CN117812800A

CN117812800A - Circuit board assembly, manufacturing method thereof and display assembly

Info

Publication number: CN117812800A
Application number: CN202211164922.7A
Authority: CN
Inventors: 王超; 李洋; 刘立坤; 李艳禄
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2024-04-02

Abstract

The application provides a manufacturing method of a circuit board assembly, which comprises the following steps: providing a first outer substrate; an inner substrate is arranged on the first outer substrate, the first outer substrate is electrically connected with the inner substrate, the inner substrate comprises a first part and a second part, and an opening is formed between the first part and the second part in a penetrating way to form a bending region; a first driving element and a second driving element are arranged at intervals on one side, away from the inner substrate, of the first outer substrate; the first driving element and the second driving element are electrically connected with the first outer substrate, the first driving element is arranged corresponding to the first part, and the second driving element is arranged corresponding to the second part. The manufacturing method of the circuit board assembly is simple to operate, and the manufactured circuit board assembly is small in size. The application also provides a circuit board assembly and a display assembly.

Description

Circuit board assembly, manufacturing method thereof and display assembly

Technical Field

The application relates to a circuit board assembly, a manufacturing method thereof and a display assembly.

Background

In general, in a dual-screen electronic product, two circuit boards are respectively connected with different display screens and main boards, so that functions of independent driving and touch control of the two display screens are realized.

However, the two circuit boards are designed according to different circuit layouts, then produced in different production lines, and then assembled with the two display screens respectively, so that the double-sided screen assembly can be obtained. The manufacturing process is tedious, and meanwhile, the double-sided screen assembly is large in size and is not suitable for the thinning development of double-sided screen electronic products.

Disclosure of Invention

In order to solve the problems in the background art, the present application provides a method for manufacturing a circuit board assembly.

In addition, the application also provides a circuit board assembly.

In addition, the application also provides a display assembly.

The application provides a manufacturing method of a circuit board assembly, which comprises the following steps:

providing a first outer substrate;

an inner substrate is arranged on one side of the first outer substrate, the first outer substrate is electrically connected with the inner substrate, the inner substrate comprises a first part and a second part which are arranged at intervals, an opening is arranged between the first part and the second part in a penetrating way, a bending area and two non-bending areas except the bending area are defined, and the bending area is arranged corresponding to the opening;

and a first driving element and a second driving element are arranged at one side of the first outer substrate, which is away from the inner substrate, at intervals, the first driving element and the second driving element are electrically connected with the first outer substrate, the first driving element is arranged corresponding to the first part, and the second driving element is arranged corresponding to the second part, so that the circuit board assembly is obtained.

Further, the inner substrate has a thickness direction, and along the thickness direction, the inner substrate includes a first inner circuit layer, an inner substrate layer, a second inner circuit layer, and a first adhesive layer, where the first inner circuit layer and the second inner circuit layer are respectively disposed on two opposite surfaces of the inner substrate layer, and a first conductive body is disposed through the inner substrate layer, and is electrically connected to the first inner circuit layer and the second inner circuit layer;

after the step of disposing the inner substrate on the first outer substrate, the method further includes:

and a second outer substrate is arranged on one side, away from the first outer substrate, of the inner substrate, the first inner circuit layer is electrically connected with the second outer substrate, and the second inner circuit layer is electrically connected with the first outer substrate.

Further, the first inner circuit layer comprises a first golden finger and a second golden finger, the first golden finger is arranged at one end of the first part, which is away from the second part, and the second golden finger is arranged at one end of the second part, which is away from the first part;

the step of disposing a second outer substrate on a side of the inner substrate facing away from the first outer substrate further includes:

A first window is arranged at the end part of the first outer substrate, and

and a second window is arranged at the end part of the second outer substrate corresponding to the first window, so that the first golden finger and the second golden finger protrude out of the end surfaces of the first outer substrate and the second outer substrate.

Further, the step of disposing an inner substrate on the first outer substrate side includes:

sequentially attaching the first part and the second part to one side of the first outer substrate, wherein the first part and the second part are arranged at intervals to form the opening;

wherein the manufacturing method of the first part or the second part comprises the steps of:

providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises an inner side substrate layer, a first inner side copper foil layer and a second inner side copper foil layer which are arranged on two opposite sides of the inner side substrate layer;

etching the first inner copper foil layer to form the first inner circuit layer;

etching the second inner copper foil layer to form the second inner circuit layer;

arranging a first bonding layer on one side of the inner substrate layer, wherein the first bonding layer coats the second inner circuit layer to obtain an inner intermediate;

Dividing the medial intermediate to obtain the first portion or the second portion.

