WO2006109553A1

WO2006109553A1 - Mounting substrate

Info

Publication number: WO2006109553A1
Application number: PCT/JP2006/306090
Authority: WO
Inventors: Taiji Okamoto; Shin Yoshida; Akira Watanabe; Koji Dono; Shuichi Chiba; Tomoyuki Higuchi
Original assignee: Alps Electric Co., Ltd.
Priority date: 2005-03-30
Filing date: 2006-03-27
Publication date: 2006-10-19
Also published as: JP2006278811A

Abstract

[PROBLEMS] To provide a mounting substrate in which mounting density can be enhanced by effectively utilizing a free space formed in the opposing region of a semiconductor device and a mother substrate. [MEANS FOR SOLVING PROBLEMS] Between a mother substrate (20) provided with a land electrode (22) and an auxiliary substrate (33) having an external connection electrode (33a) conductively connected with the land electrode (22), an interconnection substrate (40) having a predetermined thickness is interposed, thus connecting both electrodes and forming a free space (50) in the opposing region of the mother substrate (20) and the auxiliary substrate (33). When an electronic chip component (26) is arranged on at least one of the mother substrate (20) and the auxiliary substrate (33) in the free space (50), the free space (50), i.e. the opposing region, can be utilized effectively and mounting density can be enhanced.

Description

Specification

Mounting board

Technical field

[0001] The present invention relates to a mounting board on which a large number of electronic components are mounted, and in particular, by effectively utilizing an empty space formed in a facing area between the mother board and each electronic component, The present invention relates to a mounting substrate that can increase the resistance.

Background art

[0002] As a prior art related to the present invention, that is, as a technique for increasing the mounting density by providing electronic components between a set of substrates in a stacked state, for example, the prior art described in Patent Document 1 below is used. Exists.

[0003] In Patent Document 1, a tall electronic component 5 and a short electronic component 10 are soldered and fixed to one main circuit board 3 and the other extension circuit board 4, respectively. A mounting substrate is described in which a large number of electronic components can be mounted by inserting a male connector 1 provided on a board into a female connector 2 provided on the other substrate.

Patent Document 1: Japanese Patent Laid-Open No. 7-7238

Disclosure of the invention

Problems to be solved by the invention

[0004] However, in the above-described conventional one, the facing distance between the two opposing boards is the length dimension (height dimension) when the male connector and the female connector that connect and connect both boards are fitted together The height dimension exceeding the above-mentioned opposing distance is not determined because the external dimensions of such a connector are standardized and cannot be easily changed. There is a problem that the electronic component that is included cannot be disposed between the two substrates.

[0005] Alternatively, when the height dimension of the electronic component disposed between the facing distances is extremely low, for example, 1Z2 or less, compared to the facing distance, the substrate facing the head of the electronic component The clearance margin formed between the two becomes too large. For this reason, there is a problem that it is difficult to make a thin mounting board. [0006] Further, in the above conventional mounting board, since the electronic component is soldered on the board, it must be replaced 1 and the entire board must be discarded even if a defect occurs only in the electronic component. There's a problem.

[0007] Further, a semiconductor device such as a CPU is fixed with an auxiliary board provided on the lower surface facing the mother board. However, since the CPU has a large area, for example, a small electronic device (portable) Equipment), it is difficult to secure a space for mounting other electronic components on the mother board, that is, the area where the semiconductor device and the mother board face each other is not effectively used. There is a problem.

[0008] The present invention is for solving the above-described conventional problems, and can effectively use an empty space formed in a region where two substrates face each other when two substrates are placed facing each other. The purpose is to provide a mounting board!

It is another object of the present invention to provide a mounting board that can easily replace the semiconductor device even after the semiconductor device is incorporated.

