JP2004523111A - 内部結合されたローパス及びバンドパス整合段を具備するパワートランジスタ - Google Patents
内部結合されたローパス及びバンドパス整合段を具備するパワートランジスタ Download PDFInfo
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- JP2004523111A JP2004523111A JP2002558336A JP2002558336A JP2004523111A JP 2004523111 A JP2004523111 A JP 2004523111A JP 2002558336 A JP2002558336 A JP 2002558336A JP 2002558336 A JP2002558336 A JP 2002558336A JP 2004523111 A JP2004523111 A JP 2004523111A
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- 239000003990 capacitor Substances 0.000 claims abstract description 22
- 230000002265 prevention Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 230000009466 transformation Effects 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
Description
【発明の属する技術分野】
本発明は、内部にシャントインダクタを具備する高周波パワートランジスタに関する。
【0002】
【従来の技術】
このようなパワートランジスタは、一般に知られている。このようなトランジスタは、内部のシャントインダクタにより形成されるポスト整合段を一般に具備する。このようなトランジスタは満足をもって長い間使用されてきているが、基本的電子部品は継続してパフォーマンスが最適化されて改善されるよう模索されている。
【0003】
【課題を解決するための手段】
本発明によると、驚くべきことに、相対的に簡単でコスト効果の高い手段でトランジスタが実現でき、それによるとシャントキャパシタが、内部のリード線を介してトランジスタの内部のアクティブダイに内部的にそれぞれが結合された2つの別個のキャパシタで作られ、これらキャパシタのうちの1つは、他のボンドワイヤによりトランジスタのリードに接続されている。
【0004】
このようなトランジスタの製造時に容易に適用できる、この手段により、出力インピーダンスは、例えば2GHzで30Wの装置に対し約2Ωから約19オームまで非常に増大し、このことは、内部のワイヤの適当な選択により出力インピーダンスが顧客の要求に相対的に容易に適応でき、一方で技術的に少ない回路損失となるであろうことを意味する。
【0005】
本発明は特に、高いオーミックレベルでの複数のトランジスタの並列配置に利点があり、従って本発明は当該トランジスタの並列配置にも関する。斯様な配置においては、結果的に大きくなった配置の改善された効率、ゲイン及び出力パワーが得られれば、大きさの問題は低い程度であろう。
【0006】
驚くべきことに、トランジスタの品質改善も本発明により達成される。なぜならば、新しい回路配置における、直流防止キャパシタとアクティブダイとの間の内部のバンドパスワイヤと、トランジスタのアクティブダイとトランジスタのリードとの間の内部のリードワイヤとがより離れた距離にあり、相互カップリングの機会がより低くなるので、機能が改善されるからである。本改善の特に有利な点は、仮想的にコストがかからずに実施できることである。
【0007】
本発明は、以下の図面を参照して詳細に説明されるだろう。
【0008】
これら図において、対応する部品は同一の参照符号が付けられている。
【0009】
【発明の実施の形態】
図1においては、アクティブダイADは、トランジスタのフランジ部Fに固定され、DC防止部DCbも同様である。アクティブダイADはドレインDrを具備し、それを介してワイヤLdにより一方でトランジスタリードEにボンドワイヤされ、他方でワイヤLiによりDC防止部DCbにボンドワイヤされている。
【0010】
その断面図である図2は、DC防止部DCbが形成されるMOSキャパシティの層構成を示す。DC防止部DCbは、下部にシリコン層Si、中間の絶縁層Ox及び上部に金属層Mを有する。リード線Liは、トランジスタに対する所望の周波数レンジの下部でパワートランジスタの出力キャパシタと共鳴するためのバンドパスインピーダンスのトランスフォーメーションを形成する。
【0011】
図4に表されるように、本発明による新しい配置では、従来のMOSキャパシタは、中間の絶縁層Oxの上に2つの相互に分離した金属層を持つMOSキャパシタにトランスフォーメーションされる。
【0012】
本発明によると、2つのキャパシタは、このようにして単一のクリスタルで作られ、これにより好適には図3による実施が実現され、バンドパスリード線Liがアクティブダイと第1キャパシタCbとの間に形成されて新しい配置のための直流防止キャパシタを形成し、これに対し他方ではワイヤLd1によりアクティブダイADはポスト整合キャパシタとして使用される他のキャパシタCpに接続され、順にトランジスタリードEにボンドワイヤLd2により接続される。
【0013】
トランジスタ部品の上述のような驚くべき簡単な配置は、容易に当業者により実践できる。当該配置は、好適には、単一の容量クリスタルを利用して、ローパス及びバンドパス整合段を結合することによりパワートランジスタのダブルの内部のポスト整合を達成する。
【0014】
エンジンの直流防止キャパシティを2つのキャパシティへ分離すること及びトランジスタ内の若干異なるボンディングは、エクストラのインピーダンストランスフォーメーションを実現し、これを通じて(売られている)REは顕著な高いレベルまで顧客の要望で増大されてもよい。実際、従来のRFトランジスタのREは、全て実質的に付加的な製造努力なしに、8倍まで増大してもよい。
【0015】
