JP2005149958A - Socket for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid increasing of a packaging area on a printed circuit board in a socket for a semiconductor device, while sufficiently ensuring a distance between electrode pads on the printed circuit board, even when a distance between terminals of a terminal portion narrows with increasing the quantity of individual portions of the semiconductor device. <P>SOLUTION: In a lead frame 54, the center position at the top end of a contacting pin group 60 is deflected to a left side by a predetermined distance, compared with the center position at the top end of a contacting pin group 62; and the terminals 62d of the lead frame 54, mutually overlaid via spacers 56, are arranged in a staggered configuration. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor device socket having a contact pin module for electrically connecting a semiconductor device to be tested to a wiring board.

  A semiconductor device socket used for a burn-in test of a semiconductor device is generally referred to as an IC socket. For example, as disclosed in Patent Document 1, a semiconductor device as an object to be inspected is supplied with a predetermined test voltage. Is disposed on a printed wiring board having an input / output unit for sending out an abnormality detection signal representing a short circuit from the terminal.

  As shown in Patent Document 1, for example, as shown in Patent Document 1, contacts to electrically inspect each terminal portion of the semiconductor device and each electrode pad of the printed wiring board are connected to each other in the IC socket in the IC socket. A contact pin module is provided as an assembly of pins. Such a contact pin module includes, for example, a test object side contact pin group electrically connected to each terminal of the semiconductor device and a wiring board side contact pin group electrically connected to each electrode of the printed wiring board. Are formed by stacking a plurality of lead frames formed on the same plane. Therefore, each terminal of the inspected object side contact pin group and each fixed terminal of the wiring board side contact pin group are arranged in a grid, for example.

  Further, in the IC socket, as shown in Patent Document 2, in order to ensure electrical connection and shorten the length in the direction orthogonal to the arrangement direction of the contact pins on the common plane in the lead frame. Further, the distance between the contact pins in the wiring board side contact pin group in the arrangement direction is enlarged so as to be larger than the distance between corresponding contact pins in the object-side contact pin group. Proposed.

JP 2002-202344 A JP 2000-331766 A

  In recent years, semiconductor devices tend to have a so-called fine pitch in which the number of terminals increases and the distance between the terminals decreases. At that time, it is desired that the distance between the electrode pads of the printed wiring board is sufficiently ensured from the viewpoint of electrical safety.

  However, in such a current situation, when the contact pin module of the IC socket is arranged on an existing printed wiring board having a predetermined mounting area and corresponds to a semiconductor device having a fine pitch, the printed wiring board In particular, when the distance between the contact pins of the wiring board side contact pin group is enlarged as described above, the contact of the wiring board side contact pin group may be insufficient. The occupied area of the pins also increases, and there is a possibility that the number of IC sockets that can be arranged on the wiring board may be reduced. Therefore, there is a disadvantage that an existing size printed wiring board cannot be used.

  In view of the above problems, the present invention is a socket for a semiconductor device having a contact pin module for electrically connecting a semiconductor device to be tested to a wiring board, and the number of each terminal portion of the semiconductor device is Even when the distance between the terminals is increased, the distance between the electrode pads on the printed wiring board can be sufficiently secured, and the mounting area on the printed wiring board in the socket for the semiconductor device can be secured. An object of the present invention is to provide a socket for a semiconductor device that can avoid an increase in the size of the socket.

  In order to achieve the above-described object, a socket for a semiconductor device according to the present invention includes a plurality of test object side connection terminals having one end electrically connected to an electrode portion of a semiconductor device on a common plane. Each fixed-side connection terminal connected to the other end of each inspection-object-side connection terminal of the inspection-object-side connection terminal group and each other of the inspection-object-side connection terminals is larger than the distance between the inspection-object-side connection terminals. A plurality of fixed-side connection terminal groups that are connected to a wiring board that has a plurality of distances on a common plane and are electrically connected to the electrode portions of the semiconductor device, an inspected object-side connection terminal group, and a fixed-side connection terminal group A supporting member that supports an intermediate portion between the support member, an object-side connection terminal group and a fixed-side connection terminal group that are supported by the support member, and an insulating member that is arranged so that the fixed-side connection terminal group is arranged in a staggered manner. A holding member that is held in layers and is held by the holding member. A module housing portion that accommodates the inspected object side connection terminal group and the fixed side connection terminal group, and a position along the arrangement direction of each fixed side connection terminal on a common plane of the fixed side connection terminal group, It is characterized by being relatively deviated by a predetermined distance in one direction with respect to the inspected object side connection terminal group.

