JP2005039064A - Sheet-like substrate and electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-like substrate and electronic parts by which mounting failure due to the movement of a sheet can be prevented at the time of sticking the sheet-like substrate constituted of forming passive elements such as capacitor elements on an organic film to a circuit board or the electronic part. <P>SOLUTION: On the sheet-like substrate 10, electrode terminals 22, 24, 26 connected to the capacitor elements 20 are formed on a polyimide film 15 like columns, and through holes 50 are respectively formed between the column-like electrode terminals 22, 24, 26. When the circuit board and the electrode terminals 22, 24, 26 of the polyimide film 15 are soldered each other, gas is generated from solder flux or the like, but the gas is released from the through holes 50 to the outside. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a sheet-like substrate and an electronic component, and more particularly to adhesion of a sheet-like substrate.

  When soldering or bonding a sheet-like board to a circuit board, or a sheet-like board to a surface mount connector (hereinafter referred to as a connector) with solder or adhesive, in the case of soldering, gas from flux or molten solder is soldered In the case of entrained air and adhesive when flowing into the surface, volatile gas was generated from the solvent. In some cases, these gases cause the sheet-like substrate to move, resulting in mounting defects that are mounted at different positions.

In view of this, a method has been proposed in which an adhesive is applied to the joint surface in a dot shape to facilitate the release of gas generated during bonding (for example, see Patent Document 1).
JP-A-62-2688 (page 7)

The sheet-like substrate is an organic film having a density of about 1.3 g / cm ³ , a thickness of about 0.1 mm, a size of several mm square or more, and a thickness that is very thin compared to the area. Thus, this substrate weighs only about 0.13 mg / mm ² per unit area. In addition, the sheet-like substrate does not need to be bonded to the entire surface of the substrate, but a large number of bonding sites, that is, gas generation on the entire surface of the substrate, although the bonding area is small, such as requiring multiple bonding sites per 1 mm length. Have a source. As described above, when gas is generated from the entire surface of a low-weight substrate, the sheet-like substrate easily moves and causes mounting defects. Therefore, even if the bonding surface is formed in a dot shape on the sheet-like substrate, there is a problem that the sheet-like substrate moves to cause mounting failure.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a sheet-like substrate and an electronic component that eliminate the influence of gas generated during bonding and do not cause mounting defects.

  The sheet-like substrate of the present invention includes an electric circuit formed on the surface of the organic film with a plurality of rows and a predetermined interval, and an electrode derived from the electric circuit formed on the surface of the organic film and connected to an external device. It has a terminal and the organic film provided with the through-hole located between several rows of electrode terminals between several rows.

  In this way, by providing a through hole between the electrode terminals of each row of the electric circuit, the gas generated at the time of bonding at the electrode terminal is released to the outside through the through hole. Does not move and does not cause mounting defects that are adhered to different positions.

  In addition, the electric circuit of the sheet-like substrate of the present invention includes one or more passive elements selected from a capacitor element, a resistance element, and an inductor element, and electrode terminals are arranged at both ends and the center of the organic film in each row of the electric circuit. Is formed.

  The passive element formed on such a sheet-like substrate is composed of a thin film, and its mass is small, so that it is difficult to fix the position during mounting. Further, since the electrode terminals are at the center and both ends of the sheet-like substrate, gas is generated from the entire surface of the sheet-like substrate during bonding. Therefore, particularly in such a sheet-like substrate, the effect of releasing the organic film having a through hole is great.

  Moreover, the organic film of the sheet-like board | substrate of this invention has a through-hole between the electrode terminals of the center part of each row | line | column of an electric circuit at least.

  As described above, when there is a through hole between at least the central electrode terminals of each row of the electric circuit, the gas generated at the central electrode terminals of the sheet-like substrate will be the central portion of each row of the electric circuit. Escapes from the through hole provided between the electrode terminals. Further, although some of the gas generated at the electrode terminals at both ends flows toward the center of the organic film, most of the gas escapes from the end of the organic film to the outside, so that the gas does not stay in the vicinity of the organic film. Furthermore, if a through hole is provided between the electrode terminals at the end of each row of the electric circuit, the generated gas is more reliably discharged to the outside.