上述の説明及び図の詳細とは別に、本発明は、更に請求項に係る特徴にも関係する。
【図面の簡単な説明】
【図1】従来のトランジスタの状態の関連部分の概略図である。
【図2】直流防止キャパシタの層構成を示す、図1の直流防止キャパシタの仮想部分を示す。
【図3】図1に対応する、本発明によるトランジスタの関連部分の概略図である。
【図4】図2に対応する、本発明によるキャパシタの部分を示したものである。
Claims (7)
- 内部にシャントインダクタを具備するRFパワートランジスタにおいて、シャントが、内部のリード線を介してトランジスタの内部のアクティブダイに内部的にそれぞれが結合された2つの別個のキャパシタで作られ、これらキャパシタの1つは、他のボンドワイヤによりトランジスタのリードに接続されていることを特徴とする、RFパワートランジスタ。
- 前記キャパシタがMOSキャパシタである、ことを特徴とする請求項1に記載のトランジスタ。
- 前記内部のリード線が、互いに別個のボンドワイヤにより形成されることを特徴とする請求項1又は2に記載のトランジスタ。
- 前記キャパシタは、内部の前記シャントのコモン直流防止キャパシティの2つの部分に分離した金属層として作られた当該金属層により形成されることを特徴とする請求項1、2又は3に記載のトランジスタ。
- 前記分離は、追加のインピーダンストランスフォーメーションを作るために実行されることを特徴とする請求項1乃至4の何れか1項に記載のトランジスタ。
- 出力インピーダンスが10Ωより大きいことを特徴とする請求項1乃至5の何れか1項に記載のトランジスタ。
- 請求項1乃至6の何れか1項に記載のトランジスタを有する電子回路において、前記トランジスタが相対的に高いオーミック抵抗で並列接続で組み込まれていることを特徴とする電子回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01200168 | 2001-01-18 | ||
PCT/IB2001/002559 WO2002058149A1 (en) | 2001-01-18 | 2001-12-17 | Power transistor with internally combined low-pass and band-pass matching stages |
Publications (2)
Publication Number | Publication Date |
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JP2004523111A true JP2004523111A (ja) | 2004-07-29 |
JP4319407B2 JP4319407B2 (ja) | 2009-08-26 |
Family
ID=8179760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2002558336A Expired - Fee Related JP4319407B2 (ja) | 2001-01-18 | 2001-12-17 | 内部結合されたローパス及びバンドパス整合段を具備するパワートランジスタ |
Country Status (7)
Country | Link |
---|---|
US (1) | US6646321B2 (ja) |
EP (1) | EP1356521B1 (ja) |
JP (1) | JP4319407B2 (ja) |
KR (1) | KR20020086645A (ja) |
AT (1) | ATE417361T1 (ja) |
DE (1) | DE60136961D1 (ja) |
WO (1) | WO2002058149A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018050276A (ja) * | 2016-09-16 | 2018-03-29 | 株式会社東芝 | マイクロ波半導体装置 |
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US7187249B2 (en) * | 2004-09-24 | 2007-03-06 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
US7268627B2 (en) * | 2004-11-03 | 2007-09-11 | Theta Microelectronics, Inc. | Pre-matching of distributed and push-pull power transistors |
US7528062B2 (en) * | 2006-10-25 | 2009-05-05 | Freescale Semiconductor, Inc. | Integrated matching network and method for manufacturing integrated matching networks |
KR100878708B1 (ko) | 2007-09-04 | 2009-01-14 | 알.에프 에이치아이씨 주식회사 | 고출력 반도체 소자 패키지 및 방법 |
KR100973751B1 (ko) * | 2009-11-20 | 2010-08-04 | 리플래시기술 주식회사 | 수로교의 익스펜션 조인트 보수공법 |
US7986184B2 (en) | 2009-12-18 | 2011-07-26 | Nxp B.V. | Radio frequency amplifier with effective decoupling |
EP2388815A1 (en) | 2010-05-10 | 2011-11-23 | Nxp B.V. | A transistor package |
EP2458730B8 (en) | 2010-11-29 | 2015-08-05 | Nxp B.V. | Radiofrequency amplifier |
