JP2006253388A - Relay substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a relay substrate connecting electrodes of electronic components with a simplified and easy constitution without forming any through-hole. <P>SOLUTION: On a base member sheet 12, elastic contacts 20A, 20B are formed in an elastic contact formation region A and contacts 14A, 14B are formed in a contact formation region B, both being folded back along a contour of a spacer 11 at a folded-back region C. The elastic contact 20A and the contact 14A as well as the elastic contact 20B and the contact 14B are coupled respectively therebetween through coupling wires formed on the surface of the base member sheet 12. Consequently, when the relay substrate 10 is loaded to a loading part 31 of an equipment body 30 and the electronic component 40 is placed thereon and a cover is closed, electrodes 32, 33 on the side of the equipment body 30 and electrodes 41, 42 of the electronic component 40 are connected, respectively. Electrodes of an electronic component are connected to each other with a simplified and easy constitution without forming any through-hole. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a relay board that is provided between, for example, electrodes of electronic components arranged opposite to each other and secures electrical connection between both electrodes, and more particularly to a relay board that can be easily manufactured with a simple configuration. .

  In recent years, with the increase in functionality and performance of semiconductor integrated circuits (ICs), the number of input / output pins of an IC package (hereinafter referred to as “package” as appropriate) in which a semiconductor bare chip is sealed tends to increase year by year. For example, those having the number of pins exceeding 1000 have begun to appear.

  For this reason, the type of input / output pins has changed from a conventional method of taking out from both sides and four sides of a package to a method of taking out from the entire bottom surface of the package, for example, BGA (Ball Grid Array) or LGA (Lubric Contact Terminal). A semiconductor device called a CSP (Chip Size Package) having a large number of pin terminals such as a land grid array (flat contact) has been developed.

  Input / output pins such as the BGA are arranged in a matrix (also referred to as a grid or grid pattern) on the bottom surface of the CSP. Such connection between the BGA on the package side and an electrode formed on a circuit board such as a motherboard on the apparatus body side is performed using an IC socket as shown in Patent Document 1, for example.

  The IC socket shown in Patent Document 1 has a large number of through holes (through holes) formed in a matrix on the bottom surface of the IC mounting portion, and the through holes are attached to the inside of each through hole by a spring body. A sleeve having a contact probe in a biased state is provided. The sleeve is conductively connected to an electrode provided on the circuit substrate.

  When the package is positioned and mounted in the IC socket, each BGA of the package is brought into contact with the tip of each contact probe and pushed down. At this time, since the contact portion of each contact probe is in contact with each electrode on the circuit board side, the spring body and the contact in each sleeve are between each BGA on the package side and each electrode on the circuit board side. It is electrically connected via the contact portion of the probe.

In this respect, the IC socket functions as a relay board (interposer) for electrically connecting each BGA on the package side and each electrode on the circuit board side.
JP 2002-357622 A

  However, the one disclosed in Patent Document 1 has a problem that a large number of through holes must be positioned with high accuracy on the bottom surface of the IC mounting portion.

  In addition, since it is necessary to provide a contact probe in the through hole so as to be able to advance and retract together with the spring body, there is a problem that the structure of the socket is complicated and the IC mounting portion is enlarged.

  Further, since it is necessary to secure a space for fixing the socket on the circuit board, it is difficult to reduce the size of the circuit board, that is, the device body itself. Alternatively, when it is desired to increase the number of components to be mounted on the circuit board, there is a problem that the space hinders this.

  By the way, since the pitch interval between the electrodes of the semiconductor bare chip is further narrower than the pitch interval between the electrodes of the IC package that encapsulates the semiconductor bare chip, it is connected to the electrodes of the IC package with the inter-electrode distance of the semiconductor bare chip widened. Rewiring technology is required. However, in the past, since the structure of rewiring the electrodes between the two by using the technique of the multi-layer substrate, there was a problem of complicated processes and high manufacturing costs.

  The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to provide a relay board that enables electrical connection between electrodes of an electronic component with a simple and easy configuration.

  Another object of the present invention is to provide a relay substrate that can connect a large number of electrodes facing each other without forming through holes.

  A further object of the present invention is to provide a relay board that can easily perform electrical connection between electrodes having different pitch intervals.

The present invention has a base material provided with a folded region at the center in the width direction, and a plurality of contacts arranged on the surface of the base material and divided into one end side and the other end side in the width direction,
At least one contact on the one end side and the other end side is formed by an elastic contact, and a conductive connecting line is provided between the contact provided on the one end side and the contact provided on the other end side. It is characterized by being connected.