Further, the second outer substrate comprises a second bonding layer, a second outer substrate layer and a second outer line layer which are sequentially stacked, the second bonding layer is arranged towards the inner substrate, a second wire slot is formed in a penetrating mode in the second outer line layer, and the second wire slot is arranged corresponding to the opening; the step of disposing a second outer substrate on a side of the inner substrate facing away from the first outer substrate includes:

a portion of the second adhesive layer fills into the opening.

Further, the first outer substrate comprises a first outer substrate layer and a first outer circuit layer, the first outer circuit layer is penetrated to form a first wire groove, the first wire groove is arranged corresponding to the opening, the first outer circuit layer comprises a first welding pad and a second welding pad which are arranged at intervals, the first welding pad is arranged corresponding to the first part, and the second welding pad is arranged corresponding to the second part;

the step of disposing a first driving element and a second driving element at a side of the first outer substrate away from the inner substrate at intervals includes:

The first driving element is arranged on the first welding pad, and the second driving element is arranged on the second welding pad.

Further, after the step of disposing the inner substrate on the first outer substrate side, the method further includes:

a first protective film is arranged on one side, away from the inner substrate, of the first outer substrate;

a first groove and a second groove are formed through the first protective film and part of the first outer substrate layer, wherein the first groove is used for accommodating part of the second driving element, and the second groove is used for accommodating part of the first driving element; and

the bending areas are folded, so that the two non-bending areas are correspondingly arranged, part of the second driving elements are accommodated in the first grooves, and part of the second driving elements are accommodated in the first grooves.

The application also provides a circuit board assembly, which comprises a first outer substrate, an inner substrate, a first driving element and a second driving element, wherein the first outer substrate is arranged on one side of the inner substrate, the inner substrate comprises a first part and a second part, and the first part and the second part are arranged at intervals to form an opening penetrating through the inner substrate; the circuit board assembly comprises a bending region and two non-bending regions except the bending region, and the bending regions are arranged corresponding to the openings;

The first driving element and the second driving element are arranged on one side, away from the inner substrate, of the first outer substrate at intervals, the first driving element and the second driving element are electrically connected with the first outer substrate, the first driving element is arranged corresponding to the first part, and the second driving element is arranged corresponding to the second part.

Further, the method further comprises the following steps: the second outer substrate is arranged on the other side of the inner substrate, which is away from the first outer substrate;

the inner substrate is provided with a thickness direction, the inner substrate comprises an inner substrate layer, a first inner circuit layer and a second inner circuit layer, the first inner circuit layer and the second inner circuit layer are respectively arranged on two opposite sides of the inner substrate layer, the first inner circuit layer is electrically connected with the second outer substrate, the second inner circuit layer is electrically connected with the first outer substrate, two opposite sides of the first inner circuit layer comprise a plurality of exposed first golden fingers and second golden fingers, the first golden fingers are arranged on one ends of the first portions, which deviate from the second portions, and the second golden fingers are arranged on one ends of the second portions, which deviate from the first portions.

The application also provides a display assembly, including first display screen, second display screen and circuit board subassembly as above, buckle the district and buckle, two the district is buckled relatively to the non-, first display screen with the second display screen interval is located the second outside base plate deviates from one side of inboard base plate, first display screen with the second display screen is located one respectively the district is buckled to the non-, first golden finger electric connection first display screen, second golden finger electric connection the second display screen.

According to the manufacturing method of the circuit board assembly, the first part and the second part which are spaced are arranged on the inner substrate, and are respectively and independently electrically connected with the first driving element and the second driving element, so that a complete driving network is respectively realized between the first driving element and the second driving element, and crosstalk between the first driving element and the second driving element is reduced. And through with first part with the interval of second part sets up, in circuit board subassembly forms the district of buckling, make circuit board subassembly can be followed buckle the district is buckled, thereby realizes the encapsulation of two-sided display screen structure by one step, and the flow is simple, is favorable to reducing the cost of manufacture, reduces circuit board subassembly's space occupancy, is favorable to improving the degree of freedom of electronic product assembly, also is favorable to the slim development trend of future electronic product.

And, because the inboard base plate both sides are equipped with first outside base plate with the second outside base plate for the bending region has two-sided structure, can ensure not take place problems such as resilience, fracture failure when buckling.