Means for solving the problem

[0010] The mounting substrate of the present invention includes a mother substrate provided with a land electrode, an auxiliary substrate having an external connection electrode that is disposed opposite to the mother substrate and is electrically connected to the land electrode, A relay board that conductively connects the land electrode of the mother board and the external connection electrode of the auxiliary board;

Provided on at least one of the mother substrate and the auxiliary substrate in an empty space where the mother substrate and the auxiliary substrate face each other in a region excluding the electrode forming region where the external connection electrode is formed. Electronic components are arranged

[0011] In the present invention, the mother substrate and the auxiliary substrate constituting the semiconductor device are connected via a relay substrate having a predetermined thickness dimension, and a space is provided in a region facing the mother substrate and the auxiliary substrate. Thus, a plurality of electronic components can be arranged in the empty space, and the counter area can be effectively used. For this reason, the mounting density of electronic components including chip components that can be mounted on the mother substrate can be increased.

[0012] In the above, a plurality of first contacts are provided on one surface of the relay substrate, and the other A plurality of second contacts are provided on the surface, the first contact is conductively connected to the land electrode of the mother board, and the second contact is connected to the external connection electrode of the auxiliary board. It can be configured as a conductive connection.

In this case, for example, the plurality of first contacts and the plurality of second contacts are connected through a through hole formed in the relay substrate and a conductive portion provided in the through hole. It is possible to have a configuration in which conductive connection is made.

[0014] Alternatively, the plurality of first contacts and the plurality of second contacts may be conductively connected via a connecting line wired on the outer surface of the relay board.

[0015] In the above, a base substrate is provided between one surface of the relay substrate and the other surface, and by selecting the thickness of the base substrate, the height of the empty space is increased. Dimension is adjustable, prefer something.

[0016] With the above means, it is possible to select a relay board having a plate thickness dimension suitable for the purpose of use.

Further, the first contact is an elastic contact, and the second contact is an elastic contact or a fixed contact.

[0017] When the first contact and the second contact are both elastic contacts, the relay board can be easily replaced, so that a malfunction of the relay board can be quickly dealt with. It will be possible.

[0018] For example, the elastic contact may be configured as a spiral contactor. Also, a through hole is formed in the auxiliary substrate, and the electronic component is inserted into the through hole! It can be set as a scooping structure.

[0019] With the above means, even an electronic component having a high height can be arranged in the empty space.

[0020] For example, the auxiliary substrate is a semiconductor device constructed by providing at least one bare chip.

The invention's effect

In the mounting substrate of the present invention, the auxiliary substrate and the mother substrate of the semiconductor device have a predetermined thickness. By connecting via a relay board having a size, an empty space can be formed between the auxiliary board and the mother board. For this reason, it becomes possible to arrange a plurality of small electronic components (electronic chip components) in the empty space, and the mounting density can be increased. In other words, it is possible to effectively utilize the opposing region between the semiconductor device and the mother substrate that are not normally used.

In addition, the semiconductor device and the relay substrate can be easily replaced.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is a partial perspective view showing the structure of an electronic device having a mounting board of the present invention, FIG. 2 is a plan view showing an embodiment of the mounting board of the present invention, and FIG. 3 is the electronic device shown in FIG. FIG. 4 is a sectional view showing a spiral contact as an embodiment of the elastic contact provided on the relay board.

FIG. 1 shows a structure inside a housing that constitutes a part of an electronic device 10 such as a mobile phone or a PDA. The casing 11 includes a lower casing 12 and an upper casing 13, and the lower casing 12 and the upper casing 13 are attached to be freely opened and closed via an unillustrated hinge section. ing. Alternatively, the lower housing 12 and the upper housing 13 may be provided separately without providing the hinge portion or the like.

As shown in FIG. 1, the lower housing 12 and the upper housing 13 are each formed in a concave shape. The mother board 20 is housed in a recess 12 a formed in the lower housing 12. As shown in FIG. 1, a plurality of chip parts (electronic parts) 25 such as LEDs and capacitors, and four relay boards 40, 40, 40, 40, etc. are mounted on the mother board 20. .

