a spiral fitting groove 10b is formed in the pattern portion 13 of the base portion 10a in advance, and the Z2 side of the spiral side wall member 14 is formed in the fitting groove 10b. The lower end 14a is fitted in a positioned state. The gap between the lower end portion 14a of the side wall member 14 and the fitting groove 10b is very small.

  In the second embodiment, the side wall member 14 is formed of an insulating material such as a synthetic resin that is not electrodeposited by plating. Alternatively, when synthetic resins cannot be used due to problems such as durability and chemical resistance, the surface of a conductive material such as a metal formed in a spiral shape is coated with a water repellent material such as fluorine. May be.

  As shown in FIGS. 1 to 4, a groove portion 10 c that is recessed from the base portion 10 a to the Z <b> 2 side is provided between the adjacent pattern portions 13. As shown in FIG. 1, the groove 10c has a lattice shape.

  As shown in FIGS. 2 to 4, the groove portion 10 c is provided with a partition member 16 formed in a planar lattice shape. Therefore, the adjacent pattern portion 13 and the pattern portion 13 are separated by the groove portion 10 c and the partition member 16. The partition member 16 is formed by coating a surface of an insulating material such as synthetic resin or a conductive material such as metal with a water repellent material such as fluorine. In FIG. 1, the partition member 16 is omitted.

  Here, the side wall member 14 and the partition member 16 can be formed of the same material. Therefore, in the second embodiment shown in FIG. 4, the side wall member 14 and the partition member 16 can be integrally formed via the connecting portion 15, and the partition member 16 in this case is the side wall. It is described as a guide frame that holds the member 14. In addition, the connection part 15 is also shown in FIG.

  As shown in FIGS. 3 and 4, in the electroforming mold 10, when the base portion 10a is used as a reference plane, the height dimension H1 of the side wall member 14 from the reference plane in the Z1 direction is the reference standard. It is formed to be higher in the Z1 direction than the height dimension H2 from the surface to the surface of the partition member 16 (H1> H2).

Below, the manufacturing method of the spiral contactor using the said electroforming metal mold | die is demonstrated.
FIG. 5 is a plan view showing a spiral contact, FIGS. 6 to 10 are process diagrams showing a manufacturing method of the spiral contact, and FIG. 6 is a process of forming a release layer by coating an electroforming mold. Is a process of attaching the side wall member and the partition member to the electroforming mold, FIG. 8 is a process of plating the electroforming mold, FIG. 9 is a process of attaching a holding sheet to the support portion of the spiral contact, and FIG. 10 is an electroforming mold. The process of peeling a spiral contactor from is shown. In FIG. 6 and subsequent figures, the case where the electroforming mold (see FIG. 4) shown in the second embodiment is mainly used will be described.

  FIG. 5 shows one of a plurality of spiral contacts 20 manufactured by the manufacturing method of FIGS. The spiral contact 20 has a structure having a frame-like support portion 21 provided on the outer peripheral side and a contact piece 22 provided therein. The contact piece 22 is formed integrally with the support portion 21 and extends spirally or spirally from the winding start end 22a on the outer peripheral side toward the winding end 22b on the inner peripheral center side. The contact piece 22 is supported in a cantilevered manner with respect to the support portion 21 on the winding start end 22a side, and can be elastically deformed in a normal direction perpendicular to the paper surface. 6 to 10 below, in the spiral contactor manufacturing method, a large number of spiral contactors 20 are formed in a matrix on the holding sheet.

  In the first step shown in FIG. 6, a thin release layer 31 is coated on the surface of the base portion 10 a of the electroforming mold 10. As the coating material for forming the release layer 31, for example, chromic acid or potassium permanganate can be used, and the thickness of the release layer 31 is preferably about 20 Å.

  In the coating, a release layer is inevitably formed inside the fitting groove 10b and the groove portion 10c.

  In the second step shown in FIG. 7, the side wall member 14 is fitted in the fitting groove 10b while being positioned, and the partition member 16 is fitted in the groove 10c. In addition, when the said side wall member 14 and the partition member 16 are integrally molded, both are attached together. When the side wall member 14 is formed integrally with the electroforming mold 10 as in the electroforming mold 10 (see FIG. 3) shown in the first embodiment, the partitioning is performed in the second step. Only the member 16 is fitted into the groove 10c.