  In the above, the base material is folded in a mountain fold in the folded region with the surface from which the contact is exposed facing outward, and a spacer is provided between the back surfaces of the base materials facing each other. Is preferred.

  Furthermore, the spacer is preferably formed of an insulating material or a conductive material.

  In the present invention, a contact located on one surface side and a contact located on the other surface side are electrically connected without forming a through hole in the relay substrate, and a connecting line for connecting the two is provided. Since it can be formed integrally with the contact using a technique such as plating, the manufacturing is easy and the manufacturing cost can be reduced.

  Further, the thickness dimension of the relay board can be freely adjusted simply by selecting the spacer. Therefore, a small and thin relay substrate 10 can be obtained.

Further, the present invention is a substrate having a folded region at the center in the width direction, a plurality of contacts arranged on the surface of the substrate and divided into one end side and the other end side in the width direction, and the one end A conductive connecting line for connecting between the contact provided on the side and the contact provided on the other end side, and bends in a mountain fold in the folded region with the surface from which the contact is exposed facing outward A relay substrate having a spacer provided between the back surfaces of the base material,
The spacer is formed of a soft material that can be elastically deformed.

  In the said invention, since a spacer elastically deforms, it can be set as the relay board | substrate which has an elastic contact as a whole.

  In the above, for example, the arrangement order of the contacts provided on the one end side and the arrangement order of the contacts provided on the other end side may be the same order.

  Furthermore, the pitch dimension between the contacts provided on the one end side may be different from the pitch dimension between the contacts provided on the other end side.

With the above means, rewiring in the IC package can be performed easily and inexpensively.
The relay substrate according to any one of claims 1 to 6, wherein the base material is formed of a flexible sheet.

  According to the above means, the relay substrate can be easily formed from a single base sheet.

  In the above, the elastic contact provided on the base material is a spiral contact that spirally extends from the winding start end provided on the outer peripheral base toward the center winding end, and in this case, the spiral contact Is preferably a mountain shape protruding in a three-dimensional manner from the winding start end toward the winding end.

  In the present invention, since it is not necessary to form a through hole in the substrate, a simple and easy relay substrate can be obtained. Further, by changing the spacer, the thickness of the relay board can be freely adjusted. Therefore, it is possible to easily provide a thin relay board.

  Further, since the pitch dimension can be adjusted only by changing the distance between the contacts formed on the relay substrate, the rewiring of the IC package can be easily performed.

  FIG. 1 is an external perspective view showing a relay board as an embodiment of the present invention, FIG. 1A is a view of the relay board from one direction, FIG. 1B is a view of the relay board from the opposite direction, and FIG. 1 is an exploded perspective view of the relay board shown in FIG. 1, FIG. 3 is a perspective view showing a spiral contact as an example of an elastic contact, FIG. 4 is a sectional view taken along line 4-4 of FIG. is there.

  As shown in FIGS. 1A and 1B, the relay board 10 has a bar shape extending linearly in the Y1 and Y2 directions. The relay substrate 10 includes a spacer 11 that functions as a base and a base sheet (base material) 12 that is attached to the surface of the spacer 11.

  The spacer 11 is formed in a bar shape, and an arcuate curved surface 11a is formed on at least one side surface in the width (X) direction. The material for forming the spacer 11 is, for example, an insulating hard substrate (glass epoxy), a conductive metal material, or a soft material that can be elastically deformed, such as natural rubber, synthetic rubber, or elastomer. It is possible to select a suitable material. In this embodiment mode, the insulating hard substrate is used.

  The base sheet 12 is preferably a thin sheet having insulation and flexibility, such as a polyimide sheet. A plurality of contacts arranged regularly are provided on the surface of the base sheet 12.

  On one surface 10A of the relay substrate 10 shown in FIG. 1A, a plurality of elastic contacts (contacts) 20A and 20B arranged in two rows in the Y direction are provided. As shown in FIG. 2, one elastic contact 20 </ b> A is predetermined in the Y direction in the drawing along a virtual line Ya located on the surface of the base sheet 12 and outside (X1 side) in the width direction (X direction). The other elastic contacts 20B are arranged in parallel at the interval L along the virtual line Yb located on the inner side (X2 side). As shown in FIG. 1A, a predetermined inter-electrode distance (pitch dimension) W1 is provided between the virtual line Ya and the virtual line Yb, and the elastic contact 20A and the elastic contact 20B adjacent in the X direction Are in pairs. An area where the elastic contacts 20A and 20B are formed is an elastic contact formation area A.