[0025] Further, the ceiling surface 23a of the upper casing 23 has, for example, a processing device 31 such as a CPU or MPU having at least one bare chip, a memory such as ROM or RAM, or a resistor, a capacitor, or the like. A semiconductor device 30 such as an MCM (multichip module) having the electronic component 32 mounted on the auxiliary substrate 33 is held. That is, one semiconductor device 30 is constructed by having the processing device 31 and the other electronic components 32 on the auxiliary substrate 33.

As shown in FIG. 1, the upper housing 13 and the lower housing 12 are opened, and the upper housing 13 is opened. The semiconductor device 30 is attached to the ceiling surface 13a of the casing 13, the upper casing 13 corresponding to the lid side is closed in a direction approaching the lower casing 12, and the upper casing is fixed by a latching means (not shown). 13 and the lower casing 12 are hooked, the upper elastic contact 42 provided on the upper surface of each relay board 40 provided on the mother board 20 is provided on the bottom face of the auxiliary board 33. It is possible to set a state in which the plurality of external connection electrodes 33a are in contact with each other and each upper elastic contact 42 and each external connection electrode 33a are conductively connected (see FIG. 3).

In the center of the semiconductor device 30 shown in this embodiment, a through hole 33A that penetrates the auxiliary substrate 33 in the thickness direction is formed. Therefore, the processing device 31 and the other electronic components 32 are provided at positions avoiding the through hole 33A.

The plurality of external connection electrodes 33a formed on the bottom surface of the auxiliary substrate 33 constituting the semiconductor device 30 are, for example, in a substantially matrix shape, that is, in a state where the through holes 33A are avoided. It is regularly arranged in multiple rows along the vertical and horizontal directions. The external connection electrode 33a may be a planar contact (LGA) as shown, or a spherical contact (BGA), a cone contact (CGA), or a pin contact (PGA). It may be.

As shown in FIG. 3, on the ceiling surface 13 a of the upper housing 13, a holding portion 14 that is bent in a substantially L shape in the downward direction in the figure is provided integrally with the upper housing 13. . The holding part 14 includes a vertical extending part 14a extending in the downward direction (Z2 direction in the figure) and a horizontal extending part 14b extending in the horizontal direction (the XI-X2 direction in the figure). The horizontal extension 14b extends in a direction (inward direction) facing each other. An upper surface 14bl of the horizontal extension 14b is an installation surface for installing the auxiliary board 33, and a predetermined distance H is provided between the upper surface 14bl of the horizontal extension 14b and the ceiling surface 13a. Is vacant. The interval H is formed with a dimension larger than the thickness dimension of the semiconductor device 30 (thickness dimension obtained by adding a component having the highest height to the auxiliary substrate 33 (such as the processing device 31 or other electronic component 32)). ! Therefore, when the semiconductor device 30 is held in the holding portion 14, a gap d is formed between the semiconductor device 30 and the ceiling surface 13a. Therefore, the semiconductor device 30 can be moved in the Z direction in the drawing by the height corresponding to the gap d in the holding portion 14. Therefore, the semiconductor device 30 and the ceiling surface 1 A spacer 29 that is thinly sliced, for example, is laminated between the gap d and the gap 3a, and is always disposed on the upper surface 14b1 of the horizontal extending portion 14b that forms the holding portion 14. A configuration in which the semiconductor device 30 is pressed is preferable.

Note that the holding portion 14 may be provided separately from the upper housing 13. Further, the holding part 14 is provided so as to be able to hold the end parts of the four sides of the auxiliary substrate 33 so that the two sides or the three sides of the auxiliary board 33 can be held. The holding unit 14 may be provided. In this case, the semiconductor device 30 is easily formed between the holding portions 14 and 14 by moving the semiconductor device 30 from the side along the ceiling surface 13a without the holding portion 14 being formed. Therefore, the semiconductor device 30 can be easily assembled.

