JP2005183903A5 - - Google Patents

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Publication number
JP2005183903A5
JP2005183903A5 JP2004095648A JP2004095648A JP2005183903A5 JP 2005183903 A5 JP2005183903 A5 JP 2005183903A5 JP 2004095648 A JP2004095648 A JP 2004095648A JP 2004095648 A JP2004095648 A JP 2004095648A JP 2005183903 A5 JP2005183903 A5 JP 2005183903A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004095648A
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JP2005183903A (ja
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Publication of JP2005183903A publication Critical patent/JP2005183903A/ja
Publication of JP2005183903A5 publication Critical patent/JP2005183903A5/ja
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JP2004095648A 2003-12-22 2004-03-29 電子デバイスおよび電子デバイスを形成する方法 Pending JP2005183903A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53226503P 2003-12-22 2003-12-22

Publications (2)

Publication Number Publication Date
JP2005183903A JP2005183903A (ja) 2005-07-07
JP2005183903A5 true JP2005183903A5 (ja) 2007-04-26

Family

ID=34794224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004095648A Pending JP2005183903A (ja) 2003-12-22 2004-03-29 電子デバイスおよび電子デバイスを形成する方法

Country Status (5)

Country Link
US (1) US20050139644A1 (ja)
JP (1) JP2005183903A (ja)
KR (1) KR20050063690A (ja)
CN (1) CN100471364C (ja)
TW (1) TWI268191B (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005033724A1 (de) * 2005-07-15 2007-01-18 Merck Patent Gmbh Druckfähige Ätzmedien für Siliziumdioxid-und Siliziumnitridschichten
KR101181579B1 (ko) 2007-03-22 2012-09-10 다나까 홀딩스 가부시끼가이샤 봉지용 금속 페이스트, 압전소자의 기밀 봉지방법, 및 압전 디바이스
US7724359B2 (en) * 2008-05-27 2010-05-25 Agere Systems Inc. Method of making electronic entities
US8563192B2 (en) * 2008-12-23 2013-10-22 Encite Llc Gas storage system
US8263177B2 (en) * 2009-03-27 2012-09-11 Kesheng Feng Organic polymer coating for protection against creep corrosion
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
KR101046502B1 (ko) * 2010-11-12 2011-07-04 주식회사 케이엠더블유 통신용 함체
HUE028880T2 (en) * 2011-09-20 2017-01-30 Heraeus Deutschland Gmbh & Co Kg Paste and process for connecting electronic components with a carrier
US9046690B2 (en) * 2011-10-20 2015-06-02 Si-Ware Systems Integrated monolithic optical bench containing 3-D curved optical elements and methods of its fabrication
US9950393B2 (en) * 2011-12-23 2018-04-24 Intel Corporation Hybrid low metal loading flux
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
CN102922071B (zh) * 2012-10-25 2014-10-08 哈尔滨工业大学 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法
JP6083217B2 (ja) * 2012-12-04 2017-02-22 三菱マテリアル株式会社 Ａｕ−Ｓｎ−Ｂｉ合金粉末ペースト及びＡｕ−Ｓｎ−Ｂｉ合金薄膜の成膜方法
CN107530834A (zh) * 2015-03-10 2018-01-02 铟泰公司 混合合金焊料膏
WO2017015673A1 (en) * 2015-07-23 2017-01-26 Finisar Corporation Component alignment
CN106132102B (zh) * 2016-07-12 2018-09-07 北京梦之墨科技有限公司 液态金属双层电路制作方法及复合电路制作方法
EP3385762A1 (en) * 2017-04-03 2018-10-10 Indigo Diabetes N.V. Optical assembly with hermetically sealed cover cap
GB2561234B (en) 2017-04-07 2019-07-24 Ford Motor Co A housing assembly and method
US10209477B1 (en) * 2017-05-25 2019-02-19 Lockheed Martin Coherent Technologies, Inc. Systems and methods for reconfigurable micro-optic assemblies
DE102018201974A1 (de) * 2018-02-08 2019-08-08 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit
JP6773093B2 (ja) * 2018-09-20 2020-10-21 信越化学工業株式会社 光学素子パッケージ用リッド、光学素子パッケージ及びそれらの製造方法
DE102019200775A1 (de) * 2019-01-23 2020-07-23 Robert Bosch Gmbh Sensoreinrichtung zur Detektion von Partikeln oder Aerosol in einem strömenden Fluid unter Verwendung des Prinzips der laserinduzierten Inkandeszenz
US11515281B2 (en) * 2019-04-22 2022-11-29 Panasonic Holdings Corporation Bonded structure and bonding material

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557767A (en) * 1983-10-31 1985-12-10 Scm Corporation Fusible powdered metal paste
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream
JPS63238994A (ja) * 1987-03-25 1988-10-05 Tdk Corp 半田組成物
US4919729A (en) * 1988-06-08 1990-04-24 International Business Machines Corporation Solder paste for use in a reducing atmosphere
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5294242A (en) * 1991-09-30 1994-03-15 Air Products And Chemicals Method for making metal powders
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5382300A (en) * 1994-03-22 1995-01-17 At&T Corp. Solder paste mixture
US5964963A (en) * 1994-08-25 1999-10-12 Turchan; Manuel C. Brazing paste
US5666643A (en) * 1995-02-23 1997-09-09 General Electric Company High temperature braze material
JP3215008B2 (ja) * 1995-04-21 2001-10-02 株式会社日立製作所 電子回路の製造方法
JPH08294792A (ja) * 1995-04-24 1996-11-12 Yoshida Tekkosho:Kk ろう接材料及びろう接方法
JPH09318849A (ja) * 1996-05-24 1997-12-12 Fujitsu Ltd 光伝送モジュールおよびその製造方法
JP3644205B2 (ja) * 1997-08-08 2005-04-27 株式会社デンソー 半導体装置及びその製造方法
US6205264B1 (en) * 1998-04-14 2001-03-20 Lucent Technologies Inc. Optical assembly with improved dimensional stability
US6136689A (en) * 1998-08-14 2000-10-24 Micron Technology, Inc. Method of forming a micro solder ball for use in C4 bonding process
GB9929521D0 (en) * 1999-12-15 2000-02-09 Secr Defence Bonded products and methods of fabrication therefor
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
WO2001089757A1 (en) * 2000-05-24 2001-11-29 Corbin Stephen F Variable melting point solders and brazes
US6932519B2 (en) * 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
US6740287B2 (en) * 2001-02-22 2004-05-25 Romain Louis Billiet Method for making articles from nanoparticulate materials
JP2003166007A (ja) * 2001-03-28 2003-06-13 Tamura Kaken Co Ltd 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物
JP2002359426A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd 光モジュール及び光通信システム
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
US7416108B2 (en) * 2002-01-24 2008-08-26 Siemens Power Generation, Inc. High strength diffusion brazing utilizing nano-powders
CN1152769C (zh) * 2002-07-24 2004-06-09 北京工业大学 纳米颗粒增强的锡铅基复合钎料及其制备方法

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