JP3270948B2 - Nickel laminate and method for producing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nickel laminate having good adhesion, which is suitably used for components requiring vibration resistance, such as a nozzle diaphragm for an ink jet, and a jig for inserting a chip for an electronic component. And its manufacturing method.

[0002]

2. Description of the Related Art Conventionally, for example, an ink jet nozzle diaphragm is generally manufactured by etching. At the time of the etching, as shown in FIG.
Polyimide 11 on the back side of S material 10 (15-20μ thick)
Then, a resist film 12 is patterned on the surface of the SUS material 10 as shown in FIG.
Next, an etching process is performed as shown in FIG.
Finally, as shown in FIG. 1D, the resist film 12 is removed to obtain an ink jet nozzle diaphragm 13 (literature unknown).

[0003]

However, when the polyimide 11 is used as the base material, the durability is inferior to the metal and the adhesion to the SUS material 10 is not so good. In addition, sagging easily occurs during etching, and it is difficult to obtain a highly accurate shape. Therefore, the present inventors have excellent durability,
Also, in order to obtain a high-precision nozzle diaphragm for inkjet, we tried to make it by nickel electroforming. 1st nickel layer as base material in normal bright nickel bath
After forming a photoresist film on the surface of the first nickel layer by patterning, a second nickel layer is formed on the surface of the first nickel layer which is not covered with the photoresist film. It is an attempt to cast.

[0004] However, the first nickel layer and the second nickel layer were difficult to adhere to each other and were easily peeled off. It was confirmed that this was caused by electroforming the first nickel layer as a base material in a bright nickel bath. The reason for this is not clear, but one of the reasons is that when the first nickel layer of the base material is first electroformed in a nickel sulfamate bath to which butynediol or a brightener such as saccharin or NTS is added. Since the first nickel layer contains a large amount of sulfur or carbon, an oxide film may be formed on the surface between the first electroforming and the second electroforming, or a chemical such as an alkali developing solution may adhere. Changes the surface condition of the first nickel layer. Therefore, it is considered that the second nickel layer hardly adheres compositionally to the surface of the first nickel layer. In addition, it is conceivable that the crystal on the glossy surface of the first nickel layer becomes dense, so that the second nickel layer is hardly physically adhered.

[0005] The present invention has been made in view of the above points, and an object of the present invention is to provide a nickel laminate having excellent adhesion between nickel layers and a method for producing the same.

[0006]

A nickel laminate according to the present invention is obtained by subjecting a second nickel layer 2 having a predetermined pattern to the surface of a first electroformed first nickel layer 1 by a second electroforming method. The first nickel layer 1 is formed of dull nickel to which no brightener is added.

In producing the nickel laminate of the present invention, a step of primary electroforming the first nickel layer 1 on the surface of the electroformed mold 3 with a matte nickel bath, A step of patterning the photoresist film 6 and a step of second electroforming the second nickel layer 2 on the surface of the first nickel layer 1 which is not covered with the photoresist film 6;
Peeling the first nickel layer 1 together with the second nickel layer 2 from the electroformed mold 3.

It is important that the first nickel layer 1
Is formed by matte nickel electroforming, and it is optional whether the second nickel layer 2 is formed by electroforming of bright nickel or matte nickel. Here, the dull nickel without adding a brightener means that the brightener is not intentionally added after the building bath. When carbon is contained as an impurity in the bath, the allowable range is 0.012% or less. I do.
If it is contained more, good adhesion cannot be obtained as in the case of forming the first nickel layer with bright nickel.

[0009]

The first nickel layer 1 electroformed with matte nickel
The crystal of the surface is coarser and satin-like than that formed of bright nickel, and the second nickel layer 2 is likely to be physically and strongly adhered. Further, when the first nickel layer 1 is electroformed with matte nickel, the content of carbon and sulfur is small or not contained at all, so that the surface state of the first nickel layer 1 is little changed, and the composition is also low. The adhesion to the second nickel layer 2 can be increased.

[0010]

FIG. 1 shows a nickel laminate to which the present invention is applied. A nickel laminate having a predetermined pattern is laminated on the surface of a first nickel layer 1 serving as a base material.
An example of the electroforming method of such a nickel laminate will be described with reference to FIGS. First, the electroformed mold 3 is immersed in an electrolytic solution of a matte nickel bath to perform primary electroforming on the surface of the mold 3. The composition and plating conditions of this matte nickel bath are shown below. Nickel sulfamate 450 g / l Boric acid 30 g / l pH 4 to 4.5 Bath temperature 50 ° C. Current density 2 A / dm ^{2 to} 7 A / dm ² By performing electroforming in a bath, the (A) in FIG. As shown in FIG. 1, the first nickel layer 1 is formed on the surface of the electroformed mold 3. The thickness of the first nickel layer 1 is, for example, about 15 μ.