In addition, through set up first recess and second recess in the first outside base plate for after the circuit board subassembly is buckled, first drive element can imbed the second recess, second drive element can imbed in the first recess, realize in buckling first drive element with the embedding of second drive element is favorable to further thinning of circuit board subassembly.

Drawings

Fig. 1 is a schematic cross-sectional view of a first outer substrate according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional view of the first outer substrate shown in fig. 1 after an inner substrate is disposed on one side of the first outer substrate.

Fig. 3 is a schematic cross-sectional view of a double-sided copper-clad substrate according to an embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional view of the double-sided copper-clad substrate shown in fig. 3 after forming a first blind hole.

Fig. 5 is a schematic cross-sectional view of the first via formed in the first blind hole shown in fig. 4.

FIG. 6 is a schematic cross-sectional view of the first inner copper foil layer shown in FIG. 5 after etching to form a first inner circuit layer and etching to form a second inner circuit layer.

Fig. 7 is a schematic cross-sectional view of an inner intermediate obtained by providing a first adhesive layer on one side of the inner substrate layer shown in fig. 6.

FIG. 8 is a schematic cross-sectional view of the medial intermediate shown in FIG. 7 after the medial intermediate is divided to form a first portion and a second portion.

Fig. 9 is a schematic cross-sectional view of the inner substrate shown in fig. 2 after a second outer substrate is disposed on one side of the inner substrate.

Fig. 10 is a schematic cross-sectional view of the first outer substrate shown in fig. 9 after forming a second blind hole and forming a third blind hole on the second outer substrate.

Fig. 11 is a schematic cross-sectional view of the second blind hole shown in fig. 10 after forming a second via and forming a third via in the third blind hole.

Fig. 12 is a schematic cross-sectional view of the first outer copper foil layer shown in fig. 10 after etching to form a first outer wiring layer and etching to form a second outer wiring layer.

FIG. 13 is a schematic cross-sectional view of the first outer substrate layer shown in FIG. 12 after the first and second openings are opened.

Fig. 14 is a schematic cross-sectional view of the first outer substrate shown in fig. 13 after a first window is opened and a second window is opened.

Fig. 15 is a schematic cross-sectional view of the first outer substrate shown in fig. 14 after a first protective film is provided on one side thereof and a second protective film is provided on a second outer substrate.

FIG. 16 is a schematic cross-sectional view of the first and second gold fingers shown in FIG. 15 after a first nickel gold layer is disposed on the first and second bonding pads and a second nickel gold layer is disposed on the first and second bonding pads.

Fig. 17 is a schematic cross-sectional view of the circuit board assembly obtained after the first driving element is disposed on the first bonding pad and the second driving element is disposed on the second bonding pad shown in fig. 16.

Fig. 18 is a schematic view illustrating the effect of the circuit board assembly shown in fig. 17 after bending.

Fig. 19 is a schematic view of the circuit board assembly shown in fig. 17 provided with a first display screen and a second display screen.

Fig. 20 is a schematic cross-sectional view of a display assembly according to an embodiment of the present disclosure.

Description of the main reference signs

Circuit board assembly 100

First outer substrate 10

First outer substrate layer 11

First outer copper foil layer 12

Second blind hole 13

Second conductive body 131

Inner substrate 20

First portion 201

Second portion 202

Opening 203

Double-sided copper-clad substrate 20a

Inner substrate layer 21

First inner circuit layer 22

First inner copper foil layer 22a

First golden finger 221

Second golden finger 222

Second inner circuit layer 23

Second inner copper foil layer 23a

First adhesive layer 24

First conductive body 25

First blind hole 25a

Medial intermediate 26

Second outer substrate 30

Second outer substrate layer 31

Second outer copper foil layer 32

Second adhesive layer 33

Third blind hole 34

Third conductive body 341

First outer circuit layer 50

First bonding pad 501

Second bonding pad 502

First wire slot 503

Second outer line layer 51

Second wire slot 511

First opening 61

Second opening 62

First fenestration 701

Second fenestration 702

First protective film 71

Third opening 711

Fourth opening 712

Second protective film 72

First groove 73

Second groove 74

First nickel-gold layer 80

Second nickel-gold layer 82

First drive element 90

Second drive element 92

Heat conducting glue layer 102

Display assembly 200

First display screen 211

Second display screen 212

First adhesive layer 213

Second adhesive layer 214

Thickness direction L1

Direction of extension L2

Bending area A

Non-inflection region B

Bonding region B1

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may be present.

