JP2005197600A5 - - Google Patents

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Publication number
JP2005197600A5
JP2005197600A5 JP2004004483A JP2004004483A JP2005197600A5 JP 2005197600 A5 JP2005197600 A5 JP 2005197600A5 JP 2004004483 A JP2004004483 A JP 2004004483A JP 2004004483 A JP2004004483 A JP 2004004483A JP 2005197600 A5 JP2005197600 A5 JP 2005197600A5
Authority
JP
Japan
Prior art keywords
mist
manufacturing apparatus
processing
semiconductor manufacturing
carrier gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004004483A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005197600A (ja
JP4361811B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2004004483A external-priority patent/JP4361811B2/ja
Priority to JP2004004483A priority Critical patent/JP4361811B2/ja
Priority to KR1020067015082A priority patent/KR100876692B1/ko
Priority to CNB2004800400808A priority patent/CN100440451C/zh
Priority to PCT/JP2004/019418 priority patent/WO2005067023A1/ja
Priority to US10/585,408 priority patent/US20070163502A1/en
Publication of JP2005197600A publication Critical patent/JP2005197600A/ja
Publication of JP2005197600A5 publication Critical patent/JP2005197600A5/ja
Publication of JP4361811B2 publication Critical patent/JP4361811B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004004483A 2004-01-09 2004-01-09 半導体製造装置 Expired - Fee Related JP4361811B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004004483A JP4361811B2 (ja) 2004-01-09 2004-01-09 半導体製造装置
US10/585,408 US20070163502A1 (en) 2004-01-09 2004-12-24 Substrate processing apparatus
CNB2004800400808A CN100440451C (zh) 2004-01-09 2004-12-24 基板处理装置
PCT/JP2004/019418 WO2005067023A1 (ja) 2004-01-09 2004-12-24 基板処理装置
KR1020067015082A KR100876692B1 (ko) 2004-01-09 2004-12-24 기판처리장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004004483A JP4361811B2 (ja) 2004-01-09 2004-01-09 半導体製造装置

Publications (3)

Publication Number Publication Date
JP2005197600A JP2005197600A (ja) 2005-07-21
JP2005197600A5 true JP2005197600A5 (https=) 2007-02-15
JP4361811B2 JP4361811B2 (ja) 2009-11-11

Family

ID=34747122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004004483A Expired - Fee Related JP4361811B2 (ja) 2004-01-09 2004-01-09 半導体製造装置

Country Status (5)

Country Link
US (1) US20070163502A1 (https=)
JP (1) JP4361811B2 (https=)
KR (1) KR100876692B1 (https=)
CN (1) CN100440451C (https=)
WO (1) WO2005067023A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4597847B2 (ja) * 2005-11-28 2010-12-15 株式会社フジクラ 成膜装置
JP5337482B2 (ja) 2006-05-09 2013-11-06 株式会社アルバック 薄膜製造装置
US20080006044A1 (en) * 2006-07-10 2008-01-10 Ziming Tan Method for controlling temperature
KR101008914B1 (ko) * 2007-03-29 2011-01-17 신메이와 인더스트리즈,리미티드 센서 부착구조 및 진공 성막장치
US20110168673A1 (en) * 2008-07-04 2011-07-14 Tokyo Electron Limited Plasma processing apparatus, plasma processing method, and mechanism for regulating temperature of dielectric window
WO2010114118A1 (ja) * 2009-04-03 2010-10-07 東京エレクトロン株式会社 蒸着ヘッドおよび成膜装置
JP2012169552A (ja) * 2011-02-16 2012-09-06 Tokyo Electron Ltd 冷却機構、処理室、処理室内部品及び冷却方法
JP5947023B2 (ja) * 2011-11-14 2016-07-06 東京エレクトロン株式会社 温度制御装置、プラズマ処理装置、処理装置及び温度制御方法
JP6061944B2 (ja) * 2011-12-09 2017-01-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 加熱管を冷却する熱交換器、蒸発器の加熱管、加熱管を備える蒸発器および蒸発器の加熱管を冷却する方法
JP6164776B2 (ja) * 2012-03-22 2017-07-19 株式会社日立国際電気 基板処理装置および基板処理方法
JP2013243218A (ja) 2012-05-18 2013-12-05 Tokyo Electron Ltd プラズマ処理装置、及びプラズマ処理方法
KR102102003B1 (ko) * 2012-05-25 2020-04-20 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치, 및 플라즈마 처리 방법
JP6579974B2 (ja) * 2015-02-25 2019-09-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、温度センサ及び半導体装置の製造方法
US10150184B2 (en) 2015-10-21 2018-12-11 Siemens Energy, Inc. Method of forming a cladding layer having an integral channel
US11017984B2 (en) 2016-04-28 2021-05-25 Applied Materials, Inc. Ceramic coated quartz lid for processing chamber
JP6875336B2 (ja) * 2018-08-27 2021-05-26 信越化学工業株式会社 成膜方法
JP7306195B2 (ja) * 2019-09-27 2023-07-11 東京エレクトロン株式会社 基板を処理する装置及びステージをクリーニングする方法
JP7514478B2 (ja) * 2020-12-04 2024-07-11 株式会社デンソー ウエハ処理装置及びウエハ処理方法
GB2609624A (en) * 2021-08-06 2023-02-15 Leybold Gmbh Cooling device, method for cooling a cooling element and layer deposition apparatus
CN113659022B (zh) * 2021-08-16 2023-07-21 广东贝尔试验设备有限公司 一种光伏电池划刻加工用电池芯片温度检测装置
JPWO2025069789A1 (https=) * 2023-09-29 2025-04-03

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631165B1 (fr) * 1988-05-05 1992-02-21 Moulene Daniel Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support
JPH0255292A (ja) * 1988-08-19 1990-02-23 Fujitsu Ltd 反応管の冷却方法
US5316579A (en) * 1988-12-27 1994-05-31 Symetrix Corporation Apparatus for forming a thin film with a mist forming means
CA2126731A1 (en) * 1993-07-12 1995-01-13 Frank Jansen Hollow cathode array and method of cleaning sheet stock therewith
EP0827186A3 (en) * 1996-08-29 1999-12-15 Tokyo Electron Limited Substrate treatment system
JP4053173B2 (ja) * 1999-03-29 2008-02-27 東京エレクトロン株式会社 マイクロ波プラズマ処理装置及び方法
EP1230663A1 (en) * 1999-11-15 2002-08-14 LAM Research Corporation Temperature control system for plasma processing apparatus
JP2001156047A (ja) * 1999-11-30 2001-06-08 Mitsubishi Electric Corp 半導体製造装置
JP2003059884A (ja) * 2001-08-20 2003-02-28 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2003174016A (ja) * 2001-12-07 2003-06-20 Tokyo Electron Ltd 真空処理装置
US6916502B2 (en) * 2002-02-11 2005-07-12 Battelle Energy Alliance, Llc Systems and methods for coating conduit interior surfaces utilizing a thermal spray gun with extension arm
JP4022459B2 (ja) * 2002-09-30 2007-12-19 助川電気工業株式会社 冷却器付加熱装置

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