JP2005231116A - 液体吐出用ヘッドおよびその製造方法 - Google Patents
液体吐出用ヘッドおよびその製造方法 Download PDFInfo
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- JP2005231116A JP2005231116A JP2004041312A JP2004041312A JP2005231116A JP 2005231116 A JP2005231116 A JP 2005231116A JP 2004041312 A JP2004041312 A JP 2004041312A JP 2004041312 A JP2004041312 A JP 2004041312A JP 2005231116 A JP2005231116 A JP 2005231116A
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- 239000007788 liquid Substances 0.000 title claims abstract description 93
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 41
- 239000011147 inorganic material Substances 0.000 claims abstract description 41
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 28
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 12
- 239000007769 metal material Substances 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 17
- 229910004298 SiO 2 Inorganic materials 0.000 description 38
- 239000000463 material Substances 0.000 description 22
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 229910052581 Si3N4 Inorganic materials 0.000 description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 13
- 238000005260 corrosion Methods 0.000 description 12
- 230000007797 corrosion Effects 0.000 description 12
- 238000001020 plasma etching Methods 0.000 description 9
- 238000001312 dry etching Methods 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000005871 repellent Substances 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 230000002940 repellent Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 238000000018 DNA microarray Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910004200 TaSiN Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- -1 SiO 2 Chemical compound 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【解決手段】 本発明に係る液体吐出用ヘッドの一例であるインクジェット記録ヘッドの製造方法は、電気熱変換素子7が形成されたSi基板1上に、溶解可能な無機材料であるAlを用いてAl膜3をインク流路パターン状に450℃以下の温度で形成する工程と、Al膜3上にSiO2膜4によってインク流路形成部材を形成する工程と、インク流路形成部材の、電気熱変換素子7の上方に位置する部分に吐出口14を形成する工程と、Al膜3を溶出させる工程とを有する。
【選択図】 図2
Description
本発明の第1の実施形態は、犠牲層(液体流路パターンおよび吐出口パターンを形成するための材料膜)となる無機材料膜にAlを用い、インク流路形成部材の材料にSiO2を用いて構成されたインクジェット記録ヘッドおよびその製造方法に関するものである。
本発明の第2の実施形態は、犠牲層となる無機材料膜にCuを用い、インク流路形成部材の材料にSiCを用いて構成されたインクジェット記録ヘッドおよびその製造方法に関するものである。
2,4 SiO2膜
3 Al膜
5 Ta膜
6,10 Cu膜
7 電気熱変換素子
8 SiC膜
10a 吐出口パターン
11,12 開口
13 貫通孔
14 吐出口
15 撥水膜
16 インク流路
Claims (6)
- 液体吐出用素子が形成された基板上に、無機材料膜を液体流路パターン状に形成する工程と、
前記無機材料膜上に、酸化シリコン、炭化シリコン、およびSiOCのうちのいずれか1つで液体流路形成部材を形成する工程と、
前記液体流路形成部材の、前記液体吐出用素子の上方に位置する部分に液体吐出口を形成する工程と、
前記無機材料膜を溶出させる工程と、
を有する液体吐出用ヘッドの製造方法。 - 前記無機材料はAlを主成分としている、請求項1に記載の液体吐出用ヘッドの製造方法。
- 前記無機材料膜を溶出させる工程はリン酸あるいは塩酸を用いて前記無機材料膜をエッチングする工程からなる、請求項2に記載の液体吐出用ヘッドの製造方法。
- 前記無機材料はCuを主成分としている、請求項1に記載の液体吐出用ヘッドの製造方法。
- 前記無機材料膜を溶出させる工程は硝酸を用いて前記無機材料膜をエッチングする工程からなる、請求項4に記載の液体吐出用ヘッドの製造方法。
- 複数の液体吐出用素子が設けられた基板と、
複数の吐出口と該複数の吐出口にそれぞれ連通する複数の液体流路とを構成する、前記基板の前記液体吐出用素子が設けられている面上に設けられた液体流路形成部材とを有する液体吐出用ヘッドにおいて、
前記液体流路形成部材は酸化シリコン、炭化シリコン、およびSiOCのうちのいずれか1つで形成されており、前記基板と前記液体流路形成部材の一部との間に金属材料層が設けられていることを特徴とする液体吐出用ヘッド。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004041312A JP4480132B2 (ja) | 2004-02-18 | 2004-02-18 | 液体吐出用ヘッドの製造方法 |
