JP2005062188A - 厚さ測定装置及び厚さ測定方法 - Google Patents

厚さ測定装置及び厚さ測定方法 Download PDF

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Publication number
JP2005062188A
JP2005062188A JP2004235955A JP2004235955A JP2005062188A JP 2005062188 A JP2005062188 A JP 2005062188A JP 2004235955 A JP2004235955 A JP 2004235955A JP 2004235955 A JP2004235955 A JP 2004235955A JP 2005062188 A JP2005062188 A JP 2005062188A
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Japan
Prior art keywords
thickness
film
multilayer film
assumed
spectrum
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JP2004235955A
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English (en)
Japanese (ja)
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JP2005062188A5 (enExample
Inventor
Sun-Jin Kang
善 振 姜
Sokichi Ri
相 吉 李
Kyung-Ho Jung
▲けい▼ ▲こう▼ 鄭
Pilsik Hyun
弼 植 玄
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2005062188A publication Critical patent/JP2005062188A/ja
Publication of JP2005062188A5 publication Critical patent/JP2005062188A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
    • H10P74/00—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004235955A 2003-08-18 2004-08-13 厚さ測定装置及び厚さ測定方法 Pending JP2005062188A (ja)

Applications Claiming Priority (1)

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KR1020030056961A KR100556529B1 (ko) 2003-08-18 2003-08-18 다층 박막의 두께 측정 방법 및 이를 수행하기 위한 장치

Publications (2)

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JP2005062188A true JP2005062188A (ja) 2005-03-10
JP2005062188A5 JP2005062188A5 (enExample) 2005-08-11

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ID=34192117

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JP2004235955A Pending JP2005062188A (ja) 2003-08-18 2004-08-13 厚さ測定装置及び厚さ測定方法

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US (1) US6912056B2 (enExample)
JP (1) JP2005062188A (enExample)
KR (1) KR100556529B1 (enExample)
DE (1) DE102004039861A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013253881A (ja) * 2012-06-07 2013-12-19 Fujitsu Semiconductor Ltd パターン検査方法及びパターン検査装置
US9068819B2 (en) 2012-11-26 2015-06-30 Canon Kabushiki Kaisha Layered object and measuring apparatus and method
KR102205597B1 (ko) * 2019-08-16 2021-01-21 한국표준과학연구원 단일 샷 각도분해 분광 반사광 측정법을 이용한 다층박막 두께 측정장치 및 측정방법
JP2022146515A (ja) * 2021-03-22 2022-10-05 株式会社Ｓｃｒｅｅｎホールディングス 膜厚推定方法、膜厚推定装置およびエッチング方法
JP2023534598A (ja) * 2020-07-22 2023-08-10 アプライド マテリアルズ インコーポレイテッド 基板測定サブシステム