Referring to fig. 1 to 17, the present application provides a method for manufacturing a circuit board assembly 100, which includes the steps of:

referring to fig. 1, a first outer substrate 10 is provided, and the first outer substrate 10 includes a first outer substrate layer 11 and a first outer copper foil layer 12 stacked together.

Referring to fig. 2, an inner substrate 20 is disposed on the first outer substrate 10.

The inner substrate 20 has a thickness direction L1 and an extending direction L2 perpendicular to the thickness direction L1, and the inner substrate 20 includes a first inner wiring layer 22, an inner base material layer 21, a second inner wiring layer 23, and a first adhesive layer 24 along the thickness direction L1. The first inner circuit layer 22 and the second inner circuit layer 23 are respectively disposed on two opposite surfaces of the inner substrate layer 21. At least two first vias 25 are disposed through the first inner circuit layer 22 and the inner substrate layer 21, and the first vias 25 are electrically connected to the first inner circuit layer 22 and the second inner circuit layer 23. The first adhesive layer 24 covers the second inner circuit layer 23. Along the extending direction L2, the inner substrate 20 includes a first portion 201 and a second portion 202, and the first portion 201 and the second portion 202 are spaced apart from each other. The two first conductive bodies 25 are respectively disposed on the first portion 201 and the second portion 202.

The portion of the first inner circuit layer 22 located on the first portion 201 includes a first gold finger 221, where the first gold finger 221 is located at an end of the first portion 201 facing away from the second portion 202. The portion of the first inner circuit layer 22 located at the second portion 202 includes a second gold finger 222, where the second gold finger 222 is located at an end of the second portion 202 facing away from the first portion 201.

Specifically, the first portion 201 and the second portion 202 are spaced apart from the first outer substrate layer 11 to form an opening 203. The first portion 201 and the second portion 202 are connected to the first outer substrate layer 11 by the first adhesive layer 24. The first gold fingers 221 and the second gold fingers 222 are disposed in the same direction.

In some embodiments, referring to fig. 3 to 8, the method for manufacturing the first portion 201 includes the steps of:

referring to fig. 3, a double-sided copper-clad substrate 20a is provided, wherein the double-sided copper-clad substrate 20a includes the inner substrate layer 21, a first inner copper foil layer 22a and a second inner copper foil layer 23a. The first inner copper foil layer 22a and the second inner copper foil layer 23a are respectively disposed on opposite sides of the inner substrate layer 21.

S22 referring to FIG. 4, at least two first blind holes 25a are formed through the first inner copper foil layer 22a and the inner substrate layer 21, and the two first blind holes 25a are disposed at intervals.

Wherein, the first blind hole 25a can be drilled by mechanical drilling or laser drilling.

S23, referring to FIG. 5, the first via 25 is selectively plated with copper in the first blind hole 25a.

S24 referring to fig. 6, the first inner copper foil layer 22a is etched to form a first inner circuit layer 22, and the second inner copper foil layer 23a is etched to form a second inner circuit layer 23.

The first inner circuit layer 22 includes at least two first gold fingers 221 disposed at intervals.

Referring to fig. 7, a first adhesive layer 24 is disposed on one side of the inner substrate layer 21, and the first adhesive layer 24 covers the second inner circuit layer 23 to obtain an inner intermediate 26.

Referring to fig. 8, the inner intermediate body 26 is divided along the extending direction L2 to obtain the first portion 201, and the first gold finger 221 is disposed at one end of the first inner circuit layer 22. The first golden finger 221 protrudes from one end of the first adhesive layer 24.

In this embodiment, the second portion 202 may be manufactured by a similar method to the first portion 201, and will not be described herein.

In this embodiment, the first portion 201 and the second portion 202 are separately manufactured by typesetting and attached to the first outer substrate layer 11 at two intervals, so as to form the inner substrate 20. The fitting mode is not limited to a sleeve positioning rod (PIN) or a visual identification device (CCD) for identification and positioning.

In other embodiments, the first portion 201 and the second portion 202 may be fabricated simultaneously, with the first portion 201 and the second portion 202 being obtained simultaneously by dividing the medial intermediate 26.

Referring to fig. 9, a second outer substrate 30 is pressed against the inner substrate 20 on a side facing away from the first outer substrate 10.

