JP2005039024A - Circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the size of an entire circuit module as compared with the case where an upper layer is supported directly by a substrate while suppressing a decrease in reliability of components and a connecting part in association with embedding of the component disposed on the substrate and the connecting part of the component to the substrate in resin. <P>SOLUTION: The circuit module includes a plurality of components 2, 3a, and 3b disposed on the substrate 1, an upper layer 4 supported by at least part 2 of these components, and a space 5 provided between the substrate 1 and the upper layer 4. Desirably, the connecting part 6 of the substrate 1 to the components 2, 3a and 3b is disposed in the space 5, and the part of the component 2 is embedded in the upper layer 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a circuit module in which a plurality of components are arranged on a board and an upper layer that can be used for mounting machine adsorption is supported by at least one of the plurality of parts, and in particular, arranged on the board. The upper layer is directly supported by the substrate while suppressing the reliability of the component and the bonded portion from being lowered as the bonded component and the bonded portion of the component and the substrate are embedded in the resin. The present invention relates to a circuit module capable of reducing the size of the entire circuit module as compared with the case of the above. Specifically, the circuit module of the present invention can be applied to an electronic device such as a mobile phone.

  Conventionally, there has been known a circuit module in which a plurality of circuit components are arranged on a circuit board, and an upper plate that can be used as a mounting machine adsorption region by at least one of the plurality of circuit components is supported. Yes. As an example of this type of circuit module, for example, there is a circuit module described in JP-A-11-26651.

  FIG. 18 is a cross-sectional view of a conventional circuit module described in Japanese Patent Application Laid-Open No. 11-26651. In FIG. 18, 201 is a circuit board, 202 is a circuit component arranged on the circuit board 201, 203 is an IC chip arranged on the circuit board 201, and 204 is an upper plate. The upper plate 204 is disposed on the circuit component 202 having the highest height among the plurality of components disposed on the circuit board 201. Reference numeral 207 denotes an electrode, and reference numeral 210 denotes a resin filled between the circuit board 201 and the upper plate 204.

  As shown in FIG. 18, in the conventional circuit module described in Japanese Patent Application Laid-Open No. 11-26651, the lower surface of the upper plate 204 is brought into contact with the upper surface of the circuit component 202, and the lower surface of the upper plate 204 and the circuit board 201 are contacted. The resin 210 is filled between the upper surfaces of the two layers. Thereby, the whole circuit module is joined, and the circuit component 202 and the IC chip 203 embedded in the resin 210 are protected by the resin 210.

  However, in the conventional circuit module described in Japanese Patent Application Laid-Open No. 11-26651, the circuit component 202 and the IC chip 203 arranged on the circuit board 201 and the joint portion between them and the circuit board 201 are in the resin 210. Since it is embedded, the reliability of the circuit component 202 and the IC chip 203 and the joint portion between them and the circuit board 201 may be reduced by heat when the circuit module is reflowed.

  Specifically, there is a possibility that the joint between the circuit component 202 and the IC chip 203 and the circuit board 201 is peeled off by heat when the circuit module is reflowed. Further, if a space that is cut off from the outside remains around the solder joint portion, the solder moves in the space, which may cause a short circuit.

  Further, when the resin 201 is filled and the circuit module is reflowed as in the conventional circuit module described in Japanese Patent Laid-Open No. 11-26651, the thermal fluctuation factor of the resin 210 (for example, The volume, linear expansion coefficient, bubble mixing, etc.), the thermal fluctuation factors of the circuit component 202 and the IC chip 203, and the thermal fluctuation factors of the solder must be taken into consideration, and the design of the circuit module becomes complicated.

  In addition, if an attempt is made to completely fill the resin 210 and form a flat upper surface for adsorbing the mounting machine, a mold for filling and molding the resin 210 is required, which increases costs.

  Conventionally, a circuit module as shown in FIG. 19 is known. FIG. 19 is a cross-sectional view of another conventional circuit module. In FIG. 19, 211 is a substrate, 213a, 213b, and 213c are components arranged on the substrate 211, 214 is a metal cover, and 217 is an electrode.