  A plurality of contacts 14A and 14B arranged in two rows in the Y direction are provided on the other surface 10B of the relay substrate 10 shown in FIG. 1B. A plurality of contacts 14A and 14B shown in FIG. 2 are normal contacts (fixed contacts whose tips protrude in a convex shape) other than the elastic contacts 20A and 20B, and the elastic contacts 20A and 20B on the base sheet 12 are It is formed on the same surface as the surface on which it is formed. As shown in FIG. 1B, one contact 14 </ b> A is juxtaposed at the interval L in the Y direction in the drawing along a virtual line Yc located outside (X2 side) in the width direction (X direction) of the base sheet 12. The other contact point 14B is arranged in parallel at the interval L along a virtual line Yd located on the inner side (X1 side). A predetermined inter-electrode distance (pitch dimension) W2 (≧ W1> 0) is also provided between the virtual line Yc and the virtual line Yd, and the contact 14A and the contact 14B adjacent in the X direction are paired. It is made. A region where the contacts 14A and 14B are formed is a contact forming region B.

  As shown in FIGS. 1A, 1B and 2, the elastic contact 20A located outside the elastic contact formation region A and the contact 14A located outside the contact formation region B are made of, for example, gold, silver or copper They are connected by a thin film-like connecting line (pattern line) 15a formed of a conductive material, and are similarly located inside the elastic contact forming area A and inside the contact forming area B. The contact 14B is connected by a thin-film connecting line (pattern line) 15b.

  The elastic contacts 20A and 20B shown in the present embodiment are spiral contacts 21 and 21 having, for example, a spiral shape or a spiral shape. As shown in FIG. 3, a plurality of holes 12 a and 12 a penetrating the base sheet 12 are formed at positions where the spiral contacts 21 and 21 are to be formed on the base sheet 12. In the vicinity of the holes 12a, 12a, bar-shaped base portions 21a, 21a are formed by extending from the connecting lines 15a, 15b.

  The base portion 21a is formed with an elastic deformation portion 21b extending spirally or spirally toward the center of the hole 12a. The elastic deformation portion 21b has a winding start end 21b1 on the base 21a side and a winding end 21b2 on the tip.

  As shown in FIG. 3, the spiral contactor 21 gradually protrudes in the Z1 direction as it goes from the winding start end 21b1 to the winding end 21b2 side, and has a mountain shape or a convex shape as a whole. . The spiral contact 21 is cantilevered with respect to the base portion 21a in a state where the elastic deformation portion 21b can be elastically deformed in the Z1 direction in the drawing with the winding start end 21b1 side as a fulcrum. For this reason, the elastic deformation portion 21b as a whole is in a state of being elastically deformable in the Z1 and Z2 directions shown in the figure.

  The elastic contacts 20A and 20B, the contacts 14A and 14B, and the connecting lines 15a and 15b made of the spiral contactor 21 can all be formed on one surface (surface) of the base sheet 12. For this reason, it is possible to form integrally by using techniques, such as a plating process or the etching process with respect to metal foil, for example. For this reason, it can be manufactured easily and easily and the manufacturing cost can be reduced.

Next, a method for assembling the relay board 10 will be described.
As shown in FIG. 3, the elastic sheet forming region A provided on the center position in the width direction (X direction) of the base sheet 12, that is, one end (X1) side and the other end (X2) side. A folded area C is provided between the contact forming area B and the contact forming area B.

  The relay substrate 10 is folded in a mountain fold in the folded region C with the surface of the base sheet 12 (the side where the contacts 20A, 14A, etc. are exposed) facing outward.

  Then, the spacer 11 is interposed between the back surfaces of the base sheet 12 (between the back surface of the elastic contact formation region A and the back surface of the contact formation region B), and the base is formed on the surface of the spacer 11 using an adhesive. The back surface of the material sheet 12 is bonded and fixed. At this time, by interposing the curved surface 11a of the spacer 11 between the back surfaces of the base sheet 12 in a state of facing the back surface of the folded region C, a relay substrate 10 as shown in FIGS. 1A and 1B is obtained. be able to. In this way, when the folded region C is pasted so as to follow the curved surface 11a, it is possible to prevent problems such as disconnection in the connecting lines 15a and 15b.

