JP2005149778A - Electronic component with sheet-shaped base plate, laminated electronic circuit device, and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component with a sheet-shaped base plate having a noise prevention circuit preventing noise from a power source line of the electronic component or the like, reconciling both reduction of a total height of a device and prevention of an increase of mounting area. <P>SOLUTION: The sheet-shaped base plate 30 has a first face 32 facing a bottom face 12 of a connector 10, and a second face 36 at the opposite side of the first face 32 facing the opposite side of the bottom face 12, and the area of the base plate is to be larger than that surrounded by curved parts 16 of all terminal pins 14. A noise prevention circuit 44 composed of first electrode terminals 40, second electrode terminals 42, and capacitor elements 38, is formed on the second face 36 of the sheet-shaped base plate 30. First wiring terminals 34 are formed at the position corresponding to terminal pins 14 on the first face 32 facing the bottom face 12. Further, the first wiring terminals 34 and the first electrode terminals 40 corresponding to each other are electrically connected by through-holes 46, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component mainly used in a portable device such as a mobile phone, and more particularly to an electronic component with a sheet-like substrate in which an electronic component and a noise prevention circuit are integrated, a multilayer electronic circuit device, and a manufacturing method thereof.

  In many electronic devices, electronic components are surface-mounted on various circuit boards such as printed circuit boards. In order to reduce high-frequency noise generated from power lines of electronic components, predetermined terminals of electronic components are used. A filter comprising a passive element such as a capacitor is installed on the pin. 2. Description of the Related Art Conventionally, a circuit configuration has been performed in which one electrode terminal of a chip capacitor is connected to a terminal pin and the other electrode terminal is grounded on the same plane as a circuit board on which electronic components are mounted. In such a configuration, the area for mounting the chip capacitor is further required around the electronic component, so that the mounting density of the circuit board cannot be improved.

  For this reason, it has been studied to make the mounting area as small as possible when a filter circuit for preventing noise of electronic components is mounted on a circuit board.

  For example, in the conventional example shown in FIG. 12, a plug insertion chamber 320 into which a plug is inserted into the housing 310 of the electronic component 300 and a storage chamber 330 are provided at the rear thereof, and the filter 400 configured by a capacitor array or the like is provided in the storage chamber 330. An integrated configuration housed inside is shown. In the housing 310, a terminal 340a in which an extended portion of the terminal pin 340 protrudes into the storage chamber 330 and an end 350a of the terminal 350 connected to the printed wiring are arranged to face each other in the storage chamber 330, and further in the short side direction. Ground electrodes 360 are provided on both sides. The filter 400 includes an input-side external electrode 420, an output-side external electrode 440, and a ground electrode 460. A number of capacitors (not shown) corresponding to the terminal pins 340 are formed therein. The filter 400 is stored in the storage chamber 330 with the upper and lower surfaces sandwiched between the terminal 340 a of the terminal pin 340 and one end 350 a of the terminal 350 and the both side surfaces sandwiched between the ground electrodes 360. With such a configuration, a filter circuit for preventing noise is integrated with an electronic component to prevent an increase in mounting area on the circuit board (Patent Document 1).

In addition, a male electronic component having a plurality of terminal pins and a metal shell positioned so as to surround the terminal pins and connected to the ground potential, and the terminal pins are inserted through the recesses of the shell. There is also a configuration comprising a possible sheet type noise filter. In this case, the sheet-type noise filter is provided with a noise removing circuit means on a thin insulating sheet that can be elastically deformed, and has a plurality of holes through which terminal pins pass, A plurality of projecting pieces that elastically abut on the inner surface of the shell in a state of being mounted in the recesses protrude from the outer peripheral edge (Patent Document 2). With this configuration, since the insulating sheet on which the noise filter circuit is formed is disposed between the electronic component and the circuit board, the mounting area of the circuit board does not increase.
JP-A-6-20746 JP 11-329609 A

  However, in the first example described above, the filter made of the capacitor array is arranged in a direction perpendicular to the circuit board surface, so it is very difficult to reduce the height, and a thin cellular phone or the like is required. It is difficult to use for electronic equipment.

  Further, in the second example, since the sheet type noise filter is inserted into the terminal pin and the female electronic component is inserted into the terminal pin for use, the mounting configuration is simple, but it is inserted into the terminal pin. Sometimes elements such as capacitors can be damaged. In order to prevent this, it is necessary to use a sheet having a thickness that is not easily deformed by a load applied during insertion. In addition, the electronic component having this configuration is not a surface mount type, and it is difficult to reduce the height as in the first example.

  The multilayer electronic circuit device of the present invention has a noise prevention circuit that prevents noise of power lines of electronic components and the like, and is suitable for portable devices while achieving both low height and prevention of increase in mounting area. It is an object of the present invention to provide an electronic component with a sheet-like substrate, a multilayer electronic circuit device, and a manufacturing method thereof.