  In the third step shown in FIG. 8, a nickel plating layer 41 is electrodeposited on the base portion 10a of the electroforming mold 10 by electroplating. As the electroplating method, the cathode side is an electroformed mold 10 and electricity is supplied using a nickel electrode on the anode side, or the electroformed mold 10 is used as a cathode side in nickel electrolyte and electricity is supplied from the anode electrode side. Any of the methods can be used.

  At this time, the nickel plating layer 41 formed in the side wall member 14 becomes the contact piece 22 of the spiral contact 20, and the nickel plating layer 41 formed between the outer surface of the side wall member 14 and the partition member 16. Becomes the support portion 21 of the spiral contact 20. The plate thickness dimension h in the stacking direction of the plating layer 41 is higher than the height dimension H1 of the side wall member 14 from the reference surface (base portion 10a), and the height from the reference surface to the surface of the partition member 16 is high. It is formed in a range less than the dimension H2 (H1 <h <H2).

  In the third step, the plate thickness dimension h of the plating layer 41 can be formed uniformly by changing the growth rate of plating by managing the magnitude of the current, the electrodeposition time, and the like. Therefore, it is possible to provide the spiral contactor 20 having uniform physical properties such as a spring constant and high accuracy.

  Here, since at least the surface of the partition member 16 is formed of an insulating material, the plating layer 41 can be prevented from being formed on the surface of the partition member 16. Alternatively, as shown in FIG. 8, even if the plating layer 41 is formed, the edge of the support portion 21 partially overlaps, and the plating layer 41 is formed on the entire surface of the partition member 16. There is no. For this reason, it can prevent that the support parts 21 of the spiral contactor 20 are connected between the adjacent pattern parts 13. That is, the individual spiral contacts 20 can be formed in an electrically insulated state.

  In the case of the side wall member 14 shown in the second embodiment, the electrolytic solution of plating permeates into a minute gap between the lower end portion 14a of the side wall member 14 and the fitting groove 10b by a capillary phenomenon. In general, the side wall member 14 is formed of an insulating material as in the present invention, or the surface of the conductive material is coated with a water-repellent material, so that the electrolyte can be infiltrated as described above. It is possible to prevent. Note that this point is the same in the relationship between the groove 10c and the partition member 16, and it is possible to prevent infiltration of the electrolyte in the gap between the groove 10c and the partition member 16.

  For this reason, it can prevent that the adjacent contact pieces 22 and the support parts 21 are formed in the state connected with plating.

  In the fourth step shown in FIG. 9, an operation of attaching the holding sheet 50 to the surface of the plating layer 41 that becomes the support portion 21 of the spiral contact 20 is performed. In the holding sheet 50, a plurality of openings 51 are formed in a matrix. The holding sheet 50 is attached in a state where the side wall member 14 is positioned inside the opening 51 and positioned so that the side wall member 14 does not contact the inner edge of the opening 51. Then, an adhesive layer 52 provided near the inner edge of the opening 51 is attached to the surface of the support portion 21 of the spiral contactor 20. Through this step, the plurality of spiral contacts 20 are fixed to the holding sheet 50.

  Here, as described above, the plate thickness dimension h of the plating layer 41, the height dimension H1 of the side wall member 14 from the reference surface (base portion 10a), and the height dimension H2 from the reference surface to the surface of the partition member 16 are as follows. The relationship of H1 <h <H2. For this reason, the adhesive layer 52 of the holding sheet 50 can hold only the support portion 21 without sticking to the surfaces of the electroforming mold 10 and the partition member 16. Moreover, since the support portion 21 and the contact piece 22 can be formed on a uniform plane, the adhesive force of the adhesive layer 52 to the support portion 21 does not decrease.

  In the fifth step shown in FIG. 10, a peeling operation for removing the holding sheet 50 having the plurality of spiral contacts 20 from the electroforming mold 10 is performed. In the fifth step, since the adhesive layer 52 of the holding sheet 50 is separated from the surface of the partition member 16, the peeling operation can be performed smoothly.

  As described above, in the present invention, by using the electroformed mold 10, the highly accurate spiral contact 20 can be formed.

  In addition, the electroforming mold 10 can be used repeatedly, and it becomes possible to reduce the use of materials other than nickel for directly producing spiral contacts such as copper plating and resist film as in the prior art. Can be reduced.