  In addition, the electronic component of the present invention includes a plurality of terminal pins protruding in an L shape from the peripheral side surface or the peripheral edge of the bottom surface, and a through groove or bottom surface penetrating from one end to the other end of the bottom surface to the opposing surface. A surface-mounted connector having a through-hole that penetrates, an electric circuit formed on the surface facing the bonding surface that adheres to the bottom surface, and a plurality of electrode terminals that are derived from the electric circuit and are connected to an external device And a sheet-like substrate made of an organic film bonded and fixed to a region formed by the terminal pin and the bottom surface so that the electrode terminal and the terminal pin are arranged on the same plane.

  By using such an electronic component, the gas generated when the electronic component and the sheet-like substrate are bonded is released to the outside from the through groove or the through-hole, and the sheet-like substrate does not move, and the electron is emitted at a predetermined position. The component and the sheet-like substrate are bonded to each other so that mounting failure does not occur.

  Moreover, the electric circuit of the sheet-like substrate constituting the electronic component of the present invention is a noise prevention circuit for preventing noise of the surface mount connector.

  The passive element that constitutes such a noise prevention circuit is made of a thin film, has a small mass, and is difficult to fix in position when mounted on the connector, so that the effect of providing a through groove or a through hole in the connector is particularly great.

  In addition, the electric circuit of the sheet-like substrate constituting the electronic component of the present invention is formed on the surface of the organic film with a plurality of rows at a predetermined interval, and the through-holes of the sheet-like substrate are between the rows of the plurality of rows. It is provided between the electrode terminals of a row | line | column, The through-hole is connected with the through-slot or through-hole of a surface mount type connector.

  Since the gas generated when such an electronic component is bonded to an external device is discharged to the outside through the through hole and the through groove, mounting defects due to the generated gas do not occur.

  The passive element formed on the sheet-like substrate of the present invention and the passive element of the sheet-like substrate bonded to the surface mount connector of the present invention include a capacitor element (C), a resistance element (R), and an inductor element (L ) May be used alone, or a CR filter or an LC filter may be used.

  The organic film is a resin substrate that can be freely bent at a thickness of about 100 μm, and examples thereof include polyimide film, polyamide, polyether ether ketone, epoxy resin, and polybenzthiazole.

  The sheet-like substrate of the present invention includes an electric circuit formed on the surface of the organic film with a plurality of rows and a predetermined interval, and an electrode derived from the electric circuit formed on the surface of the organic film and connected to an external device. It has a terminal and the organic film provided with the through-hole located between several rows of electrode terminals between several rows.

  In this way, by providing a through hole between the electrode terminals of each row of the electric circuit, the gas generated at the time of bonding at the electrode terminal is released to the outside through the through hole. Does not move and does not cause mounting defects that are adhered to different positions.

  In addition, the electronic component of the present invention includes a plurality of terminal pins protruding in an L shape from the peripheral side surface or the peripheral edge of the bottom surface, and a through groove or bottom surface penetrating from one end to the other end of the bottom surface to the opposing surface. A surface-mounted connector having a through-hole that penetrates, an electric circuit formed on the surface facing the bonding surface that adheres to the bottom surface, and a plurality of electrode terminals that are derived from the electric circuit and are connected to an external device And a sheet-like substrate made of an organic film bonded and fixed to a region formed by the terminal pin and the bottom surface so that the electrode terminal and the terminal pin are arranged on the same plane.

  By using such an electronic component, the gas generated when the surface-mount connector and the sheet-like substrate are bonded is released to the outside from the through groove or the through-hole, and the sheet-like substrate does not move and moves to a predetermined position. In this case, the surface mount connector and the sheet-like substrate are bonded to each other, so that mounting failure does not occur.

  Therefore, the present invention has a great effect that it is possible to provide a sheet-like substrate and an electronic component that eliminate the influence of gas generated during bonding and do not cause mounting failure.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  In the embodiment of the present invention, a sheet-like substrate provided with a capacitor element and configured with a noise prevention circuit for preventing high-frequency noise, and the above-mentioned sheet-like substrate as a connector used for connection between substrates of an electronic device as an electronic component. A description will be given of an example of bonding.