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DE102004055181B3 (de) * 2004-11-16 2006-05-11 X-Fab Semiconductor Foundries Ag Verfahren und Anordnung zur elektrischen Messung der Dicke von Halbleiterschichten
KR100644390B1 (ko) * 2005-07-20 2006-11-10 삼성전자주식회사 박막 두께 측정방법 및 이를 수행하기 위한 장치
KR100769566B1 (ko) 2006-05-24 2007-10-23 중앙대학교 산학협력단 신경망을 이용한 박막 두께 측정 방법, 장치 및 이를 위한기록매체
US7444198B2 (en) * 2006-12-15 2008-10-28 Applied Materials, Inc. Determining physical property of substrate
US20080158572A1 (en) * 2006-12-27 2008-07-03 Honeywell, Inc. System and method for measurement of thickness of thin films
US7952708B2 (en) * 2007-04-02 2011-05-31 Applied Materials, Inc. High throughput measurement system
KR102086362B1 (ko) * 2013-03-08 2020-03-09 삼성전자주식회사 편광화된 빛을 이용하여 공정을 모니터링하는 반도체 제조 설비 및 모니터링 방법
US8860956B2 (en) * 2013-03-15 2014-10-14 International Business Machines Corporation Spectrometry employing extinction coefficient modulation
KR102254033B1 (ko) 2014-06-13 2021-05-20 삼성전자주식회사 광학 측정 방법 및 광학 측정 시스템
KR102214716B1 (ko) * 2014-08-28 2021-02-10 삼성전자주식회사 박막 두께 측정 장치, 이를 포함하는 시스템 및 박막 두께 측정 방법
CN108735854B (zh) * 2017-04-13 2020-11-20 苏州阿特斯阳光能源科技有限公司 光伏组件焊带内反射光学利用率的表征方法
KR102249247B1 (ko) * 2019-10-07 2021-05-07 ㈜넥센서 병렬처리를 이용한 기판내 박막의 두께측정 방법 및 이를 이용한 두께 측정 장치
CN114616455A (zh) 2019-11-28 2022-06-10 Ev 集团 E·索尔纳有限责任公司 用于测量基底的装置和方法
USD977504S1 (en) 2020-07-22 2023-02-07 Applied Materials, Inc. Portion of a display panel with a graphical user interface
US11688616B2 (en) * 2020-07-22 2023-06-27 Applied Materials, Inc. Integrated substrate measurement system to improve manufacturing process performance
KR102531420B1 (ko) 2021-03-25 2023-05-12 한국전자기술연구원 디스플레이 검사 장치 및 디스플레이 검사 방법
US12235624B2 (en) 2021-12-21 2025-02-25 Applied Materials, Inc. Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing
US12339645B2 (en) 2022-01-25 2025-06-24 Applied Materials, Inc. Estimation of chamber component conditions using substrate measurements
US12148647B2 (en) 2022-01-25 2024-11-19 Applied Materials, Inc. Integrated substrate measurement system
US12216455B2 (en) * 2022-01-25 2025-02-04 Applied Materials, Inc. Chamber component condition estimation using substrate measurements
JP7741003B2 (ja) * 2022-01-31 2025-09-17 株式会社ディスコ 測定方法及び測定装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170008A (ja) * 1988-12-23 1990-06-29 Sumitomo Electric Ind Ltd ヘテロ薄膜多層構造の半導体多層薄膜の膜厚測定法
JP2955025B2 (ja) * 1990-12-25 1999-10-04 富士通株式会社 多層膜の膜厚測定方法
FR2692700A1 (fr) * 1992-06-17 1993-12-24 Philips Electronique Lab Dispositif de traitement d'un signal mesure correspondant à l'intensité de rayons X réfléchie par une structure de couches multiples sur un substrat.
US5604581A (en) * 1994-10-07 1997-02-18 On-Line Technologies, Inc. Film thickness and free carrier concentration analysis method and apparatus
US5784167A (en) * 1996-12-03 1998-07-21 United Microelectronics Corp. Method of measuring thickness of a multi-layers film
US6489624B1 (en) * 1997-07-18 2002-12-03 Nikon Corporation Apparatus and methods for detecting thickness of a patterned layer
KR100301067B1 (ko) * 1999-08-23 2001-11-01 윤종용 마이크로 스크래치 검사방법 및 이를 적용한 장치
KR100366613B1 (ko) * 1999-10-06 2003-01-06 삼성전자 주식회사 박막두께 측정방법 및 이를 적용한 장치

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013253881A (ja) * 2012-06-07 2013-12-19 Fujitsu Semiconductor Ltd パターン検査方法及びパターン検査装置
US9068819B2 (en) 2012-11-26 2015-06-30 Canon Kabushiki Kaisha Layered object and measuring apparatus and method
KR102205597B1 (ko) * 2019-08-16 2021-01-21 한국표준과학연구원 단일 샷 각도분해 분광 반사광 측정법을 이용한 다층박막 두께 측정장치 및 측정방법
US11243070B2 (en) 2019-08-16 2022-02-08 Korea Research Institute Of Standards And Science Apparatus and method for multilayer thin film thickness measurement using single-shot angle-resolved spectral reflectometry
JP2023534598A (ja) * 2020-07-22 2023-08-10 アプライド マテリアルズ インコーポレイテッド 基板測定サブシステム
JP7598950B2 (ja) 2020-07-22 2024-12-12 アプライド マテリアルズ インコーポレイテッド 基板測定サブシステム
JP2022146515A (ja) * 2021-03-22 2022-10-05 株式会社Ｓｃｒｅｅｎホールディングス 膜厚推定方法、膜厚推定装置およびエッチング方法
JP7623174B2 (ja) 2021-03-22 2025-01-28 株式会社Ｓｃｒｅｅｎホールディングス 膜厚推定方法、膜厚推定装置およびエッチング方法

Also Published As

Publication number Publication date
DE102004039861A1 (de) 2005-03-17
US20050041255A1 (en) 2005-02-24
KR20050019303A (ko) 2005-03-03
US6912056B2 (en) 2005-06-28
KR100556529B1 (ko) 2006-03-06

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