  As is apparent from the above description, the socket for a semiconductor device according to the present invention is such that the position along the arrangement direction of each fixed-side connection terminal on the common plane of the fixed-side connection terminal group is the inspected object-side connection terminal. A test object side connection terminal supported by a support member through an insulating member so that the fixed side connection terminal group is arranged in a staggered manner in a predetermined distance relative to the group in one direction. Even when the number of each terminal portion of the semiconductor device is increased and the distance between the terminal portions is narrow, since the holding member that holds the plurality of groups and the fixed side connection terminal group in a stacked manner is provided. The distance between the electrode pads on the printed wiring board can be sufficiently secured, and an increase in the mounting area on the printed wiring board in the semiconductor device socket can be avoided.

  5 and 6 respectively show the overall configuration of an example of a semiconductor device socket according to the present invention together with a printed wiring board.

  In FIG. 5, the socket for a semiconductor device is supplied with a predetermined inspection signal and has an input / output unit for sending out an abnormality detection signal representing a short circuit or the like from the semiconductor device as each object to be inspected. Positioned on the top.

  A plurality of semiconductor device sockets are arranged vertically and horizontally at predetermined positions on the printed wiring board 32. The socket for a semiconductor device includes a socket main body 30 having a housing portion in which the semiconductor devices are detachably mounted one by one, and a cover member that performs a holding or releasing operation of pressing members 42A and 42B of the socket main body 30 described later. 44 and a contact pin module 34 disposed in the socket main body 30 and electrically connecting the terminal group of the semiconductor device and the electrode pad portion of the printed wiring board 32 as main elements. . In FIG. 5, one socket for a semiconductor device is shown as a representative.

  As shown in FIG. 7, the socket body 30 is mounted on the contact pin module 34 that electrically connects each electrode pad portion of the printed wiring board 32 and the terminal of the semiconductor device 38, and on the upper surface of the contact pin module 34. The alignment plate / positioning member 40 for positioning each electrode of the semiconductor device 38 with respect to the terminal portion of the contact pin module 34 and accommodating the semiconductor device 38, and the socket body portion 30, A cover member 44 that is arranged so as to be movable up and down so as to surround the contact pin module 34 and that selectively rotates a pair of pressing members 42A and 42B (see FIGS. 5 and 6) described later, and the cover member 44 Each pin of the semiconductor device 38 is connected to the contact pin via the alignment plate / positioning member 40 in conjunction with the lifting / lowering operation of A pressing member 42A and 42B are selectively pressed against Joule 34, a is configured to include as main components.

  The semiconductor device 38 as an object to be inspected is a BGA type, for example, a substantially square semiconductor element. In the substantially square semiconductor device 38, a bump-shaped electrode to be connected to the contact pin module 34 through the through hole of the alignment plate / positioning member 40 is the entire surface facing the alignment plate / positioning member 40 as a terminal. A plurality of them are formed at predetermined intervals. The distance between the electrodes is, for example, about 0.4 mm.

  The socket body 30 is formed of a heat-resistant plastic material, for example, a polyimide resin. On the bottom surface of the socket body 30, positioning pins 30P are provided at four locations. The bottom surface of the socket body 30 is fixed at a predetermined position on the printed wiring board 32 by a screw fastener (not shown).

  Moreover, the bottom part of the socket main-body part 30 is formed with a recess 30g extending along the longitudinal direction over the entire bottom part. In addition, a concave portion 30r into which the lower alignment plate / positioning plate is fitted intersects the concave portion 30g at a substantially central portion on the bottom surface portion.

  A module housing portion 36M for housing the contact pin module 34 is formed at a substantially central portion of the socket main body portion 30. A pair of recesses (not shown) are provided around the module housing portion 36M so as to face each other. When the cover member 44 is lowered, the lower end portion of the arm member 44A formed integrally with the cover member 44 and the base end portions of the pressing members 42A and 42B are selectively inserted into the recesses. Is done. The base end portions of the pressing members 42A and 42B are connected to the lower end of the arm member 44A by inserting the connecting pin CP into the hole at the lower end of the arm member 44A.

  Guide members 36TA and 36TB are formed opposite to each other at the periphery of each recess. Since the guide members 36TA and 36TB have the same structure, the guide member 36TA will be described, and the description of the guide member 36TB will be omitted.

  The guide member 36TA has wall portions that face each other across the pressing member 42A. On the inner surface of each wall portion, a groove 36ag for guiding the guide pin AP of the pressing member 42A in FIG. In addition, spring receiving portions (one end of a coil spring 46 that urges the cover member 46 in a direction away from the socket main body 30 are arranged at both ends of the socket main body 30 outside the guide member 36TA. (Not shown) is formed.