  An electronic component with a sheet-like substrate of the present invention includes an electronic component provided with a plurality of L-shaped terminal pins that protrude from the side surface or the peripheral edge of the bottom surface and have bent portions, and an electronic component A first surface facing the bottom surface and a second surface facing the first surface in a direction opposite to the bottom surface, the shape being larger than the region surrounded by the bent portions of all the terminal pins; At least one surface includes a noise prevention circuit, and the first surface includes a sheet-like substrate connected to the terminal pins.

  Since the sheet-like substrate including the electronic component and the noise prevention circuit is stacked in this manner and configured in a three-dimensional manner, the overall height is hardly changed and the mounting area of the noise prevention circuit portion is not increased. The device can be downsized.

  In addition, the noise prevention circuit of the electronic component with the sheet-like substrate according to the present invention corresponds to the first electrode terminal provided at a position corresponding to the terminal pin of the sheet-like substrate, and the terminal pin from the central portion or the central portion of the sheet-like substrate. And a capacitor element provided between the first electrode terminal and the second electrode terminal. With such a configuration, the high frequency noise is separated from the signal current by the capacitor element.

  In addition, the electronic component with a sheet-like substrate of the present invention has a configuration in which the second electrode terminals are commonly connected to serve as a ground terminal. With this configuration, a high frequency component is bypassed from a line on which high frequency noise such as a power supply line is superimposed to the ground terminal, and high frequency noise is removed.

  The electronic component with a sheet-like substrate of the present invention has a configuration in which a noise prevention circuit is formed on the second surface, or the electronic component with a sheet-like substrate of the present invention has a noise on the first surface of the sheet-like substrate. A prevention circuit may be formed, and the terminal pin may be connected to the first electrode terminal or the second electrode terminal. Thus, by setting it as the structure which integrated the sheet-like board | substrate containing a noise prevention circuit, and an electronic component, both can be handled as a component which completed electrical connection. As a result, it is possible to easily perform an operation test as the connected component, and to obtain a highly reliable electronic component.

  In the multilayer electronic circuit device of the present invention, a noise prevention circuit is formed on the second surface of the sheet-like substrate, and a first wiring terminal is formed on the first surface at a position facing the terminal pin. An electronic component with a sheet-like substrate in which the first wiring terminal is connected and the first wiring terminal and the first electrode terminal are connected by a through hole, and the first electrode terminal is located at a position facing the first electrode terminal. At least one second electrode pad is formed at a position facing the electrode pad and the second electrode terminal, and the first electrode pad is connected to the first electrode terminal and the second electrode pad is connected to the second electrode terminal. And a circuit board formed.

  With such a configuration, since only the sheet-like substrate is not mounted exclusively on the circuit board, the mounting area does not increase even when the sheet-like substrate is mounted.

  Also, the multilayer electronic circuit device of the present invention has an electronic component with a sheet-like substrate in which a noise prevention circuit is formed on the second surface of the sheet-like substrate, and a position corresponding to the terminal pin and the first electrode terminal surface. At least one second electrode pad is formed at a position facing the first electrode pad and the second electrode terminal, the first electrode pad is connected to the first electrode terminal and the terminal pin, and the second electrode pad Includes a circuit board connected to the second electrode terminal.

  With such a configuration, since the terminal pins of the electronic component and the electrode pads of the circuit board can be directly connected, the sheet-like board does not require a through hole, and the manufacturing process is simplified.

  In the multilayer electronic circuit device of the present invention, a noise prevention circuit is formed on the first surface of the sheet-like substrate, and the second surface in which the terminal pin and the first electrode terminal or the second electrode terminal are connected. The first wiring terminal is formed at a position corresponding to the terminal pin, the second wiring terminal is formed at a position corresponding to the second electrode terminal or the terminal pin, and the first electrode terminal, the first wiring terminal, An electronic component with a sheet-like substrate in which the second electrode terminal and the second wiring terminal are connected by a through hole, and the first electrode pad and the second wiring terminal at a position facing the first wiring terminal At least one second electrode pad is formed at a position where the first electrode pad includes the first wiring terminal and the circuit board having the second electrode pad connected to the second wiring terminal.

  With such a configuration, there is more effective space between the sheet-like board and the circuit board, and other wirings of the circuit board can be routed, and the degree of freedom in wiring design is increased.

  The multilayer electronic circuit device according to the present invention includes an electronic component with a sheet-like substrate in which a noise prevention circuit is formed on the first surface of the sheet-like substrate, a first electrode pad and a second electrode at positions corresponding to the terminal pins. And a circuit board in which the first electrode pad and the second electrode pad are connected to the terminal pins.

  With such a configuration, the terminal pin of the electronic component and the electrode pad of the circuit board can be directly connected, so that a through-hole is not necessary and the sheet-like board can be placed on the circuit board without the electrode pad. Can be

  In the multilayer electronic circuit device of the present invention, the circuit board is provided with a recess for accommodating the sheet-like board. Thereby, the multilayer electronic circuit device can be further reduced in height.

