JP2005124129A - 恒温槽を用いた高安定用の水晶発振器 - Google Patents
恒温槽を用いた高安定用の水晶発振器 Download PDFInfo
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- JP2005124129A JP2005124129A JP2004139175A JP2004139175A JP2005124129A JP 2005124129 A JP2005124129 A JP 2005124129A JP 2004139175 A JP2004139175 A JP 2004139175A JP 2004139175 A JP2004139175 A JP 2004139175A JP 2005124129 A JP2005124129 A JP 2005124129A
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- 239000013078 crystal Substances 0.000 title claims abstract description 50
- 230000010355 oscillation Effects 0.000 claims abstract description 37
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 22
- 230000020169 heat generation Effects 0.000 claims description 20
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 230000006641 stabilisation Effects 0.000 claims 1
- 238000011105 stabilization Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 22
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004043 responsiveness Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/02—Details
- H03B5/04—Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10068—Non-printed resonator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
【構成】水晶片を密閉封入する振動子用容器を含めて水晶振動子の温度を一定に維持する恒温槽本体と、前記水晶振動子とともに発振回路を構成する発振用素子と、前記恒温槽本体の槽内温度を制御する温度制御回路を構成する温度制御素子と、前記恒温槽本体、前記発振用素子及び前記温度制御素子を搭載する回路基板とを備える、恒温槽を用いた高安定用の水晶発振器において、前記回路基板の一主面に発熱用のチップ抵抗と前記発振用素子及び前記温度制御素子のうちの温度依存性の大きき熱高感度素子とを配置し、前記発熱用のチップ抵抗と前記熱高感度素子と前記恒温槽本体とを熱伝導性の物質で直接的に熱結合した構成とする。
【選択図】図1
Description
Claims (8)
- 水晶片を密閉封入する振動子用容器を含めて水晶振動子の温度を一定に維持する恒温槽本体と、前記水晶振動子とともに発振回路を構成する発振用素子と、前記恒温槽本体の槽内温度を制御する温度制御回路を構成する温度制御素子と、前記恒温槽本体、前記発振用素子及び前記温度制御素子を搭載する回路基板とを備える、恒温槽を用いた高安定用の水晶発振器において、前記回路基板の一主面に発熱用のチップ抵抗と前記発振用素子及び前記温度制御素子のうちの温度依存性の大きい熱高感度素子とを配置し、前記発熱用のチップ抵抗と前記熱高感度素子と前記恒温槽本体とを熱伝導性の物質で直接的に熱結合したことを特徴とする水晶発振器。
- 請求項1において、前記熱伝導性の物質は柔軟性物質であって、前記発熱用のチップ抵抗と前記熱高感度素子と前記恒温槽本体との間に前記柔軟性物質を設けて密着した高安定用の水晶発振器。
- 請求項2において、前記柔軟性物質はシート状であって、前記発熱用のチップ抵抗及び前記熱高感度素子と前記恒温槽本体との間に設けられた高安定用の水晶発振器。
- 請求項1又は2において、前記恒温槽本体は収容部の両端側から一対の脚部が延出した断面コ字状とする空間部を有し、前記収容部には前記水晶振動子を前記恒温槽本体と熱的に結合させて配置し、前記空間部には前記発熱用のチップ抵抗と前記熱高感度素子とを配置した高安定用の水晶発振器。
- 請求項1又は2において、前記恒温槽本体は平板部の両端側から一対の脚部が延出した断面コ字状とする空間部を有し、前記空間部の上方部には前記水晶振動子を前記恒温槽本体と熱的に結合させて配置し、前記空間部の下方部には前記発熱用のチップ抵抗と前記熱高感度素子とを配置した高安定用の水晶発振器。
- 請求項1又は2において、前記恒温槽本体は前記振動子用容器として、前記振動子用容器の下面に前記発熱用のチップ抵抗と前記熱高感度素子とを配置した高安定用の水晶発振器。
- 請求項1、2、4、5又は6において、前記熱高感度素子は温度制御素子のうちの温度感応素子又は及び発振用素子のうちの電圧可変容量素子である高安定用の水晶発振器。
- 前記回路基板の他主面には発振用素子が配置された請求項1の水晶発振器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004139175A JP4298580B2 (ja) | 2003-09-24 | 2004-05-07 | 恒温槽を用いた高安定用の水晶発振器 |
US10/946,890 US7023291B2 (en) | 2003-09-24 | 2004-09-22 | Oven controlled crystal oscillator for high stability |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003332336 | 2003-09-24 | ||