  In addition, on the inner surface of each wall portion of the guide member 36TB, the groove for guiding the guide pin of the pressing member 42B is obliquely leftward and downward so that it intersects the extension line extending in the extending direction of the groove 36ag. It is slanted at a predetermined angle.

  The module housing portion 36M includes a small-diameter portion 36ma, medium-diameter portions 36mb and 36mc, and a large-diameter portion 36md corresponding to the cross-sectional shape of the contact pin module 34 described later. The small diameter portion 36ma, the medium diameter portions 36mb and 36mc, and the large diameter portion 36md are formed on a common central axis.

  The small diameter portion 36ma and the medium diameter portion 36mb communicate with a space formed between the alignment plate / positioning member 40 disposed above the small diameter portion 36ma and the medium diameter portion 36mb. The small-diameter portion 36ma, the medium-diameter portion 36mb, and the large-diameter portion 36md are used for the respective contacts of the alignment plate / positioning member 40 of the contact pin module 34 by engaging the outer peripheral portion of the contact pin module 34 to be accommodated. Position relative to the hole.

  A surface 36sa that becomes a stepped portion between the small diameter portion 36ma and the medium diameter portion 36mb is in contact with the stepped portions 52ae and 50ae of the side plates 52 and 50 of the contact pin module 34, respectively.

  Further, a surface 36sb that is a stepped portion between the large diameter portion 36md and the medium diameter portion 36mc is in contact with the step portions 50be and 52be of the side plates 52 and 50 of the contact pin module 34, respectively.

  Therefore, the contact pin module 34 and its terminal portion are positioned with respect to the module housing portion 36M of the socket main body portion 30 and an alignment plate / positioning member 40 described later.

  Further, the alignment plate / positioning plate 70 fitted into the recesses 30r and 30g supports the terminal portion on the printed wiring board 32 side in the contact pin module 34. The alignment plate / positioning plate 70 has a plurality of through holes corresponding to the terminal portions on the printed wiring board 32 side, and is fitted into the holes of the printed wiring board 32 as shown in FIGS. Has positioning pins.

  As a result, the relative position between the terminal group on the printed wiring board 32 side of the contact pin module 34 positioned in the module housing portion 36M and the electrode pad of the printed wiring board 32 is positioned. At that time, the terminal portion on the printed wiring board 32 side of the contact pin module 34 is displaced by a predetermined amount when the socket body 30 is fixed on the printed wiring board 32. Therefore, the terminal group on the printed wiring board 32 side of the contact pin module 34 comes into contact with the electrode pad of the printed wiring board 32 with a predetermined contact force.

  As shown in FIG. 9, the alignment plate / positioning member 40 is formed in a flat plate shape so as to connect the positioning portion 40A, which respectively supports the four corners of the semiconductor device 38 as an object to be inspected, and the positioning portion 40A. And a flat plate-like portion 40B.

  In the flat plate portion 40B, a relatively small concave portion 40ai (i = 1 to n, n is a positive integer) corresponding to each terminal of the semiconductor device 38 is vertically and horizontally set to a predetermined center distance, for example, about 0. It is formed with 4 mm. The concave portion 40ai communicates with a through hole 40bi (i = 1 to n, n is a positive integer) into which each terminal portion of the contact pin module 34 is movably inserted. Accordingly, the recess 40ai positions the relative position of each terminal of the semiconductor device 38 with respect to the flat plate-like portion 40B, and positions the relative position of each terminal of the semiconductor device 38 with respect to the terminal group of the contact pin module 34. Become.

  As shown in FIG. 7, the alignment plate / positioning member 40 is arranged along the pressing direction of the pressing members 42 </ b> A and 42 </ b> B by coil springs SP provided between the bottoms of the low and high holes of the socket body 30. It is supported so as to be movable within a predetermined range.

  In the above example, the alignment plate / positioning member 40 is used to position the relative position of each terminal of the semiconductor device 38 with respect to the terminal portion of the contact pin module 34. However, the present invention is not limited to this example. For example, the semiconductor device 38 is directly movably fitted to the peripheral wall of the opening end of the module housing portion 36 </ b> M formed so as to be fitted to the outer peripheral portion of the semiconductor device 38. The relative position of each terminal with respect to the terminal portion of the contact pin module 34 may be positioned.

  5 and 7, each side of the outer peripheral portion of the socket main body 30 has a groove 30G in which eight claw portions 44N formed integrally with the lower end of the cover member 44 are movably engaged. Is formed. The groove 30 </ b> G is formed along the moving direction of the cover member 44. Further, as shown in FIG. 7, when the cover member 44 takes the uppermost end position, the end of each claw 44N is locked to the end of each groove 30G.

