JP2005252262A5 - - Google Patents
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- Publication number
- JP2005252262A5 JP2005252262A5 JP2005057669A JP2005057669A JP2005252262A5 JP 2005252262 A5 JP2005252262 A5 JP 2005252262A5 JP 2005057669 A JP2005057669 A JP 2005057669A JP 2005057669 A JP2005057669 A JP 2005057669A JP 2005252262 A5 JP2005252262 A5 JP 2005252262A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- dielectric material
- mount type
- surface mount
- melf
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims 24
- 239000003989 dielectric material Substances 0.000 claims 23
- 239000003990 capacitor Substances 0.000 claims 22
- 238000000034 method Methods 0.000 claims 17
- 229910052782 aluminium Inorganic materials 0.000 claims 6
- 229910052790 beryllium Inorganic materials 0.000 claims 6
- 229910052735 hafnium Inorganic materials 0.000 claims 6
- 229910052758 niobium Inorganic materials 0.000 claims 6
- 229910052715 tantalum Inorganic materials 0.000 claims 6
- 229910052719 titanium Inorganic materials 0.000 claims 6
- 229910052721 tungsten Inorganic materials 0.000 claims 6
- 229910052720 vanadium Inorganic materials 0.000 claims 6
- 229910052726 zirconium Inorganic materials 0.000 claims 6
- 239000007784 solid electrolyte Substances 0.000 claims 5
- 239000011810 insulating material Substances 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 238000003698 laser cutting Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/792,138 US7088573B2 (en) | 2004-03-02 | 2004-03-02 | Surface mount MELF capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005252262A JP2005252262A (ja) | 2005-09-15 |
| JP2005252262A5 true JP2005252262A5 (enExample) | 2006-03-30 |
Family
ID=34435913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005057669A Pending JP2005252262A (ja) | 2004-03-02 | 2005-03-02 | 表面実装型ｍｅｌｆコンデンサー |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US7088573B2 (enExample) |
| JP (1) | JP2005252262A (enExample) |
| DE (1) | DE102005009506A1 (enExample) |
| FR (1) | FR2867302B1 (enExample) |
| GB (1) | GB2412242B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101112019B1 (ko) * | 2002-11-08 | 2012-02-24 | 미쯔비시 가가꾸 가부시끼가이샤 | 전해콘덴서 |
| WO2005015588A1 (ja) * | 2003-08-12 | 2005-02-17 | Rohm Co., Ltd. | 固体電解コンデンサ、電気回路、及び固体電解コンデンサの実装構造 |
| US7088573B2 (en) * | 2004-03-02 | 2006-08-08 | Vishay Sprague, Inc. | Surface mount MELF capacitor |
| JP2006173383A (ja) * | 2004-12-16 | 2006-06-29 | Rohm Co Ltd | 固体電解コンデンサ及びこの固体電解コンデンサの基板への実装構造 |
| TWI283879B (en) * | 2005-02-17 | 2007-07-11 | Sanyo Electric Co | Solid electrolytic capacitor and manufacturing method thereof |
| IL173649A0 (en) * | 2006-02-09 | 2006-07-05 | Cerel Ceramic Technologies Ltd | High capacitance capacitor anode |
| US7468882B2 (en) * | 2006-04-28 | 2008-12-23 | Avx Corporation | Solid electrolytic capacitor assembly |
| JP5234521B2 (ja) * | 2009-08-21 | 2013-07-10 | Ｔｄｋ株式会社 | 電子部品及びその製造方法 |
| US8125769B2 (en) | 2010-07-22 | 2012-02-28 | Avx Corporation | Solid electrolytic capacitor assembly with multiple cathode terminations |
| US8259436B2 (en) | 2010-08-03 | 2012-09-04 | Avx Corporation | Mechanically robust solid electrolytic capacitor assembly |
