JP2005252169A5 - - Google Patents
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- Publication number
- JP2005252169A5 JP2005252169A5 JP2004064071A JP2004064071A JP2005252169A5 JP 2005252169 A5 JP2005252169 A5 JP 2005252169A5 JP 2004064071 A JP2004064071 A JP 2004064071A JP 2004064071 A JP2004064071 A JP 2004064071A JP 2005252169 A5 JP2005252169 A5 JP 2005252169A5
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- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004064071A JP4264823B2 (ja) | 2004-03-08 | 2004-03-08 | 半導体装置の製造方法 |
| US10/980,316 US7122910B2 (en) | 2004-03-08 | 2004-11-04 | Packaged semiconductor device |
| CN2004100974363A CN1667801B (zh) | 2004-03-08 | 2004-11-15 | 半导体装置及其制造方法 |
| US11/511,267 US7687320B2 (en) | 2004-03-08 | 2006-08-29 | Manufacturing method for packaged semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004064071A JP4264823B2 (ja) | 2004-03-08 | 2004-03-08 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005252169A JP2005252169A (ja) | 2005-09-15 |
| JP2005252169A5 true JP2005252169A5 (ja) | 2006-10-05 |
| JP4264823B2 JP4264823B2 (ja) | 2009-05-20 |
Family
ID=34909341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004064071A Expired - Lifetime JP4264823B2 (ja) | 2004-03-08 | 2004-03-08 | 半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7122910B2 (ja) |
| JP (1) | JP4264823B2 (ja) |
| CN (1) | CN1667801B (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306635B (zh) | 2004-11-16 | 2015-09-09 | 罗姆股份有限公司 | 半导体装置及半导体装置的制造方法 |
| JP4057017B2 (ja) * | 2005-01-31 | 2008-03-05 | 富士通株式会社 | 電子装置及びその製造方法 |
| JP4193897B2 (ja) * | 2006-05-19 | 2008-12-10 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| KR20080085380A (ko) * | 2007-03-19 | 2008-09-24 | 삼성전자주식회사 | 재배선층을 구비하는 반도체 패키지 및 그의 제조방법 |
| KR20090042574A (ko) * | 2007-10-26 | 2009-04-30 | 삼성전자주식회사 | 반도체 모듈 및 이를 구비하는 전자 장치 |
| JP5801989B2 (ja) * | 2008-08-20 | 2015-10-28 | ラピスセミコンダクタ株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5135246B2 (ja) | 2009-01-30 | 2013-02-06 | 三洋電機株式会社 | 半導体モジュールおよびその製造方法、ならびに携帯機器 |
| US10756040B2 (en) * | 2017-02-13 | 2020-08-25 | Mediatek Inc. | Semiconductor package with rigid under bump metallurgy (UBM) stack |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582511A (ja) | 1991-09-19 | 1993-04-02 | Oki Electric Ind Co Ltd | 半導体素子およびその製造方法 |
| CN1146976C (zh) * | 1997-10-30 | 2004-04-21 | 株式会社日产制作所 | 半导体装置及其制造方法 |
| KR100269540B1 (ko) * | 1998-08-28 | 2000-10-16 | 윤종용 | 웨이퍼 상태에서의 칩 스케일 패키지 제조 방법 |
| US6181569B1 (en) * | 1999-06-07 | 2001-01-30 | Kishore K. Chakravorty | Low cost chip size package and method of fabricating the same |
| JP2001168126A (ja) | 1999-12-06 | 2001-06-22 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
| JP2001230341A (ja) * | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体装置 |
| JP2001237348A (ja) | 2000-02-23 | 2001-08-31 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP3792545B2 (ja) | 2001-07-09 | 2006-07-05 | カシオ計算機株式会社 | 半導体装置の製造方法 |
| JP2003124392A (ja) | 2001-10-15 | 2003-04-25 | Sony Corp | 半導体装置及びその製造方法 |
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2004
- 2004-03-08 JP JP2004064071A patent/JP4264823B2/ja not_active Expired - Lifetime
- 2004-11-04 US US10/980,316 patent/US7122910B2/en not_active Expired - Lifetime
- 2004-11-15 CN CN2004100974363A patent/CN1667801B/zh not_active Expired - Lifetime
-
2006
- 2006-08-29 US US11/511,267 patent/US7687320B2/en active Active