  In the conventional circuit module shown in FIG. 19, a metal cover 214 that can be used for mounting machine suction is directly supported by a substrate 211. Therefore, the dimension in the width direction and the dimension in the depth direction are larger than the circuit module shown in FIG. 18 by the outer edge portion of the metal cover 214 bonded to the substrate 211. In the conventional circuit module shown in FIG. 19, a gap for absorbing the dimensional tolerance of the metal cover 214 and the dimensional tolerance of the component 213a is provided between the lower surface of the metal cover and the upper surface of the component 213a. . Therefore, the height direction dimension becomes larger than the circuit module shown in FIG. 18 in which the lower surface of the upper plate 204 and the upper surface of the circuit component 202 are brought into contact with each other by the gap.

  That is, as shown in FIG. 19, in the conventional circuit module in which the metal cover 214 is directly supported by the substrate 211, the entire circuit module becomes large.

JP-A-11-26651

  In view of the above problems, according to the present invention, the reliability of a component and a bonding portion is lowered as the component arranged on the substrate and the bonding portion between the component and the substrate are embedded in the resin. An object of the present invention is to provide a circuit module capable of reducing the size of the entire circuit module as compared with a case where an upper layer having a sufficient area and flatness for adsorbing a mounting machine is directly supported by a substrate. And

  According to the first aspect of the present invention, in a circuit module in which a plurality of components are arranged on a substrate and a flat upper layer having a predetermined area is supported by at least one component of the plurality of components, A circuit module is provided in which a space communicating with the outside is provided between the upper layer and the upper layer.

  According to a second aspect of the present invention, there is provided the circuit module according to the first aspect, wherein joint portions between the substrate and the plurality of components are arranged in the space.

  According to a third aspect of the present invention, there is provided the circuit module according to the first or second aspect, wherein a part of the one component is embedded in the upper layer.

  According to a fourth aspect of the present invention, the upper layer is supported by the one component such that the lower surface of the upper layer is located below the upper surface of the one component. Item 4. A circuit module according to any one of Items 1 to 3 is provided.

  According to a fifth aspect of the present invention, the upper layer is supported by the one component such that the upper surface of the upper layer and the upper surface of the one component are located in the same plane. A circuit module according to any one of claims 1 to 4 is provided.

  According to the invention of claim 6, a through-hole electrode is formed on an end surface of the substrate, and the through-hole electrode and the space are arranged so that the through-hole electrode and the space are in contact with each other. A circuit module according to any one of claims 1 to 5 is provided.

  In the circuit module according to the first aspect, a space is provided between the substrate and the upper layer supported by the components arranged on the substrate so as to communicate with the outside. Specifically, the components arranged on the substrate are not embedded in the resin, but are arranged in the space. For this reason, it is possible to prevent the reliability of the component from being lowered as the component arranged on the substrate is embedded in the resin. Furthermore, the upper layer is supported by components placed on the substrate. Therefore, the entire circuit module can be made smaller than when the upper layer is directly supported by the substrate. In other words, the circuit module is more than the case where the upper layer is directly supported by the board while suppressing the reliability of the parts from being lowered as the parts placed on the board are embedded in the resin. The whole can be reduced in size. This upper layer enables the mounting machine to suck the circuit module.

  In the circuit module according to the second aspect, the joint portion between the substrate and the plurality of components disposed on the substrate is disposed in the space. Therefore, it is possible to suppress the reliability of the joint portion from being lowered as the joint portion between the component disposed on the substrate and the substrate is embedded in the resin.

  In the circuit module according to claims 3 and 4, a part of the component that supports the upper layer is embedded in the upper layer. Specifically, the lower surface of the upper layer is disposed below the upper surface of the component that supports the upper layer. Therefore, the height dimension of the entire circuit module can be made smaller than when the upper surface of the component supporting the upper layer is in contact with the lower surface of the upper layer. In other words, in the present invention, the upper layer may not be the uppermost surface and may be positioned lower than the support portion as long as a sufficient area and flatness can be secured as the adsorption surface.

  In the circuit module according to the fifth aspect, the upper surface of the upper layer and the upper surface of the component supporting the upper layer are arranged in the same plane. Therefore, the height dimension of the entire circuit module can be made smaller than when the upper surface of the upper layer is disposed above the upper surface of the component supporting the upper layer, and the top surface of the circuit module Is uniform, so that the entire surface can be used as an adsorption region.

  In the circuit module according to the sixth aspect, the through-hole electrode and the space are arranged so that the through-hole electrode and the space are in contact with each other. For this reason, it is possible to avoid the resin from entering the through-hole electrode as the through-hole electrode is arranged so that the through-hole electrode and the resin are in contact with each other, and the through-hole electrode not functioning. it can. As a result, it is possible to form an end face through-hole electrode that has been difficult to put into practical use with a conventional mold, and as a result, it is possible to provide a circuit module that allows easy visual inspection of the joined state.

