JP2005205914A5 - - Google Patents

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Publication number
JP2005205914A5
JP2005205914A5 JP2005013145A JP2005013145A JP2005205914A5 JP 2005205914 A5 JP2005205914 A5 JP 2005205914A5 JP 2005013145 A JP2005013145 A JP 2005013145A JP 2005013145 A JP2005013145 A JP 2005013145A JP 2005205914 A5 JP2005205914 A5 JP 2005205914A5
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JP
Japan
Prior art keywords
substrate
embossing
temperature
embossable film
die assembly
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JP2005013145A
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English (en)
Japanese (ja)
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JP4699767B2 (ja
JP2005205914A (ja
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Priority claimed from US10/761,486 external-priority patent/US7329114B2/en
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Publication of JP2005205914A publication Critical patent/JP2005205914A/ja
Publication of JP2005205914A5 publication Critical patent/JP2005205914A5/ja
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Publication of JP4699767B2 publication Critical patent/JP4699767B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005013145A 2004-01-20 2005-01-20 恒温インプリント・エンボッシング・システム Expired - Fee Related JP4699767B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/761,486 2004-01-20
US10/761,486 US7329114B2 (en) 2004-01-20 2004-01-20 Isothermal imprint embossing system

Publications (3)

Publication Number Publication Date
JP2005205914A JP2005205914A (ja) 2005-08-04
JP2005205914A5 true JP2005205914A5 (enExample) 2008-02-28
JP4699767B2 JP4699767B2 (ja) 2011-06-15

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JP2005013145A Expired - Fee Related JP4699767B2 (ja) 2004-01-20 2005-01-20 恒温インプリント・エンボッシング・システム

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US (2) US7329114B2 (enExample)
JP (1) JP4699767B2 (enExample)
DE (1) DE102005001693A1 (enExample)
MY (1) MY137628A (enExample)

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