JP2005015506A5 - - Google Patents

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Publication number
JP2005015506A5
JP2005015506A5 JP2003177805A JP2003177805A JP2005015506A5 JP 2005015506 A5 JP2005015506 A5 JP 2005015506A5 JP 2003177805 A JP2003177805 A JP 2003177805A JP 2003177805 A JP2003177805 A JP 2003177805A JP 2005015506 A5 JP2005015506 A5 JP 2005015506A5
Authority
JP
Japan
Prior art keywords
semiconductor device
adhesive composition
adhesive
phenoxy resin
polyimide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003177805A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005015506A (ja
JP4411876B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2003177805A external-priority patent/JP4411876B2/ja
Priority to JP2003177805A priority Critical patent/JP4411876B2/ja
Priority to TW093117922A priority patent/TW200516126A/zh
Priority to KR1020057024595A priority patent/KR20060018273A/ko
Priority to EP04746707A priority patent/EP1640428A4/en
Priority to US10/562,068 priority patent/US20080131639A1/en
Priority to PCT/JP2004/009238 priority patent/WO2004113466A1/ja
Priority to CN200480023640.9A priority patent/CN1836021A/zh
Publication of JP2005015506A publication Critical patent/JP2005015506A/ja
Publication of JP2005015506A5 publication Critical patent/JP2005015506A5/ja
Publication of JP4411876B2 publication Critical patent/JP4411876B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003177805A 2003-06-23 2003-06-23 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム Expired - Fee Related JP4411876B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003177805A JP4411876B2 (ja) 2003-06-23 2003-06-23 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム
TW093117922A TW200516126A (en) 2003-06-23 2004-06-21 Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
US10/562,068 US20080131639A1 (en) 2003-06-23 2004-06-23 Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same
EP04746707A EP1640428A4 (en) 2003-06-23 2004-06-23 ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE, AND APPLICATION FILM FOR COATING, ADHESIVE SHEET, AND COPPER-COATED POLYIMIDE FILM USING THE SAME
KR1020057024595A KR20060018273A (ko) 2003-06-23 2004-06-23 반도체 장치용 접착제 조성물 및 그것을 이용한 커버 레이필름, 접착제 시트, 동박 폴리이미드 필름
PCT/JP2004/009238 WO2004113466A1 (ja) 2003-06-23 2004-06-23 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
CN200480023640.9A CN1836021A (zh) 2003-06-23 2004-06-23 半导体装置用粘结剂组合物及使用它的覆盖层薄膜、粘结剂片材、覆铜聚酰亚胺膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003177805A JP4411876B2 (ja) 2003-06-23 2003-06-23 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム

Publications (3)

Publication Number Publication Date
JP2005015506A JP2005015506A (ja) 2005-01-20
JP2005015506A5 true JP2005015506A5 (https=) 2006-06-29
JP4411876B2 JP4411876B2 (ja) 2010-02-10

Family

ID=34179620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003177805A Expired - Fee Related JP4411876B2 (ja) 2003-06-23 2003-06-23 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム

Country Status (2)

Country Link
JP (1) JP4411876B2 (https=)
CN (1) CN1836021A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102447168A (zh) * 2006-11-10 2012-05-09 日立化成工业株式会社 粘接膜、以及电路部件的连接结构和连接方法
KR100844383B1 (ko) * 2007-03-13 2008-07-07 도레이새한 주식회사 반도체 칩 적층용 접착 필름
DE602007008593D1 (de) * 2007-12-12 2010-09-30 Atotech Deutschland Gmbh Festpulverformulierungen für die Zubereitung von harzbeschichteten Folien und ihre Verwendung bei der Herstellung von Leiterplatten
JP5123341B2 (ja) * 2010-03-15 2013-01-23 信越化学工業株式会社 接着剤組成物、半導体ウエハ保護膜形成用シート
CN102965040B (zh) * 2011-09-01 2014-12-03 东丽先端素材株式会社 用于制造电子部件的胶粘带
CN103167738B (zh) * 2011-12-15 2015-07-22 北大方正集团有限公司 一种金属图形的制作方法以及金属图形半成品板
CN105295000A (zh) * 2015-11-14 2016-02-03 华玉叶 一种高粘度固化剂组合物
CN105733485B (zh) * 2016-04-28 2018-06-05 陕西生益科技有限公司 一种树脂组合物及其应用
WO2021106847A1 (ja) * 2019-11-28 2021-06-03 東洋紡株式会社 接着フィルム、積層体およびプリント配線板
JP7807034B2 (ja) * 2021-06-18 2026-01-27 合肥漢之和新材料科技有限公司 接着剤、接着シート及びフレキシブル銅張積層板
EP4394861A4 (en) * 2021-08-23 2025-07-16 Furukawa Electric Co Ltd FILM-TYPE ADHESIVE AGENT AND ELECTRONIC COMPONENT USING SAME AND PRODUCTION METHOD THEREOF

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