EP2463905B1 (en) | 2010-12-10 | 2014-10-01 | Nxp B.V. | Packaged RF transistor with special supply voltage leads |
US9419580B2 (en) | 2014-10-31 | 2016-08-16 | Raytheon Company | Output matching network having a single combined series and shunt capacitor component |
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US3969752A (en) * | 1973-12-03 | 1976-07-13 | Power Hybrids, Inc. | Hybrid transistor |
US4168507A (en) * | 1977-11-21 | 1979-09-18 | Motorola, Inc. | Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive RF power package |
US4200880A (en) * | 1978-03-28 | 1980-04-29 | Microwave Semiconductor Corp. | Microwave transistor with distributed output shunt tuning |
US5635751A (en) * | 1991-09-05 | 1997-06-03 | Mitsubishi Denki Kabushiki Kaisha | High frequency transistor with reduced parasitic inductance |
JP2728322B2 (ja) * | 1991-09-05 | 1998-03-18 | 三菱電機株式会社 | 半導体装置 |
JP2864841B2 (ja) * | 1992-02-04 | 1999-03-08 | 三菱電機株式会社 | 高周波高出力トランジスタ |
US5315156A (en) * | 1992-11-30 | 1994-05-24 | Sgs-Thomson Microelectronics, Inc. | Transistor device layout |
KR100503531B1 (ko) * | 1996-11-05 | 2005-09-26 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 반도체디바이스 |
US5880517A (en) * | 1998-02-04 | 1999-03-09 | Northrop Grumman Corporation | Microwave power transistor having matched impedance with integrated DC blocking capacitor and manufacturing method therefor |
US6194774B1 (en) * | 1999-03-10 | 2001-02-27 | Samsung Electronics Co., Ltd. | Inductor including bonding wires |
US6181200B1 (en) * | 1999-04-09 | 2001-01-30 | Integra Technologies, Inc. | Radio frequency power device |
JP2001111364A (ja) * | 1999-10-12 | 2001-04-20 | Nec Corp | マイクロ波増幅器 |
-
2001
- 2001-12-17 EP EP01273315A patent/EP1356521B1/en not_active Expired - Lifetime
- 2001-12-17 DE DE60136961T patent/DE60136961D1/de not_active Expired - Lifetime
- 2001-12-17 JP JP2002558336A patent/JP4319407B2/ja not_active Expired - Fee Related
- 2001-12-17 KR KR1020027012230A patent/KR20020086645A/ko not_active Application Discontinuation
- 2001-12-17 WO PCT/IB2001/002559 patent/WO2002058149A1/en active Application Filing
- 2001-12-17 AT AT01273315T patent/ATE417361T1/de not_active IP Right Cessation
-
2002
- 2002-01-15 US US10/047,030 patent/US6646321B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018050276A (ja) * | 2016-09-16 | 2018-03-29 | 株式会社東芝 | マイクロ波半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
US20020109203A1 (en) | 2002-08-15 |
DE60136961D1 (de) | 2009-01-22 |
KR20020086645A (ko) | 2002-11-18 |
US6646321B2 (en) | 2003-11-11 |
EP1356521B1 (en) | 2008-12-10 |
EP1356521A1 (en) | 2003-10-29 |
JP4319407B2 (ja) | 2009-08-26 |
ATE417361T1 (de) | 2008-12-15 |
WO2002058149A1 (en) | 2002-07-25 |
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