JP2004139175A JP4298580B2 (ja) | 2003-09-24 | 2004-05-07 | 恒温槽を用いた高安定用の水晶発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005124129A true JP2005124129A (ja) | 2005-05-12 |
JP4298580B2 JP4298580B2 (ja) | 2009-07-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004139175A Expired - Fee Related JP4298580B2 (ja) | 2003-09-24 | 2004-05-07 | 恒温槽を用いた高安定用の水晶発振器 |
Country Status (2)
Country | Link |
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US (1) | US7023291B2 (ja) |
JP (1) | JP4298580B2 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007110698A (ja) * | 2005-09-15 | 2007-04-26 | Nippon Dempa Kogyo Co Ltd | 高安定用とした恒温型の水晶発振器 |
JP2008136033A (ja) * | 2006-11-29 | 2008-06-12 | Epson Toyocom Corp | 高安定圧電発振器用導熱トレイ、トレイユニット、プリント基板ユニット、及び高安定圧電発振器 |
US7479835B2 (en) | 2005-09-15 | 2009-01-20 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature type crystal oscillator for high stability |
JP2010103610A (ja) * | 2008-10-21 | 2010-05-06 | Daishinku Corp | 圧電発振器 |
JP2012085046A (ja) * | 2010-10-08 | 2012-04-26 | Nippon Dempa Kogyo Co Ltd | 恒温槽付水晶発振器 |
CN103107775A (zh) * | 2013-01-17 | 2013-05-15 | 广东大普通信技术有限公司 | 发热器件以及包含其的恒温晶体振荡器 |
CN103117704A (zh) * | 2013-01-17 | 2013-05-22 | 广东大普通信技术有限公司 | 双槽恒温晶体振荡器 |
US8558629B2 (en) | 2010-12-06 | 2013-10-15 | Nihon Dempa Kogyo Co., Ltd. | Temperature-controlled crystal oscillating unit and crystal oscillator |
JP2017183907A (ja) * | 2016-03-29 | 2017-10-05 | 株式会社大真空 | 圧電発振器 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US20090037364A1 (en) * | 2005-02-04 | 2009-02-05 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Participation profiles of virtual world players |
US20070254714A1 (en) * | 2006-05-01 | 2007-11-01 | Martich Mark E | Wireless access point |
TW200744314A (en) * | 2006-05-18 | 2007-12-01 | Taitien Electronics Co Ltd | Oscillator device capable of keeping constant temperature |
US20080224786A1 (en) * | 2007-03-13 | 2008-09-18 | Stolpman James L | Apparatus and method for temperature compensating an ovenized oscillator |
EP1990911A1 (en) * | 2007-05-09 | 2008-11-12 | Taitien Electronics Co., Ltd. | Crystal oscillator device capable of maintaining constant temperature condition |
US7782147B2 (en) * | 2007-06-20 | 2010-08-24 | Motorola, Inc. | Apparatus for providing oscillator frequency stability |
EP2072832A3 (de) * | 2007-12-17 | 2014-04-30 | Ebm-Papst St. Georgen GmbH & CO. KG | Miniaturlüfter |
WO2009108324A2 (en) * | 2008-02-28 | 2009-09-03 | Cts Corporation | Ovenized crystal oscillator assembly |
WO2010002300A1 (en) * | 2008-07-01 | 2010-01-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Temperature regulation of crystal oscillator |
US8035454B2 (en) * | 2009-03-09 | 2011-10-11 | Micro Crystal Ag | Oscillator device comprising a thermally-controlled piezoelectric resonator |
CN101651446B (zh) * | 2009-09-02 | 2011-12-21 | 广东大普通信技术有限公司 | 表面贴装式恒温晶体振荡器 |
JP5020340B2 (ja) * | 2010-02-05 | 2012-09-05 | 日本電波工業株式会社 | 表面実装用とした恒温型の水晶発振器 |