  As shown in FIGS. 6 and 7, the frame-shaped cover member 44 has an opening 44a through which the outer periphery of the upper end portion of the semiconductor device 38 or the guide members 36TA and 36TB passes in the central portion.

  Arm members 44 </ b> A and 44 </ b> B connected to the pressing members 42 </ b> A and 42 </ b> B project toward the socket body 30 at portions of the cover member 44 that face the respective recesses of the socket body 30.

  The arm member 44A has a gap so as to pinch the proximal end portion of the pressing member 42A. Each arm member 44A has a hole into which a pin CP that connects the arm member 44A and the pressing member 42A is inserted. The arm member 44B also has a similar structure so as to pinch the proximal end portion of the pressing member 42B in a rotatable manner.

  As shown in FIG. 7, a plurality of claw portions 44 </ b> N engaged with the grooves 30 </ b> G of the socket body portion 30 protrude toward the socket body portion 30 at both ends in the longitudinal direction of the cover member 44. ing.

  Further, at the portions of the cover member 44 facing the spring receiving portions in the socket main body 30, spring receiving portions 44S are provided at four locations, respectively. The other end of the coil spring 46 that urges the cover member 44 in a direction away from the socket main body 30 is disposed in the spring receiving portion 44S.

  The pressing member 42A includes a base end portion having a hole into which the above-described pin CP is rotatably inserted, a pressing surface portion that is selectively brought into contact with the upper surface of the semiconductor device 38, a base end portion, and a pressing surface portion. And a connecting portion to be connected.

  The connecting portion of the pressing member 42A is provided with a guide pin AP that is movably engaged with both grooves 36ag. In addition, since the pressing member 42B provided symmetrically with respect to the pressing member 42A has the same configuration as that of the pressing member 42A, the description thereof is omitted.

  Therefore, when the cover member 44 is pressed so as to be close to the socket body 30 against the biasing force of the coil spring 46 as shown in FIG. 5, the base ends of the pressing members 42A and 42B are respectively As the guide pins AP are guided in the grooves 36ag, the pressing surfaces of the pressing members 42A and 42B are separated from each other. That is, the upper part of the module housing part 36M of the socket body part 30, that is, the upper part of the alignment plate / positioning member 40 is opened.

  On the other hand, when the cover member 44 is raised by the urging force of the coil spring 46 as shown in FIGS. 5 and 7, the base end portions of the pressing members 42A and 42B are raised synchronously, respectively. As the guide pins AP are guided in the grooves 36ag, the pressing surface portions of the pressing members 42A and 42B are brought close to each other. In other words, the pressing surface portions of the pressing members 42A and 42B are caused to enter the alignment plate / positioning member 40 of the socket main body portion 30, respectively.

  As shown in FIGS. 2 and 4, the contact pin module 34 is formed between the side plates 50 and 52, which form both end portions in the Z-coordinate direction in FIG. 4, and between the side plates 50 and 52. A plurality of lead frames 54 (see FIG. 8), which are arranged so as to be substantially parallel to each other via spacers 56 and arranged as an aggregate, are configured as main elements.

  The plate-like side plates 50 and 52 are made of a plastic material, for example, polyimide resin, and have the same structure as each other. Therefore, the side plate 50 will be described and the description of the side plate 52 will be omitted.

  In the side plate 50, through holes 50a into which coupling pins 58 described later are respectively fitted are provided at two positions with a predetermined interval.

  Both end portions of the side plate 50 formed so as to extend toward the end are each formed in a step shape. At each end, stepped portions 50ae and 50be are formed respectively corresponding to the surfaces 30sa and 30sb that become the stepped portions of the module housing portion 36M described above. A portion between the stepped portion 50ae and the stepped portion 50be is connected stepwise.

  Each of the thin plate-like spacers 56 is made of an insulating material, and has two through holes into which the coupling pins 58 are fitted, corresponding to the through holes 50 a and 52 a of the side plates 50 and 52. . Each spacer 56 has a stepped portion corresponding to the stepped portions 50ae, 50be, 52ae, and 52be of the side plates 50 and 52, respectively.

  As shown in FIG. 8, each lead frame 54 has a contact pin group 60 as a test object side connection terminal group electrically connected to a terminal of the semiconductor element 38, and the same plane as the contact pin group 60. A contact pin group 62 as a fixed-side connection terminal group that is formed on the printed circuit board 32 and electrically connected to the electrode of the printed wiring board 32, and an intermediate connection portion 68 between the contact pin group 60 and the contact pin group 62 (see FIG. 11). And a support plate 64 that supports the contact pin groups 60 and 62.

