JP2004537843A - 基板における能動及び受動部品の相互接続 - Google Patents

基板における能動及び受動部品の相互接続 Download PDF

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Publication number
JP2004537843A
JP2004537843A JP2002551911A JP2002551911A JP2004537843A JP 2004537843 A JP2004537843 A JP 2004537843A JP 2002551911 A JP2002551911 A JP 2002551911A JP 2002551911 A JP2002551911 A JP 2002551911A JP 2004537843 A JP2004537843 A JP 2004537843A
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JP
Japan
Prior art keywords
substrate
components
active
passive
passive components
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Pending
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JP2002551911A
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English (en)
Japanese (ja)
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JP2004537843A5 (OSRAM
Inventor
ラーソン，ラリー・アール
フェンナー，アンドレアス・エイ
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メドトロニック・インコーポレーテッド
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Application filed by メドトロニック・インコーポレーテッド filed Critical メドトロニック・インコーポレーテッド
Publication of JP2004537843A publication Critical patent/JP2004537843A/ja
Publication of JP2004537843A5 publication Critical patent/JP2004537843A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Semiconductor Integrated Circuits (AREA)
  • Electrotherapy Devices (AREA)
JP2002551911A 2000-12-18 2001-12-14 基板における能動及び受動部品の相互接続 Pending JP2004537843A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/740,079 US20020074633A1 (en) 2000-12-18 2000-12-18 Interconnection of active and passive components in substrate
PCT/US2001/048098 WO2002050907A2 (en) 2000-12-18 2001-12-14 Interconnection of active and passive components in substrate

Publications (2)

Publication Number Publication Date
JP2004537843A true JP2004537843A (ja) 2004-12-16
JP2004537843A5 JP2004537843A5 (OSRAM) 2005-12-22

Family

ID=24974950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002551911A Pending JP2004537843A (ja) 2000-12-18 2001-12-14 基板における能動及び受動部品の相互接続

Country Status (5)

Country Link
US (2) US20020074633A1 (OSRAM)
EP (1) EP1350271A2 (OSRAM)
JP (1) JP2004537843A (OSRAM)
CA (1) CA2436990A1 (OSRAM)
WO (1) WO2002050907A2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015033628A1 (ja) * 2013-09-04 2015-03-12 日東電工株式会社 携帯機器、充電システム、及び、電源回路基板等

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003279616A1 (en) * 2002-06-28 2004-01-19 Advanced Bionics Corporation Microstimulator having self-contained power source and bi-directional telemetry system
JP4251054B2 (ja) * 2003-10-01 2009-04-08 株式会社デンソー 半導体装置の製造方法
CA2639555A1 (en) * 2008-08-11 2008-12-15 Hyman Ngo High definition litho applique and emblems
US8781141B2 (en) 2008-08-27 2014-07-15 Starkey Laboratories, Inc. Modular connection assembly for a hearing assistance device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4133000A (en) * 1976-12-13 1979-01-02 General Motors Corporation Integrated circuit process compatible surge protection resistor
US4381010A (en) * 1981-04-03 1983-04-26 Medtronic, Inc. Heart pacemaker with integrated injection logic energy saving circuitry
JPH0624199B2 (ja) * 1982-07-30 1994-03-30 株式会社日立製作所 ウエハの加工方法
US5230747A (en) * 1982-07-30 1993-07-27 Hitachi, Ltd. Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer
US5279992A (en) * 1982-07-30 1994-01-18 Hitachi, Ltd. Method of producing a wafer having a curved notch
EP0304263A3 (en) * 1987-08-17 1990-09-12 Lsi Logic Corporation Semiconductor chip assembly
US6222212B1 (en) * 1994-01-27 2001-04-24 Integrated Device Technology, Inc. Semiconductor device having programmable interconnect layers
US5534465A (en) * 1995-01-10 1996-07-09 At&T Corp. Method for making multichip circuits using active semiconductor substrates
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
US7166495B2 (en) * 1996-02-20 2007-01-23 Micron Technology, Inc. Method of fabricating a multi-die semiconductor package assembly
US5725559A (en) * 1996-05-16 1998-03-10 Intermedics Inc. Programmably upgradable implantable medical device
US5872029A (en) * 1996-11-07 1999-02-16 Advanced Micro Devices, Inc. Method for forming an ultra high density inverter using a stacked transistor arrangement
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
US5898223A (en) * 1997-10-08 1999-04-27 Lucent Technologies Inc. Chip-on-chip IC packages
US5987358A (en) * 1998-02-17 1999-11-16 Intermedics, Inc. Semiconductor device packaging and method of fabrication
US6266567B1 (en) * 1999-06-01 2001-07-24 Ball Semiconductor, Inc. Implantable epicardial electrode

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015033628A1 (ja) * 2013-09-04 2015-03-12 日東電工株式会社 携帯機器、充電システム、及び、電源回路基板等
CN104662768A (zh) * 2013-09-04 2015-05-27 日东电工株式会社 便携式设备、充电系统以及电源电路基板等
JP2015109785A (ja) * 2013-09-04 2015-06-11 日東電工株式会社 携帯機器、充電システム、及び、電源回路基板等
US10218223B2 (en) 2013-09-04 2019-02-26 Nitto Denko Corporation Portable device, charging system, and power source circuit substrate
US11056920B2 (en) 2013-09-04 2021-07-06 Nitto Denko Corporation Portable device, charging system, and power source circuit substrate
US12191689B2 (en) 2013-09-04 2025-01-07 K/S Himpp Portable device, charging system, and power source circuit substrate

Also Published As

Publication number Publication date
WO2002050907B1 (en) 2004-04-08
EP1350271A2 (en) 2003-10-08
CA2436990A1 (en) 2002-06-27
WO2002050907A9 (en) 2002-12-27
US20020074633A1 (en) 2002-06-20
WO2002050907A3 (en) 2003-04-24
WO2002050907A2 (en) 2002-06-27
US20030080401A1 (en) 2003-05-01

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