JP2005296981A - シート状ワークのレーザ加工機 - Google Patents
シート状ワークのレーザ加工機 Download PDFInfo
- Publication number
- JP2005296981A JP2005296981A JP2004114508A JP2004114508A JP2005296981A JP 2005296981 A JP2005296981 A JP 2005296981A JP 2004114508 A JP2004114508 A JP 2004114508A JP 2004114508 A JP2004114508 A JP 2004114508A JP 2005296981 A JP2005296981 A JP 2005296981A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- workpiece
- laser beam
- winding
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004804 winding Methods 0.000 claims abstract description 18
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 6
- 230000000630 rising effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/16—Bands or sheets of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Abstract
【解決手段】
レーザ加工機50には、fθレンズ34から照射されるレーザ光に対して垂直交差するXY平面方向に移動自在なYテーブル5と、シート状ワークwが巻かれた供給ロール40を保持すると共に、シート状ワークwを供給自在な供給リール11と、加工が終了したシート状ワークwを巻取った巻き取りロール41を保持すると共に、シート状ワークを巻き取り自在な巻き取りリール12とが備えられ、加工時に移動テーブル5上の加工領域にあるシート状ワークwを固定すると共に、移動テーブル5をレーザ光に対して相対的に移動させつつレーザ光を照射することで、加工領域にあるシート状ワークwを加工する。この移動テーブル5上に、供給リール11と巻き取りリール12とを配設する。
【選択図】 図1
Description
前記供給側ロール保持装置(11)と前記巻き取り側ロール保持装置(12)との少なくとも一方を、前記移動テーブル(5)上に配設する。
5 移動テーブル(Yテーブル)
11 供給側ロール保持装置(リール軸)
12 巻き取り側ロール保持装置(リール軸)
20 移動手段(ワーク搬送装置)
30 レーザ光照射手段(コラム)
31 レーザ光照射手段(レーザ発振器)
32 レーザ光照射手段(ミラー)
33 レーザ光照射手段(ガルバノスキャナミラー)
34 レーザ光照射手段(fθレンズ)
40 供給側ロール(供給ロール)
41 巻き取り側ロール(巻き取りロール)
50 シート状ワークのレーザ加工機
w シート状ワーク
Claims (3)
- ベッド上に設置され、レーザ光を照射自在なレーザ光照射手段と、少なくとも前記レーザ光に対して垂直交差する平面方向に移動自在に設けられた移動テーブルと、シート状ワークがロール状に巻かれた供給側ロールを保持すると共に、前記移動テーブル上にシート状ワークを供給自在な供給側ロール保持装置と、加工が終了したシート状ワークをロール状に巻取った巻き取り側ロールを保持すると共に、前記移動テーブル上のシート状ワークを巻き取り自在な巻き取り側ロール保持装置と、を備え、加工時に前記移動テーブル上の加工領域にあるシート状ワークを固定すると共に、前記移動テーブルと前記レーザ光照射手段とを相対的に移動させつつ該レーザ光照射手段によりレーザ光を照射することで、該移動テーブル上の加工領域にあるシート状ワークを加工するシート状ワークのレーザ加工機において、
前記供給側ロール保持装置と前記巻き取り側ロール保持装置との少なくとも一方を、前記移動テーブル上に配設した、
ことを特徴とするシート状ワークのレーザ加工機。 - 前記供給側ロール保持装置と前記巻き取り側ロール保持装置とを、前記加工領域に対して前記移動テーブル上の一方側に配設した、
ことを特徴とする請求項1に記載のシート状ワークのレーザ加工機。 - 加工が終了した後、前記供給側ロール保持装置及び前記巻き取り側ロール保持装置によりシート状ワークを供給しつつ巻き取る際、シート状ワークを保持して巻き取る方向に所望量移動させる移動手段を備えた、
ことを特徴とする請求項1または請求項2に記載のシート状ワークのレーザ加工機。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004114508A JP4215675B2 (ja) | 2004-04-08 | 2004-04-08 | シート状ワークのレーザ加工機 |
TW094110304A TWI367140B (en) | 2004-04-08 | 2005-03-31 | Laser machining apparatus for sheet-like workpiece |
KR1020050028749A KR101215109B1 (ko) | 2004-04-08 | 2005-04-07 | 시트 형상 가공물의 레이저가공기 |
US11/100,521 US7897894B2 (en) | 2004-04-08 | 2005-04-07 | Laser machining apparatus for sheet-like workpiece |
DE102005016538.9A DE102005016538B4 (de) | 2004-04-08 | 2005-04-08 | Laserbearbeitungsvorrichtung für ein plattenförmiges Werkstück |
CN2005100635053A CN1680067B (zh) | 2004-04-08 | 2005-04-08 | 用于板状工件的激光加工设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004114508A JP4215675B2 (ja) | 2004-04-08 | 2004-04-08 | シート状ワークのレーザ加工機 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005296981A true JP2005296981A (ja) | 2005-10-27 |
JP2005296981A5 JP2005296981A5 (ja) | 2006-04-27 |
JP4215675B2 JP4215675B2 (ja) | 2009-01-28 |
Family
ID=35059494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004114508A Expired - Lifetime JP4215675B2 (ja) | 2004-04-08 | 2004-04-08 | シート状ワークのレーザ加工機 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7897894B2 (ja) |
JP (1) | JP4215675B2 (ja) |
KR (1) | KR101215109B1 (ja) |
CN (1) | CN1680067B (ja) |
DE (1) | DE102005016538B4 (ja) |
TW (1) | TWI367140B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019115929A (ja) * | 2017-11-23 | 2019-07-18 | ダッラン・ソチエタ・ペル・アツィオーニDALLAN S.p.A. | コイル状に巻かれた層状材料を断片にレーザ切断又はプラズマ切断するための装置 |