  FIG. 1 is an example of a cross-sectional configuration diagram when the sheet-like substrate and the connector of the present invention are mounted. The circuit board 40, the sheet-like board 10, and the connector 70 are configured, and the circuit board 40 and the sheet-like board 10, and the circuit board 40 and the connector 70 are electrically joined to each other. Here, the circuit board 40 is obtained by mounting circuit components made of semiconductor components and general electronic components (not shown) on a printed wiring board. In addition, an electronic apparatus is configured by the sheet-like substrate 10 having a noise prevention circuit for preventing noise such as a power supply line and the connector 70 for connecting another circuit substrate or a mechanical part.

(First embodiment)
FIG. 2 is a cross-sectional configuration diagram when the sheet-like substrate according to the first embodiment of the present invention is bonded to a circuit board. In the sheet-like substrate 10, an upper electrode film 30 and an electrode terminal 24 are formed on a polyimide film 15 having a thickness of about 100 μm, and a through hole 50 penetrating the polyimide film 15 is opened. The circuit board 40 is formed with a multilayer wiring (not shown), an electrode pad 42 is provided on the surface thereof, and the electrode terminal 24 and the electrode pad 42 are electrically joined by solder 44.

  FIG. 3 is a plan view of the sheet-like substrate of the first embodiment of the present invention shown in FIG. 2 as viewed from the XX direction on which the capacitor element is formed. In the sheet-like substrate 10, an electric circuit including the capacitor element 20 is formed on the polyimide film 15. The electrode terminals 22 and 26 at both ends and the electrode terminals 24 at the center for connection to an external device such as a circuit board, which are derived from the electric circuit, are arranged in a row, and they are arranged in a plurality of rows with a predetermined interval. Has been placed. A through hole 50 is formed between the electrode terminals 22 and 26 at both ends of each column and the electrode terminal 24 at the center. Here, the through hole 50 has a hole diameter of 50 to 100 μm by a laser.

  Next, FIG. 4 is a cross-sectional view taken along the line YY of FIG. 3 and shows a configuration of an electric circuit including a capacitor element formed on the sheet-like substrate according to the first embodiment of the present invention. A lower electrode film 32, a dielectric film 34, and an upper electrode film 30 are sequentially laminated on the polyimide film 15. Further, an insulating film 36 is laminated, the electrode terminals 22 and 26 are formed on the lower electrode film 32, and the electrode terminal 24 is formed on the upper electrode film 30. In this way, the capacitor element 20 is formed to have a thickness of several μm by forming the dielectric film 34 between the electrode films of the lower electrode film 32 and the upper electrode film 30 and covering with the insulating film 36. . The capacitor element 20 and the electrode terminals 22, 24, 26 constitute a noise prevention circuit 28.

  Here, the lower electrode film 32, the dielectric film 34, and the upper electrode film 30 are formed by a thin film process such as sputtering, the insulating film 36 is formed by a printing process, and the electrode terminals 22, 26 and the electrode terminal 24 are formed by a plating process. To do.

Further, the material of the upper electrode film 30 and the lower electrode film 32 is preferably aluminum (Al) with low resistance and good adhesion. Examples of the material of the dielectric film 34 include silicon dioxide (SiO ₂ ), barium titanate (BaTiO ₃ ), strontium titanate (SrTiO ₃ ), and titanium oxide (TiO ₂ ) having a large relative dielectric constant and a small temperature coefficient. As the insulating film 36, an ultraviolet curable resin is used. As the electrode terminals 22, 24 and 26, copper (Cu) having excellent solderability is used.

  Next, the operation of the first embodiment of the present invention will be described. When the circuit board 40 and the polyimide film 15 are put in a reflow solder tank and the electrode terminals 22, 24, 26 of each row of the polyimide film 15 are soldered, a gas such as solder flux is generated during soldering. However, the gas generated at this time escapes from the through hole 50 to the outside. Accordingly, the gas generated during soldering between the polyimide film 15 and the circuit board 40 is quickly released to the outside, and the sheet-like substrate 10 does not move with the gas, so that mounting failure does not occur.