  In addition, since the number of manufacturing steps can be reduced, the manufacturing steps can be facilitated and the time required for manufacturing can be shortened.

The top view which shows partially the electroforming metal mold | die of this invention, FIG. 1 is an enlarged plan view showing a part of the electroforming mold of FIG. FIG. 2 is a cross-sectional view taken along line 3-3 as the first embodiment of the electroforming mold; Sectional view similar to FIG. 3 as the second embodiment of the electroforming mold, A plan view showing a spiral contact, It is a process diagram showing a manufacturing method of a spiral contact, a process of forming a release layer by coating an electroforming mold, It is process drawing which shows the manufacturing method of a spiral contactor, and the process of attaching a side wall member and a partition member to an electroforming mold, It is process drawing which shows the manufacturing method of a spiral contactor, the process of plating an electroforming mold, It is a process diagram showing a manufacturing method of a spiral contact, a process of attaching a holding sheet to the support portion of the spiral contact, It is a process diagram showing a manufacturing method of the spiral contact, the process of peeling the spiral contact from the electroforming mold, As an example of a conventional spiral contactor manufacturing method, a process diagram showing the manufacturing method described in FIG. Process diagram showing a spiral contactor manufacturing method using a general mold, FIG. 12B is a process diagram showing a state where the plating is further grown from the state of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electroforming metal mold | die 10a Base part 10b Fitting groove 10c Groove part 13 Pattern part 14 Side wall member 15 Connection part 16 Partition member 20 Spiral contactor 21 Support part 22 Contact piece 31 Peeling layer 41 Plating layer (nickel plating layer)
50 Holding sheet 52 Adhesive layer

Claims (14)

In electroforming molds for forming plating into a spiral shape,
A base portion on which plating is electrodeposited, a side wall member that partitions the base portion into a spiral shape, and a partition member that is disposed so as to surround an outer periphery of the side wall member,
An electroforming mold for a spiral contact, wherein the side wall member and the partition member are provided so as to protrude from the base portion.   The height dimension of the side wall member from the said reference surface is set higher than the height dimension from the said reference surface to the surface of the said partition member when the said base part is made into a reference surface. Electroforming mold for spiral contacts.   The electroforming mold for a spiral contact according to claim 1 or 2, wherein a concave groove is formed in the base portion, and the partition member is provided in the groove.   The electroforming mold for spiral contacts according to any one of claims 1 to 3, wherein a fitting groove into which the side wall member is fitted is formed in the base portion.   5. The electroforming mold for a spiral contact according to claim 1, wherein the side wall member is formed of an insulating material, or a surface of a conductive material is coated with a water repellent material.   The electroforming mold for spiral contacts according to any one of claims 1 to 4, wherein the partition member is formed of an insulating material, or a surface of a conductive material is coated with a water repellent material.   The electroforming mold for spiral contacts according to any one of claims 1 to 6, wherein the side wall member and the partition member are integrally formed.   The electroforming mold for spiral contacts according to claim 5 or 6, wherein fluorine is used as the insulating material.   The electroforming mold for spiral contacts according to claim 5 or 6, wherein fluorine is used as the water repellent material.   The electroforming mold for spiral contacts according to any one of claims 1 to 4, wherein a release layer is formed on a surface of the base portion.   The electroforming mold for spiral contacts according to claim 10, wherein chromic acid or potassium permanganate is used as the release layer. A method of manufacturing a spiral contact using the electroformed mold according to any one of claims 1 to 11, comprising at least:
(A) a step of forming a release layer on the base portion which is the surface of the electroforming mold;
(B) Electroplating a spiral contactor provided with a contact piece and a support on the electroforming mold; and
(C) a step of attaching a holding sheet to the surface of the support part;
(D) peeling the spiral contact from the electroformed mold;
A process for producing a spiral contact, comprising:   The manufacturing method of the spiral contactor of Claim 12 which has the process of fitting the said side wall member in the said fitting groove between the said process (a) and a process (b).   When the plate thickness dimension h of the support part formed in the step (b), the height dimension H1 from the base part to the surface of the partition member, and the height dimension of the side wall member from the base part are H2. The method for manufacturing a spiral contact according to claim 12 or 13, wherein the thickness h is in the range of H1 <h <H2.

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