The second outer substrate 30 includes a second adhesive layer 33, a second outer substrate layer 31, and a second outer copper foil layer 32 stacked in order, wherein the second adhesive layer 33 is disposed toward the inner substrate 20, and a portion of the second adhesive layer 33 is filled into the opening 203. The second adhesive layer 33 only covers a part of the first inner circuit layer 22 and does not cover the first gold finger 221 and the second gold finger 222. Along the extending direction L2, a plurality of the first gold fingers 221 are exposed at one ends of the first adhesive layer 24 and the second adhesive layer 33, and a plurality of the second gold fingers 222 are exposed at the other ends of the first adhesive layer 24 and the second adhesive layer 33.

In this embodiment, the first adhesive layer 24 and the second adhesive layer 33 are both pure glue.

Referring to fig. 10, at least two second blind holes 13 are formed through the first outer substrate 10, and at least two third blind holes 34 are formed through the second outer substrate 30.

The second blind hole 13 further penetrates through the first adhesive layer 24, and a part of the second inner circuit layer 23 is exposed from the second blind hole 13. The third blind hole 34 penetrates the second outer copper foil layer 32, the second outer substrate layer 31 and the second adhesive layer 33 in order, and a part of the first inner circuit layer 22 is exposed from the third blind hole 34.

Wherein the second blind hole 13 and the third blind hole 34 are disposed away from the opening 203, the first portion 201 includes at least one second blind hole 13 and at least one third blind hole 34, and the second portion 202 includes at least one second blind hole 13 and at least one third blind hole 34.

In this embodiment, along the thickness direction L1, each of the second blind holes 13 and the third blind holes 34 are disposed correspondingly. Along the extending direction L2, the second blind hole 13 and the third blind hole 34 on the first portion 201 and the second blind hole 13 and the third blind hole 34 on the second portion 202 are symmetrically disposed respectively.

Referring to fig. 11, a second via 131 is formed in the second blind hole 13 and a third via 341 is formed in the third blind hole 34 by electroplating. The second conductive body 131 is electrically connected to the first outer copper foil layer 12 and the second inner circuit layer 23, and the third conductive body 341 is electrically connected to the second outer copper foil layer 32 and the first inner circuit layer 22.

S70 referring to fig. 12, the first outer copper foil layer 12 is etched to form a first outer circuit layer 50, and the second outer copper foil layer 32 is etched to form a second outer circuit layer 51. The first outer circuit layer 50 is electrically connected to the second inner circuit layer 23 through the second conductive body 131. The second outer circuit layer 51 is electrically connected to the first inner circuit layer 22 through the third conductive body 341.

The first outer circuit layer 50 includes a plurality of first pads 501 and a plurality of second pads 502, the first pads 501 are disposed corresponding to the first portion 201, and the second pads 502 are disposed corresponding to the second portion 202.

In this embodiment, the first outer circuit layer 50 further includes a first wire slot 503, and the first wire slot 503 is disposed corresponding to the opening 203. The second outer line layer 51 includes a second line slot 511, and the second line slot 511 is disposed corresponding to the opening 203.

Referring to fig. 13, at least one first opening 61 and at least one second opening 62 are disposed in the first outer substrate layer 11, wherein the first opening 61 is disposed corresponding to the first portion 201, and the second opening 62 is disposed corresponding to the second portion 202.

The first opening 61 and the second opening 62 penetrate through a portion of the first outer substrate layer 11, the first opening 61 and the second bonding pad 502 are symmetrically disposed, and the second opening 62 and the first bonding pad 501 are symmetrically disposed.

In the present embodiment, the first opening 61 is disposed adjacent to the first pad 501 and away from the second conductive body 131. The second opening 62 is disposed between the second conductive body 131 and the second pad 502.

Referring to fig. 14, a first opening 701 is provided at an end of the first outer substrate 10, and a second opening 702 is provided at an end of the second outer substrate 30 corresponding to the first opening 701, such that the end surface of the first outer substrate 10 and the end surface of the second outer substrate 30 are flush along the extending direction L2, and the plurality of first fingers 221 and the plurality of second fingers 222 protrude from the end surface of the first outer substrate 10 or the second outer substrate 30.

S100 referring to fig. 15, a first protective film 71 is disposed on the first outer line layer 50, and a second protective film 72 is disposed on the second outer line layer 51.

Wherein, step S100 further comprises:

at least two third openings 711 and at least two fourth openings 712 are formed on the first protective film 71 in a penetrating manner, and the first bonding pad 501 and the second bonding pad 502 are respectively exposed by one third opening 711, wherein one fourth opening 712 is communicated with the first opening 61 to form a first groove 73, and the other fourth opening 712 is communicated with the second opening 62 to form a second groove 74.

