JP2005228298A5 - - Google Patents

Download PDF

Info

Publication number
JP2005228298A5
JP2005228298A5 JP2004365771A JP2004365771A JP2005228298A5 JP 2005228298 A5 JP2005228298 A5 JP 2005228298A5 JP 2004365771 A JP2004365771 A JP 2004365771A JP 2004365771 A JP2004365771 A JP 2004365771A JP 2005228298 A5 JP2005228298 A5 JP 2005228298A5
Authority
JP
Japan
Prior art keywords
thin film
substrate
integrated circuit
wiring
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004365771A
Other languages
English (en)
Japanese (ja)
Other versions
JP4671681B2 (ja
JP2005228298A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004365771A priority Critical patent/JP4671681B2/ja
Priority claimed from JP2004365771A external-priority patent/JP4671681B2/ja
Publication of JP2005228298A publication Critical patent/JP2005228298A/ja
Publication of JP2005228298A5 publication Critical patent/JP2005228298A5/ja
Application granted granted Critical
Publication of JP4671681B2 publication Critical patent/JP4671681B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004365771A 2003-12-19 2004-12-17 半導体装置及びその作製方法 Expired - Fee Related JP4671681B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004365771A JP4671681B2 (ja) 2003-12-19 2004-12-17 半導体装置及びその作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003423061 2003-12-19
JP2004365771A JP4671681B2 (ja) 2003-12-19 2004-12-17 半導体装置及びその作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010263413A Division JP5063770B2 (ja) 2003-12-19 2010-11-26 半導体装置の作製方法、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2005228298A JP2005228298A (ja) 2005-08-25
JP2005228298A5 true JP2005228298A5 (enrdf_load_stackoverflow) 2007-12-20
JP4671681B2 JP4671681B2 (ja) 2011-04-20

Family

ID=35002924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004365771A Expired - Fee Related JP4671681B2 (ja) 2003-12-19 2004-12-17 半導体装置及びその作製方法

Country Status (1)

Country Link
JP (1) JP4671681B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311205A (ja) * 2004-04-23 2005-11-04 Nec Corp 半導体装置
EP3614442A3 (en) 2005-09-29 2020-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide semiconductor layer and manufactoring method thereof
JP5177617B2 (ja) * 2006-12-25 2013-04-03 独立行政法人産業技術総合研究所 酸化シリコン薄膜形成装置
WO2009049264A1 (en) * 2007-10-10 2009-04-16 Kovio, Inc. Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
KR101596537B1 (ko) * 2008-11-25 2016-02-22 씬 필름 일렉트로닉스 에이에스에이 인쇄형 안테나, 안테나 인쇄 방법, 및 인쇄형 안테나를 포함하는 디바이스
JP6084943B2 (ja) * 2014-03-17 2017-02-22 富士通フロンテック株式会社 無線リードライタ装置、無線タグのリユース方法、及びプログラム
WO2018150551A1 (ja) * 2017-02-17 2018-08-23 裕久 今家 印刷基板製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123047A (ja) * 2001-10-15 2003-04-25 Sharp Corp 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
US7838410B2 (en) Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly
JP4484035B2 (ja) 半導体装置の製造方法
CN101645488B (zh) 有机薄膜晶体管、其制造方法和电子装置
JP2011519147A5 (enrdf_load_stackoverflow)
US7651886B2 (en) Semiconductor device and manufacturing process thereof
JP2010519780A5 (enrdf_load_stackoverflow)
JP2004501504A5 (enrdf_load_stackoverflow)
CN107275315A (zh) 一种化合物半导体背金电容的结构及其制作方法
JP4396754B2 (ja) 配線への素子の電気的接続方法及び発光素子組立体の製造方法
JP2005228298A5 (enrdf_load_stackoverflow)
CN114026631A (zh) 驱动基板及其制作方法、显示装置
CN104103527B (zh) 一种改进的扇出型方片级半导体芯片封装工艺
SE0400973D0 (sv) Förfarande för tillverkning av kiselkarbidhalvledarordning
JP7622772B2 (ja) インターポーザ
JP2006073805A5 (enrdf_load_stackoverflow)
KR101974191B1 (ko) 반도체 장치 및 그 형성방법
US10734304B2 (en) Plating for thermal management
JP2007013127A5 (enrdf_load_stackoverflow)
JP2002057238A5 (enrdf_load_stackoverflow)
CN1953157B (zh) 电子互连及其制造方法
JP2006237402A5 (enrdf_load_stackoverflow)
JP3874059B2 (ja) 半導体装置の製造方法
JP2001291838A5 (ja) 半導体チップ及びその製造方法、半導体装置、回路基板並びに電子機器
US11282716B2 (en) Integration structure and planar joining
JP2007281216A (ja) 半導体装置及びその製造方法、並びに、電子機器