  The relay substrate 10 shown in the above embodiment is provided with, for example, an electrode provided on the device main body side and a memory card that is detachably attached to the device main body to ensure electrical connection with the electrodes of the electronic components. As a contact electrode for connecting the electrode exposed on the surface of the IC, or by arranging a plurality of relay substrates 10 side by side, the contact electrode for connecting to an electrode such as BGA or LGA arranged on the bottom surface of the IC package Can be used as

Therefore, a use example using the relay board 10 will be described below.
In the usage example shown in FIG. 4, the relay board 10 is loaded in a concave loading portion 31 provided in a device main body 30 such as a mobile phone. A plurality of electrodes 32 and 33 facing the plurality of contacts 14A and 14B are provided on the bottom surface 31a of the loading unit 31, and the contacts 14A and 14B of the relay substrate 10 and the electrodes 32 and 33 of the loading unit 31 are provided. Are fixed in a conductive state via connecting means 36 such as solder or conductive adhesive.

  The upper portion of the loading unit 31 is a storage area 34 for an electronic component 40 such as a small memory card. As shown in FIG. 4, the electronic component 40 is mounted in the storage area 34 with the electrode portions 41 and 42 facing downward. When the storage area 34 is closed with a lid (not shown), the electronic component 40 can be held between the storage area 34 and the lid.

  In a state where the electronic component 40 is held, the electronic component 40 is pressed by the lid body with a predetermined pressure F in the Z2 direction in the drawing, and therefore, an elastic contact formed by the spiral contactor 21 of the relay substrate 10. 20A and 20B are set in a state where they abut against the electrode portions 41 and 42 of the electronic component 40 and are elastically deformed in a contracting direction.

  For this reason, the electrode parts 41 and 42 of the electronic component 40 and the electrodes 32 and 33 on the device main body 30 side are electrically connected via the elastic contacts 20A and 20B, the connecting wires 15a and 15b, and the contacts 14A and 14B, respectively. Conductive connection can be established.

  In addition, the spiral contactor 21 forming the elastic contacts 20A and 20B used in the present embodiment has a protruding amount (height dimension from the base portion 21a to the winding start end 21b2) h and the conventional contact pin or the like. It is possible to set small compared. Moreover, the thickness 11 of the spacer 11 can be freely selected at the time of manufacture. For this reason, by selecting the spacer 11 having the thin plate thickness dimension H, the thin relay substrate 10 can be obtained.

  Further, the contact 14A provided on the outside is located below and corresponds to the elastic contact 20A provided on the outside, and the contact 14B provided on the inside is located below the elastic contact 20B provided on the inside. That is, the arrangement order of the elastic contacts 20A and 20B provided on the one end (elastic contact formation area A) side and the arrangement order of the contacts 14A and 14B provided on the other end (contact formation area B) side Are arranged and formed in the same order. For this reason, the electrode parts 41 and 42 of the electronic component 40 can be made to correspond to the electrodes 32 and 33 on the device main body 30 side, and the electrodes are securely connected in the correct state without changing the order of the positions. Can do.

  When a plurality of such relay boards 10 are arranged in the socket and are connected to electrodes such as BGA and LGA arranged on the bottom surface of the IC package, individual contact pressures of the spiral contactor 21 are arranged. Therefore, it is possible to hold the IC package with an extremely small pressure F as compared with the case of using the conventional contact pin or the like. Alternatively, when the IC package is held with the same large pressure F as before, it is possible to reduce the load (contact pressure due to the elastic contacts 20A and 20B) acting on the individual electrodes of the IC package. It is.

  In the relay substrate 10, the distance W1 between the electrodes on the elastic contact formation region A side and the distance W2 between the electrodes on the contact formation region B side are different from each other, that is, compared to the electrode distance W1 on the elastic contact formation region A side. Thus, the interelectrode distance W2 on the contact formation region B side is formed wider. For this reason, for example, when the relay substrate 10 is used for connection between a bare chip having a short inter-electrode distance and a package-side electrode that holds the bare chip, the inter-electrode distance W1 between the bare chips is changed to a wide inter-electrode distance W2 on the package side. Expansion, that is, rewiring can be easily performed. In addition, since it is not necessary to use a multilayer substrate technique as in the prior art, rewiring can be performed with a simple configuration.

  Further, for example, even if a failure occurs in one relay board 10, only the corresponding relay board 10 needs to be replaced, and there is no need to replace the entire socket. As a result, the repair process can be simplified and the repair cost can be reduced.

  In the above embodiment, the description has been given using the relay substrate 10 arranged in two rows in the longitudinal direction as the number of rows of elastic contacts and contacts, but the present invention is not limited to this, and the number of elastic contacts and contacts is 1 each. The configuration may be a row, or may be a configuration of three or more rows.