  FIG. 1 is a sectional view showing a first embodiment of the circuit module of the present invention, and FIG. 2 is a bottom view of the circuit module shown in FIG. 1 and 2, reference numeral 1 denotes a substrate, 1a denotes an upper surface of the substrate 1, 1b denotes a lower surface of the substrate 1, 2, 3a and 3b denote components arranged on the substrate 1, and 2a denotes an upper surface of the component 2. Reference numeral 4 denotes an upper layer disposed above the substrate 1 and the components 3a and 3b. The upper layer 4 is supported by the component 2 having the highest height among the plurality of components 2, 3 a, 3 b arranged on the substrate 1. 4 a is the upper surface of the upper layer 4, and 4 b is the lower surface of the upper layer 4. Reference numeral 5 denotes a space provided between the upper surface 1a of the substrate 1 and the lower surface 4b of the upper layer 4, 6 denotes a joint portion between the substrate 1 and the components 2, 3a, 3b, and 7 denotes an electrode.

  As shown in FIG. 1, in the circuit module of the first embodiment, a space 5 is provided between a substrate 1 and an upper layer 4 supported by a component 2 disposed on the substrate 1. More specifically, the components 3a and 3b arranged on the substrate 1 are not embedded in the resin 210 as in the conventional circuit module shown in FIG. Therefore, as the circuit component 202 arranged on the circuit board 201 is embedded in the resin 210 as in the conventional circuit module shown in FIG. 18, the reliability of the circuit component 202 is lowered. Can be suppressed. Furthermore, in the circuit module of the first embodiment, the upper layer 4 is supported by the component 2 arranged on the substrate 1. Therefore, the entire circuit module can be reduced in size as compared with the case where the metal cover (upper layer) 214 is directly supported by the substrate 211 as in the conventional circuit module shown in FIG. Specifically, the width direction dimension and the depth direction dimension of the entire circuit module can be reduced.

  In the circuit module according to the first embodiment, the joint portion 6 between the substrate 1 and the components 2, 3 a and 3 b disposed on the substrate 1 is disposed in the space 5. Therefore, as the joint portion between the circuit component 202 arranged on the circuit board 201 and the circuit board 201 is embedded in the resin 210 as in the conventional circuit module shown in FIG. It can suppress that reliability falls.

  Furthermore, in the circuit module of the first embodiment, a part of the component 2 that supports the upper layer 4 is embedded in the upper layer 4. Specifically, the lower surface 4b of the upper layer 4 is disposed below the upper surface 2a of the component 2 that supports the upper layer 4. Therefore, as in the conventional circuit module shown in FIG. 18, the upper surface of the circuit component 202 that supports the upper plate (upper layer) 204 is in contact with the lower surface of the upper plate (upper layer) 204. In addition, the overall height dimension of the circuit module can be reduced.

  Furthermore, in the circuit module of the first embodiment, the upper surface 4a of the upper layer 4 and the upper surface 2a of the component 2 that supports the upper layer 4 are disposed in the same plane. Therefore, as in the conventional circuit module shown in FIG. 18, the upper surface of the upper plate (upper layer) 204 is disposed above the upper surface of the circuit component 202 that supports the upper plate (upper layer) 204. In addition, the overall dimension of the circuit module in the height direction can be reduced, and the entire surface can be used as a suction surface.

  The upper surface 4a of the upper layer 4 of the circuit module of the first embodiment shown in FIG. 1 is adsorbed by, for example, a mounter (not shown) provided with a chucking mechanism using vacuum depressurization. The circuit module is automatically mounted.

  3 and 4 are diagrams for explaining a method of manufacturing the circuit module shown in FIG. As shown in FIG. 3A, in the first step, for example, the circuit shown in FIG. 1 and FIG. 2 is formed on the substrate 1 ″ having the size of four circuit modules shown in FIG. 1 and FIG. A unit in which the components 2, 3a, 3b for four modules are arranged is prepared upside down, and the liquid resin or sheet film resin that constitutes the upper layer 4 shown in FIG. Prepared under the unit.

  Next, as shown in FIG. 3B, in the second step, a part of the unit is embedded in the liquid resin or sheet film resin, and the liquid resin or sheet film resin is heated and cured. At this time, a space is interposed between the liquid resin or sheet film resin and the components 3a and 3b. That is, when the liquid resin or the sheet film-like resin is cured by heating, the joint portion between the substrate 1 and the components 2, 3a, 3b is disposed in the space.

