JP2004528713A5 - - Google Patents

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Publication number
JP2004528713A5
JP2004528713A5 JP2002581589A JP2002581589A JP2004528713A5 JP 2004528713 A5 JP2004528713 A5 JP 2004528713A5 JP 2002581589 A JP2002581589 A JP 2002581589A JP 2002581589 A JP2002581589 A JP 2002581589A JP 2004528713 A5 JP2004528713 A5 JP 2004528713A5
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JP
Japan
Prior art keywords
photoelectric
dam
arrangement according
photoelectric element
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002581589A
Other languages
English (en)
Japanese (ja)
Other versions
JP4369127B2 (ja
JP2004528713A (ja
Filing date
Publication date
Priority claimed from DE10118231A external-priority patent/DE10118231A1/de
Application filed filed Critical
Publication of JP2004528713A publication Critical patent/JP2004528713A/ja
Publication of JP2004528713A5 publication Critical patent/JP2004528713A5/ja
Application granted granted Critical
Publication of JP4369127B2 publication Critical patent/JP4369127B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002581589A 2001-04-11 2002-03-30 光電素子配置 Expired - Fee Related JP4369127B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10118231A DE10118231A1 (de) 2001-04-11 2001-04-11 Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung
PCT/EP2002/003564 WO2002084746A2 (de) 2001-04-11 2002-03-30 Optoelektronische bauelementanordnung und verfahren zur herstellung einer optoelektronischen bauelementanordnung

Publications (3)

Publication Number Publication Date
JP2004528713A JP2004528713A (ja) 2004-09-16
JP2004528713A5 true JP2004528713A5 (enExample) 2005-12-22
JP4369127B2 JP4369127B2 (ja) 2009-11-18

Family

ID=7681320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002581589A Expired - Fee Related JP4369127B2 (ja) 2001-04-11 2002-03-30 光電素子配置

Country Status (6)

Country Link
US (1) US6861683B2 (enExample)
EP (1) EP1380056B2 (enExample)
JP (1) JP4369127B2 (enExample)
AT (1) ATE363132T1 (enExample)
DE (2) DE10118231A1 (enExample)
WO (1) WO2002084746A2 (enExample)

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US7170188B2 (en) * 2004-06-30 2007-01-30 Intel Corporation Package stress management
US7161345B2 (en) * 2004-09-09 2007-01-09 Veris Industries, Llc Power monitoring system that determines phase using a superimposed signal
US7273767B2 (en) * 2004-12-31 2007-09-25 Carsem (M) Sdn. Bhd. Method of manufacturing a cavity package
US7364945B2 (en) * 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
US7354800B2 (en) * 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
DE102005021991A1 (de) 2005-05-09 2006-11-16 Dr. Johannes Heidenhain Gmbh Optoelektronische Anordnung und Verfahren zu deren Herstellung
US7663214B2 (en) * 2005-07-25 2010-02-16 Kingston Technology Corporation High-capacity memory card and method of making the same
WO2007012992A1 (en) * 2005-07-28 2007-02-01 Nxp B.V. A package and manufacturing method for a microelectronic component
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7723146B2 (en) * 2006-01-04 2010-05-25 Stats Chippac Ltd. Integrated circuit package system with image sensor system
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
US8704349B2 (en) 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
RU2308788C1 (ru) * 2006-03-31 2007-10-20 Федеральное государственное унитарное предприятие "НПО "ОРИОН" ФГУП "НПО "ОРИОН" Способ сборки фотоприемников на основе сернистого свинца с применением метода полимерной герметизации
US20080122122A1 (en) * 2006-11-08 2008-05-29 Weng Fei Wong Semiconductor package with encapsulant delamination-reducing structure and method of making the package
CA2609611A1 (en) * 2007-09-10 2009-03-10 Veris Industries, Llc Split core status indicator
CA2609629A1 (en) * 2007-09-10 2009-03-10 Veris Industries, Llc Current switch with automatic calibration
CA2609619A1 (en) 2007-09-10 2009-03-10 Veris Industries, Llc Status indicator
US8212548B2 (en) 2008-06-02 2012-07-03 Veris Industries, Llc Branch meter with configurable sensor strip arrangement
US8421443B2 (en) 2008-11-21 2013-04-16 Veris Industries, Llc Branch current monitor with calibration
US8421639B2 (en) 2008-11-21 2013-04-16 Veris Industries, Llc Branch current monitor with an alarm
US9335352B2 (en) * 2009-03-13 2016-05-10 Veris Industries, Llc Branch circuit monitor power measurement
US10006948B2 (en) 2011-02-25 2018-06-26 Veris Industries, Llc Current meter with voltage awareness
US9146264B2 (en) 2011-02-25 2015-09-29 Veris Industries, Llc Current meter with on board memory
US9329996B2 (en) 2011-04-27 2016-05-03 Veris Industries, Llc Branch circuit monitor with paging register
US9250308B2 (en) 2011-06-03 2016-02-02 Veris Industries, Llc Simplified energy meter configuration
US9410552B2 (en) 2011-10-05 2016-08-09 Veris Industries, Llc Current switch with automatic calibration
CN102931178A (zh) * 2012-07-30 2013-02-13 易美芯光（北京）科技有限公司 一种新型led集成光源封装结构
US10242969B2 (en) * 2013-11-12 2019-03-26 Infineon Technologies Ag Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
US9196510B2 (en) 2013-11-12 2015-11-24 Infineon Technologies Ag Semiconductor package comprising two semiconductor modules and laterally extending connectors
US10371730B2 (en) 2015-12-28 2019-08-06 Veris Industries, Llc Branch current monitor with client level access
US10274572B2 (en) 2015-12-28 2019-04-30 Veris Industries, Llc Calibration system for a power meter
US10408911B2 (en) 2015-12-28 2019-09-10 Veris Industries, Llc Network configurable system for a power meter
US10371721B2 (en) 2015-12-28 2019-08-06 Veris Industries, Llc Configuration system for a power meter
WO2018008539A1 (ja) * 2016-07-08 2018-01-11 住友化学株式会社 紫外線発光半導体装置およびその製造方法
US11215650B2 (en) 2017-02-28 2022-01-04 Veris Industries, Llc Phase aligned branch energy meter
US11193958B2 (en) 2017-03-03 2021-12-07 Veris Industries, Llc Non-contact voltage sensor
US10705126B2 (en) 2017-05-19 2020-07-07 Veris Industries, Llc Energy metering with temperature monitoring
WO2019158648A1 (en) * 2018-02-19 2019-08-22 Signify Holding B.V. Sealed device with light engine
CN111176480A (zh) * 2019-12-06 2020-05-19 深圳市鸿合创新信息技术有限责任公司 一种触控显示屏及其制备方法、触控装置

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DE19755734A1 (de) 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
DE19803936A1 (de) * 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung
DE19947044B9 (de) 1999-09-30 2007-09-13 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben
DE10023353A1 (de) 2000-05-12 2001-11-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung
DE10024336A1 (de) 2000-05-17 2001-11-22 Heidenhain Gmbh Dr Johannes Bauelementanordnung und Verfahren zur Herstellung einer Bauelementanordnung

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