As shown in FIG. 3, a holding portion 14 is provided on the ceiling surface 13a of the upper housing 13, and the holding substrate 14 holds the auxiliary substrate 33 of the semiconductor device 30 below the upper housing 23. In particular, the semiconductor device 30 can be easily replaced when the semiconductor device 30 does not need to be bonded and fixed to the ceiling surface 13a of the upper housing 13 with an adhesive or the like. 30 can be removed from the ceiling surface 13 a of the upper housing 13 and replaced with a new semiconductor device 30.

[0032] The mother board 20 housed in the recess 12a of the lower housing 12 is a laminated board formed by stacking a large number of printed wiring boards (PWB), and the upper surface of the mother board 20 A plurality of land electrodes 22 are exposed on 21.

Next, an embodiment of the relay board 40 provided on the mother board 20 will be described with reference to FIG. Note that the relay board shown in FIG.

As shown in FIG. 4, the relay substrate 40A includes a base substrate 41, upper elastic contacts (first contacts) 42 and lower contacts (second contacts) provided above and below the base substrate 41. Contact) 43 and sheet members 44, 44.

[0035] The upper elastic contact 42 provided on the upper side (Z1 side) of the base substrate 41 is, for example, a spiral contact in which an elastically deforming portion is formed in a spiral shape. Called the upper-nodal contactor 42. The upper spiral contact 42 shown in FIG. 3 is elastically deformed by receiving a pressing force from the external connection electrode 33a of the auxiliary substrate 33. When the pressing force is not applied to the spiral contact 42, that is, the upper spiral contact 42 when the spiral contact 42 is in a natural length, as shown in FIG. The top and bottom surface force of each of them has a shape protruding in the direction of Z1 and Z2.

As shown in FIG. 4, the upper spiral contactor 42 includes a fixed portion 42a and an elastically deformable portion 42b that extends from the fixed portion 42a. When the fixing portion 42a is viewed from directly above, for example, it is formed in a ring shape, and an elastically deforming portion 42b is formed to extend in a spiral shape from a predetermined portion of the fixing portion 42a toward the inside of the fixing portion 42a. ing. At the same time, the elastic deformation portion 42b is projected and formed upward by three-dimensional forming. The fixing portion 42a is fixedly held by the sheet member 44. That is, the sheet member 44 is provided with a through hole 44a, and the upper surface of the fixing portion 42a is fixed to the peripheral edge portion on the lower surface side of the through hole 44a with an adhesive. The elastic deformation part 42b of the upper spiral contactor 42 protrudes through the through hole 44a in the upward direction in the figure. The sheet member 44 is preferably formed of an insulating material, for example, polyimide resin.

[0037] The upper-side spiral contactor 42 is formed by electroplating or by forming a plating layer on the surface of the foil body. One example is a structure in which Ni or NiP is formed by electroless plating around a spiral contact copper foil.

[0038] A large number of such upper spiral contacts 42 are fixedly held on the sheet member 44. The sheet member 44 having a large number of upper spiral contacts 42 is provided on the upper side of the base substrate 41.

As shown in FIG. 4, a through hole 40a is formed in the base substrate 41 at a position facing the elastic deformation portion 42b of the upper spiral contactor 42 in the film thickness direction. A conductive portion 45 is formed by sputtering or the like on the inner peripheral surface of the through hole 40a. The conductive portion 45 is formed to extend to a part of the upper surface and a part of the lower surface of the base substrate 41. As shown in FIG. 4, the sheet member 44 on which the upper spiral contactor 42 is fixedly held is attached to the upper surface side of the base substrate 41 with an anisotropic conductive adhesive (not shown) or the like. At this time, the difference between the fixed portion 42a of the upper spiral contactor 42 and the conductive portion 45 is the same. It becomes conductive through the anisotropic conductive adhesive.