Wherein the first recess 73 is configured to receive a portion of the second driving member 92, and the second recess is configured to receive a portion of the first driving member 90 (see fig. 17 and 18).

Referring to fig. 16, a first nickel-gold layer 80 is disposed on the first gold finger 221 and the second gold finger 222, and a second nickel-gold layer 82 is disposed on the first bonding pad 501 and the second bonding pad 502, respectively, by way of gold plating.

S120, referring to FIG. 17, a first driving device 90 is disposed at one of the third openings 711, and the first driving device 90 is electrically connected to the first bonding pad 501; a second driving element 92 is disposed at the other third opening 711, and the second driving element 92 is electrically connected to the second pad 502, so as to obtain the circuit board assembly 100.

Referring to fig. 17 and 18, a bending region a and two non-bending regions B other than the bending region a are defined in the circuit board assembly 100, and the bending region a is disposed corresponding to the opening 203. The bending region a is bent 180 degrees, so that two non-bending regions B are correspondingly disposed, a part of the second driving element 92 is accommodated in the first groove 73, and a part of the second driving element 92 is accommodated in the first groove 73. The two non-bending areas B are mirror-symmetrical, the protruding first gold finger 221 and the second gold finger 222 form two bonding areas B1, and the two bonding areas B1 are respectively used for connecting the first display screen 211 and the second display screen 212 to obtain the display assembly 200 (see fig. 20).

Referring to fig. 19 and 20, the method for manufacturing the display assembly 200 may include the following steps:

a first display screen 211 and a second display screen 212 are disposed at intervals on a side of the second outer substrate 30 away from the inner substrate 20 (see fig. 19), the first display screen 211 and the second display screen 212 are respectively disposed in the non-bending area B, the first gold finger 221 is electrically connected to the first display screen 211, and the second display screen 212 is electrically connected to the second display screen;

The circuit board assembly 100 is symmetrically bent 180 degrees along the bending area a, the two non-bending areas B are correspondingly bonded through the heat conducting glue layer 102, the first driving element 90 is embedded in the second groove 74, the second driving element 92 is embedded in the first groove 73, and the first display screen 211 and the second display screen 212 are respectively located on two opposite sides of the circuit board assembly 100.

The first display screen 211 and the second external substrate 30 are fixedly bonded through a first adhesive layer 213, and the second display screen and the second external substrate 30 are fixedly bonded through a second adhesive layer 214. The heat-conducting glue layer 102 is used for bonding the circuit board assembly 100, and the heat-conducting glue layer 102 has the heat dissipation function of the first driving element 90 and the second driving element 92.

In some embodiments, the first gold finger 221 may be electrically connected to a lead (not shown) of the first display screen 211 through Anisotropic Conductive Film (ACF), and the second gold finger 222 may be electrically connected to a lead (not shown) of the second display screen 212 through Anisotropic Conductive Film (ACF). In other embodiments, conductive particles, solder paste, etc. may be used for electrical connection.

It can be appreciated that the circuit board assembly 100 may be bent first and then packaged with the display screen, or may be bent first and then packaged with the display screen, and the circuit board assembly is in a central symmetrical structure during bending.

Compared with the prior art, the manufacturing method of the circuit board assembly 100 provided by the application has the following advantages:

first, by providing separate first portions 201 and second portions 202 at intervals from the inner substrate 20, the first portions 201 and the first driving elements 90 are separately connected, and the second portions 202 and the second driving elements 92 are separately connected, and each of the two driving networks realizes a complete driving network, and the two driving networks independently operate, so that crosstalk between the first driving elements 90 and the second driving elements 92 is advantageously reduced.

And secondly, the first portion 201 and the second portion 202 are arranged at intervals, the bending area a is formed at the central position of the circuit board assembly 100, and two sides of the bending area a are arranged in a mirror image structure, so that the circuit board assembly 100 can be bent 180 degrees along the bending area a, and the packaging of the double-sided display screen structure is realized in one step. In addition, since the first outer substrate 10 and the second outer substrate 30 are disposed on both sides of the inner substrate 20, the bending region a has a double-sided structure, so that it is possible to ensure that problems such as rebound and fracture failure do not occur during bending. Since the bending area a does not include any circuit structure (including the opening 203, the first wire slot 503, and the second wire slot 511), the performance of the circuit board assembly 100 can be ensured not to be affected after bending, so as to improve the reliability of the circuit board assembly 100.

