JP2005290409A5 - - Google Patents

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Publication number
JP2005290409A5
JP2005290409A5 JP2004102899A JP2004102899A JP2005290409A5 JP 2005290409 A5 JP2005290409 A5 JP 2005290409A5 JP 2004102899 A JP2004102899 A JP 2004102899A JP 2004102899 A JP2004102899 A JP 2004102899A JP 2005290409 A5 JP2005290409 A5 JP 2005290409A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004102899A
Other languages
English (en)
Japanese (ja)
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JP4356071B2 (ja
JP2005290409A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2004102899A external-priority patent/JP4356071B2/ja
Priority to JP2004102899A priority Critical patent/JP4356071B2/ja
Priority to US11/070,339 priority patent/US20050230244A1/en
Priority to CNB2005100594763A priority patent/CN100447290C/zh
Priority to KR1020050026676A priority patent/KR100665243B1/ko
Priority to TW094109924A priority patent/TWI310407B/zh
Publication of JP2005290409A publication Critical patent/JP2005290409A/ja
Publication of JP2005290409A5 publication Critical patent/JP2005290409A5/ja
Priority to KR1020060086790A priority patent/KR20060102322A/ko
Priority to US12/479,121 priority patent/US8409498B2/en
Publication of JP4356071B2 publication Critical patent/JP4356071B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004102899A 2004-03-31 2004-03-31 スパッタリングターゲット材およびその製造方法 Expired - Lifetime JP4356071B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004102899A JP4356071B2 (ja) 2004-03-31 2004-03-31 スパッタリングターゲット材およびその製造方法
US11/070,339 US20050230244A1 (en) 2004-03-31 2005-03-03 Sputter target material and method of producing the same
CNB2005100594763A CN100447290C (zh) 2004-03-31 2005-03-25 溅射靶材料及其生产方法
TW094109924A TWI310407B (en) 2004-03-31 2005-03-30 Sputter target material and method of producing the same
KR1020050026676A KR100665243B1 (ko) 2004-03-31 2005-03-30 스퍼터링 표적재 및 그의 제조 방법
KR1020060086790A KR20060102322A (ko) 2004-03-31 2006-09-08 스퍼터링 표적재 및 그의 제조 방법
US12/479,121 US8409498B2 (en) 2004-03-31 2009-06-05 Method of producing a sputter target material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004102899A JP4356071B2 (ja) 2004-03-31 2004-03-31 スパッタリングターゲット材およびその製造方法

Publications (3)

Publication Number Publication Date
JP2005290409A JP2005290409A (ja) 2005-10-20
JP2005290409A5 true JP2005290409A5 (fr) 2006-08-24
JP4356071B2 JP4356071B2 (ja) 2009-11-04

Family

ID=35323679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004102899A Expired - Lifetime JP4356071B2 (ja) 2004-03-31 2004-03-31 スパッタリングターゲット材およびその製造方法

Country Status (1)

Country Link
JP (1) JP4356071B2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108606B2 (ja) 2016-09-29 2022-07-28 プランゼー エスエー スパッタリングターゲット

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008255440A (ja) * 2007-04-06 2008-10-23 Hitachi Metals Ltd ＭｏＴｉ合金スパッタリングターゲット材
AT10578U1 (de) * 2007-12-18 2009-06-15 Plansee Metall Gmbh Dunnschichtsolarzelle mit molybdan-haltiger ruckelektrodenschicht
JP5518375B2 (ja) * 2008-09-19 2014-06-11 山陽特殊製鋼株式会社 加速電極用ドリル加工性に優れたモリブデン合金からなる成形体およびその製造方法
JP5287669B2 (ja) * 2009-11-04 2013-09-11 住友金属鉱山株式会社 真空蒸着法用酸化亜鉛系酸化物ペレットの製造方法
US8449817B2 (en) 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
US8449818B2 (en) 2010-06-30 2013-05-28 H. C. Starck, Inc. Molybdenum containing targets
US9334565B2 (en) 2012-05-09 2016-05-10 H.C. Starck Inc. Multi-block sputtering target with interface portions and associated methods and articles
AT13602U3 (de) 2013-10-29 2014-08-15 Plansee Se Sputtering Target und Verfahren zur Herstellung
CN115094390A (zh) * 2014-09-30 2022-09-23 捷客斯金属株式会社 溅射靶用母合金和溅射靶的制造方法
JP7205213B2 (ja) * 2018-03-27 2023-01-17 日立金属株式会社 ＴｉＷ合金ターゲットおよびその製造方法
JP7267086B2 (ja) * 2019-05-07 2023-05-01 株式会社アルバック スパッタリングターゲットの製造方法
CN111850490B (zh) * 2020-07-29 2023-01-20 丰联科光电(洛阳)股份有限公司 一种二元钼合金溅射靶材及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108606B2 (ja) 2016-09-29 2022-07-28 プランゼー エスエー スパッタリングターゲット

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