JP2005039250A - レーザ照射装置、レーザ照射方法、及び半導体装置の作製方法 - Google Patents

レーザ照射装置、レーザ照射方法、及び半導体装置の作製方法 Download PDF

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JP2005039250A
JP2005039250A JP2004188123A JP2004188123A JP2005039250A JP 2005039250 A JP2005039250 A JP 2005039250A JP 2004188123 A JP2004188123 A JP 2004188123A JP 2004188123 A JP2004188123 A JP 2004188123A JP 2005039250 A JP2005039250 A JP 2005039250A
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laser
fundamental wave
laser beam
resonator
wave
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JP2005039250A5 (https=
Inventor
Akihisa Shimomura
明久 下村
Hironobu Shoji
博信 小路
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2004188123A priority Critical patent/JP2005039250A/ja
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Publication of JP2005039250A5 publication Critical patent/JP2005039250A5/ja
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  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
JP2004188123A 2003-06-26 2004-06-25 レーザ照射装置、レーザ照射方法、及び半導体装置の作製方法 Withdrawn JP2005039250A (ja)

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JP2004188123A JP2005039250A (ja) 2003-06-26 2004-06-25 レーザ照射装置、レーザ照射方法、及び半導体装置の作製方法

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JP2003182650 2003-06-26
JP2004188123A JP2005039250A (ja) 2003-06-26 2004-06-25 レーザ照射装置、レーザ照射方法、及び半導体装置の作製方法

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JP2005039250A true JP2005039250A (ja) 2005-02-10
JP2005039250A5 JP2005039250A5 (https=) 2007-07-12

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008109753A (ja) * 2006-10-24 2008-05-08 Tdk Corp 被覆剥離方法
JP2009272396A (ja) * 2008-05-02 2009-11-19 Japan Atomic Energy Agency 固体レーザー装置
WO2019138990A1 (ja) * 2018-01-09 2019-07-18 日本電気硝子株式会社 ガラス物品の製造方法及び製造装置並びにガラス物品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629323A (en) * 1979-08-17 1981-03-24 Nec Corp Two-wavelength laser surface treating apparatus
JPH05104276A (ja) * 1991-10-16 1993-04-27 Toshiba Corp レーザ加工装置およびレーザによる加工方法
JP2000012484A (ja) * 1998-06-25 2000-01-14 Mitsubishi Electric Corp レーザアニール装置
JP2003347237A (ja) * 2002-05-30 2003-12-05 Mitsubishi Electric Corp 半導体装置の製造方法およびその製造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629323A (en) * 1979-08-17 1981-03-24 Nec Corp Two-wavelength laser surface treating apparatus
JPH05104276A (ja) * 1991-10-16 1993-04-27 Toshiba Corp レーザ加工装置およびレーザによる加工方法
JP2000012484A (ja) * 1998-06-25 2000-01-14 Mitsubishi Electric Corp レーザアニール装置
JP2003347237A (ja) * 2002-05-30 2003-12-05 Mitsubishi Electric Corp 半導体装置の製造方法およびその製造装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008109753A (ja) * 2006-10-24 2008-05-08 Tdk Corp 被覆剥離方法
JP2009272396A (ja) * 2008-05-02 2009-11-19 Japan Atomic Energy Agency 固体レーザー装置
WO2019138990A1 (ja) * 2018-01-09 2019-07-18 日本電気硝子株式会社 ガラス物品の製造方法及び製造装置並びにガラス物品

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