JP2004514301A - 半導体回路構成および関連する製造方法 - Google Patents
半導体回路構成および関連する製造方法 Download PDFInfo
- Publication number
- JP2004514301A JP2004514301A JP2002547234A JP2002547234A JP2004514301A JP 2004514301 A JP2004514301 A JP 2004514301A JP 2002547234 A JP2002547234 A JP 2002547234A JP 2002547234 A JP2002547234 A JP 2002547234A JP 2004514301 A JP2004514301 A JP 2004514301A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- source
- semiconductor circuit
- circuit configuration
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 117
- 239000011241 protective layer Substances 0.000 claims description 27
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 21
- 229920005591 polysilicon Polymers 0.000 claims description 21
- 238000003860 storage Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 238000002955 isolation Methods 0.000 claims description 11
- 230000015654 memory Effects 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 238000011065 in-situ storage Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 230000006870 function Effects 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 238000005468 ion implantation Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 239000005380 borophosphosilicate glass Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 abstract description 4
- 238000001459 lithography Methods 0.000 description 8
- 230000010354 integration Effects 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 101100521334 Mus musculus Prom1 gene Proteins 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
Landscapes
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10058948A DE10058948A1 (de) | 2000-11-28 | 2000-11-28 | Halbleiterschaltungsanordnung sowie dazugehöriges Herstellungsverfahren |
PCT/DE2001/004008 WO2002045170A1 (fr) | 2000-11-28 | 2001-10-22 | Systeme de memoire eeprom flash et procede de production correspondant |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004514301A true JP2004514301A (ja) | 2004-05-13 |
Family
ID=7664908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002547234A Pending JP2004514301A (ja) | 2000-11-28 | 2001-10-22 | 半導体回路構成および関連する製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6800893B2 (fr) |
EP (1) | EP1342270B1 (fr) |
JP (1) | JP2004514301A (fr) |
DE (2) | DE10058948A1 (fr) |
TW (1) | TW544925B (fr) |
WO (1) | WO2002045170A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332095B3 (de) * | 2003-07-15 | 2005-01-20 | Infineon Technologies Ag | Halbleiterspeicher mit Charge-trapping-Speicherzellen |
EP1792345A1 (fr) * | 2004-09-15 | 2007-06-06 | Koninklijke Philips Electronics N.V. | Dispositif memoire sonos a isolement par tranchees peu profondes optimise |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2375692A1 (fr) * | 1976-12-27 | 1978-07-21 | Texas Instruments Inc | Memoire semi-conductrice a grilles flottantes, programmable electriquement |
US5210047A (en) * | 1991-12-12 | 1993-05-11 | Woo Been Jon K | Process for fabricating a flash EPROM having reduced cell size |
JP3465397B2 (ja) * | 1995-01-26 | 2003-11-10 | ソニー株式会社 | 半導体不揮発性メモリ装置 |
JPH08330550A (ja) * | 1995-05-31 | 1996-12-13 | Ricoh Co Ltd | 不揮発性半導体メモリ装置とその製造方法 |
JPH0982921A (ja) * | 1995-09-11 | 1997-03-28 | Rohm Co Ltd | 半導体記憶装置、その製造方法および半導体記憶装置の仮想グランドアレイ接続方法 |
JP3097657B2 (ja) * | 1998-05-13 | 2000-10-10 | 日本電気株式会社 | 半導体記憶装置とその製造方法 |
US6037223A (en) * | 1998-10-23 | 2000-03-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stack gate flash memory cell featuring symmetric self aligned contact structures |
-
2000
- 2000-11-28 DE DE10058948A patent/DE10058948A1/de not_active Withdrawn
-
2001
- 2001-10-22 WO PCT/DE2001/004008 patent/WO2002045170A1/fr active IP Right Grant
- 2001-10-22 EP EP01999005A patent/EP1342270B1/fr not_active Expired - Lifetime
- 2001-10-22 JP JP2002547234A patent/JP2004514301A/ja active Pending
- 2001-10-22 DE DE50113096T patent/DE50113096D1/de not_active Expired - Fee Related
- 2001-10-30 TW TW090126895A patent/TW544925B/zh not_active IP Right Cessation
-
2003
- 2003-05-28 US US10/446,491 patent/US6800893B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20040004233A1 (en) | 2004-01-08 |
DE10058948A1 (de) | 2002-06-06 |
EP1342270B1 (fr) | 2007-10-03 |
US6800893B2 (en) | 2004-10-05 |
EP1342270A1 (fr) | 2003-09-10 |
TW544925B (en) | 2003-08-01 |
DE50113096D1 (de) | 2007-11-15 |
WO2002045170A1 (fr) | 2002-06-06 |
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