CN111266732A (zh) * | 2020-02-21 | 2020-06-12 | 中南大学 | 基于功率与光斑检测的四件式光器件耦合焊接设备 |
WO2022186975A1 (en) * | 2021-03-05 | 2022-09-09 | Electro Scientific Industries, Inc. | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4778031B2 (ja) * | 2008-09-26 | 2011-09-21 | 日立ビアメカニクス株式会社 | レーザ加工機 |
JP5800486B2 (ja) * | 2010-10-06 | 2015-10-28 | 住友化学株式会社 | レーザー切断装置、これを備えるスリッター機、およびレーザー切断方法 |
CN103372723A (zh) * | 2012-04-24 | 2013-10-30 | 星云电脑股份有限公司 | 复合式自动收送料激光加工机 |
DE102015109740A1 (de) * | 2015-06-18 | 2016-12-22 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Maschine zur trennenden Bearbeitung von plattenförmigen Materialen |
JP6487413B2 (ja) * | 2016-12-22 | 2019-03-20 | ファナック株式会社 | レーザ加工用ヘッドおよびそれを備えたレーザ加工システム |
JP7041482B2 (ja) * | 2017-09-13 | 2022-03-24 | 株式会社オーク製作所 | 露光装置 |
IT201700111570A1 (it) | 2017-10-05 | 2019-04-05 | Dallan Spa | Apparato e metodo per il taglio al laser o al plasma di pezzi da materiale laminare avvolto in bobina |
CN110320765B (zh) * | 2018-03-29 | 2023-05-16 | 株式会社Orc制作所 | 曝光装置 |
TWI830529B (zh) * | 2022-12-07 | 2024-01-21 | 信力特科技股份有限公司 | 雷射加工裝置與方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3226527A (en) * | 1963-10-23 | 1965-12-28 | William H Harding | Apparatus for perforating sheet material |
JPH0710438B2 (ja) * | 1986-04-30 | 1995-02-08 | オークマ株式会社 | 自動ノズル交換装置付レ−ザ加工機 |
JPH0642504B2 (ja) | 1989-06-15 | 1994-06-01 | 東レエンジニアリング株式会社 | インナーリードボンダー |
US5767480A (en) * | 1995-07-28 | 1998-06-16 | National Semiconductor Corporation | Hole generation and lead forming for integrated circuit lead frames using laser machining |
US5853530A (en) | 1997-04-11 | 1998-12-29 | Label Aire Inc. | Label applicator |
JP2000094472A (ja) * | 1998-09-18 | 2000-04-04 | Dainippon Printing Co Ltd | 射出成形同時絵付用のシート巻出供給装置 |
JP2000143052A (ja) | 1998-11-05 | 2000-05-23 | Sony Corp | フィルム状の被加工物の供給装置及び供給方法 |
JP3942135B2 (ja) * | 1999-01-22 | 2007-07-11 | 日立ビアメカニクス株式会社 | レーザ加工機 |
JP2000246479A (ja) * | 1999-02-25 | 2000-09-12 | Hitachi Via Mechanics Ltd | レーザ加工機 |
US20040154749A1 (en) * | 2003-02-10 | 2004-08-12 | Rice Clifford B. | Label applicator |
-
2004
- 2004-04-08 JP JP2004114508A patent/JP4215675B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-31 TW TW094110304A patent/TWI367140B/zh active
- 2005-04-07 KR KR1020050028749A patent/KR101215109B1/ko active IP Right Grant
- 2005-04-07 US US11/100,521 patent/US7897894B2/en active Active
- 2005-04-08 CN CN2005100635053A patent/CN1680067B/zh active Active
- 2005-04-08 DE DE102005016538.9A patent/DE102005016538B4/de active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019115929A (ja) * | 2017-11-23 | 2019-07-18 | ダッラン・ソチエタ・ペル・アツィオーニDALLAN S.p.A. | コイル状に巻かれた層状材料を断片にレーザ切断又はプラズマ切断するための装置 |
JP7182260B2 (ja) | 2017-11-23 | 2022-12-02 | ダッラン・ソチエタ・ペル・アツィオーニ | コイル状に巻かれた薄板状材料を断片にレーザ切断又はプラズマ切断するための装置 |
CN111266732A (zh) * | 2020-02-21 | 2020-06-12 | 中南大学 | 基于功率与光斑检测的四件式光器件耦合焊接设备 |
CN111266732B (zh) * | 2020-02-21 | 2021-03-30 | 中南大学 | 基于功率与光斑检测的四件式光器件耦合焊接设备 |
WO2022186975A1 (en) * | 2021-03-05 | 2022-09-09 | Electro Scientific Industries, Inc. | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Also Published As
Publication number | Publication date |
---|---|
KR101215109B1 (ko) | 2012-12-24 |
US20050224476A1 (en) | 2005-10-13 |
CN1680067A (zh) | 2005-10-12 |
DE102005016538A1 (de) | 2005-10-27 |
CN1680067B (zh) | 2010-08-18 |
US7897894B2 (en) | 2011-03-01 |
JP4215675B2 (ja) | 2009-01-28 |
KR20060045539A (ko) | 2006-05-17 |
TW200536648A (en) | 2005-11-16 |
TWI367140B (en) | 2012-07-01 |
DE102005016538B4 (de) | 2017-10-19 |
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