  FIG. 5 is a plan view showing another example of the sheet-like substrate according to the first embodiment of the present invention, and shows a case where the sheet-like substrate 12 is viewed from the surface on which the capacitor element is formed. As in FIG. 3, the sheet-like substrate 12 includes a polyimide film 15, a capacitor element 20, electrode terminals 22 and 26 at both ends, and a central electrode terminal 24 in a row, and a plurality of them with a predetermined interval. Arranged in columns. The polyimide film 15 has a through hole 52 only between the electrode terminal 24 and the electrode terminal 24 at the center of each row.

  Gas generated when soldering the electrode terminal 24 escapes from the through hole 52 to the outside, and part of the gas generated when soldering the electrode terminals 22 and 26 at the end part flows toward the center of the polyimide film 15, Most of them escape from the end of the polyimide film 15 to the outside. As described above, since the polyimide film is thin and flexible, even a very small hole has a small resistance for the gas to escape, and the gas can smoothly escape. Therefore, by providing the through hole 52 at least between the electrode terminal 24 and the electrode terminal 24 in the center of each row, gas generated during soldering stays between the polyimide film 15 and the circuit board 40. There is almost no mounting failure caused by the gas.

  Further, FIG. 6 is a plan view showing another example of the sheet-like substrate according to the first embodiment of the present invention, and shows a case where the sheet-like substrate 14 is viewed from the surface where the capacitor elements are similarly formed. In the sheet-like substrate 14, the capacitor element 20, the electrode terminals 22 and 26 at both ends, and the electrode terminal 24 at the center are arranged on the polyimide film 15 in the same manner as in the first embodiment. The difference is that the polyimide film 15 has a rectangular through hole 54 formed between the electrode terminals 22, 24, 26 and the electrode terminals 22, 24, 26 in each row.

  By using the through holes 54 opened along the electrode terminals 22, 24, and 26 to be soldered, the gas generated during soldering is easily released. Moreover, such a rectangular through-hole can be produced with a dicing saw, and carbonization marks generated when the through-hole is produced with a laser are eliminated, and the influence on the subsequent process is further reduced.

  In the first embodiment of the present invention, solder is described as an adhesive material for electrically joining the electrode terminals 22, 24, and 26 of the polyimide film 15 and the electrode pads 42 of the circuit board 40. A conductive adhesive containing a metal material having electrical conductivity such as silver (Ag) may be used. Sn-Ag-Cu-Bi as the solder, and conductive fillers such as silver (Ag), copper (Cu), nickel (Ni), aluminum (Al) as the conductive adhesive as an epoxy resin binder A dispersed one is suitable.

(Second Embodiment)
FIG. 7A is a cross-sectional configuration diagram when a sheet-like substrate, which is an electronic component according to the second embodiment of the present invention, is bonded to a connector. In the same manner as in the first embodiment, the sheet-like substrate 16 has the noise prevention circuit 28 formed of the capacitor element 20 and the electrode terminals 22, 24, 26 formed on the polyimide film 15.

  The connector 70 has a hollow portion 72 into which a male connector (not shown) is fitted, and is connected to the circuit board via a terminal pin 74. The terminal pin 74 protrudes in an L shape from the peripheral edge portion of the opposed bottom surface. Further, a through hole 60 is opened from the bottom surface of the connector 70 to the facing surface that contacts the hollow portion 72. And the sheet-like board | substrate 16 is adhere | attached and fixed to the area | region formed with the terminal pin 74 and the bottom face of the connector 70 so that the electrode terminals 22,24,26 and the terminal pin 74 may be arrange | positioned on the same plane. .

  FIG. 7B is a plan view of FIG. A plurality of terminal pins 74 face and protrude from the connector 70. The through holes 60 having a diameter of about 100 μm are formed in every other row of the terminal pins 74 in the horizontal direction of the sheet. The size and number of the through holes 60 may be determined as appropriate based on the amount of gas generated during bonding and the strength of the connector 70.

  Here, when the polyimide film 15 of the sheet-like substrate 16 is bonded to the connector 70 with the adhesive 46, a volatile gas is generated from the solvent of the adhesive 46, and the volatile gas is released from the through hole 60 to the outside. Therefore, the volatile gas does not stay between the connector 70 and the polyimide film 15, and mounting failure does not occur.