In this embodiment, the lower contact 43 provided on the lower side of the base substrate 41 is also a spiral contact similar to the upper spiral contact 42 (hereinafter referred to as “lower spiral contact 43” and V , U)! The elastic deformation portion 43b formed in a spiral shape of the lower side contactor 43 is three-dimensionally formed so as to protrude downward as shown in FIG. The fixed portion 43a of the lower spiral contactor 43 is conductively connected to the conductive portion 45 via an anisotropic conductive adhesive or the like, and as a result, in the film thickness direction (Zl-Z2 direction in the drawing). The upper spiral contactor 42 and the lower spiral contactor 43 that face each other are in a conductive state via the conductive part 45. The upper spiral contactor 42 and the lower spiral contactor 43 are in an elastically deformable state in the Z direction in the figure at the upper and lower positions of the conducting portion 45.

[0041] The upper elastic contact 42 and the lower contact 43 are not limited to the spiral contact as described above. For example, an elastic contact in which an elastic body such as rubber or elastomer is attached to the back surface of the metal film. The spring tip (contact pin), stressed metal, and contact probe (see Japanese Patent Application Laid-Open No. 2002-357622) can be deformed by inertia. Alternatively, it can be made of a bamboo shoot panel.

[0042] The lower contact 42 is not limited to an elastic contact having a force such as the spiral contactor. For example, it may be a fixed contact (stud bump) having a convex shape, and the tip of the fixed contact and the land electrode 22 may be fixed by soldering or a conductive adhesive.

Next, another embodiment of the relay board will be described with reference to FIGS. FIG. 5 is a perspective view of a relay board shown as another embodiment when viewed in one direction, and FIG. 6 is a perspective view when viewed from another direction different from the one direction. The relay board shown in FIGS. 5 and 6 is referred to as relay board 40B.

As shown in FIGS. 5 and 6, the relay board 40B has a bar shape extending linearly in the longitudinal direction of Y1 and Y2 in the drawing. The relay substrate 40B includes a base substrate 41 that functions as a base, and a sheet member 44 that is attached to the surface of the base substrate 41. The base substrate 41 is formed in a bar shape, and has an arcuate curved surface 41 A on one side surface in the width (X) direction. The base substrate 41 can be formed of, for example, an insulating hard substrate (glass epoxy).

[0046] The sheet member 44 is preferably a thin insulating and flexible material such as a polyimide sheet as described above, and a plurality of contacts arranged regularly are provided on the surface of the sheet member 44. On one surface of the relay board 40B shown in FIG. 5, a plurality of upper elastic contacts (first contacts) 42A, 42B are provided in the Y direction and arranged in two rows.

[0047] As shown in FIG. 5, the upper elastic contact 42A is the surface of the sheet member 44 and in the width direction.

It is formed at a predetermined interval L in the Y direction in the figure along the virtual line Ya located outside (the XI side) in the (X direction). The upper elastic contact 42B is formed at a predetermined interval L in the Y direction in the drawing along the virtual line Yb located on the surface of the sheet member 44 and on the inner side (X2 side) in the width direction (X direction). . An area where the upper elastic contacts 42A and 42B are formed is an elastic contact forming area A.

Further, a plurality of lower contacts (second contacts) 43A and 43B arranged in two rows in the Y direction are provided on the other surface of the relay board 40B shown in FIG. The plurality of lower contacts 43A, 43B shown in this embodiment are normal contacts (fixed contacts (stud bumps) whose tip protrudes in a convex shape) other than elastic contacts, and the upper elastic contacts on the sheet member 44 It is formed on the same surface as the surface on which the contacts 42 A and 42 B are formed. As shown in FIG. 6, one of the lower contacts 43A is arranged at the interval L in the Y direction in the figure along the virtual line Yc located outside (XI side) in the width direction (X direction) of the sheet member 44. The other lower contact 43B is formed in parallel with the interval L along the virtual line Yd located inside (X2 side). A region where the lower contacts 43A and 43B are formed is a contact forming region B. And between the elastic contact formation area A and the contact formation area B is a folded area C which is folded in a substantially U shape.

