JP2005183903A5 - - Google Patents
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- Publication number
- JP2005183903A5 JP2005183903A5 JP2004095648A JP2004095648A JP2005183903A5 JP 2005183903 A5 JP2005183903 A5 JP 2005183903A5 JP 2004095648 A JP2004095648 A JP 2004095648A JP 2004095648 A JP2004095648 A JP 2004095648A JP 2005183903 A5 JP2005183903 A5 JP 2005183903A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53226503P | 2003-12-22 | 2003-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005183903A JP2005183903A (ja) | 2005-07-07 |
| JP2005183903A5 true JP2005183903A5 (enExample) | 2007-04-26 |
Family
ID=34794224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004095648A Pending JP2005183903A (ja) | 2003-12-22 | 2004-03-29 | 電子デバイスおよび電子デバイスを形成する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050139644A1 (enExample) |
| JP (1) | JP2005183903A (enExample) |
| KR (1) | KR20050063690A (enExample) |
| CN (1) | CN100471364C (enExample) |
| TW (1) | TWI268191B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005033724A1 (de) * | 2005-07-15 | 2007-01-18 | Merck Patent Gmbh | Druckfähige Ätzmedien für Siliziumdioxid-und Siliziumnitridschichten |
| EP2124254B1 (en) * | 2007-03-22 | 2018-08-01 | Tanaka Kikinzoku Kogyo Kabushiki Kaisha | Method for hermetical sealing of piezoelectric element |
| US7724359B2 (en) * | 2008-05-27 | 2010-05-25 | Agere Systems Inc. | Method of making electronic entities |
| US8563192B2 (en) * | 2008-12-23 | 2013-10-22 | Encite Llc | Gas storage system |
| US8263177B2 (en) * | 2009-03-27 | 2012-09-11 | Kesheng Feng | Organic polymer coating for protection against creep corrosion |
| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| KR101046502B1 (ko) * | 2010-11-12 | 2011-07-04 | 주식회사 케이엠더블유 | 통신용 함체 |
| EP2572814B1 (de) * | 2011-09-20 | 2016-03-30 | Heraeus Deutschland GmbH & Co. KG | Paste und Verfahren zum Verbinden von elektronischem Bauelement mit Substrat |
| EP2769257B1 (en) * | 2011-10-20 | 2018-12-12 | SI-Ware Systems | Integrated monolithic optical bench containing a doubly-curved optical element and method of its fabrication |
| WO2013095670A1 (en) * | 2011-12-23 | 2013-06-27 | Intel Corporation | Hybrid low metal loading flux |
| JP6167494B2 (ja) * | 2012-09-26 | 2017-07-26 | セイコーエプソン株式会社 | 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器 |
| CN102922071B (zh) * | 2012-10-25 | 2014-10-08 | 哈尔滨工业大学 | 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法 |
| JP6083217B2 (ja) * | 2012-12-04 | 2017-02-22 | 三菱マテリアル株式会社 | Ａｕ−Ｓｎ−Ｂｉ合金粉末ペースト及びＡｕ−Ｓｎ−Ｂｉ合金薄膜の成膜方法 |
| KR101913994B1 (ko) * | 2015-03-10 | 2018-12-28 | 인듐 코포레이션 | 혼합 합금 땜납 페이스트 |
| WO2017015673A1 (en) * | 2015-07-23 | 2017-01-26 | Finisar Corporation | Component alignment |
| CN106132102B (zh) * | 2016-07-12 | 2018-09-07 | 北京梦之墨科技有限公司 | 液态金属双层电路制作方法及复合电路制作方法 |
| EP3385762A1 (en) * | 2017-04-03 | 2018-10-10 | Indigo Diabetes N.V. | Optical assembly with hermetically sealed cover cap |
| GB2561234B (en) | 2017-04-07 | 2019-07-24 | Ford Motor Co | A housing assembly and method |
| US10209477B1 (en) * | 2017-05-25 | 2019-02-19 | Lockheed Martin Coherent Technologies, Inc. | Systems and methods for reconfigurable micro-optic assemblies |
| DE102018201974A1 (de) * | 2018-02-08 | 2019-08-08 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit |
| JP6773093B2 (ja) * | 2018-09-20 | 2020-10-21 | 信越化学工業株式会社 | 光学素子パッケージ用リッド、光学素子パッケージ及びそれらの製造方法 |
| DE102019200775A1 (de) * | 2019-01-23 | 2020-07-23 | Robert Bosch Gmbh | Sensoreinrichtung zur Detektion von Partikeln oder Aerosol in einem strömenden Fluid unter Verwendung des Prinzips der laserinduzierten Inkandeszenz |
| US11515281B2 (en) * | 2019-04-22 | 2022-11-29 | Panasonic Holdings Corporation | Bonded structure and bonding material |