  The number of rows of elastic contacts may be different from the number of rows of contacts. That is, the elastic contact and the contact do not necessarily have a one-to-one relationship, and for example, a configuration in which two or more contacts are connected to one elastic contact by the connecting line 15a or 15b may be used. .

  In the above embodiment, the contacts 14A and 14B are formed as convex electrodes and fixed to the electrodes 32 and 33 on the device body 30 side by soldering or the like. However, the present invention is limited to this. Instead, the contacts 14A and 14B are elastic contacts made of spiral contacts similar to those described above, and may be configured to be connected to the device-side electrodes 32 and 33 by elastic pressure.

  Furthermore, in the above-described embodiment, the spiral contacts are used as one configuration of the elastic contacts 20A and 20B. However, the elastic contacts 20A and 20B are not limited to spiral contacts, and are, for example, contacts. The tip portion may be formed of an elastic contact made of a spring pin (contact pin), a stressed metal, or a bamboo spring that can be elastically deformed while being curved in a substantially U shape. However, the above-described spiral contactor and stressed metal are preferable as the elastic contact that can be thinned.

  Furthermore, in the above embodiment, the spacer 11 is a hard substrate, the contact located inside the elastic contact formation region A is an elastic contact, and the contact located inside the contact formation region B is elastic. The case of the normal contacts 14 </ b> A and 14 </ b> B other than the contacts has been described. However, when the spacer 11 is formed of a member having excellent elasticity such as a cushion material, the elastic contact formation region A and the contact formation are described. A configuration in which both of the regions B are formed by normal contacts 14A and 14B other than the elastic contact may be employed. Even in this case, it is not excluded that either the elastic contact formation region A or the contact formation region B is an elastic contact.

The external appearance perspective view which looked at the relay substrate as an embodiment of the present invention from one direction, External perspective view of the relay board viewed from the opposite direction, Exploded perspective view of the relay board, The perspective view which shows the spiral contact as an example of an elastic contact, A sectional view taken along line 4-4 of FIG.

Explanation of symbols

10 Relay board 11 Spacer (base)
11a Curved surface 12 Substrate sheet 12a Holes 14A, 14B Normal contacts 15a, 15b Connecting line (pattern line)
20A, 20B Elastic contact (contact)
21 spiral contact 21a base 21b elastic deformation part 21b1 winding start end 21b2 winding end 30 equipment body 31 loading part 32, 33 electrode 34 storage area 36 connection means 40 electronic component 41, 42 electrode part A elastic contact formation area B contact formation area C Folding area W1 Distance between electrodes (pitch dimension) between elastic contacts
W2 Distance between normal contacts (pitch size)

Claims (9)

A base material provided with a folded region in the center in the width direction, and a plurality of contacts arranged on the surface of the base material and divided into one end side and the other end side in the width direction;
At least one contact on the one end side and the other end side is formed by an elastic contact, and a conductive connecting line is provided between the contact provided on the one end side and the contact provided on the other end side. A relay board characterized by being connected.   The base material is folded in a mountain fold in the folded region with the surface on which the contact is exposed facing outward, and a spacer is provided between the back surfaces of the opposing base materials. The relay board according to claim 1.   The relay substrate according to claim 2, wherein the spacer is formed of an insulating material or a conductive material. A base material provided with a folded region at the center in the width direction, a plurality of contacts arranged on the surface of the base material and divided into one end side and the other end side in the width direction, and provided on the one end side A conductive connecting line that connects between a contact point and a contact point provided on the other end side, and the base material that is folded into a mountain fold in the folded region with the surface from which the contact point is exposed facing outward A relay board having a spacer provided between the back surfaces of
A relay substrate, wherein the spacer is made of a soft material that can be elastically deformed.   5. The arrangement order of the contacts provided on the one end side and the arrangement order of the contacts provided on the other end side are the same order. 6. Relay board.   The pitch dimension between the contacts provided on the one end side and the pitch dimension between the contacts provided on the other end side are different from each other. The relay board | substrate as described in a term.   The relay substrate according to claim 1, wherein the base material is formed of a flexible sheet.   8. The elastic contact provided on the base material is a spiral contact that spirally extends from a winding start end provided at an outer peripheral base toward a center winding end. The relay board | substrate as described in any one.   9. The relay board according to claim 8, wherein the spiral contact has a mountain shape projecting three-dimensionally from the winding start end toward the winding end.

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