[0049] The upper elastic contact 42A located outside the elastic contact formation region A and the lower contact 43A located outside the contact formation region B are formed of a conductive material such as gold, silver or copper, for example. Are connected by a thin film-like connecting line 46a, and are similarly positioned inside the elastic contact forming area A and the upper elastic contact 42B and the contact forming area B. The lower contact 43B is connected by a thin film connecting line 46b.

[0050] The sheet member 44 including the elastic contact formation region A, the contact formation region B, and the folded region C is folded back along the curved surface 41A of the base substrate 41 and the back surface thereof. The entire surface is attached to the outer surface of the base substrate 41 with an adhesive. Therefore, as shown in FIG. 5, an elastic contact formation region A having upper elastic contacts 42A and 42B is formed on one surface (upper surface on the Z1 side) of the base substrate 41. As shown in FIG. A contact forming region B having lower contacts 43A and 43B is formed on the other surface (the lower surface on the Z2 side) of the base material 41.

[0051] Note that also in the relay substrate 40B, the upper elastic contacts 42A, 42B can use, for example, a three-dimensionally formed spiral contact similar to the above-described relay substrate 40A. However, the upper elastic contacts 42A and 42B are not limited to spiral contacts. Similarly to the above, an elastic contact in which a resilient elastic body such as rubber or elastomer is attached to the back surface of the metal film, and the tip of the contact is approximately U. It can also be configured by using a spring pin (contact pin), stressed metal, contact probe, or bamboo shoot panel that can be bent into a letter shape and elastically deformed as a whole. is there

Further, in the embodiment shown in FIGS. 5 and 6, the force lower contacts 43A and 43B described as the case where the lower contacts 43A and 43B are fixed contacts are not limited to this. Nagu It may be composed of the same elastic contact as above (spiral contact etc.).

[0053] Further, in the embodiment relating to the relay substrate 40, the case of the number of rows of the upper elastic contact and the lower contact has been described. However, the present invention is not limited to this. · It may be a configuration with multiple columns. In this case as well, each upper elastic contact and the corresponding lower contact are connected to each other by using the conductive portion 45 or the connecting wires 46a, 46b, etc. provided on the inner peripheral surface of the through hole 40a. It is possible to make it.

[0054] In the relay substrate 40 (40A, 40B), the base substrate 41 provided between the upper elastic contact and the lower contact can freely select a plate thickness dimension thereof. Therefore, the thin relay board 40 and the thick relay board 40 can be used in accordance with the purpose of use. [0055] In a state where the upper lid (upper housing 13) shown in FIG. 3 is closed, the lower spiral contactor 43 of the relay board 40 is in contact with the land electrode 22 on the mother board 20 and is in a conductive state. It is. The relay substrate 40 itself may be bonded and fixed to the mother substrate 20 with an adhesive, but is not limited to such a form. When an adhesive is used, an anisotropic conductive paste is applied to the entire lower surface of the relay substrate 40, and the relay substrate 40 and the mother substrate 20 are bonded and fixed via the anisotropic conductive paste, or The relay substrate 40 and the mother substrate 20 can be bonded and fixed using a non-conductive paste or a non-conductive film. When the non-conductive paste or non-conductive film is used, the non-conductive paste and the non-conductive paste should be used to achieve good conductivity between the lower spiral contact 43 and the land electrode 22 of the mother substrate 20. Preferably, the conductive film is interposed between the relay substrate 40 and the mother substrate 20 with the lower spiral contact 43 and the land electrode 22 formed thereon.

