WO2006095724A1 - Interposer - Google Patents

Interposer

Info

Publication number
WO2006095724A1
WO2006095724A1 PCT/JP2006/304353 JP2006304353W WO2006095724A1 WO 2006095724 A1 WO2006095724 A1 WO 2006095724A1 JP 2006304353 W JP2006304353 W JP 2006304353W WO 2006095724 A1 WO2006095724 A1 WO 2006095724A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
contact
contacts
substrate
relay
elastic
Prior art date
Application number
PCT/JP2006/304353
Other languages
French (fr)
Japanese (ja)
Inventor
Shin Yoshida
Taiji Okamoto
Tomoyuki Higuchi
Original Assignee
Alps Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00-H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7082Coupling device supported only by cooperation with PCB
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/77Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures

Abstract

[PROBLEMS] To provide an interposer capable of connecting electrodes of an electronic part with simple structure without requiring formation of a through hole. [MEANS FOR SOLVING PROBLEMS] Elastic contacts (20A, 20B) are formed in an elastic contact formation area A while contacts (14A, 14B) are formed in a contact formation area B on a substrate sheet (12). The substrate sheet (12) is folded at the portion between the two types of contacts in a folding area C along an outer shape of a spacer (11). The connection between the elastic contact (20A) and the contact (14A) and the connection between the elastic contact (20B) and the contact (14B) are made by connection lines formed on the substrate sheet (12). Accordingly, when the interposer (10) is mounted on a mounting unit (31) of a device body (30) and an electronic part (40) is mounted thereon before closing the cover, it is possible to connect the electrodes (32, 33) of the device body (30) to the electrodes (41, 42) of the electronic part (40), respectively. Thus, it is possible to connect electrodes of the electronic part with a simple structure without forming a through hole.

Description

Relay board

Technical field

[0001] The present invention is, for example, provided between oppositely disposed the electronic component electrode, relates to a relay board to secure electrical connection between the electrodes, it can be easily manufactured in a particularly simple construction on Do not relay board.

BACKGROUND

In recent years, multifunctional and companion ,, IC package semiconductor bare chip is sealed in the performance of semiconductor integrated circuits (IC) (hereinafter to as "packages", U) the number of input and output pins of It will tend to increase year by year, for example, the number of pins is also beginning to emerge as more than 1000

[0003] Therefore, the type of input and output pins, the method to retrieve the flanks and the four sides of the conventional package, are changing the type which emit from the entire bottom surface of the package, for example, BGA (B all Grid Array; spherical contact terminals ) and LGA (Land Grid Array; semiconductor devices called flat contact) of any number of CSP having a pin terminal (Chip Size Package) has been developed.

[0004] input and output pins, such as the BGA are arranged in a matrix (also referred to as a lattice or grid pattern) on the bottom surface of the CSP. Such package side connection of the BGA and the device body side of the electrode formed on the circuit board, such as Ma The one board is carried out, for example, using an IC socket as shown in Patent Document 1.

[0005] IC socket shown in Patent Document 1 has an IC mounting large number of through holes formed in a matrix on the bottom of the part (through hole), the spring body is in the interior of each through hole sleeve is provided with a contact probe in a state being movably biased Te cowpea. Then, the sleeve is electrically connected to the electrode provided on the circuit substrate

[0006] When mounted in the IC socket while positioning the package, depressing the BGA package contact with the distal end of each contact probe. At this time, since the contact portion of the serial each contour Tatopurobu contacts to each electrode of the circuit board side, the spring member between each electrode of each BGA and the circuit board side of the package-side in each said sleeve and contacts it is that are electrically connected through the contact portion of the probe.

[0007] In addition, the IC socket in this regard, functions as a relay board (interposer) for electrically connecting connecting each electrode of each BGA and the circuit board side of the Roh Kkeji side! /, Ru.

Patent Document 1: JP 2002- 357622 JP

Disclosure of the Invention

Problems that the Invention is to you'll solve

[0008] However, those shown in Patent Document 1, a large number of through holes on the bottom surface of the IC mounting portion and positioned with high accuracy is a problem that not necessary to opening.

[0009] and force also, the contact probe in the through holes it is necessary to Ru provided retractably with the spring body, as well as the structure of the socket is complicated I spoon, a problem that IC mounting portion becomes large is there.

[0010] Also because there is necessary to secure a space for fixing the socket on the circuit board, the circuit board, that is difficult to miniaturize the apparatus body itself. Or if you want to increase the number of components mounted on the circuit board, Ru mower problem the space hinder this.

