JP2004538146A5 - - Google Patents

Download PDF

Info

Publication number
JP2004538146A5
JP2004538146A5 JP2003510472A JP2003510472A JP2004538146A5 JP 2004538146 A5 JP2004538146 A5 JP 2004538146A5 JP 2003510472 A JP2003510472 A JP 2003510472A JP 2003510472 A JP2003510472 A JP 2003510472A JP 2004538146 A5 JP2004538146 A5 JP 2004538146A5
Authority
JP
Japan
Prior art keywords
plate
separator
steel
multilayer
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003510472A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004538146A (ja
JP4064344B2 (ja
Filing date
Publication date
Priority claimed from DE10131887A external-priority patent/DE10131887A1/de
Application filed filed Critical
Publication of JP2004538146A publication Critical patent/JP2004538146A/ja
Publication of JP2004538146A5 publication Critical patent/JP2004538146A5/ja
Application granted granted Critical
Publication of JP4064344B2 publication Critical patent/JP4064344B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2003510472A 2001-07-04 2002-07-03 分離板又は多層プレスセットのための分離板の製造方法 Expired - Lifetime JP4064344B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10131887A DE10131887A1 (de) 2001-07-04 2001-07-04 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket
PCT/DE2002/002418 WO2003004717A2 (de) 2001-07-04 2002-07-03 Trennblech bzw. verfahren zur herstellung eines trennbleches für ein multilayerpresspaket

Publications (3)

Publication Number Publication Date
JP2004538146A JP2004538146A (ja) 2004-12-24
JP2004538146A5 true JP2004538146A5 (OSRAM) 2007-10-18
JP4064344B2 JP4064344B2 (ja) 2008-03-19

Family

ID=7690248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003510472A Expired - Lifetime JP4064344B2 (ja) 2001-07-04 2002-07-03 分離板又は多層プレスセットのための分離板の製造方法

Country Status (8)

Country Link
US (1) US6986950B2 (OSRAM)
EP (1) EP1401636B1 (OSRAM)
JP (1) JP4064344B2 (OSRAM)
KR (1) KR100601539B1 (OSRAM)
CN (1) CN100361809C (OSRAM)
AU (1) AU2002354732A1 (OSRAM)
DE (3) DE10131887A1 (OSRAM)
WO (1) WO2003004717A2 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005034499B4 (de) 2005-07-20 2011-03-31 Wickeder Westfalenstahl Gmbh Presspaketaufbau zum Verpressen von Multilayern bzw. Presse zur Verpressung bzw. Herstellung von Multilayern
DE102007054171A1 (de) * 2007-02-28 2008-09-04 Backhaus, Monika Press- und Heizsystem zum Verpressen eines Multilayerpresspaketes
JP4383493B2 (ja) * 2007-08-17 2009-12-16 新日本製鐵株式会社 780MPa以上のTSを持つハイテン出荷鋼板の材質情報提供方法及び材質情報利用方法
RU2524892C2 (ru) * 2012-11-22 2014-08-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Способ изготовления деталей машин с получением субмикро- и наноструктурированного состояния диффузионного приповерхностного слоя при азотировании
CN103118494B (zh) * 2013-01-29 2015-09-16 苏州市嘉明机械制造有限公司 用于线路板压合制程电压机压合的镜板
CN104202927A (zh) * 2014-09-12 2014-12-10 高德(无锡)电子有限公司 一种软硬结合半成品印刷线路板的生产工艺
CN104955279B (zh) * 2015-05-22 2017-12-29 苏州市嘉明机械制造有限公司 一种高强度防凹陷镜板的生产工艺
CN105517334A (zh) * 2015-12-10 2016-04-20 苏州市嘉明机械制造有限公司 一种基于含浸工艺的高强度绝缘镜板的生产工艺
KR102660937B1 (ko) * 2016-09-29 2024-04-26 다이니폰 인사츠 가부시키가이샤 증착 마스크 곤포체 및 증착 마스크 곤포 방법
DE102017102940B4 (de) * 2017-02-14 2026-01-22 Bundesdruckerei Gmbh Vorrichtung zum Laminieren von mehreren in einem Stapel angeordneten Schichten zu einem Laminatverbund
CN111278221A (zh) * 2020-02-21 2020-06-12 盐城维信电子有限公司 一种快压隔板及多层快压方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3507568C2 (de) * 1985-03-04 1987-01-08 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zum Verpressen von Prepregs in einer Etagenpresse mit einer Rutschsicherung
DE3844498A1 (de) * 1988-12-30 1990-07-05 Klaus Schneider Vorrichtung zum verpressen von multilayerpaketen
JP2556897B2 (ja) * 1989-02-23 1996-11-27 ファナック株式会社 多層プリント配線板の外層材及び製造方法
DE4116543C2 (de) * 1991-05-21 1995-07-27 Siemens Nixdorf Inf Syst Verfahren zum Verpressen von mehrlagigen Leiterplatten
DE29719716U1 (de) * 1997-11-06 1997-12-11 Carl Aug. Picard GmbH & Co. KG, 42857 Remscheid Trennblech
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
DE19831461C1 (de) * 1998-07-14 2000-02-24 Dieter Backhaus Verfahren zur partiellen Verbindung von Kupferfolien und Trennblechen (CuAI-Verfahren)
DE69833783T2 (de) * 1998-11-04 2007-01-18 Nikko Materials Usa Inc., Chandler Komponente einer platine

Similar Documents

Publication Publication Date Title
US9500418B2 (en) Graphite composite film
JP7799793B2 (ja) キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板
JP4064344B2 (ja) 分離板又は多層プレスセットのための分離板の製造方法
TWI621381B (zh) Laminated body with metal foil with carrier
JP6678029B2 (ja) 回路形成層付支持基板、両面回路形成層付支持基板、多層積層板、多層プリント配線板の製造方法及び多層プリント配線板
US4269549A (en) Method for drilling circuit boards
WO2002007487A1 (en) Production method for copper-clad laminated sheet
KR100578511B1 (ko) 접합강도와 내식성이 우수한 내환경성 클래드 판재 및 그제조방법
TWI588273B (zh) Copper alloy foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board and electronic equipment
KR20150123184A (ko) 캐리어가 형성된 동박, 프린트 배선판, 적층체, 전자 기기 및 프린트 배선판의 제조 방법
KR102021175B1 (ko) 동박, 구리 피복 적층판, 그리고 플렉시블 프린트 기판 및 전자 기기
US20150190982A1 (en) Graphite composite material
TWI615271B (zh) 附載體金屬箔
WO2007097366A1 (ja) 多層プリント配線板及びその製造方法
JP4096171B2 (ja) プリント配線板用銅箔複合板およびプリント配線板の製造方法
HK1064329B (en) Partition plate and method for producing a partition plate for a multi-layer pressed stack
KR102018942B1 (ko) 캐리어 부착 금속박, 적층체, 프린트 배선판의 제조 방법, 전자기기의 제조 방법 및 캐리어 부착 금속박의 제조 방법
JP3808406B2 (ja) 内層回路入り銅張り積層板成形用型板
JP4894344B2 (ja) 片面板の製造方法及び多層プリント配線板
EP0050693A2 (en) Backup material for use in drilling printed circuit boards
TW201811555A (zh) 附載體之金屬箔、積層體、印刷配線板之製造方法、電子機器之製造方法及附載體之金屬箔的製造方法
JP2798292B2 (ja) プリント配線板用基板の製造方法
JPH0466692B2 (OSRAM)
JPH08141784A (ja) 肉盛溶接用溶加材およびその製造方法
JP2002198625A (ja) 樹脂付き銅箔の製造方法