JP2005217393A5 - - Google Patents

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Publication number
JP2005217393A5
JP2005217393A5 JP2004344103A JP2004344103A JP2005217393A5 JP 2005217393 A5 JP2005217393 A5 JP 2005217393A5 JP 2004344103 A JP2004344103 A JP 2004344103A JP 2004344103 A JP2004344103 A JP 2004344103A JP 2005217393 A5 JP2005217393 A5 JP 2005217393A5
Authority
JP
Japan
Prior art keywords
composition
composition according
encapsulating
encapsulated
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004344103A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005217393A (ja
Filing date
Publication date
Priority claimed from US10/727,951 external-priority patent/US7479653B2/en
Application filed filed Critical
Publication of JP2005217393A publication Critical patent/JP2005217393A/ja
Publication of JP2005217393A5 publication Critical patent/JP2005217393A5/ja
Pending legal-status Critical Current

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JP2004344103A 2003-12-04 2004-11-29 Ｕｖ硬化性保護封入剤 Pending JP2005217393A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/727,951 US7479653B2 (en) 2003-12-04 2003-12-04 UV curable protective encapsulant

Publications (2)

Publication Number Publication Date
JP2005217393A JP2005217393A (ja) 2005-08-11
JP2005217393A5 true JP2005217393A5 (enExample) 2008-01-17

Family

ID=34465776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004344103A Pending JP2005217393A (ja) 2003-12-04 2004-11-29 Ｕｖ硬化性保護封入剤

Country Status (6)

Country Link
US (1) US7479653B2 (enExample)
EP (1) EP1538170A1 (enExample)
JP (1) JP2005217393A (enExample)
KR (1) KR20050054453A (enExample)
CN (1) CN1637109A (enExample)
TW (1) TW200535152A (enExample)

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
US8617715B2 (en) * 2003-12-06 2013-12-31 Cpfilms Inc. Fire retardant shades
US7371335B2 (en) * 2004-10-21 2008-05-13 E.I. Dupont De Nemours And Company Curable thick film compositions for use in moisture control
JP2009531516A (ja) * 2006-03-29 2009-09-03 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 放射線−硬化性ゴム系接着剤／シーラント
US20090181242A1 (en) * 2008-01-11 2009-07-16 Enniss James P Exterior window film
JP5410732B2 (ja) * 2008-09-30 2014-02-05 東京応化工業株式会社 感光性樹脂組成物及び封止剤
US8999509B2 (en) 2011-04-27 2015-04-07 Cpfilms Inc. Weather resistant exterior film composite
US9059580B2 (en) 2011-11-10 2015-06-16 Thomas & Betts International, Llc Curing system for sealing an electrical fitting
TWI452553B (zh) * 2011-12-30 2014-09-11 Au Optronics Corp 製作可撓式顯示裝置之方法
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
US8481626B1 (en) * 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
EP2986510B1 (en) 2013-04-15 2020-07-29 3M Innovative Properties Company Translucent seal cap
CA2909377A1 (en) * 2013-04-15 2014-10-23 3M Innovative Properties Company Light weight seal cap
KR20150016878A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
FR3068037B1 (fr) * 2017-06-27 2020-09-11 Valeo Systemes De Controle Moteur Procede de synthese d'un materiau slicone/polyurethane
KR102789243B1 (ko) * 2018-03-28 2025-04-01 헨켈 아게 운트 코. 카게아아 광경화성 조성물 및 광경화성 조성물을 사용하여 막 표면 상에 지형적 특징부를 형성하는 방법

