JP2005144628A - 研磨材 - Google Patents
研磨材 Download PDFInfo
- Publication number
- JP2005144628A JP2005144628A JP2003388418A JP2003388418A JP2005144628A JP 2005144628 A JP2005144628 A JP 2005144628A JP 2003388418 A JP2003388418 A JP 2003388418A JP 2003388418 A JP2003388418 A JP 2003388418A JP 2005144628 A JP2005144628 A JP 2005144628A
- Authority
- JP
- Japan
- Prior art keywords
- fiber
- abrasive
- group
- strength
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000835 fiber Substances 0.000 claims abstract description 175
- 239000006061 abrasive grain Substances 0.000 claims abstract description 61
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims abstract description 11
- -1 polyparaphenylene terephthalamide Polymers 0.000 claims description 112
- 239000007788 liquid Substances 0.000 claims description 53
- 239000011248 coating agent Substances 0.000 claims description 50
- 238000000576 coating method Methods 0.000 claims description 50
- 125000003118 aryl group Chemical group 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229920003235 aromatic polyamide Polymers 0.000 claims description 15
- 239000004744 fabric Substances 0.000 claims description 15
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000004745 nonwoven fabric Substances 0.000 claims description 10
- 239000004760 aramid Substances 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 239000002759 woven fabric Substances 0.000 claims description 7
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 239000008262 pumice Substances 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000010433 feldspar Substances 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052580 B4C Inorganic materials 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- 239000011045 chalcedony Substances 0.000 claims description 3
- 239000010431 corundum Substances 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000010459 dolomite Substances 0.000 claims description 3
- 229910000514 dolomite Inorganic materials 0.000 claims description 3
- 229910001651 emery Inorganic materials 0.000 claims description 3
- 239000002223 garnet Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- 238000012643 polycondensation polymerization Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000011029 spinel Substances 0.000 claims description 3
- 229910052596 spinel Inorganic materials 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052845 zircon Inorganic materials 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
- 239000006004 Quartz sand Substances 0.000 claims description 2
- 239000010458 rotten stone Substances 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 abstract description 8
- 239000003082 abrasive agent Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 50
- 229920005989 resin Polymers 0.000 description 50
- 239000011347 resin Substances 0.000 description 50
- 239000000047 product Substances 0.000 description 34
- 238000010438 heat treatment Methods 0.000 description 19
- 238000001035 drying Methods 0.000 description 16
- 238000005470 impregnation Methods 0.000 description 15
- 125000001424 substituent group Chemical group 0.000 description 14
- 239000004753 textile Substances 0.000 description 12