[0011] Incidentally, since even narrower than the pitch interval between the pitch intervals, IC package one di electrode sealed it between the electrodes of the semiconductor bare chip, the IC package distance between the electrodes of the semiconductor bare chip in a wide clogs state redistribution technology to connect to the electrode is required. However, conventionally by using a multilayer substrate technology, it has been made in a configuration that rewiring the electrodes therebetween, has a problem that complicated process and manufacturing cost high.

[0012] The present invention is intended to solve the conventional problems described above, purpose thereof is to provide a relay board to allow electrical connection between the electrodes of the electronic component in a simple and easy configuration It is set to.

[0013] The present invention, Ru for the purpose of providing a relay substrate which is to allow a connection between a number of electrodes each other immediately opposite thing to form through holes.

[0014] The present invention aims at providing a relay board to allow easy electrical connection between the different electrodes of pitch.

Means for Solving the Problems

[0015] The present invention comprises a substrate having a folded region to the center in the width direction, and a plurality of contacts which are disposed and divided into one end and the other end in the width direction on the surface of the substrate has,

In the one end side and at least one contact of the other end side is formed by elastic contacts, and the conductivity of the communication connection between the contact provided at one end with the contact provided on the other end is connected, it is characterized in Rukoto.

[0016] Te Contact, above, the substrate, the surface of the contact is exposed is bent into a mountain fold before Symbol folded region in a state of outward, between the back surface of the substrate facing each other vinegar spacer is provided, it is preferably Rukoto,.

[0017] Further 〖This, the spacer is formed of a material having an insulating material or a conductive, Rukoto is preferably! /,.

[0018] In the present invention has a structure that electrically connect the contact point located in contact with the other surface side positioned on one side of the Nag possible to form a through hole in the relay board, you connecting both it is possible to form a connection line to the contact and integrally using techniques such as plated, manufacturing is easy, even teeth force it is possible to reduce the manufacturing cost.

[0019] Just select Matasupesa, as possible out to adjust freely the thickness dimension of the relay board. Therefore, it is possible to relay board 10 of the small and thin.

[0020] The present invention comprises a substrate having a folded region to the center in the width direction, a plurality of contacts disposed divided into one end and the other end of 且 one the width direction on the surface of the substrate If the connecting line of conductive for connecting the contact provided on the other end side contact provided on the one end side, in the folded region with the front surface of the contact is exposed to the outside a relay board and a spacer provided between the rear surface of the base material which is bent into a mountain fold, and wherein the Ru said spacer is formed of an elastically deformable soft material is Suruchi's.

[0021] In the above invention, spacer can be a relay board having a resilient contact as a whole to 弹性 deformed.

[0022] The above Nio, Te, for example, the order of contact provided on the one end, and order of contact provided on the other end, can be configured to be the same order .

[0023] Furthermore, it is also possible to adopt a configuration in which the pitch dimension between contact provided on the one end, the pitch dimension between contact provided on the other end side is formed in different sizes.

In [0024] the means, it becomes possible to perform the rewiring in the IC package easily and inexpensively.

Also said substrate, a relay substrate according to any of claims 1 a ヽ to 6, characterized in that the flexible sheet is formed Ru.

In [0025] the means, it is possible to easily form the relay substrate from a single substrate sheet.

[0026] In the above, elastic contact provided on the substrate is a spiral contacts extending toward the force connexion spirally Certificates-out start mosquito also the center side winding terminations provided on the base of the outer peripheral side, the If the spiral contactor is preferably a mountain-shape protruding the wind-starting end mosquito ゝ et the take countercurrent mosquito ゝ connexion elevational body to terminate.

Effect of the invention

[0027] In the present invention, it may be a simple and easy relay board since it is not necessary to form a through hole in the substrate. By varying the Matasupesa, it is possible to freely adjust the thickness dimension of the relay board, Therefore, it is easily possible to provide a thin relay board.

[0028] Further, it is possible to adjust the pitch dimension by changing the distance between the contacts formed in the relay board, it is possible to perform the rewiring of the IC package easily.

BEST MODE FOR CARRYING OUT THE INVENTION

[0029] FIG. 1 is an external perspective view showing the relay board as an embodiment of the present invention, when viewed relayed substrate from one side 1 A is Figure 1B viewed relay substrate from the opposite direction If, Figure 2 is an exploded perspective view of the relay board illustrated in FIG. 1, FIG. 3 is a perspective view showing a spiral contactor as an example of elastic contacts, 4 4 line in FIG. 1A with FIG. 4 shows an example of the use of the relay substrate is a cross-sectional view taken along.