  Each of the contact pins 54pi (i = 1 to n, n is a positive integer) forming the contact pin groups 60 and 62 in the lead frame 54 is composed of one lead. The contact pins 54pi are arranged on a common plane at a predetermined interval in the X coordinate direction indicated by the arrow X in FIG.

  The number of contact pins 54pi is set according to the number of terminals of the semiconductor element 38 and the arrangement form, or the number of electrode pads of the printed wiring board 32. The number of contact pins 54pi may be 22, 31 or the like, for example. That is, the number of contact pins 54pi may be an even number or an odd number.

  The distance between the tips of the contact pins 54pi in the contact pin groups 60 and 62 is also set according to the pitch between the terminals of the semiconductor element 38 and the pitch between the electrode pads of the printed wiring board 32. The distance between the centers of the contact pins 54pi in the contact pin groups 60 and 62 is different from each other, for example, and is set to about 0.4 mm and about 0.6 mm. Accordingly, the distance between the tips of the contact pins 54pi in the contact pin group 60 is set smaller than the distance between the tips of the contact pins 54pi in the contact pin group 62.

  At this time, for example, when the number of contact pins 54pi is 22, the distance Lac from the end of the contact pin group 60 to the center position (position between the 11th terminal and the 12th terminal) is This is half the width La of the tip of the contact pin group 60. On the other hand, the distance Lbc from the end of the tip of the contact pin group 62 to the center position (position between the eleventh terminal and the twelfth terminal) is half of the width Lb of the tip of the contact pin group 62. Further, the center position from the end of the tip of the contact pin group 60 is biased to the left side by a predetermined distance DL, for example, 0.15 mm as compared to the center position of the tip of the contact pin group 62.

  The contact pin 54pi includes a terminal part 60d that forms a terminal group of the contact pin group 60, a connecting line part 68f supported by the support plate 64, a curved part 60b that connects the terminal part 60d and the connecting line part 68f, The terminal part 62d which forms the terminal group of the contact pin group 62, and the curved part 62b which connects the terminal part 62d and the connection line part 68f are comprised.

  The tip of the terminal portion 60d formed in a linear shape is formed in an arc shape according to the shape of the terminal of the semiconductor element 38, for example. The shape of the curved portion 60b is convex toward the X-coordinate direction indicated by the arrow X in FIG. 8, and the plate thickness according to the appropriate contact force between the terminal of the semiconductor element 38 and the tip of the terminal portion 60d, The width and radius of curvature are set. Therefore, the bending rigidity (spring constant) of the bending portion 60b, that is, the elastic force generated by the displacement of the bending portion 60b is set according to the appropriate contact force between the terminal of the semiconductor element 38 and the tip of the terminal portion 60d. It will be. At this time, the curvature radii of the curved portions 60b of the contact pins 54pi adjacent to each other are set to be substantially the same in order to make the contact forces of the respective terminal portions 60d substantially the same.

  In FIG. 11, one end of the connecting line portion 68f on the right end extends in parallel with the terminal portion 60d after being coupled to one end of the bending portion 60b at a predetermined angle, as shown in FIG. , And is coupled to one end of the curved portion 62b at a predetermined angle. On the other hand, in FIG. 11, one end of the connecting line portion 68f at the left end is coupled to one end of the curved portion 60b at a predetermined angle so as to be symmetrical with one end of the connecting line portion 68f at the right end. It extends parallel to 60d, and is coupled to one end of the curved portion 62b at a predetermined angle. Each of the connecting line portions 68f positioned between the right end connecting line portion 68f and the left end connecting line portion 68f is formed in a substantially linear shape toward the center position.

  On the other hand, the tip of the linearly formed terminal portion 62d that forms the terminal group of the contact pin group 62 is formed in a spire shape, for example, in order to reduce electrical resistance with the electrode pad of the printed wiring board 32. Yes. The bending portion 62b has a plate thickness, a width, and a radius of curvature set according to an appropriate contact force between the electrode pad of the printed wiring board 32 and the tip of the terminal portion 62d. Therefore, the bending rigidity (spring constant) of the bending portion 62b, that is, the elastic force generated by the displacement of the bending portion 62b is set according to an appropriate contact force between the electrode pad of the printed wiring board 32 and the tip of the terminal portion 62d. Will be.

  The shape of the bending portion 62b is convex in the direction opposite to the bending portion 60b in the X coordinate direction indicated by the arrow X in FIG. 8, and the plate thickness, width, and curvature of the bending portion 62b according to the appropriate contact force. The radius is set. At this time, the curvature radii of the curved portions 62b of the contact pins 54pi adjacent to each other are set to be substantially the same in order to make the contact forces of the respective terminal portions 62d substantially the same.

