JP2004521496A - 干渉遮蔽を有する集積回路ダイ - Google Patents

干渉遮蔽を有する集積回路ダイ Download PDF

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Publication number
JP2004521496A
JP2004521496A JP2002566551A JP2002566551A JP2004521496A JP 2004521496 A JP2004521496 A JP 2004521496A JP 2002566551 A JP2002566551 A JP 2002566551A JP 2002566551 A JP2002566551 A JP 2002566551A JP 2004521496 A JP2004521496 A JP 2004521496A
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JP
Japan
Prior art keywords
integrated circuit
package
circuit
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002566551A
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English (en)
Japanese (ja)
Other versions
JP2004521496A5 (https=
Inventor
スリドハラン，グルスワミ・エム
スリドハラン，カーティク・エム
Original Assignee
アシュバッタ・セミコンダクター・インコーポレーテッド
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Application filed by アシュバッタ・セミコンダクター・インコーポレーテッド filed Critical アシュバッタ・セミコンダクター・インコーポレーテッド
Publication of JP2004521496A publication Critical patent/JP2004521496A/ja
Publication of JP2004521496A5 publication Critical patent/JP2004521496A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/263—Shielding bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2002566551A 2001-02-16 2002-02-13 干渉遮蔽を有する集積回路ダイ Pending JP2004521496A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/785,620 US6486534B1 (en) 2001-02-16 2001-02-16 Integrated circuit die having an interference shield
PCT/US2002/004193 WO2002067326A2 (en) 2001-02-16 2002-02-13 Integrated circuit die having an electromagnetic interference shield

Publications (2)

Publication Number Publication Date
JP2004521496A true JP2004521496A (ja) 2004-07-15
JP2004521496A5 JP2004521496A5 (https=) 2005-12-22

Family

ID=25136069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002566551A Pending JP2004521496A (ja) 2001-02-16 2002-02-13 干渉遮蔽を有する集積回路ダイ

Country Status (5)

Country Link
US (2) US6486534B1 (https=)
EP (1) EP1393372A2 (https=)
JP (1) JP2004521496A (https=)
AU (1) AU2002306475A1 (https=)
WO (1) WO2002067326A2 (https=)

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* Cited by examiner, † Cited by third party
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WO2019244487A1 (ja) * 2018-06-22 2019-12-26 日本電産株式会社 モータ

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Also Published As

Publication number Publication date
WO2002067326A3 (en) 2003-12-18
AU2002306475A1 (en) 2002-09-04
WO2002067326A9 (en) 2004-04-01
US20030017646A1 (en) 2003-01-23
US6486534B1 (en) 2002-11-26
US7151011B2 (en) 2006-12-19
WO2002067326A2 (en) 2002-08-29
EP1393372A2 (en) 2004-03-03

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