[0030] Figure 1A, as shown in B, the relay substrate 10 are countercurrent force connexion linearly extending bar shape the Y1 and Y2 directions. Relay board 10 has a spacer 11 which functions as a base, and the spacer 11 adhered to the surface Tagged base sheet (base material) 12. [0031] The spacer 11 is formed in a bar shape, on one side surface of at least the width (X) direction are arc-shaped curved surface 11 a is formed, Ru. The scan Paix as a material for forming the p o 11, for example, an insulating hard substrate (glass epoxy), or a conductive metal material, there have natural rubber, synthetic rubber, elastically deformable soft material such as an elastomer one etc., it is possible to select the desired manner suits material used. Incidentally, in the present embodiment is formed of a hard substance insulating substrate.

[0032] The base sheet 12 is preferably such as those thin hands having insulating properties and flexibility such as polyimide sheet. On the surface of the substrate sheet 12, a plurality of contacts arranged regularly is eclipsed set.

[0033] On one surface 10A of the relay board 10 shown in FIG. 1A, a plurality of elastic contacts arranged in direction force connexion two rows in the Y direction (contact) 20A, 20B are provided. As shown in FIG. 2, one 弹 of contacts 20A is predetermined in the Y direction along the virtual line Ya located outside (XI side) of the surface and the width direction of the base sheet 12 (X-direction) of being arranged at intervals L, the other elastic contacts 20B are arranged side by side at the distance L and also along the imaginary line Yb located inside (X2 side). As shown in FIG. 1A, the distance between the predetermined electrodes (pitch dimension) W1 is provided between the imaginary line Ya and the virtual line Yb, an elastic contact 20A and elastic contacts 20B adjacent in the X direction There has been a pair. Incidentally, the elastic contact 20A, the region 20B is that is formed of an elastic contact forming region A.

[0034] In addition to the other surface 10B of the relay board 10 shown in FIG. 1B, a plurality of contacts 14A arranged in two rows toward the Y direction, 14B are provided. A plurality of contacts 14A shown in FIG. 2, 14B is the elastic contacts 20A, a conventional contact other than 20B (stationary contact tip protrudes in a convex shape), the elastic contacts 20A on the base sheet 12, 20B is They are formed on the same table plane and formed by being surface. As shown in FIG. 1B, one contact 14A is juxtaposed with the gap L in the Y direction along the virtual line Yc located outside (X2 side) in the width direction of the base sheet 12 (X-direction) are, the other contact 14B are arranged in phantom Yd on along connexion the distance L to the inner (XI side) 〖this position. The virtual line Yc to a predetermined distance between the electrodes (pitch dimension) 1 \ ^ 2 (≥ 1 ^ 1> 0) is provided also between the virtual line Yd, and contact points 14A adjacent in the X direction and contact 14B are paired. The region where the contact 14A, 14B are formed is the contact formation region B.

[0035] Figure 1A, as shown in B and 2, the contact 14A positioned outside the 弹 of contacts 20A located outside of the elastic contact-forming region A the contact formation region B, for example, gold, silver or is connected with a conductive material thin film-like connecting line formed by (pattern line) 15a such as copper, the elastic contacts 20B located inside the same way the elastic contact-forming region a contact formation and contact 14B located inside the region B are connected by a thin film-like connecting lines (pattern line) 15b.

[0036] The elastic contact 20A of this embodiment, 20B is, for example, spiral contacts 21, 21 in which the helical shape or spiral shape. As shown in FIG. 3, the positions where front Symbol spiral contacts 21, 21 are formed on the substrate sheet 12, a plurality of holes 12a you penetrate the base sheet 12, 12a are formed . Then, the hole 12a, in the vicinity of the 12a, the base portion 21a consisting of a bar shape, 21a are formed by extending from the connection line 15a, 15b.

[0037] to the base 21a is elastically deformable portion 21b extending in the holes 12a centered toward the force connexion helical or spiral is formed. The elastically deformable portion 21b, the a base 21a side winding start 21bL, a tip winding end 21b2.

[0038] As shown in FIG. 3, the spiral contacts 21, the wind-projects from beginning 21bl gradually the Z1 direction according Kochikara the winding end 21b2 side, mountain-shaped or convex as a whole It has a shape. The spiral contact 21 is cantilevered relative to the elastic deformable portion 21b is the wind-starting end 21bl side front Symbol base 21a of an elastically deformable state in the illustrated Z1 direction as a fulcrum. Therefore, the elastically deformable portion 21b is in the Z1 and Z2 directions as a whole elastically deformable state.