[0056] When the relay substrate 40 and the mother substrate 20 are not bonded and fixed, an adhesive material such as a double-sided adhesive tape is used to bond the relay substrate 40 and the mother substrate 20 together. In such a case, the relay board 40 can be attached to and detached from the mother board 20, and for example, the relay board 40 can be easily replaced. The double-sided pressure-sensitive adhesive tape is obtained by applying a pressure-sensitive adhesive such as a rubber-based elastomer or acrylic resin on the upper and lower surfaces of a polyvinyl chloride film. In particular, it is possible to accurately hold the relay board 40 on a predetermined position of the mother board 20 without interposing the adhesive or the adhesive between the relay board 40 and the mother board 20. . When the upper casing 13 is hooked on the lower casing 12, a pressing force in the downward direction (Z2 direction in the drawing) acts on the relay board 40 via the auxiliary board 33 from the upper casing 13. Therefore, the relay board 40 can be accurately held on a predetermined position of the mother board 20 by the pressing force. Further, if a positioning member is provided on the mother board 20 and the relay board 40 is installed on the mother board 20 by the positioning member, the relay board 40 is placed on the mother board 20. It becomes possible to install more accurately at a predetermined position.

In the one shown in FIGS. 1 and 2, four relay boards 40 are provided at positions facing four sides of the auxiliary board 33 of the semiconductor device 30. For this reason, the semiconductor device 30 and the mother An empty space 50 is formed in a region facing the one substrate 20 and surrounded by the four relay substrates 40. A plurality of electronic chip components (electronic components) 26 (individually labeled 26a, 26b, 26c, and 26d are attached to the empty space 50 on the mother board 20, for example, resistors, capacitors, or coils. Force).

That is, a vacant space 50 is positively formed in an opposing region between the auxiliary substrate 33 and the mother substrate 20 constituting the semiconductor device 30 that is not normally used in the present invention, and the vacant space 50 is effectively used. Since it is intended to be used, that is, more electronic chip components 26 are mounted, it is possible to obtain a mother board 20 capable of high-density mounting.

[0059] Further, for example, when it is necessary to arrange the electronic chip component 26 having a high height dimension in the empty space 50, the relay substrate 40 having a thick plate thickness of the base substrate 41 is selected and the above-mentioned If the number of the spacers 29 is reduced, the semiconductor device 30 can be moved upward (in the Z1 direction) close to the ceiling surface 23a of the upper housing 23 so that the empty space 50 is opposed. It becomes possible to adjust the distance L1 in the direction of expanding in the height direction. Therefore, even the electronic chip component 26 having a high height can be arranged in the empty space 50.

[0060] However, when the height dimension h of the electronic chip component 26 is larger than the maximum facing distance L1 when the semiconductor device 30 is moved most in the Z1 direction (however, the ceiling surface of the upper casing 13). 13a and the mother board 20 cannot be arranged in the vacant space 50 in the facing distance L2 or less.

Therefore, when the height dimension h exceeds the maximum facing distance L1, that is, when it is necessary to arrange the electronic chip component 26c as shown in FIG. When the head of the electronic chip component 26c is passed through the through hole 33A formed in the auxiliary substrate 33, the electronic chip component 26c is connected to the ceiling surface 13a of the upper housing 13 and the mother board. It becomes possible to arrange within 20 facing distance L2.

In the above embodiment, the relay substrate 40 having the upper elastic contact 42 and the lower contact 43 is arranged between the auxiliary substrate 33 and the mother substrate 20 constituting the semiconductor device 30. The semiconductor device 30 and the relay substrate 40 itself can be freely replaced. For this reason, when the semiconductor device 30 is upgraded or when the relay board 40 is defective, A new semiconductor device 30 or a relay board 40 can be replaced quickly and easily.

[0063] Moreover, by selecting the relay substrate 40 having a plate thickness dimension corresponding to the facing distance L1 between the auxiliary substrate 33 and the mother substrate 20, a plurality of electronic chip components are provided in the empty space 50. In the state where 26 is arranged, the conductive connection between the external connection electrode 33a of the semiconductor device 30 and the land electrode 22 of the mother substrate 20 can be secured.