  Next, as shown in FIG. 4C, in the third step, the unit and the liquid resin or sheet film resin (upper layer) integrated are taken out from the mold. Next, as shown in FIG. 4D, in the fourth step, the integrated unit and the liquid resin or sheet film resin (upper layer) are divided into four parts, and the circuit module shown in FIG. Complete.

  FIG. 5 is a sectional view showing a modification of the first embodiment of the circuit module of the present invention, and FIG. 6 is a bottom view of the circuit module shown in FIG. 5 and 6, the same reference numerals as those shown in FIGS. 1 to 4 denote the same parts or portions as the parts or parts shown in FIGS. The substrate of the circuit module according to the modification of the first embodiment, 1a ′ is the upper surface of the substrate 1 ′, and 1b ′ is the lower surface of the substrate 1 ′. Reference numeral 7 'denotes a through-hole electrode formed on the end face of the substrate 1', specifically a half-through-hole electrode.

  In the circuit module according to the modification of the first embodiment, as shown in FIGS. 5 and 6, the through-hole electrode 7 ′ and the space 5 are arranged so that the through-hole electrode 7 ′ and the space 5 are in contact with each other. ing. Therefore, as in the conventional circuit module shown in FIG. 18, the resin enters the through-hole electrode 207 as the through-hole electrode 207 is arranged so that the through-hole electrode 207 and the resin 210 are in contact with each other. Therefore, it can be avoided that the through-hole electrode 207 does not function. Also, since the through-hole electrode 7 ′ is formed on the end surface of the substrate 1 ′, unlike the circuit module of the first embodiment in which the electrode 7 is not formed on the end surface of the substrate 1, soldering is performed after the module circuit is mounted. Bondability can be visually confirmed. Others are the same as in the first embodiment.

  Hereinafter, a second embodiment of the circuit module of the present invention will be described. FIG. 7 is a cross-sectional view showing a second embodiment of the circuit module of the present invention.

  As shown in FIG. 7, in the circuit module of the second embodiment, a space 15 is provided between the substrate 1 and the upper layer 14 supported by the component 12 arranged on the substrate 1. The difference from the first embodiment is that the upper layer is installed on the flip chip type semiconductor (component 12), and the present invention is applicable even if it is not the tallest component. There are other effects similar to those of the first embodiment.

  Hereinafter, a third embodiment of the circuit module of the present invention will be described. FIG. 8 is a sectional view showing a third embodiment of the circuit module of the present invention. Thus, the upper layer 24 is supported by the component 2 having the highest height among the plurality of components 2, 3 a, 3 b arranged on the substrate 1. Reference numeral 24 a denotes an upper surface of the upper layer 24 and reference numeral 24 b denotes a lower surface of the upper layer 24.

  In the circuit module of the third embodiment, a part of the component 2 that supports the upper layer 24 is embedded in the upper layer 24 by about half. Therefore, as in the conventional circuit module shown in FIG. 18, the upper surface of the circuit component 202 that supports the upper plate (upper layer) 204 is in contact with the lower surface of the upper plate (upper layer) 204. In addition, the overall height dimension of the circuit module can be reduced. Others are the same as in the first embodiment.

  Hereinafter, a fourth embodiment of the circuit module of the present invention will be described. FIG. 9 is a sectional view showing a circuit module according to a fourth embodiment of the present invention. As described above, the upper layer 34 is supported by all the components 2, 3 a and 3 b arranged on the substrate 1. 34 a is an upper surface of the upper layer 34, and 34 b is a lower surface of the upper layer 34.

  In the circuit module according to the fourth embodiment, the top of the component 2 that supports the upper layer 34 is embedded so as to penetrate the upper layer 34. Even with such a structure, it is possible to secure the suction surface.

  Hereinafter, a fifth embodiment of the circuit module of the present invention will be described. FIG. 10 is a sectional view showing a fifth embodiment of the circuit module of the present invention. The upper layer may be supported by using a component arranged in the center in this way. Others are the same as in the first embodiment.

  Hereinafter, a sixth embodiment of the circuit module of the present invention will be described. FIG. 11 is a cross-sectional view showing a sixth embodiment of the circuit module of the present invention. In this way, the upper layer may be supported by two tall parts 52.