  Also, the manufacturing method of the multilayer electronic circuit device of the present invention is an electronic component provided with a plurality of L-shaped terminal pins that protrude from the peripheral portion of the side surface or bottom surface and have bent portions. A first connection step of connecting a terminal board and a sheet-like substrate provided with a noise prevention circuit in an area wider than the area surrounded by the bent portions of all the terminal pins and an electronic component with a connecting member; and the terminal pin or the sheet And a second connection step of connecting the electrode pads of the circuit board formed at a position corresponding to the center portion of the sheet-like substrate to the sheet-like substrate or the sheet-like substrate and the terminal pins with a connecting member.

  This manufacturing method allows the noise prevention circuit to be arranged three-dimensionally with the electronic components, but the overall height can be kept almost unchanged, reducing the mounting area on the circuit board and reducing the height. A small and thin multilayer electronic circuit device can be obtained. In addition, since the electronic component and the sheet-like substrate are integrated first, it can be mounted on the circuit board at one time, and can be mounted on the circuit board at the same time as the mounting of other electronic components. The process becomes easier. Further, since the operation can be confirmed integrally as the electronic component with the sheet-like substrate, if the operation is confirmed before being mounted on the circuit board, the defective electronic component with the sheet-like substrate is not mounted.

  In the manufacturing method of the multilayer electronic circuit device of the present invention, the first solder material is used for the connection member in the first connection step, and the connection member in the second connection step has a lower melting point than the first solder material. These solder materials are used.

  With this manufacturing method, when connecting the electrode terminal of the sheet-like substrate to the electrode pad of the circuit substrate, the connection member between the terminal pin and the wiring terminal is not melted again, and the connection reliability is improved.

  An electronic component with a sheet-like substrate of the present invention includes an electronic component provided with a plurality of L-shaped terminal pins that protrude from the side surface or the peripheral edge of the bottom surface and have bent portions, and an electronic component A first surface facing the bottom surface and a second surface facing the first surface in a direction opposite to the bottom surface, the shape being larger than the region surrounded by the bent portions of all the terminal pins; At least one surface includes a noise prevention circuit, and the first surface includes a sheet-like substrate connected to the terminal pins.

  In this way, the overall height can be kept almost unchanged by stacking sheet-like substrates including electronic components and a noise prevention circuit in a three-dimensional manner. It is possible to provide an electronic component with a sheet-like substrate that is suitable for portable devices while simultaneously preventing an increase in mounting area.

  Hereinafter, an electronic component with a sheet-like substrate, a multilayer electronic circuit device, and a manufacturing method thereof according to embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1A is a sectional structural view of an electronic component with a sheet-like substrate according to the first embodiment of the present invention, and FIG. 1B is a plan view thereof. In the embodiment of the present invention, a connector will be described as an example of the electronic component 10, and a noise prevention circuit 44 including only the capacitor element 38 will be described as an example.

  A plurality of terminal pins 14 protrude from the peripheral portion of the bottom surface 12 of the connector 10 so as to face each other. The protruding terminal pin 14 is bent in an L shape and has a horizontal portion 20 from the bent portion 16 to the tip portion 18. Further, the connector 10 has an extended portion of the terminal pin 14 embedded in the resin mold 22, and a part of the connector 10 protrudes into the space portion 24 into which the male connector is inserted to form a contact portion 26. The contact portion 26 is configured to be elastically deformable when the male connector is inserted.

  The sheet-like substrate 30 has a first surface 32 that opposes the bottom surface 12 of the connector 10 and a second surface 36 that opposes the first surface 32 in the direction opposite to the bottom surface 12, all of which are shaped. It is made larger than the area surrounded by the bent portion 16 of the terminal pin 14. FIG. 1A shows a case where the sheet-like substrate 30 is formed in a region surrounded by the tip portions 18 of the terminal pins 14. A noise prevention circuit 44 is formed on the second surface 36 of the sheet-like substrate 30. In FIG. 1A, the noise prevention circuit 44 includes a first electrode terminal 40, a second electrode terminal 42, and a capacitor element 38. Here, the first electrode terminal 40 is provided at a position corresponding to the terminal pin 14 at the end of the sheet-like substrate 30, and the second electrode terminal 42 is provided at the center of the sheet-like substrate 30. Further, the first surface 32 has a first wiring terminal 34 formed at a position facing the terminal pin 14. Further, the first wiring terminal 34 and the first electrode terminal 40 are electrically connected through a through hole 46. And the terminal pin 14 and the 1st wiring terminal 34 of the sheet-like board | substrate 30 are electrically connected by the connection members 70, such as solder.

  The sheet-like substrate 30 will be described in more detail with reference to FIG. 2A is a plan view of the sheet-like substrate 30, and FIG. 2B is a cross-sectional view taken along line X1-X1 shown in FIG.