  As shown in FIG. 8, the support plate 64 formed of a resin material is formed so as to cover the outer periphery of the connecting line portion 68f. The support plate 64 has an opening 64b at the center. Further, through holes 64a into which the above-described coupling pins 58 are inserted are formed at both ends of the support plate 64, respectively.

  That is, the contact forces in the terminal groups of the contact pin group 60 and the contact pin group 62 are individually set by changing the shapes of the curved portions 60b and 62b, respectively. In addition, the length from the tip of the terminal portion 62d to the vicinity of the connecting line portion 68f and the length from the tip of the terminal portion 60d to the vicinity of the connecting line portion 68f are set to be substantially the same, so that the curved portions 60b and 62b Since the contact force can be individually set by changing the shape of the contact pin module, the contact pin module can be easily downsized.

  When assembling the contact pin module 34, as shown in FIG. 9A, the obtained lead frame 54 and a pair of spacers 56 are alternately arranged along the Z coordinate direction of FIG. Is done. At this time, in FIG. 9A, for example, the lead frames 54 overlapped with each other via the spacer 56 are overlapped so that the curved portions 60b and 62b of the contact pin 54pi are arranged in line symmetry. Therefore, as shown in FIGS. 3 and 10A, the terminal portions 60d of the contact pins 54pi are arranged in a plurality of rows on the same straight line and at the same pitch in the vertical and horizontal directions.

  On the other hand, the terminal portion 62d of the contact pin 54pi is biased to the left by a predetermined distance DL as compared with the center position of the tip of the contact pin group 62, as described above. Therefore, as shown in FIG. 1, FIG. 9 (B), and FIG. 10 (B), they are arranged in a staggered pattern. As a result, the pitch between adjacent rows, that is, the pitch in the Z-coordinate direction is about 0.4 mm, as shown in FIG. The distance between the terminal portions 62d in the X-coordinate direction between the two terminals is, for example, half the pitch of the terminal portions 62d, that is, about 0.3 mm.

  Furthermore, the area of the common portions A1 and A2 that overlap in FIG. 9A between the lead frames 54 arranged opposite to each other is larger than that of a conventional contact pin module as shown in, for example, Patent Document 1 described above. Therefore, when a test is performed by supplying an inspection signal to the semiconductor device 38 through the printed wiring board 32 and each contact terminal group, the capacitance between the parallel surfaces of the lead frames 54 is larger than that of the conventional one. Will be reduced.

  When manufacturing a plurality of lead frames 54 as described above at a time, as shown in FIGS. 11 and 12, for example, first, a predetermined etching process is performed on a thin frame member material, and a resin By performing a process such as a covering process, the lead frames 54 having the support plates 64 are formed in the plurality of openings 66H of the single frame member 66, respectively. Next, each lead frame 54 is obtained by cutting the coupling portions 66a, 66b, 66c, 66d, 66e, and 66f between the lead frame 54 and the peripheral edge of each opening 66H.

  Next, when assembling the contact pin module 34, as shown in FIG. 4, the obtained lead frames 54 and the pair of spacers 56 are alternately arranged as described above and overlapped with each other. At that time, the pair of spacers 56 are arranged so that the through holes thereof coincide with the through holes 50 a and 52 a of the side plates 50 and 52 and the through holes 64 a of the support plate 64 of the lead frame 54. Further, the terminal portions 60 d and 62 d of the lead frame 54 are fitted into the recesses (not shown) of the spacer 56, respectively.

  Subsequently, the side plates 50 and 52 are arranged so as to sandwich the superimposed lead frame 54 and spacer 56.

  Then, the coupling pins 58 are inserted into the through holes 50a and 52a so that the lead frame 54, the spacer 56, and the side plates 50 and 52 are integrated. Thereby, the contact pin module 34 itself is completed as shown in FIG.

  In such a configuration, when testing the semiconductor element 38, first, as shown in FIG. 5, the tip of the arm of the work robot (not shown) is brought into contact with the upper surface of the cover member 44 to It is pressed downward against the urging force. Thereby, the front ends of the pressing members 42A and 42B are separated from each other to be opened. Further, the semiconductor element 38 is sucked and held by a transfer arm of a transfer robot (not shown) and transferred to a position directly above the opening 44a of the cover member 44 and the positioning portion 40A of the alignment plate 40.