  Hereinafter, a seventh embodiment of the circuit module of the present invention will be described. FIG. 12 is a cross-sectional view showing a seventh embodiment of the circuit module of the present invention. Thus, the upper layer may be supported using both the IC 63a and the component 2.

  The eighth embodiment of the circuit module of the present invention will be described below. FIG. 13 is a sectional view showing an eighth embodiment of the circuit module of the present invention. As described above, the upper layer may be supported by using a wire bonding IC mold.

  The ninth embodiment of the circuit module of the present invention will be described below. FIG. 14 is a sectional view showing a ninth embodiment of the circuit module of the present invention. As described above, the upper layer 84 is supported by the component 2 having the highest height among the plurality of components 2, 3 a and 3 b disposed on the substrate 1 and the pins 88 disposed on the substrate 1. It is good also as a structure.

  The tenth embodiment of the circuit module of the present invention will be described below. FIG. 15 is a sectional view showing a tenth embodiment of the circuit module of the present invention. As described above, the upper layer 94 is supported by the component 2 having the highest height among the plurality of components 2, 3 a, 3 b disposed on the substrate 1 and the pins 98 disposed on the component 3 a. It is good also as a structure.

  The eleventh embodiment of the circuit module of the present invention will be described below. FIG. 16 is a sectional view showing an eleventh embodiment of the circuit module of the present invention. Thus, the upper layer 104 is supported by the component 2 having the highest height among the plurality of components 2, 102, 3 b disposed on the substrate 1 and the resin layer 109 disposed on the component 102. It is good also as a structure.

  The twelfth embodiment of the circuit module of the present invention will be described below. FIG. 17 is a sectional view showing a twelfth embodiment of the circuit module of the present invention. As described above, the upper layer 114 is supported by the component 2 having the highest height among the plurality of components 2, 112, and 3 b disposed on the substrate 1 and the stress relaxation layer 119 disposed on the component 112. It is good also as a structure.

  In the present invention, the circuit modules of the first to twelfth embodiments and their modifications can be appropriately combined.

It is sectional drawing which showed 1st Embodiment of the circuit module of this invention. It is a bottom view of the circuit module shown in FIG. It is a figure for demonstrating the manufacturing method of the circuit module shown in FIG. It is a figure for demonstrating the manufacturing method of the circuit module shown in FIG. It is sectional drawing which showed the modification of 1st Embodiment of the circuit module of this invention. FIG. 6 is a bottom view of the circuit module shown in FIG. 5. It is sectional drawing which showed 2nd Embodiment of the circuit module of this invention. It is sectional drawing which showed 3rd Embodiment of the circuit module of this invention. It is sectional drawing which showed 4th Embodiment of the circuit module of this invention. It is sectional drawing which showed 5th Embodiment of the circuit module of this invention. It is sectional drawing which showed 6th Embodiment of the circuit module of this invention. It is sectional drawing which showed 7th Embodiment of the circuit module of this invention. It is sectional drawing which showed 8th Embodiment of the circuit module of this invention. It is sectional drawing which showed 9th Embodiment of the circuit module of this invention. It is sectional drawing which showed 10th Embodiment of the circuit module of this invention. It is sectional drawing which showed 11th Embodiment of the circuit module of this invention. It is sectional drawing which showed 12th Embodiment of the circuit module of this invention. It is sectional drawing of the conventional circuit module described in Unexamined-Japanese-Patent No. 11-26651. It is sectional drawing of another conventional circuit module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Components 3a, 3b Components 4 Upper layer 5 Space 6 Joint part 7 Electrode

Claims (6)

  In a circuit module in which a plurality of components are arranged on a substrate and a flat upper layer having a predetermined area is supported by at least one of the plurality of components, the circuit module communicates with the outside between the substrate and the upper layer. A circuit module characterized by providing a space.   The circuit module according to claim 1, wherein joint portions between the substrate and the plurality of components are arranged in the space.   3. The circuit module according to claim 1, wherein a part of the one component is embedded in the upper layer.   The said upper layer was supported by the said one component so that the lower surface of the said upper layer may be located below the upper surface of the said one component, The Claim 1 characterized by the above-mentioned. Circuit module.   5. The upper layer is supported by the one component so that the upper surface of the upper layer and the upper surface of the one component are located in the same plane. The circuit module as described.   The through-hole electrode is formed in the end surface of the said board | substrate, The said through-hole electrode and the said space are arrange | positioned so that the said through-hole electrode and the said space may contact | connect. The circuit module described in 1.

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