  The sheet-like substrate 30 is a first electrode for forming capacitor elements 38 in an array shape on a second surface 36 of a thin and light resin substrate 31 such as a polyimide film by a thin film process and for connecting to an external device. The terminal 40 and the second electrode terminal 42 are formed by a thin film process and a plating process, for example. The capacitor element 38 is formed as follows, for example. A lower electrode film 33 is formed at a predetermined position on the resin substrate 31 by, for example, mask vapor deposition. Thereafter, a part of the lower electrode film 33 is left, and a dielectric film 35 is similarly formed on the surface of the lower electrode film 33 by using a mask, for example, by sputtering. An upper electrode film 37 is further formed on the dielectric film 35 to form a capacitor element 38. Further, if the first electrode terminal 40 and the second electrode terminal 42 are formed, a noise prevention circuit 44 is produced. In order to protect the capacitor element 38 from the external environment, the insulating protection layer 39 is formed except for the first electrode terminal 40 and the second electrode terminal 42, so that the capacitor element 38 having excellent environmental resistance can be obtained. can do.

By the way, the lower electrode film 33 is not particularly limited as long as it is a material having low resistance, good adhesion, and low reactivity with the dielectric film 35. However, aluminum (Al) is easy for film formation. The membrane is one suitable material. As this film forming method, a vacuum deposition method, a sputtering method, a plating method, or the like may be combined. The dielectric film 35 is preferably made of a material having a large relative dielectric constant and a small temperature coefficient. For example, silicon dioxide (SiO ₂ ), barium titanate (BaTiO ₃ ), strontium titanate (SrTiO ₃ ), or oxide A material generally used as a dielectric material such as titanium (TiO ₂ ) can also be used. As these film forming methods, it is possible to use a sputtering method, a vacuum deposition method, a sol-gel method, a plasma chemical vapor deposition method (PCVD method), or the like. Further, the upper electrode film 37 is made of the same material as the lower electrode film 33, and both electrode films can be formed to a thickness of 0.1 μm to 0.3 μm.

  The insulating protective layer 39 is suitable because an ultraviolet curable resin can be easily formed to a thickness of about 10 μm by a printing process and is excellent in moisture resistance, but is not particularly limited to such a material. For example, an insulating film made of an inorganic material may be formed by sputtering or the like. Furthermore, the first electrode terminal 40 and the second electrode terminal 42 can be soldered to an external device if, for example, a copper (Cu) film is formed around 5 μm and a gold (Au) film is formed about 0.2 μm. An electrode terminal with excellent attachment can be formed.

  Further, the first wiring terminal 34 may be formed at the end of the first surface 32 by the same method as the electrode terminal. And the 1st wiring terminal 34 and the 1st electrode terminal 40 are connected by the through hole 46, and the sheet-like board | substrate 30 is produced.

  Here, as shown in FIG. 2, the first electrode terminal 40 and the second electrode terminal 42 are connected via a capacitor element 38, and the second electrode terminal 42 is commonly connected. And the high frequency noise component of the line connected to the 1st electrode terminal 40 is bypassed by the 2nd electrode terminal 42 used as a ground terminal, and a high frequency noise is removed.

  In such an electronic component with a sheet-like substrate, the sheet-like substrate including the electronic component and the noise prevention circuit is stacked to form a three-dimensional structure, so that the overall height is hardly changed and the noise prevention circuit portion is mounted. Since the area is not increased, the size of the apparatus can be reduced. Furthermore, in a state where the electronic component and the sheet-like substrate having the noise prevention circuit are integrated, both can be handled as components that have been electrically connected. Therefore, the operation test as the connected component can be easily performed, and a highly reliable component can be obtained.

  In the first embodiment of the present invention, the case where the noise prevention circuit 44 is formed on the second surface 36 of the sheet-like substrate 30 is shown, but the same may be said even if the noise prevention circuit is formed on the first surface. Thus, an electronic component with a sheet-like substrate can be obtained.

(Second Embodiment)
Next, the multilayer electronic circuit device and the manufacturing method of the present invention will be described with reference to FIGS. The multilayer electronic circuit device of the present invention includes an electronic component with a sheet-like substrate in which a sheet-like substrate 50 is attached to an electronic component (connector) 10, and a circuit board 60.

  FIG. 3A is a cross-sectional structure diagram of the multilayer electronic circuit device according to the second embodiment of the present invention, and FIG. 3B is a plan view of FIG. Similar to the first embodiment of the present invention, a noise prevention circuit including the first electrode terminal 40, the capacitor element 38, and the second electrode terminal 47 is formed on the second surface 36 of the sheet-like substrate 50. ing. A first wiring terminal 34 is formed on the first surface 32 at a position corresponding to the terminal pin 14, and the terminal pin 14 and the first wiring terminal 34 are connected by a connecting member 70. The first wiring terminal 34 and the first electrode terminal 40 are connected by a through hole 46. 3A is a cross-sectional view taken along line X2-X2 of FIG. Further, the connector 10 is the same as that of the first embodiment of the present invention, so the description is omitted.

