JP2004537843A5 - - Google Patents

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Publication number
JP2004537843A5
JP2004537843A5 JP2002551911A JP2002551911A JP2004537843A5 JP 2004537843 A5 JP2004537843 A5 JP 2004537843A5 JP 2002551911 A JP2002551911 A JP 2002551911A JP 2002551911 A JP2002551911 A JP 2002551911A JP 2004537843 A5 JP2004537843 A5 JP 2004537843A5
Authority
JP
Japan
Prior art keywords
medical device
implantable medical
active components
substrate
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002551911A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004537843A (ja
Filing date
Publication date
Priority claimed from US09/740,079 external-priority patent/US20020074633A1/en
Application filed filed Critical
Publication of JP2004537843A publication Critical patent/JP2004537843A/ja
Publication of JP2004537843A5 publication Critical patent/JP2004537843A5/ja
Pending legal-status Critical Current

Links

JP2002551911A 2000-12-18 2001-12-14 基板における能動及び受動部品の相互接続 Pending JP2004537843A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/740,079 US20020074633A1 (en) 2000-12-18 2000-12-18 Interconnection of active and passive components in substrate
PCT/US2001/048098 WO2002050907A2 (en) 2000-12-18 2001-12-14 Interconnection of active and passive components in substrate

Publications (2)

Publication Number Publication Date
JP2004537843A JP2004537843A (ja) 2004-12-16
JP2004537843A5 true JP2004537843A5 (OSRAM) 2005-12-22

Family

ID=24974950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002551911A Pending JP2004537843A (ja) 2000-12-18 2001-12-14 基板における能動及び受動部品の相互接続

Country Status (5)

Country Link
US (2) US20020074633A1 (OSRAM)
EP (1) EP1350271A2 (OSRAM)
JP (1) JP2004537843A (OSRAM)
CA (1) CA2436990A1 (OSRAM)
WO (1) WO2002050907A2 (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003279616A1 (en) * 2002-06-28 2004-01-19 Advanced Bionics Corporation Microstimulator having self-contained power source and bi-directional telemetry system
JP4251054B2 (ja) * 2003-10-01 2009-04-08 株式会社デンソー 半導体装置の製造方法
CA2639555A1 (en) * 2008-08-11 2008-12-15 Hyman Ngo High definition litho applique and emblems
US8781141B2 (en) 2008-08-27 2014-07-15 Starkey Laboratories, Inc. Modular connection assembly for a hearing assistance device
JP6381947B2 (ja) * 2013-09-04 2018-08-29 日東電工株式会社 携帯機器、充電システム、及び、電源回路基板等

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4133000A (en) * 1976-12-13 1979-01-02 General Motors Corporation Integrated circuit process compatible surge protection resistor
US4381010A (en) * 1981-04-03 1983-04-26 Medtronic, Inc. Heart pacemaker with integrated injection logic energy saving circuitry
JPH0624199B2 (ja) * 1982-07-30 1994-03-30 株式会社日立製作所 ウエハの加工方法
US5230747A (en) * 1982-07-30 1993-07-27 Hitachi, Ltd. Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer
US5279992A (en) * 1982-07-30 1994-01-18 Hitachi, Ltd. Method of producing a wafer having a curved notch
EP0304263A3 (en) * 1987-08-17 1990-09-12 Lsi Logic Corporation Semiconductor chip assembly
US6222212B1 (en) * 1994-01-27 2001-04-24 Integrated Device Technology, Inc. Semiconductor device having programmable interconnect layers
US5534465A (en) * 1995-01-10 1996-07-09 At&T Corp. Method for making multichip circuits using active semiconductor substrates
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
US7166495B2 (en) * 1996-02-20 2007-01-23 Micron Technology, Inc. Method of fabricating a multi-die semiconductor package assembly
US5725559A (en) * 1996-05-16 1998-03-10 Intermedics Inc. Programmably upgradable implantable medical device
US5872029A (en) * 1996-11-07 1999-02-16 Advanced Micro Devices, Inc. Method for forming an ultra high density inverter using a stacked transistor arrangement
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
US5898223A (en) * 1997-10-08 1999-04-27 Lucent Technologies Inc. Chip-on-chip IC packages
US5987358A (en) * 1998-02-17 1999-11-16 Intermedics, Inc. Semiconductor device packaging and method of fabrication
US6266567B1 (en) * 1999-06-01 2001-07-24 Ball Semiconductor, Inc. Implantable epicardial electrode

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