JP2005120464A - 電解加工装置及び電解加工方法 - Google Patents

電解加工装置及び電解加工方法 Download PDF

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Publication number
JP2005120464A
JP2005120464A JP2004248128A JP2004248128A JP2005120464A JP 2005120464 A JP2005120464 A JP 2005120464A JP 2004248128 A JP2004248128 A JP 2004248128A JP 2004248128 A JP2004248128 A JP 2004248128A JP 2005120464 A JP2005120464 A JP 2005120464A
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Japan
Prior art keywords
electrode
eddy current
workpiece
processing
electrolytic
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JP2004248128A
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Japanese (ja)
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JP2005120464A5 (https=
Inventor
Ikutaro Nomichi
郁太郎 野路
Hozumi Yasuda
穂積 安田
Takeshi Iiizumi
健 飯泉
Kazuto Hirokawa
一人 廣川
Itsuki Obata
厳貴 小畠
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Ebara Corp
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Ebara Corp
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Priority to JP2004248128A priority Critical patent/JP2005120464A/ja
Publication of JP2005120464A publication Critical patent/JP2005120464A/ja
Publication of JP2005120464A5 publication Critical patent/JP2005120464A5/ja
Pending legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
JP2004248128A 2003-09-26 2004-08-27 電解加工装置及び電解加工方法 Pending JP2005120464A (ja)

Priority Applications (1)

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JP2004248128A JP2005120464A (ja) 2003-09-26 2004-08-27 電解加工装置及び電解加工方法

Applications Claiming Priority (2)

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JP2003336327 2003-09-26
JP2004248128A JP2005120464A (ja) 2003-09-26 2004-08-27 電解加工装置及び電解加工方法

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JP2005120464A true JP2005120464A (ja) 2005-05-12
JP2005120464A5 JP2005120464A5 (https=) 2007-10-18

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JP2004248128A Pending JP2005120464A (ja) 2003-09-26 2004-08-27 電解加工装置及び電解加工方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023008390A (ja) * 2021-07-06 2023-01-19 東京エレクトロン株式会社 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
WO2003042433A1 (en) * 2001-11-13 2003-05-22 Acm Research, Inc. Electropolishing assembly and methods for electropolishing conductive layers
JP2003175422A (ja) * 2001-12-13 2003-06-24 Ebara Corp 電解加工装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
WO2003042433A1 (en) * 2001-11-13 2003-05-22 Acm Research, Inc. Electropolishing assembly and methods for electropolishing conductive layers
JP2003175422A (ja) * 2001-12-13 2003-06-24 Ebara Corp 電解加工装置及び方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023008390A (ja) * 2021-07-06 2023-01-19 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7696241B2 (ja) 2021-07-06 2025-06-20 東京エレクトロン株式会社 基板処理装置および基板処理方法

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