  The circuit board 60 is provided with a multilayer wiring (not shown) or the like on a substrate 62 made of, for example, glass epoxy resin. Further, as shown in FIGS. 3A and 3B, a first electrode pad 64 is provided at a position corresponding to the first electrode terminal 40 of the sheet-like substrate 50 and a shape drawn therefrom. ing. And the 1st electrode terminal 40 of the sheet-like board | substrate 50 and the 1st electrode pad 64 of the circuit board 60 are electrically connected by the connection members 72, such as solder.

  FIG. 4 is a bottom view of the sheet substrate 50 as viewed from the circuit substrate 60 side of FIG. The second electrode terminals 47 of the sheet-like substrate 50 are commonly connected and grounded from the second electrode terminal lead portion 47a.

  FIG. 5 is a sectional view taken along line X3-X3 in FIG. 4 of the multilayer electronic circuit device according to the second embodiment of the present invention. As shown in FIG. 5, the second electrode terminal 47 is formed by extending the second electrode terminal 47 at a position corresponding to the terminal pin 14a that does not require connection. The second electrode terminal lead portion 47a is connected to the second electrode pad 66 of the circuit board 60 by a connecting member 79 such as solder. As a result, the connection place between the sheet-like substrate 50 and the circuit board 60 is only the end of the sheet-like substrate 50, so that it is easy to check whether the connection is good or bad. In addition, when conducting a continuity check for confirming whether or not the connection is good, since the inspection terminal for the continuity check is not brought into contact with the center portion of the sheet-like substrate 50 where the terminal pins are not supported, the accuracy of confirmation is improved.

  Note that the grounding method is not limited to the method in which the second electrode terminal lead portion 47a is used in a lump, and a plurality of the second electrode terminals 47 may be grounded together or individually. At this time, the second electrode pad 66 may be formed at a position facing the second electrode terminal 47 without pulling out the second electrode terminal.

  As described above, the connector and the sheet-like substrate including the noise prevention circuit are stacked, configured in a three-dimensional manner, and connected to the circuit substrate. Therefore, the area of the noise prevention circuit portion in the circuit board does not increase. And the height as an electronic circuit apparatus only becomes high about 100 micrometers which is the thickness of a sheet-like board | substrate. As described above, the multilayer electronic circuit device of the present invention has a noise prevention circuit, but does not increase the mounting area and hardly changes its height.

  Next, a manufacturing method of the multilayer electronic circuit device according to the second embodiment of the present invention will be described with reference to FIG.

  FIG. 6A is a diagram showing the first connection step, in which the sheet-like substrate 30 is placed on a flat plate 80 having a flat surface and the connector 10 is aligned. Further, a connection member 70 for connecting to the terminal pin 14 is supplied to the first wiring terminal 34.

  FIG. 6B is a diagram showing a state in which the terminal pins 14 of the connector 10 and the first wiring terminals 34 of the sheet-like substrate 30 are connected and integrated by the connecting member 70.

  FIG. 6C is a diagram showing the second connection step, and shows a state in which the integrated connector 10 with the sheet-like substrate 30 is aligned with the circuit substrate 60. A connection member 72 for connecting to the first electrode terminal 40 is supplied to the first electrode pad 64 of the circuit board 60. Thereafter, the circuit board 60 and the connector 10 with the sheet-like board 30 are connected to complete the multilayer electronic circuit device.

  Thus, since the connector and the sheet-like board are integrated first, mounting on the circuit board is possible at one time, and it can be mounted on the circuit board at the same time as mounting other electronic components, The mounting process becomes easier. Further, since the operation can be confirmed integrally as the electronic component with the sheet-like substrate, if the operation is confirmed before being mounted on the circuit board, the defective electronic component with the sheet-like substrate is not mounted.

  In addition, Sn—Ag and Sn—Sb, which are high melting point solder materials, are used for the connection member in the first connection step, and Sn—Bi and Bi—, which are low melting point solder materials, are used as the connection members in the second connection step. If the In system and the Sn-In system are used, the solder in the first connection process does not remelt in the second connection process. Furthermore, a solder material may be used for the connection member in the first connection step, and a room temperature curing type epoxy conductive adhesive may be used for the connection member in the second connection step.

(Third embodiment)
FIG. 7 is a cross-sectional structural view of the multilayer electronic circuit device according to the third embodiment of the present invention, and shows a case where the shape of the sheet-like substrate in the second embodiment of the present invention is small. 7A is a cross-sectional structural view of a portion where the connector 10 with the sheet-like substrate 56 is connected only to the first electrode pad 64, and FIG. 7B is a diagram illustrating the connector 10 with the sheet-like substrate 56 being grounded. FIG. 6 is a cross-sectional structure diagram that also includes a portion connected to the second electrode pad 66.