[0039] The elastic contact 20A made of the spiral contact 21, 20B, contacts 14A, 14B, communicating connection 15a, 15b may be any previously formed on one surface (surface) of the base sheet 12 it can. Therefore, it is possible to integrally formed by using techniques such as etching treatment for example with respect plated processing, or metal foil. Therefore, it is possible to inexpensively and the manufacturing cost can be easily and produced easily.

[0040] Next, a description method for assembling the relay substrate 10. As shown in FIG. 3, provided in a central position, i.e. the elastic contact-forming region A and the other end provided at one end (XI) side (X2) side in the width direction of the base sheet 12 (X-direction) folded region C is provided between the front SL contact formation region B was.

[0041] The relay substrate 10, the surface of the substrate sheet 12 as described above (the contact 20A, a side that is out dew, etc. 14A) in a state where the outward and Save the folded region C, mountain fold Te in wrap.

[0042] Then, the inter backside of the substrate sheet 12 is interposed the spacer 11 (between the rear surface of the back surface and the contact forming region B of the elastic contact forming region A), using said adhesive scan page the back surface of the base sheet 12 is bonded and fixed to the surface of the support 11. At this time, by interposing between the back surface of the base sheet 12 of the bay curved 11 a of the spacer 11 while being opposed to the rear surface of the folded region C, as shown in FIG. 1A, B relay It may be a substrate 10. Thus, when the paste so as to follow the folded region C the curved surface 11a, the connecting line 1 5a, a defect such as disconnection and 15b can be prevented from occurring.

[0043] relay board 10 shown in the above embodiment, as to ensure the electrical connection between the electrode of the electronic component, for example, an electrode provided on the device body side, a freely state detachable to the apparatus main body and a contact electrode for connecting the electrode exposed on the surface of a memory card, or by arranging a plurality of the relay board 10, and the electrode such as BGA and LGA, which are disposed on the bottom surface of the IC package it can be used as a contact electrode for connecting.

[0044] Therefore, the following describes an example use with the relay board 10.

In the example used in FIG. 4, the relay substrate 10 is, for example, is loaded into a concave loading portion 31 provided in the device body 3 0, such as a mobile phone. Wherein the bottom surface 31a of the loading section 31, the plurality of contacts 14A, 14B plurality of electrodes 32, 33 facing is provided on the contact 14A of RELAY substrate 10, 14B and the electrode 32 of the loading section 31, 33 and via the contact connecting means 36 such as solder or conductive adhesive is fixed in the conducting state.

[0045] above the loading section 31 is a storage area 34 of the electronic component 40, such as a small memory card. As shown in FIG. 4, the electronic component 40 is mounted to the housing area 34 in a state of being the electrode portions 41, 42 downwards. When closing the housing area 34 in the lid (not shown), and is it possible to hold the electronic component 40 between the lid and the housing area 34.

[0046] In a state where the electronic component 40 is held, the order in which the electronic component 40 by the cover member is pressurized at a predetermined pressure F in the Z2 direction, the spiral contact probe 21 of the relay substrate 10 elastic contacts 20A made of, 20B is set the electrode portion 41 of the electronic component 40, 42 to abut to Rutotomoni, the state of being elastically deformed in the direction of contraction.

[0047] Therefore, the electrode portions 41, 42 and the apparatus main body 30 side of the electrodes 32, 33 of the electronic component 40, respectively elastic contacts 20A, 20B, connecting lines 15a, 15b and the contact point 14A, through the 14B it can be electrically conductively connected.

[0048] and mosquito ゝ also the elastic contacts 20A used in this embodiment, the spiral contacts 21 to form a 20B is a h (height of the starting end 21b2 wind-from the base portion 21a) thereof projecting amount, It can be set smaller than such the above conventional contact pins. Moreover the space p o 11 may be free to choose its thickness dimension H at the time of manufacturing. By selecting For this reason, the spacer 11 made of a thin plate thickness dimension H force may be a relay substrate 10 thin.

[0049] Further, likewise corresponds to the position the contact 14A provided outside below the elastic contacts 20A provided outside, and contacts also provided inside under the elastic contacts 20B provided on the inner side structure 14B is located, i.e. the one end (elastic contact forming region a) elastic contacts 20A was kicked set to side, and order of 20B, the other end contacts 14A provided (the contact forming region B) side, 14B sorted and power are arranged and formed so as to have the same order. For this reason, the an electronic electrode portion 41 of the component 40, 42 and the apparatus main body 30 side of the electrodes 32, 33 can be associated, securely connected in a positive ヽ state without mistaking the order of the electrodes is located it is to be leave in.