  Next, the semiconductor element 38 sucked and held by the transfer arm is lowered through the space formed between the pressing members 42A and 42B, and positioned and mounted on the flat plate portion 40B through the positioning portion 40A. At that time, the respective terminals of the semiconductor element 38 are in contact with the concave portions of the flat plate portion 40B.

  Subsequently, when the cover member 44 is lifted with the front end of the work robot in contact with the upper surface of the cover member 44, the cover member 44 is moved from the open position to the test position by the biasing force of the coil spring 46, as shown in FIG. Can be raised.

  At this time, the pressing surface portions of the pressing members 42A and 42B are rotated at substantially the same timing to press the semiconductor element 38 toward the terminal group of the contact pin module 34. As a result, the semiconductor element 38 is pressed by the pressing surface portions of the pressing members 42A and 42B, and as a result, the semiconductor element 38 is pressed evenly with a predetermined pressure toward the flat plate portion 40B. Further, the terminal portion 60d of the contact pin module 34 is displaced and comes into contact with the terminal of the semiconductor element 38 with a predetermined contact force. At that time, the applied pressing force is not transmitted to the terminal portion 62 d of the contact pin module 34.

  When an inspection signal is supplied to the input / output unit of the printed circuit board 32 while the cover member 44 is maintained at the test position, the inspection signal is supplied to the semiconductor element 38 through the contact pin module 34 and When a circuit abnormality is detected, an abnormality detection signal from the semiconductor element 38 is supplied to an external failure diagnosis device through the input / output unit.

  When the inspection of the semiconductor element 38 is completed, the tip of the arm of the work robot is brought into contact with the upper surface of the cover member 44 in order to take out the semiconductor element 38 and mount a new semiconductor element 38 as described above. The coil spring 46 is pressed downward against the biasing force. The tested semiconductor element 38 is removed from the alignment plate / positioning member 40 by the transfer arm, and a new semiconductor element 38 to be tested is mounted in the same manner as described above.

  In the above example, the number of the terminal portions 60d and 62d of each lead frame 54 is the same. However, the present invention is not limited to this example, and for each lead frame according to the terminal arrangement of the semiconductor element 38. Needless to say, the contact pins may be thinned out as appropriate.

  13 and 14A and 14B show an example of another lead frame used in an example of a socket for a semiconductor device according to the present invention.

  In FIG. 13, each lead frame 54 ′ is on the same plane as the contact pin group 60 ′ as a test object side connection terminal group electrically connected to the terminal of the semiconductor element 38 and the contact pin group 60 ′. A contact pin group 62 ′ as a fixed-side connection terminal group that is formed and electrically connected to the electrode of the printed wiring board 32, and a connecting portion 68 ′ between the contact pin group 60 ′ and the contact pin group 62 ′ are provided. And a support plate 64 that supports the contact pin groups 60 and 62. In FIG. 13, components that are the same as those in the example shown in FIG. 8 are given the same reference numerals, and redundant description thereof is omitted.

  In the example shown in FIG. 8, the center position at the tip of the contact pin group 60 is biased to the left by a predetermined distance DL, for example, 0.15 mm, compared to the center position of the tip of the contact pin group 62. Instead, in the example shown in FIG. 13, the center position at the tip of the contact pin group 60 ′ is a predetermined distance DL ′, for example, 0.2 mm, compared to the center position of the tip of the contact pin group 62 ′. It is assumed that it is biased to the left only.

  Also in the example shown in FIG. 13, the distance between the tips of the contact pins 54 ′ pi in the contact pin groups 60 ′ and 62 ′ is also the pitch between the terminals of the semiconductor element 38 and the distance between the electrode pads of the printed wiring board 32. Is set according to the pitch. The distances between the centers of the tips of the contact pins 54'pi in the contact pin groups 60 'and 62' are different from each other, and are set to about 0.4 mm and about 0.6 mm, for example. Accordingly, the distance between the tips of the contact pins 54'pi in the contact pin group 60 'is smaller than the distance between the tips of the contact pins 54'pi in the contact pin group 62'.

  The contact pin 54′pi has a structure similar to that of the above-described contact pin 54ai, and a terminal portion 60′d that forms a terminal group of the contact pin group 60 ′ and a connecting line portion 68 ′ that is supported by the support plate 64. f, a curved portion 60'b that connects the terminal portion 60'd and the connecting line portion 68'f, a terminal portion 62'd that forms a terminal group of the contact pin group 62, and a terminal portion 62'd A curved portion 62′b that connects the line portion 68′f is included.