US11/058,164 US7090339B2 (en) | 2004-02-18 | 2005-02-16 | Liquid discharge head and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004041312A JP4480132B2 (ja) | 2004-02-18 | 2004-02-18 | 液体吐出用ヘッドの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005231116A true JP2005231116A (ja) | 2005-09-02 |
JP2005231116A5 JP2005231116A5 (ja) | 2007-04-05 |
JP4480132B2 JP4480132B2 (ja) | 2010-06-16 |
Family
ID=34836411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004041312A Expired - Fee Related JP4480132B2 (ja) | 2004-02-18 | 2004-02-18 | 液体吐出用ヘッドの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7090339B2 (ja) |
JP (1) | JP4480132B2 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007230083A (ja) * | 2006-03-01 | 2007-09-13 | Canon Inc | 液体吐出ヘッドの製造方法、及び、液体吐出ヘッド |
JP2008254259A (ja) * | 2007-04-03 | 2008-10-23 | Canon Inc | 液体吐出ヘッドの製造方法 |
JP2010512261A (ja) * | 2006-12-12 | 2010-04-22 | イーストマン コダック カンパニー | 液体チャンバが改善された液滴排出装置 |
JP2011212944A (ja) * | 2010-03-31 | 2011-10-27 | Canon Inc | 液体吐出ヘッド及びその製造方法 |
JP2012530624A (ja) * | 2009-08-25 | 2012-12-06 | シルバーブルック リサーチ ピーティワイ リミテッド | 耐クラック性熱曲げアクチュエータ |
JP2013237228A (ja) * | 2012-05-16 | 2013-11-28 | Canon Inc | 液体吐出ヘッド |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4865309B2 (ja) * | 2005-11-29 | 2012-02-01 | キヤノン株式会社 | インクジェット記録ヘッド用基板の製造方法 |
JP4854336B2 (ja) * | 2006-03-07 | 2012-01-18 | キヤノン株式会社 | インクジェットヘッド用基板の製造方法 |
US20090233386A1 (en) * | 2008-03-12 | 2009-09-17 | Yimin Guan | Method for forming an ink jetting device |
JP5566130B2 (ja) * | 2009-02-26 | 2014-08-06 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP6230279B2 (ja) * | 2013-06-06 | 2017-11-15 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4611219A (en) * | 1981-12-29 | 1986-09-09 | Canon Kabushiki Kaisha | Liquid-jetting head |
US4438191A (en) * | 1982-11-23 | 1984-03-20 | Hewlett-Packard Company | Monolithic ink jet print head |
JP3143307B2 (ja) | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JPH11138773A (ja) * | 1997-11-10 | 1999-05-25 | Fuji Xerox Co Ltd | 画像形成方法および画像形成装置 |
JP3619036B2 (ja) | 1997-12-05 | 2005-02-09 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
US6650350B2 (en) * | 1998-08-31 | 2003-11-18 | Canon Kabushiki Kaisha | Process and apparatus for forming images |
JP2002029047A (ja) * | 2000-07-13 | 2002-01-29 | Fuji Xerox Co Ltd | インクジェット記録ヘッド及びその製造方法、インクジェット記録装置 |
US6398329B1 (en) * | 2000-11-13 | 2002-06-04 | Hewlett-Packard Company | Thermal inkjet pen having a backpressure sensor |
-
2004
- 2004-02-18 JP JP2004041312A patent/JP4480132B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-16 US US11/058,164 patent/US7090339B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007230083A (ja) * | 2006-03-01 | 2007-09-13 | Canon Inc | 液体吐出ヘッドの製造方法、及び、液体吐出ヘッド |
JP2010512261A (ja) * | 2006-12-12 | 2010-04-22 | イーストマン コダック カンパニー | 液体チャンバが改善された液滴排出装置 |
JP2008254259A (ja) * | 2007-04-03 | 2008-10-23 | Canon Inc | 液体吐出ヘッドの製造方法 |
JP2012530624A (ja) * | 2009-08-25 | 2012-12-06 | シルバーブルック リサーチ ピーティワイ リミテッド | 耐クラック性熱曲げアクチュエータ |
JP2011212944A (ja) * | 2010-03-31 | 2011-10-27 | Canon Inc | 液体吐出ヘッド及びその製造方法 |
JP2013237228A (ja) * | 2012-05-16 | 2013-11-28 | Canon Inc | 液体吐出ヘッド |
Also Published As
Publication number | Publication date |
---|---|
US7090339B2 (en) | 2006-08-15 |
US20050179744A1 (en) | 2005-08-18 |
JP4480132B2 (ja) | 2010-06-16 |
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