  FIG. 8A is a cross-sectional configuration diagram of another example when the sheet-like substrate according to the second embodiment of the present invention is bonded to a connector. In the sheet-like substrate 16, a noise prevention circuit 28 is formed on the polyimide film 15 by the same method as in the second embodiment. The connector 78 also includes a terminal pin 74 and a hollow portion 72 having the same shape as the connector 70. The same is true in that the sheet-like substrate 16 is bonded and fixed to a region formed by the bottom surface of the connector 78 and the terminal pins 74. The difference is that the connector 78 is provided with a rectangular parallelepiped through-hole 62 from the bottom surface to the opposite surface instead of the circular through-hole.

  FIG. 8B is a plan view of FIG. 8A, and a plurality of terminal pins 74 are opposed to and protrude from the connector 78. The through holes 62 having a rectangular cross section are formed in every two rows of terminal pins 74. The size and number of the through holes 62 may be determined as appropriate so that the amount of gas generated during bonding, the strength of the connector 78, and the generated gas are evenly released. Such a through-hole 62 has a large cross section in a rectangular shape, and the generated gas is smoothly discharged.

  FIG. 9A is a cross-sectional configuration diagram of another example when the sheet-like substrate according to the second embodiment of the present invention is bonded to a connector. In the sheet-like substrate 16, the noise prevention circuit 28 is formed on the polyimide film 15 by the same method, and the connector 80 includes a terminal pin 74 and a hollow portion 72 having the same shape as the connector 70. The same is true in that the sheet-like substrate 16 is bonded and fixed to a region formed by the bottom surface of the connector 80 and the terminal pins 74. The difference is that a through-groove 56 having a semicircular cross section is formed in the bottom surface of the connector 80 from one end to the other end.

  FIG. 9B is a plan view of the bottom surface of the connector as viewed from the ZZ direction in FIG. The through groove 56 is opened on the bottom surface of the connector 80 extending, and the volatile gas of the adhesive 46 is released to the outside through the through groove 56. Therefore, the sheet-like substrate 16 is not moved by the volatile gas, and mounting failure does not occur.

  FIG. 9C is a plan view of another example of the bottom of the connector according to the second embodiment of the present invention. A through groove 58 orthogonal to the through groove 56 is provided, and the volatile gas of the adhesive 46 is evenly distributed. In addition, it is configured to facilitate discharge to the outside. The diameters of the through groove 56 and the through groove 58 are about 100 μm.

(Third embodiment)
FIG. 10A is a cross-sectional configuration diagram when a sheet-like substrate according to a third embodiment of the present invention bonded to a connector is bonded to a circuit board. FIG. 10B is a plan view of the sheet-like substrate and the connector viewed from the direction P-P in FIG. The connector 80 has a through groove 56 on the bottom surface, and the sheet-like substrate 10 has a through hole 50 between the electrode terminals 22, 24 and 26. The through hole 50 of the sheet substrate 10 is connected to the through groove 56 of the connector 80. In addition, the sheet-like substrate 10 is bonded to the connector 80 with an adhesive 48. However, the adhesive 48 is not applied to all the places where the sheet-like substrate 10 and the bottom surface of the connector 80 are in contact with each other. It is applied excluding these so as not to fill the groove 56.

  On the circuit board 40, the electrode pad 42 is formed at a predetermined position including the corresponding positions of the terminal pin 74 and the electrode terminals 22, 24, 26. The terminal pin 74 and the electrode terminals 22, 24, 26 on the electrode pad 42 are formed. Solder 44 is placed on the corresponding position.

  The gas generated when such a sheet-like substrate 10 is bonded to the connector 80 with the adhesive 48 is released from the through groove 56 or the through hole 50 to the outside. Further, the gas generated when the connector 80 to which the sheet-like substrate 10 is bonded is bonded to the circuit board 40 with the solder 44 passes from the through hole 50 of the sheet-like substrate 10 to the outside through the through groove 56 of the connector 80. Since it is released, there will be no adhesion failure due to solder gas.