  In assembling the contact pin module 34, as shown in FIG. 14A, the obtained lead frame 54 and a pair of spacers 56 are alternately arranged along the Z coordinate direction of FIG. Is done. In this case, in FIG. 14A, for example, the lead frames 54 overlapped with each other via the spacer 56 are overlapped so that the curved portions 60′b and 62′b of the contact pins 54′pi are arranged in line symmetry. It is done. Therefore, as in the example shown in FIG. 3, the terminal portions 60'd of the contact pins 54'pi are arranged in a plurality of rows on the same straight line at the same pitch in the vertical and horizontal directions.

  On the other hand, as described above, the terminal portion 62'd of the contact pin 54'pi has a center position at the tip of the contact pin group 60 'that is a predetermined distance DL' compared to the center position of the tip of the contact pin group 62 '. Therefore, as shown in FIG. 14B, they are arranged in a staggered manner. As a result, the pitch between adjacent rows, that is, the pitch in the Z-coordinate direction is about 0.4 mm, as shown in FIG. The distance between the terminal portions 62d in the X-coordinate direction between the two is, for example, about 0.2 mm.

  Further, also in this example, the area of the common portions A1 and A2 overlapping in FIG. 14A between the lead frames 54 arranged to face each other is, for example, a conventional contact pin module as shown in Patent Document 1 as well. Therefore, when a test is performed by supplying an inspection signal to the semiconductor device 38 through the printed wiring board 32 and each contact terminal group, the capacitance between the parallel surfaces of the lead frame 54 is the conventional one. It will be reduced as compared.

It is a bottom view which shows the contact pin module used for an example of the socket for semiconductor devices which concerns on this invention. It is a front view in the example shown by FIG. FIG. 2 is a top view of the example shown in FIG. 1. It is a side view in the example shown by FIG. It is a front view which shows the external appearance of an example of the socket for semiconductor devices which concerns on this invention. It is a top view in the example shown by FIG. It is a side view in the example shown by FIG. It is a front view which shows the lead frame used for the contact pin module shown by FIG. FIG. 9A is a front view showing a state in which the lead frames shown in FIG. 8 are overlapped with each other. (B) is a plan view showing the arrangement of one terminal group in the plurality of lead frames shown in (A). FIG. 9A is a plan view showing an arrangement of one terminal group in a state where the lead frames shown in FIG. 8 are overlapped with each other. FIG. 9B is a plan view showing the arrangement of the other terminal group in a state where the lead frames shown in FIG. FIG. 9 is a plan view showing a state in which a support member is omitted in the lead frame shown in FIG. 8 connected to a frame member material. FIG. 9 is a plan view showing the lead frame shown in FIG. 8 connected to a frame member material. FIG. 7 is a front view showing another example of a lead frame used in the contact pin module shown in FIG. 1. FIG. 9A is a front view showing a state in which the lead frames shown in FIG. 8 are overlapped with each other. (B) is a plan view showing the arrangement of one terminal group in the plurality of lead frames shown in (A).

Explanation of symbols

30 Socket body 32 Printed wiring board 34 Contact pin modules 54, 54 'Lead frame 60, 60' Contact pin group 62, 62 'Contact pin group 64 Support plate

Claims (3)

A plurality of inspection object side connection terminals having one end electrically connected to the electrode portion of the semiconductor device, a group of inspection object side connection terminals on a common plane,
Each fixed-side connection terminal connected to the other end of each inspection-object-side connection terminal of the inspection-object-side connection terminal group has a common plane with a mutual distance larger than the mutual distance of the inspection-object-side connection terminals. A plurality of fixed-side connection terminals connected to a wiring board electrically connected to the electrode portion of the semiconductor device,
A support member for supporting an intermediate portion between the inspection object side connection terminal group and the fixed side connection terminal group;
Holding the test object side connection terminal group and the fixed side connection terminal group supported by the support member in a stacked manner via an insulating member so that the fixed side connection terminal group is arranged in a staggered manner. Members,
A module housing portion for housing the inspection object side connection terminal group and the fixed side connection terminal group held by the holding member;
The position along the arrangement direction of each fixed-side connection terminal on the common plane of the fixed-side connection terminal group is relatively deviated by a predetermined distance in one direction with respect to the inspection-object-side connection terminal group. A socket for a semiconductor device.   2. The semiconductor according to claim 1, wherein the predetermined distance is set to be smaller than a mutual distance along an arrangement direction of the fixed-side connection terminals on a common plane of the fixed-side connection terminal group. Device socket. The plurality of inspected object side connection terminal groups and the fixed side connection terminal group held by the holding member have reduced capacitance between parallel surfaces in the inspected object side connection terminal group and the fixed side connection terminal group. The semiconductor device socket according to claim 1, wherein the semiconductor device socket has a common portion overlapping each other.

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