JP6127651B2 (ja) * | 2013-03-29 | 2017-05-17 | セイコーエプソン株式会社 | 電子デバイス、電子機器、移動体および電子デバイスの製造方法 |
JP6286884B2 (ja) * | 2013-06-13 | 2018-03-07 | セイコーエプソン株式会社 | 電子デバイス、電子機器、および移動体 |
JP6561764B2 (ja) * | 2015-10-23 | 2019-08-21 | セイコーエプソン株式会社 | 発振器、電子機器および基地局 |
JP6828286B2 (ja) * | 2016-06-27 | 2021-02-10 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
CN109189116B (zh) * | 2018-08-14 | 2022-01-14 | 上海华虹宏力半导体制造有限公司 | 集成电路芯片的温度保持装置和方法 |
JP7388015B2 (ja) * | 2019-07-02 | 2023-11-29 | セイコーエプソン株式会社 | 集積回路装置、発振器、電子機器及び移動体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5041800A (en) * | 1989-05-19 | 1991-08-20 | Ppa Industries, Inc. | Lower power oscillator with heated resonator (S), with dual mode or other temperature sensing, possibly with an insulative support structure disposed between the resonator (S) and a resonator enclosure |
WO1999037018A1 (fr) * | 1998-01-20 | 1999-07-22 | Toyo Communication Equipment Co., Ltd. | Oscillateur piezo-electrique |
US6060692A (en) * | 1998-09-02 | 2000-05-09 | Cts Corporation | Low power compact heater for piezoelectric device |
US6049256A (en) * | 1998-09-10 | 2000-04-11 | Cts Corporation | Low profile ovenized oscillator packing having a high thermal conductivity substrate |
US7345552B2 (en) * | 2004-05-19 | 2008-03-18 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature type crystal oscillator |
-
2004
- 2004-05-07 JP JP2004139175A patent/JP4298580B2/ja not_active Expired - Fee Related
- 2004-09-22 US US10/946,890 patent/US7023291B2/en not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007110698A (ja) * | 2005-09-15 | 2007-04-26 | Nippon Dempa Kogyo Co Ltd | 高安定用とした恒温型の水晶発振器 |
US7479835B2 (en) | 2005-09-15 | 2009-01-20 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature type crystal oscillator for high stability |
JP2008136033A (ja) * | 2006-11-29 | 2008-06-12 | Epson Toyocom Corp | 高安定圧電発振器用導熱トレイ、トレイユニット、プリント基板ユニット、及び高安定圧電発振器 |
JP2010103610A (ja) * | 2008-10-21 | 2010-05-06 | Daishinku Corp | 圧電発振器 |
JP2012085046A (ja) * | 2010-10-08 | 2012-04-26 | Nippon Dempa Kogyo Co Ltd | 恒温槽付水晶発振器 |
US8558629B2 (en) | 2010-12-06 | 2013-10-15 | Nihon Dempa Kogyo Co., Ltd. | Temperature-controlled crystal oscillating unit and crystal oscillator |
CN103107775A (zh) * | 2013-01-17 | 2013-05-15 | 广东大普通信技术有限公司 | 发热器件以及包含其的恒温晶体振荡器 |
CN103117704A (zh) * | 2013-01-17 | 2013-05-22 | 广东大普通信技术有限公司 | 双槽恒温晶体振荡器 |
CN103117704B (zh) * | 2013-01-17 | 2016-02-17 | 广东大普通信技术有限公司 | 双槽恒温晶体振荡器 |
CN103107775B (zh) * | 2013-01-17 | 2016-04-20 | 广东大普通信技术有限公司 | 发热器件以及包含其的恒温晶体振荡器 |
JP2017183907A (ja) * | 2016-03-29 | 2017-10-05 | 株式会社大真空 | 圧電発振器 |
Also Published As
Publication number | Publication date |
---|---|
JP4298580B2 (ja) | 2009-07-22 |
US20050082377A1 (en) | 2005-04-21 |
US7023291B2 (en) | 2006-04-04 |
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