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 11
- 229920006231 aramid fiber Polymers 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000005498 polishing Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000009940 knitting Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229920000271 Kevlar® Polymers 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000004761 kevlar Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 125000000623 heterocyclic group Chemical group 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 150000004756 silanes Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000009987 spinning Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
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- 229920006393 polyether sulfone Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 125000000547 substituted alkyl group Chemical group 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 238000009941 weaving Methods 0.000 description 3
- AIFRHYZBTHREPW-UHFFFAOYSA-N β-carboline Chemical compound N1=CC=C2C3=CC=CC=C3NC2=C1 AIFRHYZBTHREPW-UHFFFAOYSA-N 0.000 description 3
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical compound C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- BPMFPOGUJAAYHL-UHFFFAOYSA-N 9H-Pyrido[2,3-b]indole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=N1 BPMFPOGUJAAYHL-UHFFFAOYSA-N 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
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- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
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- 239000004721 Polyphenylene oxide Substances 0.000 description 2
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- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
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- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- 125000005842 heteroatom Chemical group 0.000 description 2
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
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- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
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- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- FLBAYUMRQUHISI-UHFFFAOYSA-N 1,8-naphthyridine Chemical compound N1=CC=CC2=CC=CN=C21 FLBAYUMRQUHISI-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 125000004972 1-butynyl group Chemical group [H]C([H])([H])C([H])([H])C#C* 0.000 description 1
- 125000000530 1-propynyl group Chemical group [H]C([H])([H])C#C* 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- TZMSYXZUNZXBOL-UHFFFAOYSA-N 10H-phenoxazine Chemical compound C1=CC=C2NC3=CC=CC=C3OC2=C1 TZMSYXZUNZXBOL-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
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- CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 description 1
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000004762 twaron Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】高強度繊維とシロキサンポリマーと砥粒とを有することを特徴とする研磨材。
【選択図】なし
Description
本発明者らは、かかる種々の知見を得た後、さらに検討を重ね、本発明を完成するに至った。
(1) 高強度繊維とシロキサンポリマーと砥粒とを含有することを特徴とする研磨材、
(2) 高強度繊維が、全芳香族ポリアミド繊維、全芳香族ポリエステル繊維又はヘテロ環芳香族繊維であることを特徴とする(1)に記載の研磨材、
(3) 高強度繊維が、ポリパラフェニレンテレフタルアミド繊維であることを特徴とする(1)又は(2)に記載の研磨材、
(4) シロキサンポリマーが式