  As shown in FIG. 7A, the sheet-like substrate 56 is connected to the terminal pins 14 by connection members 78, and the first electrode terminals 40 are connected to the first electrode pads 64 by connection members 72b such as solder. Yes. Further, the terminal pin 14 is connected to the first electrode pad 64 by a connecting member 77 such as solder. Others are the same as those of the second embodiment of the present invention, and the description thereof will be omitted. Note that the connecting member 78 does not need to have conductivity, and the connector 10 and the sheet substrate 56 are integrated before the terminal pins 14 and the sheet substrate 56 are connected to the first electrode pads 64. That's fine.

  7B is different from FIG. 7A in that the second electrode pad 66 is not connected to the terminal pin 14a that does not need to be connected, and the second electrode terminal lead portion 47a is connected to the solder or the like. It is connected with the member 79b. Here, the terminal pin 14a that does not require connection is a terminal pin that does not require connection with an external device. Normally, not only the terminal pins of the connector need to be connected to an external device but also a margin including a terminal pin that does not need to be connected. The second electrode terminal lead portion 47 a is obtained by extending the second electrode terminal 47 to the end portion of the sheet-like substrate 56 as in the second embodiment of the present invention.

  With such a configuration, the sheet-like substrate 56 does not require any through holes, and the manufacturing process is simplified.

(Fourth embodiment)
Next, a multilayer electronic circuit device including a sheet-like substrate 52 having a noise prevention circuit formed on the first surface 32 facing the connector 10 is shown in FIGS. 8 and 9 as a fourth embodiment of the present invention. It explains using. Here, it demonstrates centering on a different point from the 1st Embodiment of this invention-3rd Embodiment.

  FIG. 8 is a sectional structural view of a multilayer electronic circuit device according to a fourth embodiment of the present invention, and FIG. 9 is a plan view of a sheet-like substrate used in the multilayer electronic circuit device. 8A and 8B are cross-sectional views taken along lines X4-X4 and X5-X5 in FIG. 9, respectively. In the sheet-like substrate 52 shown in FIG. 8 and FIG. 9, the second electrode terminal 48 is commonly connected in the same manner as the sheet-like substrate 50 of the second embodiment of the present invention. Grounded.

  FIG. 8A is a cross-sectional view of a portion where the sheet-like substrate 52 is connected only to the first electrode pad 64. A capacitor element 38, a first electrode terminal 41, and a second electrode terminal 48 are formed on the first surface 32 of the sheet-like substrate 52 facing the bottom surface 12 of the connector 10. Further, the first electrode terminal 41 is provided at a position facing the terminal pin 14 at the end of the sheet-like substrate 52, and the second electrode terminal 48 is provided at the center of the sheet-like substrate 52. The second surface 36 is a surface facing the circuit board 82, and the first wiring terminal 34 is formed at a position corresponding to the first electrode terminal 41. Further, the corresponding first wiring terminal 34 and first electrode terminal 41 are electrically connected through a through hole 46. Further, the first electrode terminal 41 and the terminal pin 14, and the first wiring terminal 34 and the first electrode pad 64 are electrically connected by a connection member 71 such as solder and a connection member 73, respectively.

  FIG. 8B is a cross-sectional view of a portion where the second electrode terminal 48 of the sheet-like substrate 52 is extended to form the second electrode terminal lead portion 48a. At a position corresponding to the terminal pin 14a that does not require connection, the second electrode terminal lead portion 48a is formed on the first surface 32, the second wiring terminal 43 is formed on the second surface 36, and the second electrode pad 66 is formed on the circuit board 82. The second electrode terminal lead portion 48a and the second wiring terminal 43 are connected by a through hole 49. Further, the terminal pin 14a and the second electrode terminal lead portion 48a that do not require connection, and the second wiring terminal 43 and the second electrode pad 66 are electrically connected by a connection member 74 such as solder and a connection member 75, respectively. Yes. The second electrode pad 66 is grounded, and the high frequency component contained in the terminal pin 14 is separated by the capacitor element 38 and removed from the second electrode pad 66.

  Thus, by forming the noise prevention circuit on the connector side, an effective space is created between the circuit board and the sheet-like board, and the other wiring of the circuit board can be routed more easily.

(Fifth embodiment)
FIG. 10 is a cross-sectional structural view of the multilayer electronic circuit device according to the fifth embodiment of the present invention, in which the shape is smaller than that of the sheet-like substrate according to the fourth embodiment of the present invention. 10A is a cross-sectional view of a portion where the connector 10 with the sheet-like substrate 54 is connected only to the first electrode pad 65, and FIG. 10B shows that the connector 10 with the sheet-like substrate 54 is grounded. 6 is a cross-sectional view including a portion connected to the second electrode pad 66.