[0050] In addition, by placing such a connecting board 10 are arranged a plurality in the socket, in the case of connecting the electrode such as BGA and LGA, which are disposed on the bottom surface of the IC package, the scan Roh Iraru contact since 21 is smaller individual contact pressure of, compared conventional contact pins, the use V, and if the Ru is the possible to hold the IC package in a very small pressure F. Or the IC package, is a case of holding over the same large pressure force F to the conventional, to reduce the load acting on the individual electrodes of the IC Roh Kkeji the (contact pressure by elastic contacts 20A, 20 B) It is possible.

[0051] In addition the the relay substrate 10, the elastic contact-forming region A side of the inter-electrode distance W1 between the contact formation region B between the side electrode distance W2 are different sizes, i.e. the distance between the electrodes of the elastic contact-forming region A side compared to W1, towards the electrode distance W2 of the contact forming region B side is made wider form. Thus, for example, the use of the relay substrate 10 in the connection between the package-side electrode holding the narrow distance between electrodes bare this, the inter-electrode distance W1 between bare chip package side wide distance between the electrodes It is extended to W2, i.e. the rewiring it is possible to perform the easily. And force also, it is not necessary to use the traditional way of the multilayer substrate technology, it is possible to re-wire with a simple configuration.

[0052] Further, for example, even if a defect in one of the relay substrate 10 has occurred, there is no need to replace the Yogu entire socket if replacing only the relevant relay board 1 0. Therefore both can be simplified repair process, it is possible to repair costs and inexpensive.

[0053] In the above embodiment has been described with reference to the relay substrate 10 arranged in two rows in each longitudinal direction columns of elastic contacts and the contacts, the present invention is 弹 of contacts and contacts Nag for limitation it may be the respective first column configuration, or may be filed in three or more rows of configurations.

[0054] In addition'll also be a number of columns and is different from the number of columns in the configuration of the number of columns and the contact of the elastic contact! /,. That may not necessarily be filed in a configuration in which two or more contacts to Yogu example one elastic contacts without a relationship in which the elastic contacts and the contact is a one-to-one correspondence is linked in the connecting line 15a or 15b .

[0055] In the above embodiment, the contacts 14A, 14B are formed in the convex electrode, has been described as configured to be fixed by soldering or the like to the electrodes 32, 33 of the apparatus body 30 side, the present invention will now the contact 14A necessarily be those in the which Nag in, 14B is the same spiral contact child force elastic contacts also ing, configuration der connexion may be connected by oppression to the device side electrode 32, 33.

[0056] Furthermore, in the above embodiment, the elastic contacts 20A, as a structure of 20B, has been described by using the spiral le contact, the elastic contacts 20A, intended 20B is limited to spiral contacts Nag e.g. whole is composed of 弹性 deformable spring pin (contact pins) which can be, stressed Metall or volute panel such force becomes elastic contacts, the tip portion serving as a contact is curved in a substantially U-shape or as hereinbefore but, spiral contacts and stressed metal as described above is preferable as elastic contacts that can be made thinner.

[0057] Furthermore, in the above embodiment, the spacer 11 and a hard substrate, and contacts located inside the front Symbol elastic contact formation region A by the elastic contact, the inside of the contact formation region B when the contacts of which are positioned has been described with the case of the conventional contacts 14A, 14B other than the elastic contacts, the spacer 11 is formed by members of a material having excellent elasticity, such as a cushion material Ru is the elastic contact-forming region a and the contact forming region both normal contacts 14A other than the elastic contacts of B, may be configured to be formed in 14B. In this case not exclude embodiments wherein an elastic contact forming region A or ヽ Zurekagatama of contact of the contact formation region B, even it! /,.