And (III) the first groove 73 and the second groove 74 are formed in the first outer substrate 10, so that after the circuit board assembly 100 is bent, the first driving element 90 can be embedded in the second groove 74, the second driving element 92 can be embedded in the first groove 73, and the first driving element 90 and the second driving element 92 are embedded while being bent, thereby being beneficial to further thinning of the circuit board assembly 100.

And (four) compared with the mode of arranging two first golden fingers 221 or two second golden fingers 222 on one side, in the method, the first golden fingers 221 and the second golden fingers 222 are arranged on two opposite sides, so that the subsequent press connection with the first display screen 211 and the second display screen 212 is easier to realize, deformation and fracture of the circuit board assembly 100 are not easy to cause in the press connection process, the assembly efficiency of the display screen can be improved, and the packaging process is more feasible and reliable. In addition, in this application, the first display screen 211 and the second display screen 212 may be disposed at intervals on the same side of the circuit board assembly 100, and after the first display screen 211 and the second display screen 212 are bent by 180 degrees, they are respectively located on two opposite sides of the circuit board assembly 100, so as to complete packaging of the display screens. Compared with the mode that two display screens are respectively arranged on two sides of the circuit board, double side frames are arranged on two sides after packaging is completed. The screen occupation ratio of the obtained display assembly 200 is larger by adopting a single-side packaging scheme.

Referring to fig. 17, the embodiment of the present application further provides a circuit board assembly 100, where the circuit board assembly 100 includes a first outer substrate 10, an inner substrate 20, a second outer substrate 30, a first protective film 71, a second protective film 72, a first driving element 90, and a second driving element 92.

The inner substrate 20 is disposed between the first outer substrate 10 and the second outer substrate 30, the inner substrate 20 is provided with an opening 203 therethrough, and the opening 203 symmetrically separates the inner substrate 20 into a first portion 201 and a second portion 202. The first protective film 71 is disposed on a side of the first outer substrate 10 facing away from the inner substrate 20, and the second protective film 72 is disposed on a side of the second outer substrate 30 facing away from the inner substrate 20.

The inner substrate 20 includes a first inner wiring layer 22, an inner base material layer 21, a second inner wiring layer 23, and a first adhesive layer 24. The first inner circuit layer 22 and the second inner circuit layer 23 are respectively disposed on two opposite surfaces of the inner substrate layer 21. At least two first vias 25 are disposed through the first inner circuit layer 22 and the inner substrate layer 21, and the first vias 25 are electrically connected to the first inner circuit layer 22 and the second inner circuit layer 23. The first adhesive layer 24 covers the second inner circuit layer 23. The two first conductive bodies 25 correspond to the first portion 201 and the second portion 202, respectively.

The portion of the first inner circuit layer 22 located in the first portion 201 includes a first gold finger 221, where the first gold finger 221 is located at one end of the first portion 201. The portion of the first inner circuit layer 22 located at the second portion 202 includes a second gold finger 222, and the second gold finger 222 is located at one end of the second portion 202. The first nickel gold layer 80 is disposed on the surfaces of the first gold finger 221 and the second gold finger 222.

The first outer substrate 10 includes a first outer substrate layer 11 and a first outer circuit layer 50 disposed on a surface of the first outer substrate layer 11, the first outer circuit layer 50 includes a first bonding pad 501 and a second bonding pad 502, the first bonding pad 501 is disposed corresponding to the first portion 201, the second bonding pad 502 is disposed corresponding to the second portion 202, and the surfaces of the first bonding pad 501 and the second bonding pad 502 are provided with a second nickel-gold layer 82. At least two third openings 711 are formed through the first protective film 71, the first bonding pad 501 and the second bonding pad 502 are exposed from the third openings 711, the first driving element 90 is electrically connected to the first bonding pad 501 through one of the third openings 711, and the second driving element 92 is electrically connected to the second bonding pad 502 through the other third opening 711. The first outer substrate 10 is further provided with a second conductive body 131 in a penetrating manner, and the first outer circuit layer 50 is electrically connected to the second inner circuit layer 23 through the second conductive body 131.

Along the thickness direction L1, at least one first groove 73 and at least one second groove 74 are further disposed through the first protective film 71 and a portion of the first outer substrate layer 11, where the first groove 73 is symmetrically disposed with the second driving element 92, and the second groove 74 is symmetrically disposed with the first driving element 90.