  As shown in FIG. 10, on the circuit board 61, the first electrode pad 65 has a position corresponding to a part of the terminal pin 14 and a drawn shape, and the second electrode pad 66 does not need to be connected to the terminal pin 14a. It is formed in the position corresponding to a part of and the shape pulled out. The terminal pin 14 and the first electrode terminal 41, the terminal pin 14 and the first electrode pad 65, the connection unnecessary terminal pin 14a and the second electrode terminal lead portion 48a, the connection unnecessary terminal pin 14a and the second terminal pin 14a. The electrode pads 66 are connected by a connection member 71b such as solder, a connection member 77, a connection member 74a, and a connection member 76, respectively.

  With the stacked electronic circuit device having such a configuration, the sheet-like substrate 54 does not require any through holes, and it is not necessary to connect the sheet-like substrate 54 to the circuit substrate 61 with a connecting member. Can be reduced in height. Here, the terminal pin 14 and the terminal pin 14a that does not need to be connected are connected to the first electrode pad 65 and the second electrode pad 66 by a connecting member 77 such as solder and a connecting member 76, respectively. Since the connecting member 77 and the connecting member 76 need to have a thickness of about 100 μm, several coating processes such as screen printing are required.

  Therefore, as shown in FIG. 11, by providing a recess in the circuit board 63 so as to accommodate the sheet-like board 54, the terminal pins 14 and the first electrode pads 65, the terminal pins 14a that do not need to be connected, and the second pins are connected. There is no need to increase the thickness of the connection members 77b and 76a to which the electrode pads 66 are connected by about 100 μm. Further, the terminal pin 14, the first electrode terminal 41 and the first electrode pad 65, the terminal pin 14a which does not need to be connected, the second electrode terminal lead portion 48a and the second electrode pad 66 are respectively connected to a connecting member 71b such as solder. The connection member 77b, the connection member 74a, and the connection member 76a can be connected simultaneously.

  In the first to fifth embodiments of the present invention, the capacitor element array has been described as the noise prevention circuit. However, the present invention is not limited to this. The noise prevention circuit may be a CR filter or an LC filter.

  Furthermore, in the embodiment of the present invention, the connector has been described as an example of the electronic component, but the present invention is not limited to the connector. For example, the present invention can be similarly applied to a surface mount type package such as a semiconductor element having a gull wing type terminal package structure.

  INDUSTRIAL APPLICABILITY The electronic component with a sheet-like substrate, the multilayer electronic circuit device, and the manufacturing method thereof according to the present invention can be miniaturized while achieving both a reduction in height and an increase in mounting area, and thus are useful for portable devices such as cellular phones. .

(A) Cross-sectional structure diagram of electronic component with sheet-like substrate of the first embodiment of the present invention (B) Plan view of electronic component with sheet-like substrate of the same embodiment (A) Plan view of sheet-like substrate used for electronic component with sheet-like substrate of the embodiment (B) Cross section taken along line X1-X1 of sheet-like substrate used for electronic component with sheet-like substrate of the embodiment Figure (A) Cross-sectional view taken along line X2-X2 of FIG. 4 showing a cross-sectional structure of the multilayer electronic circuit device of the second embodiment of the present invention (B) Plane of the multilayer electronic circuit device of the same embodiment Figure Bottom view of the sheet-like substrate used in the multilayer electronic circuit device of the same embodiment as viewed from the circuit substrate side Sectional drawing along the X3-X3 line of FIG. 4 of the multilayer electronic circuit device of the embodiment (A) The figure which shows the 1st connection process which shows the manufacturing method of the multilayer electronic circuit device of the embodiment (B) The connector and sheet-like board | substrate which show the manufacturing method of the multilayer electronic circuit device of the embodiment are integrated The figure which shows the state which became (C) The figure which shows the 2nd connection process which shows the manufacturing method of the multilayer electronic circuit device of the embodiment (A) Cross-sectional structure diagram of a portion connected to only the first electrode pad of the multilayer electronic circuit device of the third embodiment of the present invention (B) Second of the multilayer electronic circuit device of the same embodiment Sectional structure diagram including the part connected to the electrode pad of (A) Cross-sectional view taken along line X4-X4 of FIG. 9 showing a cross-sectional structure of the multilayer electronic circuit device of the fourth embodiment of the present invention (B) Cross section of the multilayer electronic circuit device of the same embodiment Sectional view taken along line X5-X5 in FIG. 9 showing the structure Plan view of a sheet-like substrate used in the multilayer electronic circuit device of the same embodiment Sectional structure diagram of a multilayer electronic circuit device according to a fifth embodiment of the present invention Sectional structural view in which a sheet-like substrate is housed in a circuit board in the multilayer electronic circuit device of the embodiment The figure which shows the example which integrated the filter for the conventional noise prevention into the electronic component