| JP2012186233A (ja) * | 2011-03-03 | 2012-09-27 | Jsr Corp | デバイス及びこの製造方法 |
| US8300387B1 (en) * | 2011-04-07 | 2012-10-30 | Avx Corporation | Hermetically sealed electrolytic capacitor with enhanced mechanical stability |
| DE102011112659B4 (de) * | 2011-09-06 | 2022-01-27 | Vishay Semiconductor Gmbh | Oberflächenmontierbares elektronisches Bauelement |
| CN103311206B (zh) * | 2013-05-23 | 2016-04-13 | 华为技术有限公司 | 封装有焊端环的电子器件及具有该电子器件的电子设备 |
| JP6710085B2 (ja) * | 2016-03-31 | 2020-06-17 | 株式会社村田製作所 | 固体電解コンデンサ |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3424952A (en) * | 1966-06-27 | 1969-01-28 | Mallory & Co Inc P R | Powder on wire capacitor |
| GB2110878B (en) * | 1981-12-01 | 1986-02-05 | Standard Telephones Cables Ltd | Batch process for making capacitors |
| DE3619212A1 (de) | 1986-06-07 | 1987-12-10 | Philips Patentverwaltung | Passives elektrisches bauelement |
| JPH04367212A (ja) * | 1991-06-14 | 1992-12-18 | Nec Corp | チップ型固体電解コンデンサの製造方法 |
| US5390074A (en) * | 1991-09-30 | 1995-02-14 | Matsushita Electric Industrial Co., Ltd. | Chip-type solid electrolytic capacitor and method of manufacturing the same |
| JP2770636B2 (ja) * | 1992-03-03 | 1998-07-02 | 日本電気株式会社 | チップ型固体電解コンデンサ |
| US5412533A (en) * | 1993-06-22 | 1995-05-02 | Rohm Co., Ltd. | Solid electrolytic capacitor and manufacturing method thereof |
| US6185090B1 (en) * | 1997-01-29 | 2001-02-06 | Vishay Sprague, Inc. | Method for doping sintered tantalum and niobium pellets with nitrogen |
| US6238444B1 (en) * | 1998-10-07 | 2001-05-29 | Vishay Sprague, Inc. | Method for making tantalum chip capacitor |
| JP2001085273A (ja) * | 1999-09-10 | 2001-03-30 | Matsushita Electric Ind Co Ltd | チップ形固体電解コンデンサ |
| JP4261105B2 (ja) * | 2000-03-01 | 2009-04-30 | キャボット コーポレイション | 窒化バルブ金属およびその製造方法 |
| JP3349133B2 (ja) * | 2000-04-07 | 2002-11-20 | エヌイーシートーキン株式会社 | チップ型コンデンサ及びその製造方法並びにモールド金型 |
| US6541302B2 (en) | 2001-01-11 | 2003-04-01 | Vishay Sprague, Inc. | Method of forming termination on chip components |
| IL143780A (en) * | 2001-06-14 | 2007-06-03 | Cerel Ceramic Technologies Ltd | Process for manufacturing electrode |
| TW485856U (en) * | 2001-06-20 | 2002-05-01 | Foxconn Precision Components Co Ltd | Angles forming device |
| JP4010447B2 (ja) * | 2002-05-30 | 2007-11-21 | ローム株式会社 | 固体電解コンデンサ及びその製造方法 |
| JP2004281749A (ja) * | 2003-03-17 | 2004-10-07 | Nippon Chemicon Corp | 固体電解コンデンサ |
| US7088573B2 (en) * | 2004-03-02 | 2006-08-08 | Vishay Sprague, Inc. | Surface mount MELF capacitor |
-
2004
- 2004-03-02 US US10/792,138 patent/US7088573B2/en not_active Expired - Fee Related
-
2005
- 2005-03-02 GB GB0504292A patent/GB2412242B/en not_active Expired - Fee Related
- 2005-03-02 FR FR0502115A patent/FR2867302B1/fr not_active Expired - Fee Related
- 2005-03-02 JP JP2005057669A patent/JP2005252262A/ja active Pending
- 2005-03-02 DE DE200510009506 patent/DE102005009506A1/de not_active Withdrawn
- 2005-10-26 US US11/259,503 patent/US7167357B2/en not_active Expired - Fee Related
- 2005-11-02 US US11/264,977 patent/US7221555B2/en not_active Expired - Fee Related
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