| WO2023282976A2 (en) * | 2021-05-24 | 2023-01-12 | Corning Research & Development Corporation | Systems and methods of joining substrates using nano-particles |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4557767A (en) * | 1983-10-31 | 1985-12-10 | Scm Corporation | Fusible powdered metal paste |
| US4661173A (en) * | 1986-07-25 | 1987-04-28 | Mcdonnell Douglas Corporation | Alloy-enriched solder cream |
| JPS63238994A (ja) * | 1987-03-25 | 1988-10-05 | Tdk Corp | 半田組成物 |
| US4919729A (en) * | 1988-06-08 | 1990-04-24 | International Business Machines Corporation | Solder paste for use in a reducing atmosphere |
| US5141568A (en) * | 1990-05-15 | 1992-08-25 | Hughes Aircraft Company | Water-soluble soldering paste |
| US5294242A (en) * | 1991-09-30 | 1994-03-15 | Air Products And Chemicals | Method for making metal powders |
| US5412748A (en) * | 1992-12-04 | 1995-05-02 | Kabushiki Kaisha Toshiba | Optical semiconductor module |
| US5346118A (en) * | 1993-09-28 | 1994-09-13 | At&T Bell Laboratories | Surface mount solder assembly of leadless integrated circuit packages to substrates |
| US5382300A (en) * | 1994-03-22 | 1995-01-17 | At&T Corp. | Solder paste mixture |
| US5964963A (en) * | 1994-08-25 | 1999-10-12 | Turchan; Manuel C. | Brazing paste |
| US5666643A (en) * | 1995-02-23 | 1997-09-09 | General Electric Company | High temperature braze material |
| JP3215008B2 (ja) * | 1995-04-21 | 2001-10-02 | 株式会社日立製作所 | 電子回路の製造方法 |
| JPH08294792A (ja) * | 1995-04-24 | 1996-11-12 | Yoshida Tekkosho:Kk | ろう接材料及びろう接方法 |
| JPH09318849A (ja) * | 1996-05-24 | 1997-12-12 | Fujitsu Ltd | 光伝送モジュールおよびその製造方法 |
| JP3644205B2 (ja) * | 1997-08-08 | 2005-04-27 | 株式会社デンソー | 半導体装置及びその製造方法 |
| US6205264B1 (en) * | 1998-04-14 | 2001-03-20 | Lucent Technologies Inc. | Optical assembly with improved dimensional stability |
| US6136689A (en) * | 1998-08-14 | 2000-10-24 | Micron Technology, Inc. | Method of forming a micro solder ball for use in C4 bonding process |
| GB9929521D0 (en) * | 1999-12-15 | 2000-02-09 | Secr Defence | Bonded products and methods of fabrication therefor |
| JP3423930B2 (ja) * | 1999-12-27 | 2003-07-07 | 富士通株式会社 | バンプ形成方法、電子部品、および半田ペースト |
| AU2001261952A1 (en) * | 2000-05-24 | 2001-12-03 | Stephen F. Corbin | Variable melting point solders and brazes |
| US6932519B2 (en) * | 2000-11-16 | 2005-08-23 | Shipley Company, L.L.C. | Optical device package |
| US6827503B2 (en) * | 2000-12-01 | 2004-12-07 | Shipley Company, L.L.C. | Optical device package having a configured frame |
| US6883977B2 (en) * | 2000-12-14 | 2005-04-26 | Shipley Company, L.L.C. | Optical device package for flip-chip mounting |
| US6740287B2 (en) * | 2001-02-22 | 2004-05-25 | Romain Louis Billiet | Method for making articles from nanoparticulate materials |
| JP2003166007A (ja) * | 2001-03-28 | 2003-06-13 | Tamura Kaken Co Ltd | 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物 |
| JP2002359426A (ja) * | 2001-06-01 | 2002-12-13 | Hitachi Ltd | 光モジュール及び光通信システム |
| US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
| US7416108B2 (en) * | 2002-01-24 | 2008-08-26 | Siemens Power Generation, Inc. | High strength diffusion brazing utilizing nano-powders |
| CN1152769C (zh) * | 2002-07-24 | 2004-06-09 | 北京工业大学 | 纳米颗粒增强的锡铅基复合钎料及其制备方法 |
-
2004
- 2004-03-29 JP JP2004095648A patent/JP2005183903A/ja active Pending
- 2004-12-15 TW TW093138885A patent/TWI268191B/zh not_active IP Right Cessation
- 2004-12-17 KR KR1020040107550A patent/KR20050063690A/ko not_active Ceased
- 2004-12-21 CN CNB2004100821419A patent/CN100471364C/zh not_active Expired - Fee Related
- 2004-12-22 US US11/020,406 patent/US20050139644A1/en not_active Abandoned