Explanation of symbols

10,300 Electronic components (connectors)
12 bottom surface 14,340 terminal pin 14a connection unnecessary terminal pin 16 bent portion 18 tip portion 20 horizontal portion 22 resin mold 24 space portion 26 contact portion 30, 50, 52, 54, 56 sheet-like substrate 31 resin substrate 32 first Surface 33 Lower electrode film 34 First wiring terminal 35 Dielectric film 36 Second surface 37 Upper layer electrode film 38 Capacitor element 39 Insulating protective layer 40, 41 First electrode terminal 42, 47, 48 Second electrode terminal 43 Second wiring terminal 44 Noise prevention circuit 46, 49 Through hole 47a, 48a Second electrode terminal lead-out portion 60, 61, 63, 82 Circuit board 62 Board 64, 65 First electrode pad 66 Second electrode pad 70 71, 71b, 72, 72b, 73, 74, 74a, 75, 76, 76a, 77, 77b, 78, 79, 79b Member 80 flat 310 housing 320 plug insertion chamber 330 accommodating chamber 340a, 350 terminals 350a end 360,460 ground electrode 400 filter 420 input-side external electrodes 440 output-side external electrodes

Claims (12)

An electronic component provided with a plurality of L-shaped terminal pins protruding from the side surface or the peripheral edge of the bottom surface and having a bent portion bent;
A first surface facing the bottom surface of the electronic component and a second surface facing the first surface in a direction opposite to the bottom surface, the shape of which is the bent portion of all the terminal pins An electronic component with a sheet-like substrate, which is larger than the enclosed region and includes a sheet-like substrate on which at least one surface thereof is provided with a noise prevention circuit and the first surface is connected to the terminal pins. The noise prevention circuit includes a first electrode terminal provided at a position corresponding to the terminal pin of the sheet-like substrate, and a second part provided at a center portion of the sheet-like substrate or a position corresponding to the terminal pin from the center portion. 2. The electronic component with a sheet-like substrate according to claim 1, further comprising: an electrode terminal; and a capacitor element provided between the first electrode terminal and the second electrode terminal. The electronic component with a sheet-like substrate according to claim 2, wherein the second electrode terminals are connected in common to serve as a ground terminal. The electronic component with a sheet-like substrate according to claim 2 or 3, wherein the noise prevention circuit is formed on the second surface. 4. The electronic component with a sheet-like substrate according to claim 2, wherein the noise prevention circuit is formed on the first surface, and the terminal pin is connected to the first electrode terminal or the second electrode terminal. . A first wiring terminal is formed on the first surface at a position facing the terminal pin, the terminal pin and the first wiring terminal are connected, and the first wiring terminal and the first electrode terminal And an electronic component with a sheet-like substrate according to claim 4, wherein the electronic component is connected through a through hole,
At least one second electrode pad is formed at a position facing the first electrode terminal and at a position facing the second electrode terminal at a position facing the first electrode terminal, and the first electrode pad is formed at the first electrode pad. A multilayer electronic circuit device comprising: an electrode terminal; and a circuit board having the second electrode pad connected to the second electrode terminal. An electronic component with a sheet-like substrate according to claim 4,
At least one second electrode pad is formed at a position opposite to the first electrode pad and the second electrode terminal at a position corresponding to the terminal pin and the first electrode terminal surface, and the first electrode A stacked electronic circuit device comprising: a circuit board having a pad connected to the first electrode terminal and the terminal pin, and the second electrode pad connected to the second electrode terminal. A first wiring terminal is formed on the second surface at a position corresponding to the terminal pin, and a second wiring terminal is formed at a position corresponding to the second electrode terminal or the terminal pin. The electronic component with a sheet-like substrate according to claim 5, wherein the electrode terminal, the first wiring terminal, the second electrode terminal, and the second wiring terminal are connected by a through hole,
At least one second electrode pad is formed at a position facing the first wiring terminal and at a position facing the second wiring terminal at a position facing the first wiring terminal, and the first electrode pad is formed at the first wiring pad. A multilayer electronic circuit device including a wiring board and a circuit board in which the second electrode pad is connected to the second wiring terminal. An electronic component with a sheet-like substrate according to claim 5,
A laminated type including a circuit board in which a first electrode pad and a second electrode pad are formed at a position corresponding to the terminal pin, and the first electrode pad and the second electrode pad are connected to the terminal pin. Electronic circuit device. The multilayer electronic circuit device according to claim 9, wherein the circuit board is provided with a recess for accommodating the sheet-like substrate. In the terminal pin of the electronic component provided with a plurality of L-shaped terminal pins protruding and bent from the peripheral portion of the side surface or the bottom surface, and the bent portions of all the terminal pins A first connection step of connecting the electronic component with a sheet-like substrate provided with a noise prevention circuit in a wider area than the enclosed area; and
A second connection step of connecting an electrode pad of a circuit board formed at a position corresponding to a center portion of the terminal pin or the sheet-like substrate to the sheet-like substrate or the sheet-like substrate and the terminal pin with a connection member; A method for manufacturing a stacked electronic circuit device. The lamination according to claim 11, wherein a first solder material is used for the connection member in the first connection step, and a solder material having a melting point lower than that of the first solder material is used for the connection member in the second connection step. Type electronic circuit device manufacturing method.

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