  In the second and third embodiments of the present invention, the adhesive, which is an adhesive material between the polyimide film 15 and the connectors 70, 78, 80, is an epoxy, urethane, or acrylic room temperature curable adhesive. Is preferred.

  The through groove 56, the through groove 58, the through hole 60, and the through hole 62 may be formed by processing the connector 70, the connector 78, and the connector 80, respectively. What is necessary is just to produce in the shape which has.

  The circuit board 40 is a multilayer board in which glass epoxy resin is often used as a material and multilayer wiring is formed.

  The present invention can be applied to a small and light portable device using a sheet-like substrate, such as a mobile phone, a camera-integrated VTR, or a wearable computer because it can be easily folded. The possibilities are very wide and great.

Cross-sectional configuration diagram when the sheet-like substrate and connector of the present invention are mounted Sectional block diagram when the sheet-like substrate of the first embodiment of the present invention is bonded to a circuit board Plan view of the sheet-like substrate of the same embodiment Sectional drawing which shows the noise prevention circuit comprised in the sheet-like board | substrate of the embodiment The top view of the sheet-like board | substrate of the other example of the embodiment The top view of the sheet-like board | substrate of the other example of the embodiment (A) Cross-sectional block diagram when a sheet-like substrate is bonded to the connector of the second embodiment of the present invention (B) Plan view of the connector and the sheet-like substrate of the same embodiment (A) Cross-sectional configuration diagram of another example when a sheet-like substrate is bonded to the connector of the embodiment (B) Plan view of another example of the connector and the sheet-like substrate of the embodiment (A) Cross-sectional configuration diagram of another example when a sheet-like substrate is bonded to the connector of the same embodiment (B) Plan view of another example of the connector of the same embodiment (C) Connector of the same embodiment Plan view of another example of the bottom (A) Cross-sectional configuration diagram when adhering a sheet-like board of the third embodiment of the present invention bonded to a connector to a circuit board (B) The connector was seen from the sheet-like board side of the same embodiment Top view when

Explanation of symbols

10, 12, 14, 16 Sheet substrate 15 Polyimide film 20 Capacitor element 22, 24, 26 Electrode terminal 28 Noise prevention circuit 30 Upper electrode film 32 Lower electrode film 34 Dielectric film 36 Insulating film 40 Circuit board 42 Electrode pad 44 Solder 46,48 Adhesive 50,52,54,60,62 Through hole 56,58 Through groove 70,78,80 Connector 72 Hollow part 74 Terminal pin

Claims (6)

An electric circuit formed on the surface of the organic film with a plurality of rows having a predetermined interval;
An electrode terminal derived from the electric circuit formed on the surface and connected to an external device;
The sheet-like board | substrate which has the said organic film provided with the through-hole located between the said electrode terminals of the said multiple rows between the said multiple rows. The electric circuit includes one or more passive elements selected from a capacitor element, a resistance element, and an inductor element, and the electrode terminals are formed at both ends and a center of the organic film in each row of the electric circuit. Item 2. A sheet-like substrate according to Item 1. The sheet-like substrate according to claim 2, wherein the organic film has a through hole at least between electrode terminals at the center of each row of the electric circuit. Provided with a plurality of terminal pins projecting in an L-shape from the opposing side surface or the peripheral edge of the bottom surface and a through groove penetrating from one end to the other end of the bottom surface or a through hole penetrating from the bottom surface to the opposite facing surface Surface mount connectors,
An electric circuit formed on a surface opposite to the bonding surface to be bonded to the bottom surface, and a plurality of electrode terminals derived from the electric circuit and connected to an external device, wherein the electrode terminals and the terminal pins are in the same plane The electronic component which has a sheet-like board | substrate consisting of the organic film adhere | attached and fixed to the area | region formed with the said terminal pin and the said bottom face so that it may be arrange | positioned on the top. The electronic component according to claim 4, wherein the electrical circuit is a noise prevention circuit for preventing noise of the surface mount connector. The electric circuit is formed on the surface of the organic film with a plurality of rows having a predetermined interval, and through holes provided in the organic film between the rows of the rows and between the electrode terminals of the rows of the surface are mounted on the surface. The electronic component according to claim 4, wherein the electronic component is connected to a through groove or a through hole of the mold connector.

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