で表わされる化合物を縮重合して得られる化学架橋体であることを特徴とする(1)〜(3)のいずれかに記載の研磨材、
に関する。
(5) 砥粒が、ダイアモンド、コランダム、エメリー、ガーネット、ブーアストーン、チャート、石英、砂岩、玉髄、尖晶石、すい石、ケイ砂、ケイ素、ドロマイト、トリポリ、長石、軽石、浮石粉、タルク、炭化ホウ素、立方晶窒化ホウ素、溶融アルミナ、セラミック酸化アルミニウム、熱処理した酸化アルミニウム、アルミナジルコニア、ガラス、炭化ケイ素、酸化鉄、炭化タンタル、酸化セリウム、酸化錫、炭化チタン、合成ダイアモンド、二酸化マンガン、酸化ジルコン及び窒化ケイ素からなる群から選ばれる一種以上からなっていることを特徴とする(1)〜(4)のいずれかに記載の研磨材、
(6) 高強度繊維が高強度繊維からなる織物、編物又は不織布であることを特徴とする(1)〜(5)のいずれかに記載の研磨材、
(7) 架橋性シロキサン化合物と砥粒とを含有するコーティング液で高強度繊維を処理することを特徴とする(1)記載の研磨材の製造方法、
(8) 砥粒を担持した高強度繊維を、架橋性シロキサン化合物を含有するコーティング液で処理することを特徴とする(1)記載の研磨材の製造方法、
に関する。
(9) 架橋性シロキサン化合物を含有するコーティング液で処理した高強度繊維に砥粒を担持させることを特徴とする(1)記載の研磨材の製造方法、
(10) 架橋性シロキサン化合物と砥粒とを含むことを特徴とするコーティング液、
(11) さらに硬化触媒となる金属を含有する有機化合物を含むことを特徴とする(10)記載のコーティング液、
に関する。
〔数1〕
水分率(質量%)=(W−W’)×100/W’ (式1)
(式中、Wは試料採取時の質量を示し、W’は試料の絶乾時質量を示す。)
X線回折装置 理学電機株式会社製 4036A2型、X線源 CuK α線 (Niフィルター使用)、出力35kV、15mA
ゴニオメーター 理学電機株式会社製 スリット 2mmφ−1°−1°、検出器 シンチレーションカウンター、
計数記録装置 理学電機株式会社製 RAD−C型
そこで、本発明においては、ホットローラー等の熱処理条件などを適宜変更することにより、水分率が約15〜100質量%、繊維の結晶サイズ(110方向)が約30〜55ÅのPPTA繊維を製造し、かかる繊維を用いることが好ましい。このような水分率にするには、紡糸したPPTA繊維を約100〜150℃で約5〜20秒間乾燥することが好ましい。
上記のような水分率又は/及び結晶サイズであるPPTA繊維は、東京都中央区日本橋本町1−5−6(第10中央ビル)の東レ・デュポン株式会社[ケブラー開発部(TEL;03−3245−5082、FAX;03−3242−3183)]から入手可能である。
で表わされる化合物、式
で表わされる化合物、式
で表わされる化合物、式、
で表わされる化合物、式
で表わされる化合物、又はこれらの混合物等が挙げられる。
本発明においては、上記製造方法で製造された研磨材が繊維状で得られる場合、前記繊維状研磨材を自体公知の手段に従って繊維を例えば下記するような繊維製品に加工してもよい。
上記繊維製品が織物である場合、例えば、公知の織機(ジェット織機又はスルザー織機等)を用いて、平織、綾織、朱子織または斜文織等の所望の織物を製造し、上記各工程に付して本発明の研磨材を製造することができる。
上記繊維製品が不織布である場合、例えば、公知の不織布機を用いて、湿式法、トウ開繊法などの乾式法、スパンボンド法、メルトブロー法又はフラッシュ紡糸法等により、所望の不織布を高強度繊維から製造し、上記各工程に付して本発明の研磨材を製造することができる。例えば、上記湿式法を用いる場合、繊維状の上記高強度繊維を短く切断し、抄紙機で抄紙後、乾燥させることによって湿式不織布を作製することができる。
経糸、緯糸とも20番手双糸のポリパラフェニレンテレフタルアミド繊維(東レ・デュポン株式会社製 KEVLAR(登録商標))からなる織密度タテ58×ヨコ47本/吋、織物目付230g/m3の平織の織物に、フェノール樹脂(住友ベークライト株式会社製のスミライトレジンTM)50gを塗布し、その表面に砥粒(ミネソタ マイニング アンド マニユフアクチユアリング社製 キュビトロンTM)100gを散布し、砥粒が担持された織物を作製した。
イソプロピルアルコール735gにメトキシシランオリゴマー(重合度3〜4量体)200gとポリジメチルジメトキシシラン50gとを加え撹拌した後、チタンテトラブトキシド15gを加え十分に撹拌し、コーティング液を調合した。このシラン系コーティング液中に、実施例1で砥粒を担持した織物を浸漬し、マングルで2kg/cm2の圧力で絞った後風乾し、さらにタバイ株式会社製の乾燥機を用いて200℃で2分間熱処理した後、本発明に係る研磨材を得た。このとき、シロキサンポリマーの付着率は8.7質量%であった。
実施例2で作製した研磨材を繊維軸方向が長手方向になるように長さ180mm、幅20mm及び厚さ1.1〜1.3mmの短冊形状に切り出し、これを引張試験片とした。曲げ弾性率は、インストロン万能試験機を用い、変位速度1.00mm/min、スパン間距離80mm及び常温下の条件により求められた。また、比較例として実施例1で作製したコーティング液で処理していない織物を上記と同様にして測定した。測定結果を表1に示す。
2 コーティング液
3(3a、3b、3c、3d) ローラー
4 ヒーター
5 繊維製品
Claims (11)
- 高強度繊維とシロキサンポリマーと砥粒とを含有することを特徴とする研磨材。
- 高強度繊維が、全芳香族ポリアミド繊維、全芳香族ポリエステル繊維又はヘテロ環芳香族繊維であることを特徴とする請求項1に記載の研磨材。
- 高強度繊維が、ポリパラフェニレンテレフタルアミド繊維であることを特徴とする請求項1又は2に記載の研磨材。
- シロキサンポリマーが式
で表わされる化合物を縮重合して得られる化学架橋体であることを特徴とする請求項1〜3のいずれかに記載の研磨材。 - 砥粒が、ダイアモンド、コランダム、エメリー、ガーネット、ブーアストーン、チャート、石英、砂岩、玉髄、尖晶石、すい石、ケイ砂、ケイ素、ドロマイト、トリポリ、長石、軽石、浮石粉、タルク、炭化ホウ素、立方晶窒化ホウ素、溶融アルミナ、セラミック酸化アルミニウム、熱処理した酸化アルミニウム、アルミナジルコニア、ガラス、炭化ケイ素、酸化鉄、炭化タンタル、酸化セリウム、酸化錫、炭化チタン、合成ダイアモンド、二酸化マンガン、酸化ジルコン及び窒化ケイ素からなる群から選ばれる一種以上からなっていることを特徴とする請求項1〜4のいずれかに記載の研磨材。
- 高強度繊維が高強度繊維からなる織物、編物又は不織布であることを特徴とする請求項1〜5のいずれかに記載の研磨材。
- 架橋性シロキサン化合物と砥粒とを含有するコーティング液で高強度繊維を処理することを特徴とする請求項1記載の研磨材の製造方法。
- 砥粒を担持した高強度繊維を、架橋性シロキサン化合物を含有するコーティング液で処理することを特徴とする請求項1記載の研磨材の製造方法。
- 架橋性シロキサン化合物を含有するコーティング液で処理した高強度繊維に砥粒を担持させることを特徴とする請求項1記載の研磨材の製造方法。
- 架橋性シロキサン化合物と砥粒とを含むことを特徴とするコーティング液。
- さらに硬化触媒となる金属を含有する有機化合物を含むことを特徴とする請求項10記載のコーティング液。
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