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US4073835A (en) * 1976-01-30 1978-02-14 Toyo Ink Manufacturing Co., Ltd. Method of resin encapsulating electrical parts with UV curing of fire retardant resin
US4134175A (en) * 1977-09-01 1979-01-16 Liquid Controls Corporation Non-rotating bushing
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
US4336311A (en) * 1980-08-25 1982-06-22 Sprague Electric Company Humidity- and salt-resistant electronic component
US4349605A (en) * 1980-09-09 1982-09-14 National Distillers & Chemical Corp. Flame retardant radiation curable polymeric compositions
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US4390401A (en) * 1981-02-23 1983-06-28 Celanese Corporation Acrylate or methacrylate esters of alkylene oxide adducts of alkyl/aryl phenols as wetting agents for ultraviolet curable coating compositions
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US4635356A (en) * 1984-12-28 1987-01-13 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module
CH665060A5 (en) 1985-10-16 1988-04-15 Valtronic S A Electronic module for integrated circuit mounting on PCB - has space provided between rows of connector pins for chips mounted on board through which pins pass
DE3702999C2 (de) * 1987-02-02 2003-03-06 Siemens Ag Vorrichtung zur Verarbeitung von UV-härtbaren Reaktionsharzmassen und deren Anwendung
US4843036A (en) 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
US5180757A (en) * 1987-12-16 1993-01-19 Michael Lucey Photopolymerizable compositions used in electronics
US5134175A (en) 1987-12-16 1992-07-28 Michael Lucey Curable composition for electrical and electronic components
US5017406A (en) 1988-12-08 1991-05-21 Dow Corning Corporation UV curable compositions cured with polysilane and peroxide initiators
CA2009274A1 (en) 1989-02-22 1990-08-22 Manuel Buentello Iii Method for making electronic components using a masking material and a masking material therefor
US5098766A (en) * 1989-03-03 1992-03-24 Ibm Corporation Encapsulated wire circuit board
US5085924A (en) * 1990-03-23 1992-02-04 General Electric Company UV-curable pre-crosslinked epoxy functional silicones
DE4017941A1 (de) 1990-06-05 1991-12-12 Univ Schiller Jena Haertbare zusammensetzung
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JPH05218276A (ja) 1991-11-12 1993-08-27 Motorola Inc 割れにくい半導体装置およびその作製方法
CA2131358A1 (en) * 1993-09-02 1995-03-03 Jack S. Treger Battery tester adhesive and system
CH684528A5 (de) 1994-02-05 1994-10-14 Hans Auer Verfahren zur Herstellung von bedruckten Smart Cards.
DE4434382A1 (de) 1994-09-16 1996-03-21 Thomas Voges Verfahren zum Einkapseln oder Versiegeln mit allseitigem hermetischem Abschluß von mikroelektronischen Hybrid-Halbleiterschaltungen
DE4435120C2 (de) 1994-09-30 2000-08-03 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstellung
JP2740943B2 (ja) * 1994-10-31 1998-04-15 大日本印刷株式会社 耐摩耗性を有する化粧材
DE4444812C1 (de) 1994-12-15 1996-05-15 Ods Gmbh & Co Kg Verfahren zum Verkappen eines Chipkartenmoduls und Vorrichtung zum Durchführen des Verfahrens
AU1687197A (en) 1995-12-19 1997-07-14 Midwest Research Institute Encapsulating material for photovoltaic devices
US6034441A (en) * 1997-11-26 2000-03-07 Lucent Technologies, Inc. Overcast semiconductor package
US6674158B2 (en) 1998-09-03 2004-01-06 Micron Technology, Inc. Semiconductor die package having a UV cured polymeric die coating
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
US6775451B1 (en) * 1999-12-30 2004-08-10 Corning Incorporated Secondary coating composition for optical fibers
JP2002194039A (ja) * 2000-10-19 2002-07-10 Toagosei Co Ltd 光硬化性組成物
DE10054873C2 (de) 2000-11-06 2002-10-17 Mada Marx Datentechnik Gmbh Kontaktlose Chipkarte und Verfahren zur Herstellung einer solchen Chipkarte
US6553169B2 (en) * 2000-11-29 2003-04-22 Corning Incorporated Optical fiber coating compositions and coated optical fibers

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