Then, the electroformed mold 3 provided with the first nickel layer 1 is lifted from the bath, and a negative type photoresist 4 is uniformly formed on the surface of the first nickel layer 1 as shown in FIG. Apply and dry or laminate. Next, a negative type film 5 corresponding to a desired pattern is brought into close contact with the resist 4 as shown in FIG. 4C, and each process of baking and development is performed to obtain a desired film as shown in FIG. A patterned photoresist film 6 is formed. Of course, the photoresist 4 may be of a positive type instead of the negative type.

Next, the electroformed mold 3 on which the photoresist film 6 is formed is transferred to a bright nickel bath and subjected to secondary electroforming. The composition and plating conditions of this bright nickel bath are shown below. Nickel sulfamate 450 g / l Butynediol 0.005 to 0.01 g / l NTS 0.01 to 0.05 g / l Boric acid 30 g / l pH 4 to 4.5 Bath temperature 50 ° C or higher Bath current density 2A By performing electroforming at / dm ^{2 to} 7 A / dm ² , the second nickel layer 2 is formed on the surface of the first nickel layer 1 which is not covered with the photoresist film 6 as shown in FIG. I do. The thickness of the second nickel layer 2 is about 30 μ.

After the electroforming of the second nickel layer 2, the photoresist film 6 is removed, and the first nickel layer 1 and the second nickel layer 2 are separated from the electroforming mold 3 as shown in FIG. I do. Thus, a nickel laminate electroformed product as shown in FIG. 2G and FIG. 2 is obtained.

The adhesion strength between the first and second nickel layers 1 and 2 of the thus obtained nickel laminate was tested. That is, when vibration was applied to the nickel laminate, the second nickel layer 2 such as a laminate of a first nickel layer and a second nickel layer formed of bright nickel was formed on the first nickel layer.
There was no peeling off from the nickel layer 1 and it was completely adhered. In addition, the nickel laminate is transferred to the first nickel layer 1.
It was bent to the side and a peeling stress was applied to one end between the first and second nickel layers 1 and 2, but there was no peeling of the joint as shown in FIG. Unlike the joint portion C of the first nickel layer 1 with the second nickel layer 2, a portion D of the exposed surface portion of the first nickel layer 1 which is not covered with the second nickel layer 2 is torn off. A broken state was recognized, and it was clearly understood how strongly the nickel layers 1 and 2 were closely adhered to each other.

The second nickel layer 2 is excellent in adhesion to the first nickel layer 1 when formed by electroforming either bright nickel or dull nickel. Is electroformed in a bright nickel bath to which butyne diol is added, the second nickel layer 2 containing sulfur becomes the first nickel layer 1 containing no sulfur in a corrosive environment.
Acts as an anode, and the corrosion stops at the second nickel layer 2, so that the corrosion resistance can be improved.

The second nickel layer 2 is usually formed at a current density of about ² to 7 A / dm ^{2 as} described above, but is preferably formed at a low current density of 0.5 to 1 A / dm ² . If the two nickel layers 2 are formed, the electrodeposition time is long, but the affinity with the first nickel layer 1 is improved, and better adhesion is obtained.

[0017]

According to the present invention, a first nickel layer 1 having a predetermined pattern is formed on the surface of a first nickel layer 1 which has been electroformed. Since it is formed of matte nickel without adding a brightener, a nickel laminate excellent in adhesion can be obtained,
For example, it can be suitably used for components that require vibration resistance, such as an inkjet nozzle diaphragm.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a nickel laminate with a part cut away.

FIG. 2 is an electroforming process chart of a nickel laminate.

FIG. 3 is a partial perspective view showing a state where the adhesion strength of the nickel laminate is tested.

FIG. 4 is an etching process diagram of an inkjet nozzle diaphragm by a conventional etching method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st nickel layer 2 2nd nickel layer 3 Electroforming mold 6 Photoresist film

Claims (2)

(57) [Claims] 1. A second nickel layer 2 having a predetermined pattern is secondarily electroformed on the surface of the first electroformed first nickel layer 1, and the first nickel layer 1 has no brightener. A nickel laminate formed of bright nickel. 2. A step of primary electroforming the first nickel layer 1 on the surface of the electroformed mold 3 in a matte nickel bath, and a step of forming a photoresist film 6 on the surface of the first nickel layer 1 by patterning. A step of secondary electroforming the second nickel layer 2 on the surface of the first nickel layer 1 which is not covered with the photoresist film 6; and converting the first nickel layer 1 from the electroforming matrix 3 to the second nickel layer 2. And a step of peeling off each other.