BRIEF DESCRIPTION OF THE DRAWINGS

[0058] [FIG. 1A] external perspective view of the relay substrate from one direction according to an embodiment of the present invention,

[Figure 1B] external perspective view of the relay substrate from the opposite direction,

[Figure 2] exploded perspective view of a relay board,

[Figure 3] a perspective view showing a spiral contacts as an example of elastic contacts,

[Figure 4] a cross-sectional view at line 4-4 in FIG. 1A with an example use of a relay board, REFERENCE NUMERALS

[0059] 10 relay board

11 spacer (base)

11a curved surface

12 base sheet

12a and mosquito larva

14A, 14B normal contact

15a, 15b connecting lines (pattern line)

20A, 20B elastic contacts (contact)

21 spiral contact 21a base

21b elastically deformable portion

21bl wind-starting end

21b2 winding end

30 equipment body

31 loading unit

32, 33 electrode

34 housing area

36 connection means

40 electronic components

41, 42 electrode 咅

A resilient contact formation region

B contact formation region

C folded region

W1 electrode distance between the elastic contacts (pitch dimension) W2 electrode distance between the normal of the contact (pitch dimension)

Claims

The scope of the claims
[1] has a substrate having a folded region to the center in the width direction, and a plurality of contacts disposed divided into one end and the other end of and the width direction on the surface of the substrate,
In the one end side and at least one contact of the other end side is formed by elastic contacts, and the conductivity of the communication connection between the contact provided at one end with the contact provided on the other end is connected, the relay substrate, wherein Rukoto.
[2] The substrate, the surface of the contact is exposed is bent into a mountain fold in the folded region in a state of outward and spacers are provided between the back surface of the substrate facing each other relay substrate according to claim 1, wherein the are.
[3] The spacer is, the relay substrate according to claim 2, wherein the formed Ru a material having an insulating material or a conductive.
[4] a base material having a folded region to the center in the width direction, and a plurality of contacts arranged and divided into the one end and the other end in the width direction on the surface of the substrate, said one end a connecting line of the conductive connecting between the contact point and the contact point provided on the other end which is provided, et folded into a mountain fold in the folded region in a state where the surface of the contact is exposed towards the outside a relay board and a spacer provided between the rear surface of the substrate that is, relay substrate in which the spacer is equal to or is formed of an elastically deformable soft material Ru .
[5] and order of contact provided on the one end side, claim a 1, characterized in that the sorted and force the same order of contact provided on the other end, the teeth 4, Zureka relay substrate according to an item.
[6] and the pitch dimension between contact provided on the one end, and a pitch dimension are formed in different sizes between the contacts provided on the other end, a claim 1, characterized in Rukoto, relay substrate according to ヽ deviation or claim 5.
[7] The substrate is formed of a flexible sheet, a relay substrate according to claim 1 which, ヽ deviation or claim tooth 6, wherein Rukoto.
[8] an elastic contact provided on the substrate, and wherein the the winding end of the start mosquito Ra center side wind-provided at the base of the outer peripheral side is a spiral contacts extending toward the force connexion spiral claim 1 of, the tooth 7, the relay substrate according to the deviation or claim to.
The spiral contact, the wind-relay substrate according to claim 8, wherein the starting power is also mountain-shape out sterically collision Te Kochikara the winding end.
PCT/JP2006/304353 2005-03-10 2006-03-07 Interposer WO2006095724A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005-067426 2005-03-10
JP2005067426A JP2006253388A (en) 2005-03-10 2005-03-10 Relay substrate

Publications (1)

Publication Number Publication Date
WO2006095724A1 true true WO2006095724A1 (en) 2006-09-14

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Family Applications (1)

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PCT/JP2006/304353 WO2006095724A1 (en) 2005-03-10 2006-03-07 Interposer

Country Status (4)

Country Link
JP (1) JP2006253388A (en)
KR (1) KR20070101389A (en)
CN (1) CN101138133A (en)
WO (1) WO2006095724A1 (en)

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JP5325085B2 (en) * 2009-12-24 2013-10-23 日本碍子株式会社 Connecting device
JP5351307B1 (en) 2012-06-11 2013-11-27 ファナック株式会社 The pressure controller of the injection molding machine

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JPH08203583A (en) * 1995-01-20 1996-08-09 Shin Etsu Polymer Co Ltd Connector and manufacture thereof
US5573409A (en) * 1991-10-17 1996-11-12 Itt Corporation Interconnector
JP2005032708A (en) * 2003-06-20 2005-02-03 Alps Electric Co Ltd Connecting device and its manufacture method

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US5573409A (en) * 1991-10-17 1996-11-12 Itt Corporation Interconnector
JPH08203583A (en) * 1995-01-20 1996-08-09 Shin Etsu Polymer Co Ltd Connector and manufacture thereof
JP2005032708A (en) * 2003-06-20 2005-02-03 Alps Electric Co Ltd Connecting device and its manufacture method

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JP2006253388A (en) 2006-09-21 application
CN101138133A (en) 2008-03-05 application

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