In the above embodiment, the case where a plurality of (four) bar-shaped relay substrates 40 are used has been described. However, the shape of the relay substrate 40 is not limited to the bar shape. For example, a square base material that matches the auxiliary substrate 33 of the semiconductor device 30 or a mouth-shaped base material that has an opening formed in the center of the auxiliary substrate 33 (other positions are possible), and others. A configuration may be adopted in which upper and lower contacts similar to those described above are arranged in a substantially matrix form on both the front and back surfaces of the base substrate having the following shape force.

Further, in the above-described embodiment, the power described as the electronic chip component 26 provided on the mother board is disposed in the empty space. The present invention is not limited to this. The electronic chip component 26 fixed to the lower surface of the auxiliary substrate 33 may be arranged in the empty space, or the electronic chip component provided on both the mother substrate 20 and the auxiliary substrate 33. The electronic device 10 according to the present invention is not limited to a portable device.

Brief Description of Drawings

FIG. 1 is a partial perspective view showing the structure of an electronic apparatus having a mounting board of the present invention.

FIG. 2 is a plan view showing an embodiment of a mounting board of the present invention,

[Fig. 3] Partial sectional view of the electronic device shown in Fig. 1,

FIG. 4 is a cross-sectional view showing a spiral contact as an embodiment of an elastic contact provided on a relay board,

FIG. 5 is a perspective view when a relay board shown as another embodiment is viewed from one direction;

FIG. 6 is a perspective view when a relay board shown as another embodiment is viewed from another direction different from the one direction;

Explanation of symbols Electronics

Enclosure

Lower housing

Upper housing

a Ceiling surface

Holding part

Mother board

Land electrode

Electronic chip parts (electronic parts)

Spacer

Semiconductor device

Auxiliary board

a External connection electrode

A through hole

, 40A, 40B Relay board

Base substrate

, 42A, 42B Upper elastic contact (upper spiral contact; first contact) a Fixed part

b, 43b Elastic deformation

Lower contact (lower spiral contact; second contact)

A, 43B Lower contact (fixed contact; second contact)

a Through hole

Conductive part

a, 46b Connecting line

Free space

Claims

The scope of the claims

[1] A mother substrate provided with a land electrode, an auxiliary substrate that is disposed opposite to the mother substrate and has an external connection electrode that is electrically connected to the land electrode, and the mother substrate A relay substrate for conductively connecting the land electrode and the external connection electrode of the auxiliary substrate,

Provided on at least one of the mother substrate and the auxiliary substrate in an empty space where the mother substrate and the auxiliary substrate face each other in a region excluding the electrode formation region where the external connection electrode is formed A mounting board on which electronic components are arranged

[2] A plurality of first contacts are provided on one surface of the relay substrate, and a plurality of second contacts are provided on the other surface, and the first contact is a land electrode of the mother substrate. 2. The mounting substrate according to claim 1, wherein the second contact is electrically connected to an external connection electrode of the auxiliary substrate.

[3] The plurality of first contacts and the plurality of second contacts are conductively connected to a through hole formed in the relay substrate via a conductive portion provided in the through hole. The mounting board according to claim 1, wherein:

[4] The plurality of first contacts and the plurality of second contacts are conductively connected via a connecting line wired on an outer surface of the relay board. Mounting board

[5] A base substrate is provided between one surface of the relay substrate and the other surface, and the height dimension of the empty space is adjusted by selecting the thickness of the base substrate. 5. The mounting board according to claim 1, wherein the mounting board is made possible.

6. The mounting according to claim 2, wherein the first contact is an elastic contact, and the second contact is an elastic contact or a fixed contact. substrate.

7. The mounting board according to claim 6, wherein the elastic contact is a spiral contactor.

[8] A through hole is formed in the auxiliary substrate, and the electronic component is inserted into the through hole. The mounting substrate according to any one of claims 1, 2, 4 or 5, wherein the auxiliary substrate is provided with at least one bare chip or more. The mounting substrate according to claim 1 or 2, wherein