Along the thickness direction L1, the second outer substrate 30 includes a second adhesive layer 33, a second outer substrate layer 31, and a second outer line layer 51 stacked in this order, and a part of the second adhesive layer 33 is filled into the opening 203. The second outer substrate 30 is further provided with a third via 341 in a penetrating manner, and the second outer circuit layer 51 is electrically connected to the first inner circuit layer 22 through the third via 341.

A bending region A and two non-bending regions B except the bending region A are defined in the circuit board assembly 100, the bending region A is arranged corresponding to the opening, the two non-bending regions B are in mirror symmetry, the protruding first golden finger 221 and the second golden finger 222 partially form two bonding regions B1, and the two bonding regions B1 are used for connecting a display screen.

Referring to fig. 17 and 18 together, the circuit board assembly 100 may be symmetrically bent 180 degrees along the bending region a, after bending, the two non-bending regions B are bonded by the heat conductive adhesive layer 102, the first driving element 90 is embedded in the second groove 74, and the second driving element 92 is embedded in the first groove 73.

Referring to fig. 20, an embodiment of the present application further provides a display assembly 200, where the display assembly 200 includes a first display screen 211, a second display screen 212, and the circuit board assembly 100 bent 180 degrees. The first display screen 211 and the second display screen 212 are disposed at intervals on a side of the second outer substrate 30 away from the inner substrate 20 (see fig. 17), the first golden finger 221 is electrically connected to the first display screen 211, and the second golden finger 222 is electrically connected to the second display screen 212.

Hereinabove, the specific embodiments of the present application are described with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that various changes and substitutions can be made in the specific embodiments of the present application without departing from the spirit and scope of the present application. Such modifications and substitutions are intended to be within the scope of the present application.

Claims

1. A method of manufacturing a circuit board assembly, comprising the steps of:

providing a first outer substrate;

2. The method of manufacturing according to claim 1, wherein the inner substrate has a thickness direction, and along the thickness direction, the inner substrate includes a first inner wiring layer, an inner substrate layer, a second inner wiring layer, and a first adhesive layer, the first inner wiring layer and the second inner wiring layer are respectively disposed on opposite surfaces of the inner substrate layer, a first via is disposed through the inner substrate layer, and the first via is electrically connected to the first inner wiring layer and the second inner wiring layer;

3. The method of manufacturing of claim 2, wherein the first inner circuit layer includes a first gold finger and a second gold finger, the first gold finger being disposed at an end of the first portion facing away from the second portion, the second gold finger being disposed at an end of the second portion facing away from the first portion;

a first window is arranged at the end part of the first outer substrate, and

4. The method of manufacturing according to claim 2, wherein the step of disposing an inner substrate on the first outer substrate side includes:

5. The manufacturing method according to claim 2, wherein the second outer substrate includes a second adhesive layer, a second outer substrate layer, and a second outer line layer stacked in this order, the second adhesive layer being provided toward the inner substrate, the second outer line layer being formed with a second line groove penetrating therethrough, the second line groove being provided corresponding to the opening; the step of disposing a second outer substrate on a side of the inner substrate facing away from the first outer substrate includes:

A portion of the second adhesive layer fills into the opening.

6. The method of manufacturing of claim 1, wherein the first outer substrate includes a first outer substrate layer and a first outer circuit layer, the first outer circuit layer having a first wire slot formed therethrough, the first wire slot disposed corresponding to the opening, the first outer circuit layer including first pads and second pads disposed at intervals, the first pads disposed corresponding to the first portion, the second pads disposed corresponding to the second portion;

7. The method of manufacturing according to claim 6, wherein after disposing the inner substrate on the first outer substrate side, the method further comprises:

8. The circuit board assembly is characterized by comprising a first outer substrate, an inner substrate, a first driving element and a second driving element, wherein the first outer substrate is arranged on one side of the inner substrate, the inner substrate comprises a first part and a second part, and the first part and the second part are arranged at intervals to form an opening penetrating through the inner substrate; the circuit board assembly comprises a bending region and two non-bending regions except the bending region, and the bending regions are arranged corresponding to the openings;

9. The circuit board assembly of claim 8, further comprising: the second outer substrate is arranged on the other side of the inner substrate, which is away from the first outer substrate;

10. The display assembly is characterized by comprising a first display screen, a second display screen and the circuit board assembly according to claim 9, wherein the bending area is bent, the two non-bending areas are oppositely arranged, the first display screen and the second display screen are arranged on one side, away from the inner substrate, of the second outer substrate at intervals, the first display screen and the second display screen are respectively located in the non-bending area, the first golden finger is electrically connected with the first display screen, and the second golden finger is electrically connected with the second display screen.